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High Frequency PCB Communication Circuits
Friday, October 4th, 2024

Best is mainly engaged in the production of High frequency pcb communication circuits, high-speed, microwave and radio frequency printed circuit boards, mainly in sample making and small and medium batches. The main products are: microwave radio frequency high-frequency boards, Rogers high-frequency boards, Rogers multi-layer high-frequency mixed-pressure boards, Rogers radio frequency boards, Taconic microwave boards, Taconic multi-layer circuit boards, Arlon microstrip antenna boards, ARLON high-frequency boards, F4BM antenna boards, F4BM multi-layer mixed-pressure boards, radio frequency amplifier PCB boards, HDI precision multi-layer boards, serving domestic and foreign high-tech enterprises and scientific research institutions.

high frequency pcb communication circuits
high frequency pcb communication circuits

‌What is a high frequency pcb communication circuits

High frequency pcb communication circuits to a circuit board with an operating frequency in the high frequency band (usually greater than 300MHz or a wavelength less than 1 meter), which is mainly used to transmit high-frequency signals and data. ‌ This type of circuit board is widely used in radio frequency (RF) and microwave fields, such as communication equipment, radar systems, satellite communications, and high-speed data transmission systems.

high frequency pcb communication circuits

What is a high frequency pcb communication circuits

The characteristics of high-frequency circuits include challenges such as transmission line effects, signal integrity issues, and electromagnetic interference (EMI). Due to the short wavelength of high-frequency signals, traditional low-frequency circuit design methods are no longer applicable, and special design and processing methods are required to ensure the performance and stability of the circuit.

High-frequency circuit boards are produced on microwave substrate copper-clad boards using ordinary rigid circuit board manufacturing methods or special processing methods. They need to have high-quality electrical properties and chemical stability to meet the requirements of high-frequency signal transmission.

Definition of high frequency pcb communication circuits

High-frequency circuit board, as a special circuit board, is mainly suitable for occasions with high electromagnetic frequency, especially in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter).

It is a circuit board made on a microwave substrate copper-clad board by adopting some manufacturing processes or special processing methods of ordinary rigid circuit boards. Generally speaking, when the frequency of the circuit board reaches above 1GHz, it can be defined as a high-frequency board.

With the rapid development of science and technology, more and more equipment designs have begun to involve microwave frequency bands (>1GHz) and even expanded to the millimeter wave field (such as 77GHz), especially in popular applications such as 77GHz millimeter wave antennas on vehicles.

This trend not only promotes the continuous increase in frequency, but also puts higher requirements on the substrate of the circuit board.

For example, the substrate material needs to have excellent electrical properties, stable chemical properties, and as the frequency of the power signal increases, the loss on the substrate must be extremely small. Therefore, the importance of high-frequency boards is becoming more and more prominent.

Advantages of high frequency pcb communication circuits

The main advantages of high frequency pcb communication circuits include efficient data transmission, strong anti-interference ability, high-frequency bandwidth and high reliability. ‌

  1. high frequency pcb communication circuits can achieve efficient data transmission. High-frequency signals have a short cycle and can transmit more information per unit time, so they have the advantage of large-capacity transmission. In addition, high-frequency signals can achieve fast signal processing and are suitable for application scenarios that require high-speed data transmission and high real-time requirements.
  2. high frequency pcb communication circuits have strong anti-interference capabilities. Due to the short wavelength of high-frequency signals, they can better avoid external interference and attenuation and have strong anti-interference capabilities. This makes high-frequency signals have advantages in fields such as wireless communications and radar systems, and can achieve stable signal transmission and reception. ‌
  3. high frequency pcb communication circuits also have the advantage of high-frequency bandwidth. High-frequency signals correspond to a larger frequency range and can provide higher bandwidth than low-frequency signals. This means that more data can be transmitted, thereby supporting higher data rates and richer media content. ‌
  4. High reliability of high frequency pcb communication circuits is also one of its advantages. The use of high-quality materials and manufacturing processes can effectively resist external interference and oxidation corrosion, ensure stable performance in high temperature environments, and thus extend the service life of the circuit board.

Classification of high frequency pcb communication circuits

Classification by material:

  1. Organic materials: including phenolic resin, glass fiber/epoxy resin, Polyimide, BT/Epoxy (bismaleimide triazine/epoxy resin), etc.
  2. Inorganic materials: mainly including aluminum, copper-invar-copper, ceramic, etc. These materials are mainly selected for their excellent heat dissipation function.

Classification by the hardness of the finished product:

  1. Rigid PCB: has a solid structure and stable performance.
  2. Flexible PCB: has flexibility and bendability, suitable for occasions requiring flexible wiring.
  3. Rigid-Flex PCB: It combines the characteristics of rigid and flexible boards, and has higher design flexibility and wide application.

Classification by structure:

  1. Single-sided board: A circuit board with a conductive layer on only one side.
  2. Double-sided board: Both sides are coated with conductive layers, separated by insulating materials in the middle.
  3. Multilayer board: It is composed of multiple conductive layers and insulating layers, and has higher circuit integration and reliability.

Classification by use:

  1. Communication board: It is used in various communication equipment and systems.
  2. Consumable electronic board: It is commonly found in consumer electronic products.
  3. Military board: A circuit board that meets special requirements in the military field.
  4. Computer board: A circuit board used in computer hardware.
  5. Semiconductor board: A circuit board used in the manufacturing and testing process of semiconductors.
  6. Electrical test board: A circuit board used in electronic testing and measurement equipment.

How to choose high-frequency circuit board high-speed board

When choosing PCB board, you must find a balance between meeting design requirements, mass production and cost. In short, the design requirements cover two aspects: electrical performance and structural reliability. Especially when designing ultra-high-speed PCB (frequency greater than GHz), the choice of board is particularly important. For example, the commonly used FR-4 material will have a significantly increased dielectric loss (Df, i.e., Dielectric Loss) at a frequency of several GHz, and may no longer be applicable.

Taking the 10Gb/S high-speed digital signal as an example, this signal can be regarded as the superposition of multiple sinusoidal wave signals of different frequencies. Therefore, the 10Gb/S signal contains multiple components of different frequencies: such as a 5GHz fundamental signal, a 3rd-order 15GHz signal, a 5th-order 25GHz signal, and a 7th-order 35GHz signal. In order to ensure the integrity of digital signals, maintain the steepness of the upper and lower edges of the signals, and be compatible with the low-loss, low-distortion transmission of RF microwaves (the high-frequency harmonic part of the digital signal reaches the microwave frequency band), the selection of materials for high-speed digital circuit PCBs has many similarities with the needs of RF microwave circuits.

In actual engineering operations, the selection of high-frequency boards seems simple, but the factors that need to be considered are quite complex. Through the introduction of this article, PCB design engineers or high-speed project leaders can have a deeper understanding of the characteristics and selection of boards. Understand the electrical properties, thermal properties, reliability and other characteristics of the board, and use the stacking design reasonably to create products with high reliability and excellent processability, and achieve the best balance of various factors.

Composition and key components of high frequency pcb communication circuits

High frequency pcb communication circuits are basically composed of passive components, active devices and passive networks. Passive components include resistors, capacitors and inductors, which mainly exhibit resistance characteristics at low frequencies, but also exhibit reactance characteristics at high frequencies. Active devices such as high-frequency triodes have the characteristics of high gain, high frequency response and low noise, and are widely used in television, radio communication, radar and other fields.

Application of high frequency pcb communication circuits

High frequency pcb communication circuits are widely used in long-distance communication systems, with a communication distance of up to thousands of kilometers, and are often used to maintain communication between aircraft and bases. It occupies a high-frequency band of 2~30MHz, uses skywave propagation, and can propagate over long distances. Modern airborne high-frequency communication systems usually use single-sideband communication systems, which can greatly compress the occupied frequency band and save transmission power. However, high-frequency communication is also susceptible to electrical interference such as ionospheric disturbances and lightning, generating radio background noise, and there is fading, and the signal is sometimes strong and sometimes weak.

Design Guidelines for High Frequency PCB Communication Circuits

Design Guidelines

High Frequency PCB Communication Circuits

  1. How to avoid high-frequency interference?

The basic idea of ​​avoiding high-frequency interference is to minimize the interference of the electromagnetic field of high-frequency signals, which is the so-called crosstalk. You can increase the distance between high-speed signals and analog signals, or add ground guard/shunt traces next to analog signals. Also pay attention to the noise interference of digital ground to analog ground.

  1. How to solve the signal integrity problem in high-frequency communication PCB design?

Signal integrity is basically an impedance matching problem. The factors that affect impedance matching include the architecture and output impedance of the signal source, the characteristic impedance of the trace, the characteristics of the load end, and the topology of the trace. The solution is to rely on termination and adjust the topology of the trace.

  1. How is the differential wiring method implemented?

There are two points to note when wiring differential pairs. One is that the length of the two lines should be as equal as possible, and the other is that the spacing between the two lines (this spacing is determined by the differential impedance) should remain unchanged, that is, they should be kept parallel. There are two parallel methods, one is that two lines run on the same routing layer (side-by-side), and the other is that two lines run on two adjacent layers (over-under). Generally, the former side-by-side (side by side, shoulder to shoulder) is more commonly used.

  1. How to implement differential routing for clock signal lines with only one output end?

To use differential routing, it must be meaningful if both the signal source and the receiving end are differential signals. Therefore, differential routing cannot be used for clock signals with only one output end.

  1. Can a matching resistor be added between the differential line pairs at the receiving end?

The matching resistor between the differential line pairs at the receiving end is usually added, and its value should be equal to the value of the differential impedance. This will improve the signal quality.

  1. Why should the routing of differential pairs be close and parallel?

The routing method of differential pairs should be appropriately close and parallel. The so-called appropriate proximity is because this spacing will affect the value of differential impedance, which is an important parameter for designing differential pairs. Parallelism is also required because the consistency of differential impedance must be maintained. If the two lines are sometimes far away and sometimes close, the differential impedance will be inconsistent, which will affect the signal integrity and timing delay.

  1. How to deal with some theoretical conflicts in actual wiring?

Basically, it is right to separate the analog/digital ground. It should be noted that the signal routing should try not to cross the split place (moat), and the return current path of the power supply and signal should not be too large.

The crystal oscillator is an analog positive feedback oscillation circuit. To have a stable oscillation signal, the loop gain and phase specifications must be met. The oscillation specification of this analog signal is easily interfered. Even if ground guard traces are added, it may not be possible to completely isolate the interference. Moreover, if it is too far away, the noise on the ground plane will also affect the positive feedback oscillation circuit. Therefore, the distance between the crystal oscillator and the chip must be as close as possible.

It is true that there are many conflicts between high-speed wiring and EMI requirements. But the basic principle is that the resistors, capacitors or ferrite beads added due to EMI cannot cause some electrical characteristics of the signal to not meet the specifications. Therefore, first use the techniques of arranging routing and PCB stacking to solve or reduce EMI problems, such as routing high-speed signals on the inner layer. Only then use resistors, capacitors or ferrite beads to reduce damage to the signal.

  1. How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the winding method and the number of vias. The winding engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the ability of the winding engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing to the copper plating, etc. Therefore, choosing a routing tool with a strong winding engine capability is the solution.

  1. About test coupon.

The test coupon is used to measure the characteristic impedance of the produced PCB board with TDR (Time Domain Reflectometer) to see if it meets the design requirements. Generally, the impedance to be controlled is single line and differential pair. Therefore, the trace width and line spacing (when there is a differential pair) on the test coupon should be the same as the line to be controlled. The location of the ground point during measurement is important. In order to reduce the inductance of the ground lead, the grounding point of the TDR probe is usually very close to the probe tip, so the distance and method between the point where the signal is measured on the test coupon and the ground point should be consistent with the probe used.

  1. In high-speed PCB design, the blank area of ​​the signal layer can be copper-plated, and how should the copper of multiple signal layers be distributed in grounding and power supply?

Generally, the copper plating in the blank area is mostly grounded. However, when plating copper next to high-speed signal lines, pay attention to the distance between the copper plating and the signal line, because the copper plating will reduce the characteristic impedance of the trace a little. Also be careful not to affect the characteristic impedance of other layers, such as in the dual strip line structure.

  1. Can the signal line on the power plane be calculated using the microstrip line model? Can the signal between the power and ground planes be calculated using the stripline model?

Yes, both the power plane and the ground plane must be considered as reference planes when calculating the characteristic impedance. For example, a four-layer board: top layer-power layer-ground layer-bottom layer. At this time, the model of the characteristic impedance of the top layer routing is a microstrip line model with the power plane as the reference plane.

  1. Can the automatic generation of test points on high-density printed circuit boards by software generally meet the test requirements of mass production?

Whether the test points automatically generated by general software meet the test requirements depends on whether the specifications for adding test points meet the requirements of the test equipment. In addition, if the routing is too dense and the specifications for adding test points are strict, it may not be possible to automatically add test points to each line. Of course, the places to be tested need to be filled manually.

  1. Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the way of adding test points and how fast the signal is. Basically, the additional test point (without using the existing via or DIP pin as the test point) may be added to the line or a short line may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, and the latter is an additional branch. Both situations will have some impact on the high-speed signal, and the degree of impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be known through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

  1. How should the ground wires between the boards of a system be connected when several PCBs are connected to each other?

When the signals or power supplies between the PCB boards are in operation, for example, when the power supply or signal from board A is sent to board B, there will be an equal amount of current flowing back from the ground layer to board A (this is Kirchoff current law). The current on the ground layer will flow back to the impedance. Therefore, at each interface where the power supply or signal is connected to each other, the number of pins allocated to the ground layer should not be too small to reduce the impedance, so as to reduce the noise on the ground layer. In addition, the entire current loop can be analyzed, especially the part with larger current, and the connection method of the ground layer or ground wire can be adjusted to control the flow of current (for example, create low impedance at a certain place to let most of the current flow through this place) to reduce the impact on other more sensitive signals.

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High Density Interconnect PCB: Everything You Should Know
Friday, September 27th, 2024

What is High Density Interconnect PCB?

High density Interconnect (HDI) PCB is a printed circuit board designed to meet the growing needs of modern electronic products. It allows for higher component density due to the use of thinner lines, smaller through-holes, and precise component placement. These boards are particularly popular in industries where miniaturization is key, such as smartphones, medical devices, and military equipment.

The HDI board uses the micro-blind hole technology to realize the circuit board design with high line distribution density, which is especially suitable for applications requiring high performance and high reliability. Compared with traditional PCBs, HDI boards have significant advantages in terms of volume, weight, wiring density and electrical performance, which can meet the electrical requirements of high-speed signals, provide impedance control of alternating current characteristics, high-frequency transmission capacity and reduce unnecessary radiation (EMI).

HDI PCBs use a combination of advanced technologies such as laser drilling and sequential lamination to enable denser wiring without compromising performance. By integrating smaller, more efficient through-holes, HDI boards offer greater functionality on a smaller footprint than traditional PCBs.

What is the Difference Between Connect and Interconnect?

The terms “connect” and “interconnect” may seem similar but serve distinct functions in electronics. “Connect” typically refers to the linking of two points, components, or circuits. This could be as simple as joining a wire to a terminal.

On the other hand, “interconnect” deals with more complex connections, usually involving the linking of multiple circuits or components within a system. In the context of HDI PCBs, interconnectivity is crucial because it defines how different layers and components of the board communicate. HDI technology optimizes these interconnections to make the board more efficient in terms of space and performance.

What is HDI PCB Stackup?

The stackup in HDI PCBs refers to how the multiple layers of the board are arranged. Stackups are critical in determining the board’s performance, particularly when it comes to signal integrity, power delivery, and heat dissipation. HDI stackups often involve intricate configurations that vary depending on the design’s complexity and purpose. Here are the most common types:

HDI PCB (1+N+1)

This is one of the simplest forms of HDI stackups, where “1+N+1” means there are two layers of high-density interconnect (one on each side) sandwiching N layers of traditional PCB. This structure is often used in applications where moderate complexity is required, providing a balance between performance and cost.

HDI PCB (2+N+2)

In this configuration, there are two HDI layers on each side of the N traditional layers. This setup allows for greater flexibility in routing, especially for complex designs requiring more components. The additional HDI layers enhance the board’s ability to manage signal transmission efficiently, making it suitable for high-performance applications.

ELIC (Every Layer Interconnection): Most Complex HDI

ELIC takes HDI technology to the next level. In this configuration, every layer of the PCB can interconnect directly with any other layer. This is the most advanced form of HDI stackup, offering unparalleled design flexibility and performance. However, it is also the most complex and expensive option. ELIC is often used in cutting-edge technology applications such as aerospace and military equipment.

Other HDI Stackups

What are the Advantages of HDI PCB?

The main advantage of the HDI board is its high-density interconnect design, through the use of micro lines and highly compact layout, can achieve higher interconnection density, thereby accommodating more electronic components in a limited space, improving the performance and function of the board. This design makes HDI boards particularly suitable for applications requiring high performance and high functional density, such as high performance computing, data centers, and mobile communication equipment, to support high-speed data transmission and processing.

The design of the HDI board also focuses on improving the anti-interference ability and reliability of the circuit board, by using better signal integrity and power management technology, effectively reduce the impact of electromagnetic interference and power noise on the circuit.

However, HDI boards also have some limitations. First of all, compared with other advanced boards, the cost of HDI boards is usually lower, because HDI manufacturing technology helps to use advanced packaging technology, but its processing is more difficult, higher requirements for technology and equipment, which may increase a certain cost. In addition, the material choice of HDI board will also affect its performance and cost, such as FR4, PI and BT materials have advantages and disadvantages, need to be weighed according to the specific application needs.

5 Types of Vias in HDI PCB

HDI PCBs rely on several types of vias to achieve their high-density interconnections. Each type of via has its specific role in the design and manufacturing process.

Blind Vias

Blind vias connect an outer layer of the PCB to one or more inner layers but do not extend through the entire board. These vias allow for complex routing without using unnecessary space on the PCB’s inner layers.

Buried Vias

Buried vias are located entirely within the board, connecting internal layers without appearing on the outer surfaces. This is ideal for designs where surface area needs to be preserved for components, while still allowing inter-layer connectivity.

Microvias

Microvias are tiny vias, typically created using laser drilling, that connect adjacent layers of the PCB. These are essential for HDI designs as they save space while maintaining high-density connections. They can be used in stacked or staggered configurations to optimize space and signal flow.

Staggered Vias

Staggered vias are microvias that are offset from each other across layers. This design allows for more flexibility in routing and avoids overlapping, making it a popular choice for HDI PCBs that require complex routing.

Through Hole Vias

Though not exclusive to HDI designs, through-hole vias extend through the entire PCB, connecting all layers. While these vias occupy more space, they are sometimes necessary for power connections or when working with thicker boards.

What is the Difference Between PCB and HDI PCB?

The key difference between a traditional PCB and an HDI PCB lies in the design and manufacturing process. Traditional PCBs use through-hole technology and thicker traces, limiting the board’s ability to accommodate high-density components. HDI PCBs, by contrast, use finer lines, smaller vias, and advanced interconnect techniques to maximize component density. Here are some key differences between them:

Manufacturing Processes

The embedded via and blind via technologies used in the manufacturing process of HDI (High-Density Interconnect) boards allow for the addition of more layers without increasing the thickness of the board, thereby improving space utilization. In contrast, the drilling process for standard PCBs is relatively simple, but as the number of layers increases, the board thickness also increases accordingly. This difference means that HDI boards require more advanced equipment and higher technical requirements during production.

Space Constraints

In space-constrained devices, such as smartphones and portable electronics, HDI boards are the ideal choice because they can integrate more functions within a smaller size. HDI boards can achieve a line width of 2/2 mil and a 10-layer board thickness of below 0.8mm. Standard PCBs, due to their larger size and lower integration, may not be suitable for these applications. The line width and spacing of regular PCBs are generally limited to 3/3 mil, and their thickness also has certain restrictions.

Performance Requirements

For high-end electronic products that require high-speed signal processing and complex circuit designs, HDI boards offer better performance. Due to their high density and efficiency, HDI boards can meet the high-performance demands of modern electronic devices. Standard PCBs, on the other hand, may not be suitable for these applications because of their lower signal transmission quality and higher latency.

Different Layering Methods

HDI boards are created through continuous stacking and lamination, resulting in advantages such as being “light, thin, short, and small.” Electrical interconnections between layers are achieved through conductive vias, embedded vias, and blind vias, making the structure different from standard multilayer boards. Most HDI boards are laminated two or more times (except for special structures), while standard boards are typically laminated once.

PTH vs. HDI PCB

Plated Through Hole (PTH) technology is commonly used in traditional PCBs and involves drilling holes through the entire board to connect different layers. This method, while reliable, is limited in terms of design flexibility and component density.

HDI PCBs, on the other hand, use smaller vias such as microvias, blind vias, and buried vias. These allow for more efficient use of space, making HDI technology the go-to solution for high-density, multi-layer designs.

High Density Interconnect PCB Applications

  • Communication equipment
  • Computers and servers
  • Automotive electronics
  • Medical equipment
  • Industrial control equipment
  • Consumer electronics
  • ADAS system
  • Wireless connection module

For nearly 20 years, Best Technology have always been committed to providing overseas customers High Mixed, Low Volume products with Reliable Quality and Quick Delivery, and are determined to become one of most trusted partners in the field of printed circuit boards and PCBA. As an expert of HDI PCB manufacturer, we are so confident that we can provide the highest quality product that highly meet your specifications.

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hdi printed circuit board,hdi pcb manufacturer
Wednesday, August 14th, 2024

What is hdi pcb?

HDI stands for High Density Interconnect, which refers to high-density interconnect technology. HDI circuit board is a high-end printed circuit board with very high circuit density and complexity, which can achieve high-speed signal transmission and reliability design. The main features of HDI circuit board are multi-layer circuit, thin plate, small aperture, dense wiring and fine circuit. It is widely used in mobile phones, computers, network communications, automotive electronics and other fields. Bestpcb is a professional HDI manufacturer with 18 years of HDI manufacturing experience.

hdi pcb
hdi pcb
hdi pcb
hdi pcb

What are the advantages of hdi pcb

  1. Higher line density: HDI PCB can support more circuit tracks, arrange more electronic components in a limited space, and achieve high-density interconnection.
  2. Smaller device spacing: The micro-hole technology of HDI PCB allows smaller spacing between components, which is suitable for compact design.
  3. Improve signal integrity: The advanced stacking layer structure is adopted to provide better signal transmission quality and reduce signal interference.
  4. Improve reliability: The manufacturing process of HDI PCB improves the mechanical strength of the board, making it more durable and suitable for demanding application environments.
  5. Improve circuit integration: More line connections and component arrangements are achieved in a limited circuit board space to meet the needs of modern products that are thin and compact.
  6. Enhance signal transmission efficiency: The use of advanced wires and connection methods can increase the operating speed of electronic devices and reduce energy consumption.
  7. Support more complex system design: High-density connection capabilities provide support for complex system design and give full play to the performance of electronic devices. ‌
  8. Promote innovation in the electronics industry: The application of HDI technology has promoted the innovation and development of the electronics industry, making electronic equipment more intelligent and efficient. ‌
  9. Smaller size: It can complete a large number of circuit connections in a smaller space, meeting the needs of electronic products for lightness and portability. ‌
  10. Higher signal transmission speed: The high-density line design allows signals to be transmitted quickly in a short time, improving the system operation speed and response speed.

Why does HDI PCB need via filling and plating?

‌Via filling plating plays a vital role in ‌HDI PCB manufacturing, with the main purpose of improving ‌electrical performance, connection reliability, operating frequency, and avoiding electromagnetic interference. This technology fills the blind holes of HDI PCB with conductive materials through the electroplating process to form a conductive path, which improves the performance and reliability of electronic equipment.

  1. Improve electrical performance: Via filling plating can improve the electrical performance of HDI PCB, especially in high-frequency circuit board design, which is crucial for improving connection reliability, operating frequency and avoiding electromagnetic interference.
  2. Via plugging and electrical interconnection in one step: Via filling plating technology combines via plugging and electrical interconnection, avoiding the defects caused by resin via filling, and also avoiding the CTE difference caused by other materials via filling.
  3. Improve efficiency: Compared with resin via filling or other materials via filling, via filling plating has a simpler process and higher efficiency.
  4. Process flow and technical challenges of via filling plating
  5. Process flow: including steps such as tank preparation, setting of electroplating process control parameters, and analysis of potion addition.
  6. Technical challenges: including positioning accuracy issues and electroplating quality issues, which need to be solved by strictly controlling parameters such as electroplating time and current density.

Application scenarios of hole filling electroplating

First-order HDI: Suitable for electronic devices with less complex circuits.
Second-order and above blind hole electroplating copper filling: Suitable for more complex electronic devices, such as mobile phones, laptops, etc.
Comparison between hole filling electroplating and full-board electroplating
Full-board electroplating: Although it can provide a uniform surface copper thickness distribution, it may encounter the problem of residual dry film on the board surface or in the hole during pre-treatment, resulting in some areas unable to be plated with copper. In addition, the etching process after full-board electroplating may cause quality defects such as side etching and fine lines.
Hole filling electroplating: Compared with full-board electroplating, hole filling electroplating is more accurate in filling blind holes, avoiding the problems that may be encountered in full-board electroplating, while simplifying the process and improving efficiency.

Materials of HDI PCB

The materials of HDI PCB mainly include coated copper foil (RCC), prepreg, copper foil, etc.

Resin-coated copper foil (RCC): This is a material that coats a special resin film layer on electroplated copper foil, used for HDI insulation layer. The characteristics of RCC include no glass dielectric layer, easy laser and plasma micro-hole forming, extremely high peel strength and good toughness, suitable for micro-narrow line etching. Laser drilling is performed on RCC, and the aperture shape formed is an inverted trapezoid, and the general aperture size is 0.076-0.10 mm. The use of RCC makes HDI PCB more widely used in small portable products, such as mobile phones, digital cameras, laptops, etc.

Prepreg and copper foil: These are basic materials in HDI PCB manufacturing, there are no special requirements, and they are suitable for different types of HDI PCB structures. The inner layer circuits are generally 1 ounce copper thick, while the outer layer circuits are plated with half an ounce of base copper to 1 ounce of finished copper thickness. The thickness of the board is usually thinner to meet the miniaturization requirements of HDI PCB.

Other materials: In addition to the main materials mentioned above, the manufacture of HDI PCBs may also involve other materials, such as FR4, PI (polyimide), BT, etc. These materials are selected according to specific application requirements. For example, FR4 has good electrical and mechanical properties and is suitable for most general applications; PI has higher heat resistance and chemical corrosion resistance, and is suitable for high temperature, high humidity and strong acid and alkali environments, but it is more expensive and difficult to process; BT combines good electrical properties, mechanical properties and thermal stability, and is suitable for application scenarios that require higher heat resistance.

Classification of HDI circuit boards

HDI circuit boards are mainly divided into first-order, second-order, third-order, high-order (including fourth-order and above) and Anylayer HDI. ‌

  1. First-order HDI circuit boards mainly include single-sided or double-sided micro-hole processes, and the circuit layer has only one layer. ‌This type of HDI circuit board is suitable for applications with high requirements on cost and space, such as consumer electronics. ‌
  2. Second-order HDI circuit boards contain two circuit layers, which are more complex but also more powerful than first-order HDI circuit boards. They can handle higher signal frequencies and are suitable for applications that require high performance, such as high-end communication equipment and computer hardware. ‌
  3. Third-order HDI circuit boards contain three circuit layers. They are the most complex type at present. They can handle the highest signal frequency and the maximum data transmission rate. They are usually used in applications that require the highest performance, such as aerospace and military equipment. ‌
  4. High-order HDI (including fourth-order and above) The applications of third-order or fourth-order HDI in electronic terminal products are more, while those above fourth-order are mostly converted to Anylayer structure. ‌
  5. Anylayer HDI refers to HDI of any order/any layer. Compared with PCB boards with traditional lamination processes, HDI can reduce costs to a lower level when the stacking density exceeds eight layers. It also has higher electrical performance and signal accuracy, and significantly improves the performance of electromagnetic waves and radio frequency interference, electrostatic discharge and heat conduction in interconnection and relay transmission.

HDI PCB Process Flow

The process flow standards of HDI PCB mainly involve the application and processing technology of high-density interconnection technology (High Density Interconnection Technology, HDI for short), including first-order, second-order and third-order processes. Specifically, the HDI PCB process flow includes the following key steps and characteristics:

First-order process (1+N+1): This is a basic high-density interconnection technology that manufactures multi-layer boards through build-up and micro-blind via technology.

Second-order process (2+N+2): Further development on the basic technology, adding more layers and complexity.

Third-order process (3+N+3): Represents the highest stage of HDI technology, with extremely high layers and interconnection density

Differences between HDI PCB and ordinary PCBs

  1. Differences in circuit design:
    HDI PCB adopts a more sophisticated circuit design, with smaller line width and spacing, and smaller aperture, which can integrate more electronic components and realize more complex circuit functions. ‌
    The blind, buried and stacked hole designs of HDI PCB greatly improve the utilization rate and signal transmission performance of the circuit board.
  2. Differences in manufacturing process:
    The manufacturing process of HDI PCB is more complicated, requiring high-precision processes such as laser drilling technology, hole filling electroplating technology and photolithography technology.
    The manufacturing cost of HDI PCB is relatively high, but the performance and reliability are also higher. ‌
  3. Differences in application:
    Due to its high density and high performance, HDI PCB is widely used in high-end electronic products, such as smartphones, tablets, high-end communication equipment, etc.
    Ordinary PCB is mainly used in low-end electronic products and general electronic equipment.
  4. Characteristics and application scenarios of HDI PCB:
    HDI PCB has high-density wiring, multi-layer structure, high-precision manufacturing process and excellent electrical performance, which can meet the extremely high requirements of high-end electronic products for size, weight, performance and reliability.
    HDI PCB is widely used in smart phones, tablet computers, high-end communication equipment and other fields, promoting the continuous development and upgrading of electronic products.

Application of HDI PCB

HDI PCB (High Density Interconnection Printed Circuit Board) is widely used in multiple industries, including medical equipment, mobile phones, laptops, automotive electronics, computer industry, and future 5G technology fields

  1. Medical equipment: The application of HDI PCB in medical equipment, such as sphygmomanometers and ultrasonic imaging systems, achieves accurate measurement of blood pressure and high-definition imaging of the internal structure of the body, providing patients with timely and accurate diagnosis and treatment information. ‌
  2. Mobile phone industry: With the increasingly miniaturized design of mobile phones, HDI PCB is widely used in transceiver modules, motherboards, SIM card interfaces, fingerprint recognition modules and other parts of mobile phones due to its high density, high quality and high reliability. ‌
  3. Computer industry: In the computer industry, the application of HDI PCB improves the performance of computers, especially in the fields of high-speed algorithms and multimedia applications, and adapts to the miniaturization trend of computer equipment2. ‌
  4. Automotive electronics: HDI PCB has broad application prospects in the field of automotive electronics. In addition to the dominant mobile phone market, it also involves multiple fields such as automobiles, modules and artificial intelligence, demonstrating its key role in complex electronic systems. ‌
  5. Future development trends: With the advent of 5G technology, the demand for HDI PCB will continue to increase, requiring higher speeds and frequencies while adapting to smaller and thinner device designs. Research new micro HDI PCB boards to adapt to future development trends. ‌

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How Much Does A PCB Board Cost?
Tuesday, August 6th, 2024

When communicate with clients, they always ask why the PCB board are so expensive? Is there any basis for that? Actually, the price of PCBs are made specifically according to its manufacturing process, layers, complexities and so on. Today, Best Technology is deeply sharing the composition of PCB cost. Welcome to keep reading.

Why is PCB Board So Expensive?

The cost of a PCB can sometimes seem high due to several reasons. Firstly, the complexity of the design plays a significant role. High-density interconnect (HDI) PCBs, multi-layer PCBs, and those requiring advanced materials or special finishes can drive up the cost. Additionally, stringent quality control measures and the need for precise manufacturing processes add to the expense.

Another factor is the cost of raw materials. Copper, laminates, and specialty substrates can vary in price, affecting the overall cost of the PCB. Furthermore, labor costs in the region where the PCB is manufactured, along with overhead costs such as utilities and facility maintenance, contribute to the final price.

What Factors Affect the PCB Board Cost?

PCB board can cost from $10 to $500 to produce. Buyers are always amazing that why PCB cost so high? But they don’t know there are numerous factors a manufacturer considers in determining PCB costs. If you are in the market to design a PCB, this guide provides factors to consider that could increase or decrease the cost of circuit boards.

  • Manufacture technology

The specific technology used in the PCB can significantly impact the cost. Advanced technologies such as HDI (High-Density Interconnect), embedded busbar or flexible PCBs often require more complex manufacturing processes, which can increase the cost.

  • Material Type

The type of materials used for the PCB, such as standard FR4, high-frequency laminates, or other specialty substrates, can influence the cost. Higher quality or specialized materials typically cost more.

  • IPC Grade

The IPC standards and grades indicate the quality and reliability requirements of the PCB. In electronics manufacturing, printed circuit boards are divided into three levels: level 1, level 2 and level 3. These grades reflect the quality level of each board type, from the lowest (Level 1 standard) to the highest (Level 3 standard). This classification system was developed and defined by IPC and is specified in the IPC-6011 series.

  • Circuit Design

The complexity of the circuit design, including the number of layers, trace width, and spacing, affects the cost. More intricate designs require more precision and advanced techniques, leading to increased expenses.

  • PCB Size & Yield

The physical dimensions of the PCB and the yield rate during production play a role in the overall cost. Larger boards or designs with lower yield rates (more defects) will typically cost more to produce.

  • Material Thickness

The thickness of the materials used in the PCB construction, such as the substrate and copper layers, can impact the cost. Thicker materials may be more expensive and require more resources to process.

  • Copper Thickness

The thickness of the copper used in the PCB, measured in ounces per square foot, can affect the cost. Thicker copper layers provide better electrical performance but are more expensive.

  • Stack-up

The method of layering and stacking the materials in the PCB, known as the stack-up configuration, can influence the cost. Complex stack-ups with multiple layers and specific arrangements can be more costly to manufacture. Read our another post of How Can I Reduce and Optimize the Cost of My PCB in A Best Way?

Manufacturing Process of A Standard PCB

How Much Does A PCB Board Cost?

PCB Design and Layout

The manufacturing process begins with the design phase, where engineers use CAD (Computer-Aided Design) software to create the PCB layout. This includes defining the circuit paths, components, and layers, ensuring the design meets the electrical and mechanical requirements.

Once the design is finalized, a photomask is created, which is a transparent film with the PCB design printed on it. The PCB substrate, typically made of FR4, is then coated with a light-sensitive material called photoresist.

Drilling

Precise holes are drilled into the board for through-hole components and vias using computer-controlled drilling machines. The board is cleaned and deburred to remove any rough edges or debris from the drilling process.

Plating and Copper Deposition

A thin layer of copper is deposited on the surface of the board and inside the drilled holes through an electroless plating process, providing a conductive base. Additional copper is electroplated onto the board, building up the thickness of the copper traces and plated through-holes.

Pattern Transfer

The photomask is placed over the photoresist-coated substrate and exposed to ultraviolet (UV) light. The UV light hardens the photoresist where the design allows light to pass through, and the board is then developed to wash away the unhardened photoresist, leaving behind the desired circuit pattern.

Etching

The PCB undergoes an etching process using a chemical solution to remove unwanted copper, leaving only the copper traces that form the circuits. The remaining hardened photoresist is then stripped away to reveal the clean copper pattern.

Applying Solder Mask

A layer of solder mask is applied to the board to protect the copper traces from oxidation and prevent solder bridges during assembly. The solder mask is cured using UV light, hardening it and making it durable.

Surface Finish/Surface Treatment

A surface finish is applied to the exposed copper areas to protect them and facilitate soldering. Common finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives).

Outline Routing

One the surface treatment finish, it will be routed according to the manufacturing file by CNC machine. And then individual PCBs are cut from the larger panel using routing or V-scoring, depending on the board design and requirements.

Electrical Testing & FQC

The PCB undergoes electrical testing to check for short circuits, open circuits, and other defects. This is typically done using a flying probe tester or a bed-of-nails tester. Then the board is visually inspected for any cosmetic defects or anomalies, and further tests and inspections are performed to ensure the PCB meets all specified requirements and standards. Below you can see the full manufacturing process video of a PCB:

Best Technology – A 18+ Years Experience PCB Manufacturer

When you are looking for a reliable PCB manufacturer, considering Best Technology. We have transparent price and 5years quality warranty. We 24/7 hours online and welcome all the technical questions and PCB inquiries. Contact us for more!

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What Is led ring light pcb
Friday, August 2nd, 2024

led ring light pcb leads the development of lighting industry with its innovative design, high efficiency and flexibility, bringing more intelligent and comfortable lighting experience to our life.

It is not only an integrated platform of electronic components, but also a perfect combination of modern technology and aesthetics, and is the focus of future lighting trends.

led ring light pcb, like a magic wand on the electronic stage, uses precise SMT technology to lightly attach LED components to it. Whether it is a warm small lamp for home decoration, efficient lighting in commercial space, or smart display inside the car, it is indispensable.

Its core structure includes efficient LED lamp beads, power cords that provide electricity, and intelligent controllers that adjust light effects, which together build an excellent lighting solution.

What Is led ring light pcb

Why use mcpcb for led ring light pcb

With the continuous development of LED technology, the heat generated by LEDs has gradually increased. The traditional FR4 printed circuit board (PCB) has been unable to meet the heat dissipation requirements due to its low thermal conductivity (only 0.36W/m.K). In order to solve this problem, the metal core printed circuit board (MCPCB) was proposed. It attaches the original printed circuit board to a metal with better thermal conductivity (such as aluminum and copper) to enhance the heat dissipation effect. The thermal conductivity efficiency of MCPCB is higher than that of traditional FR4 PCB, reaching 1W/m.K to 2.2W/m.K, which effectively improves the heat dissipation performance of LED PCB.

In addition, the use of MCPCB can also reduce the number of LEDs required to generate lighting, making it an ideal choice for street lights, automotive LED applications, and backlight unit applications. The use of metal substrates has practical advantages in heat dissipation, thermal conductivity, reliability, and electrical insulation, especially in harsh environments, and can also achieve reliable operation of LEDs. For example, using a metal substrate can reduce the LED junction temperature by 20-30°C, improve light output and enhance the overall performance of the product, ensure consistent UV light generation, and expand the possibilities of UV applications in various industries.

Unveiling the Components of LED PCBs

  • LED Chips: The heart of the LED PCB, these semiconductor chips emit light when current passes through them.
  • Substrate Material: The base layer of the PCB provides mechanical support and thermal conductivity.
  • Copper Traces: These conductive pathways connect the LEDs and other components, allowing current to flow through the circuit.
  • Solder Mask: A protective layer that covers the copper traces, safeguarding them from external factors and preventing short circuits.
  • Silkscreen: This layer contains markings and labels, providing important information about the PCB’s components and assembly.

Advantages of led ring light pcb?

Thermal performance advantages of metal substrate PCB

High thermal conductivity:
The thermal conductivity of metal substrate PCB is much better than that of traditional plastic substrates such as FR4. It can effectively conduct the heat generated by components, reduce the operating temperature of components, and improve the reliability and life of circuit boards.

Good thermal stability:
Metal substrate PCB can maintain good dimensional stability and electrical performance in high temperature environment, and is suitable for high temperature working environment.

Mechanical performance advantages of metal substrate PCB

High strength: Metal substrate PCB has high mechanical strength and rigidity, is not easy to deform and break, and can withstand large external forces and vibrations.

Good processability: Metal substrate PCB can be processed by conventional mechanical processing methods such as drilling and cutting, which is convenient for the production of circuit boards with complex shapes and sizes.

Electrical performance advantages of metal substrate PCB
Excellent electrical insulation performance: Metal substrate PCB has a special insulation layer design to ensure good electrical insulation performance and avoid electrical short circuits between components.

Low impedance: The conductive layer of metal substrate PCB is made of metal material, which has low impedance, which is conducive to signal transmission and processing.

How does led ring light pcb dissipate heat?

The power device is mounted on the circuit layer. The heat generated by the device during operation is quickly transferred to the metal base layer through the insulating layer, and then the metal base layer transfers the heat to achieve heat dissipation of the device.

Compared with the traditional FR-4, the aluminum substrate can reduce the thermal resistance to the minimum, making the aluminum substrate have excellent thermal conductivity; compared with the thick film ceramic circuit, its mechanical properties are extremely good.

In the circuit design scheme, the heat diffusion is handled very effectively, thereby reducing the module operating temperature, extending the service life, and improving the power density and reliability; reducing the assembly of the heat sink and other hardware (including thermal interface materials), reducing the product volume, and reducing the hardware and assembly costs; combining the power circuit and the control circuit

How to make a LED light circuit board?

Step 1: Design Your LED PCB:
Using PCB design software, create a schematic for your LED circuit and design the PCB layout, considering component placement and signal flow.

Step 2: Choose the Materials:
Select a suitable substrate material and copper-clad board based on your project requirements.

Step 3: Transfer the Design:
Print your PCB layout onto a special transfer paper and transfer it onto the copper-clad board using a heat press.

Step 4: Etch the Board:
Immerse the board in an etching solution to remove the excess copper and reveal the copper traces.

Step 5: Drill Holes:
Drill holes on the board to accommodate the LED chips and other components.

Step 6: Solder the Components:
Carefully solder the LED chips and other components onto the board, ensuring secure connections.

Step 7: Test Your LED PCB:
Connect your LED PCB to a power source and test the LEDs to ensure they light up correctly.

How to make a LED light circuit board?

Capabilities of led ring light pcb?

ItemCapabilities
Layer Count1 – 10 Layers
Max Board Dimension24*64″(610*1625mm)
Min Board Thickness0.6mm
Max Board Thickness4.0mm
Conductor Thickness0.5oz – 10oz
Min Line Width/Line Space4/4mil (0.10/0.10mm)
Min Hole Diameter10mil (0.25mm)
Min Punch Hole Dia0.12″ (3.0mm)
Min Hole Spacing16mil (0.4mm)
Min PAD Ring(Single)3mil (0.075mm)
PTH Wall ThicknessNormal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia14mil (0.35mm)
Min Soldermask Bridge8mil (0.20mm)
Min BAG PAD Margin5mil (0.125mm)
PTH/NPTH Dia TolerancePTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation±3mil (0.075mm)
Outline ToleranceCNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio10:01
Surface TreatmentENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,
Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Capabilities

Applications of led ring light pcb?

  1. Application in medical equipment
    The rapid progress of medicine is closely related to the rapid development of the electronics industry. Many medical devices are made of basic PCBs alone, such as pH meters, heart rate sensors, temperature measurements, electrocardiographs, electroencephalographs, MRIs, X-ray machines, CT scanners, blood pressure machines, blood sugar level measuring equipment, etc.
  2. Application in industrial equipment
    PCBs are widely used in manufacturing, especially in industries with high-power mechanical equipment; these devices run on high power and require high current circuit drive. Such as arc welding, large servo motor drives, lead-acid battery chargers, clothing cotton machines, etc.
  3. Application in lighting
    LED lights and high-intensity LEDs are mounted on PCBs based on aluminum substrates; aluminum has the property of absorbing heat and dissipating it in the air.
  4. Application in the automotive and aerospace industries
    Flexible PCBs are lightweight but can withstand high vibrations. Because of their light weight, they can reduce the total weight of spacecraft; flexible PCBs can be adjusted even in narrow spaces. These flexible PCBs are used as connectors, interfaces, and can be assembled even in compact spaces

FAQs About led ring light pcb

What is the thermal conductivities and withstanding voltages of BT/FR4 layer and Dielectric layer?
The SinkPAD conducts heat primarily through the copper base (400W/m.K), the withstanding voltages of Dielectric layer is around 4KV.

What is the placement accuracy for the SMT components?
+/-0.05mm is our SMT accuracy tolerance. You are welcome to come to our SMT factory in Shenzhen China and Vietnam.

Can the aluminum be made as the base of sinkpad MCPCB?

Actually, the sinkpad can only use copper as the base.
As you can see the below manufacturing steps, the SinkPad will etch the copper base into convex platform with Copper Etching Solution, then hollow out the Double Layer FR4 PCB, and do lamination with the convex platform.
However, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching the LED pad platform. Considering the scrap rate, the process of etching LED pad platform with aluminum is more complex and the overall cost is higher.

Can I plated copper in mcpcb via holes?
Generally speaking, copper plating through holes requires hole rings, otherwise the copper in the hole wall will easily fall off.

In addition, if it is a copper substrate, through the hole first to resin plug before copper plating. 

Otherwise there’s no chemical reaction between copper and copper. And if the copper layer is connected to each copper layer, it is easy to short circuit.

Are you UL certified led pcb manufacturer?

Yes, we are UL certified manufacturer, our UL is E475635. We have already passed UL certificated. Meanwhile, we are passed ISO9001, ISO13485 and IATF16949 certifications. 

Our LED pcbs are manufactured under highly monitored by these quality system controls.

How does the conveity of sinkpad manufactured?

Actually the sinkpad can only use copper as the base.

As you can see the below manufacturing steps, the SinkPad will etch the copper base into convex platform with Copper Etching Solution, then hollow out the Double Layer FR4 PCB, and do lamination with the convex platform.However, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching.

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How to Test a PCB Board? – Best Technology
Friday, August 2nd, 2024

Nowadays, PCBs became more and more important and you can see it in every electronic device. The PCB plays a critical role in our daily life. With circuit board, the device can power on and help to transmit signals, manage heat and perform electricity. A good PCB can help to improve the overall of your device. However, not all the PCBs are work good and within your expectable, you must know how to test it and ensure it enables a good performance. As an experienced PCB manufacturers in Asia, today we want to share with you how we test a PCB, and we try to use simple words to make you sense.

How to Test a PCB? - Best Technology

What is a printed circuit board?

Before knowing the methods of testing circuit board, let’s understand the definition of PCB. A PCB is a flat board made from insulating materials like fiber glasses with conductive pathways etched onto its surface. The pathways we called circuit or traces. These pathways connect different electronic components, so that they can communicate and function together. PCBs come in various materials, shapes and sizes, which always is customized to meet specific applications and performance requirements.

PCBs can be divided into different types according to substrate material used. They are – normal FR4 PCB, polyimide flexible PCB, metal core PCB, ceramic PCB, rogers PCB. Different has its own properties and advantages. The choice of materials and the design of the PCB significantly impact the performance and reliability of the final product. Understanding the materials used in PCBs is crucial for anyone involved in electronics, from hobbyists to professional engineers/designers.

How to Test a PCB? - Best Technology

Common PCB Circuit Board Issues

Though PCB has a strong construction, they are easy to be broken or failure since they always encounter a range of issues. These problems can stem from manufacturing defects, wear and tear, or improper handling. Identifying and diagnosing these issues promptly is crucial for maintaining the reliability and performance of electronic devices. Common issues we faced are including:

  • Open Circuits: These occur when a break in the circuits prevents current flow normally. Open circuits can result from physical damage or manufacturing errors.
  • Short Circuits: Due to improper soldering, unreasonable circuit design and other reasons, resulting in a short circuit between two or more points in the circuit that should not be connected. This can cause excessive current flow, potentially damaging components.
  • Grounding: The unreasonable design of ground area leads to interference signals on the grounding, which affects the normal operation of the circuit.
  • Signal: The signal circuit design is not reasonable, resulting in interference signals on the signal.
  • Component Failures: Individual components on a PCB can fail due to aging, overheating, or electrical stress breakdown. And incorrect orientation will lead to the failure of PCB.
  • Soldering Issues: Poor soldering can lead to weak connections, causing intermittent faults or complete circuit failure. This including the dents in the solder joints, this also can make the PCB failure.
  • Corrosion: PCB exposure to moisture and contaminants for a long time can cause corrosion, degrading the conductive pathways and component leads.

How to check a PCB?

In generally, there are four common ways to check whether if your PCB are good or failure.

1. Visual inspection

The easiest way is visual inspection. Through naked eye observation, check whether the solder joint on the PCB circuit board is firm, whether there is short circuit, open circuit and other phenomena. And look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

2. Use a multimeter

Multimeter is a common tool used for measuring PCB. Multimeter is versatility and it has multiplied modes. Select the appropriate mode on the multimeter, such as continuity, voltage, or resistance mode, depending on what you are testing. Before testing, make sure probes are in good condition and properly connected to the multimeter, with the red probe typically being positive and the black probe negative or ground. Click here to read What is the PCB flying probe test?

3. E-tester

E-tester is a good way to test short or open circuit when it is a mass production. If you just want to test one piece PCB, multimeter is much better.

How to Test a PCB? - Best Technology

4. Use oscilloscope

An oscilloscope is a powerful diagnostic tool used to observe the waveform of electrical signals in a circuit. Connect the oscilloscope probes to the test points on the PCB, it can capture the waveform. By observing the waveform, determine whether the circuit is working normally.

5. Use a thermal imager

A thermal imager also is a effective way to check the condition of PCB. It can capture the temperature distribution on the PCB. It helps identify areas with excessive heat, which can indicate potential issues.

How to Test a Circuit Board with a Multimeter Effectively?

Testing a circuit board with a multimeter is essential for diagnosing and fixing electronic issues. A multimeter can measure voltage, current, and resistance, helping you identify problems with the PCB. The main way to test a PCB with a multimeter is to measure voltage, ‌ resistance, and ground. ‌

  • Measuring voltage

By measuring the voltage on the circuit board, ‌ can quickly test whether the circuit is working properly. Use the voltage gear of the multimeter, ‌ select the appropriate range, ‌ then measure the input and output of the power supply on the circuit board respectively, ‌ to check whether the voltage is within the normal range. If the voltage is abnormal, ‌ may indicate that the circuit is open or short. ‌

  • Measuring resistance value

By measuring the resistance value on the circuit board, can detect whether the circuit is smooth. Use the resistance level of the multimeter, select the appropriate range, then measure the key nodes on the circuit board, check whether the resistance value is within the normal range. If the resistance value is abnormal, may indicate that the circuit is open or short. ‌

How to Test a PCB? - Best Technology
  • Check the grounding

Grounding is critical to the proper operation of the circuit board. Use the multimeter’s ground test function, to check that key points on the board are properly grounded, ‌ this helps to spot potential electrical connection problems. ‌

In addition, for industrial-grade PCB measurement, the use of higher-precision multimeters and special pens can improve the accuracy and efficiency of the measurement. ‌ For example, the ‌ Fluke 17B Max multimeter is equipped with an extra-pointed stylus, enables more accurate measurement of patch components and pins, and ‌ improves measurement fineness and accuracy.

Generally speaking, using a multimeter to test the PCB board needs to master the correct measurement methods and skills. At the same time according to the complexity of the circuit board to choose the appropriate measurement tools, to ensure the accuracy and efficiency of the test.

How to Tell if a Circuit Board is Bad?

Identifying a bad circuit board requires a combination of visual inspection and multimeter testing. Here are some signs and methods to determine if a PCB is faulty:

  • Visual Signs

Look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

  • Component Testing

Use the multimeter to test individual components. A component that doesn’t show the expected resistance or voltage is likely faulty.

  • Continuity Testin

Check for open circuits. Lack of continuity in a path indicates a broken trace or solder joint.

  • Short Circuit Detection

Identify any unintended connections between different paths. This can be done by checking for continuity where there should be none.

  • Functionality Testing

Test the circuit board in its intended application. If the device does not function correctly, there may be an issue with the PCB.

Why Choose Best Technology?

By reading this post, you may know how to test a PCB by multimeter already and other methods to identify them. Best Technology has engaging in the PCB manufacturing for more than 18 years, we have served over 2000+ customers all around the world. We have strong R&D team and equipped with advanced equipment to improve the yield and product quality.

At Best Technology, we provide various PCB manufacturing, including metal core PCBs, ceramic PCBs, rigid-flex PCBs and some other special PCBs like HDI PCB, busbar PCB, heavy copper PCB. If you have similiar projects, you are welcome to contact us.

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What is a PCB Board? – Best Technology
Saturday, July 13th, 2024

In our daily life, the electronics has been gradually infiltrated our lives. Between them, the PCB board plays an important role in it, and we must say, PCB is the foundational element of electronics. From the simplest gadgets to the most complex machinery, PCBs play a crucial role.

What is a PCB Board?

A printed circuit board (PCB) is an electronic that uses metal conductors to create electrical connections between components. Generally, a PCB is a flat, laminated composite made of non-conductive substrate materials with conductive pathways etched or printed onto it. These pathways, also known as traces, enable the electronic components mounted on the board to communicate with each other.

What is a PCB Board?

PCBs are designed to support and electrically connect various components such as resistors, capacitors, diodes, and integrated circuits. The intricate network of copper tracks forms circuits that dictate the device’s functionality. PCBs can range from simple single-sided boards used in basic electronics to complex multi-layered structures found in advanced applications.

Common PCB Structure

A PCB’s structure is composed of several key layers, each serving a distinct purpose. Here is a detailed breakdown of these layers:

Substrate (Base Material)

The substrate, usually made of fiberglass (FR4), provides the board with its rigidity and thickness. It is the foundational layer upon which all other materials are built.

Copper Layer

This conductive layer is typically made of copper foil. For single-sided PCBs, the copper layer is only on one side of the substrate, whereas double-sided and multi-layer PCBs have copper layers on both sides or between multiple layers of substrate.

Solder Mask

The solder mask is a protective layer applied over the copper traces to prevent oxidation and accidental short-circuiting. It insulates the copper traces and leaves the component pads exposed for soldering. The green color commonly associated with PCBs comes from this layer, though it can also be found in other colors like red, blue, black, and white.

Silkscreen

The silkscreen layer is used to add labels, symbols, logos, and other markings to the PCB. This layer helps in identifying component locations and orientations during assembly and troubleshooting.

Components and Connectors (PCBA)

Components such as resistors, capacitors, diodes, and integrated circuits are soldered onto the PCB. Connectors allow the PCB to interface with other boards, power supplies, and external devices.

What is a PCB Board?

How Many Types of PCB?

Single-Sided PCBs

These are the simplest types of PCBs, with copper on only one side of the board. You’ll find them in basic, low-cost electronics like calculators, radios, and power supplies. They’re easy to design and manufacture, which keeps costs down and makes them great for straightforward applications.

Double-Sided PCBs

These boards have copper layers on both sides, allowing for more complex circuits. They’re common in more sophisticated electronics like amplifiers, power monitoring systems, and HVAC systems. With increased circuit density and flexible design options, they can handle more complex tasks.

Multi-Layer PCBs

When you need to pack in a lot of circuits, multi-layer PCBs are the way to go. They consist of three or more layers of copper, separated by insulating layers. You’ll see these in high-tech devices like computers, servers, medical equipment, and aerospace electronics. They offer high circuit density, reduced size and weight, and better signal integrity.

Rigid PCBs

Made from solid, inflexible materials like fiberglass, rigid PCBs keep their shape and provide strong support for components. They’re durable and used in everything from simple toys to complex industrial equipment.

Flexible PCBs

These are made from flexible plastic materials like polyimide, allowing them to bend and flex. Perfect for wearable electronics, flexible displays, and compact devices where space is tight. They’re lightweight, can fit into small, irregular spaces, and can handle being bent repeatedly.

Rigid-Flex PCBs

Combining the best of both rigid and flexible PCBs, these are great for devices that need both stability and flexibility, like smartphones, cameras, and medical devices. They save space, reduce the need for connectors and interconnections, and improve reliability.

High-Frequency PCBs

Designed to operate at frequencies above 1 GHz, these are used in communication systems, microwave technology, and high-speed devices. They provide low signal loss and high performance, making them crucial for advanced communication technologies.

Ceramic PCBs

Using ceramic as the substrate material, these PCBs offer excellent thermal conductivity and stability. They’re perfect for high-power applications and environments with extreme temperatures, like LED lighting, power electronics, and aerospace systems. Ceramic PCBs ensure reliable performance in harsh conditions.

Metal Core PCBs

Featuring a metal core, usually aluminum or copper, these PCBs improve heat dissipation. They’re used in high-power applications where efficient thermal management is crucial, such as LED lighting, power supplies, and automotive electronics.

Special PCBs

Bus Bar PCBs

These integrate bus bars for high-current applications, ensuring efficient power distribution and minimal voltage drop. They’re used in heavy-duty power supplies, electric vehicles, and industrial machinery. Bus bar PCBs provide robust and reliable connections for high-power systems.

What is a PCB Board?

Heavy Copper PCBs

With thicker copper layers, typically 3 ounces per square foot or more, these PCBs can handle higher currents and enhance thermal management. They’re used in power distribution, automotive, and industrial applications where durability and performance are critical. Heavy copper PCBs ensure reliable operation under high-stress conditions.

What is a PCB Board?

HDI (High-Density Interconnect) PCBs

These feature finer lines and spaces, smaller vias, and higher connection pad density. They’re used in advanced electronics like smartphones, tablets, and medical devices where space and performance are paramount. HDI PCBs enable miniaturization and improved electrical performance.

Extra Thin PCBs

Designed with minimal thickness, these PCBs are perfect for fitting into compact and lightweight devices. You’ll find them in flexible displays, wearables, and miniaturized electronic gadgets. Extra thin PCBs allow for innovative design solutions and space-saving configurations.

What is a PCB Board?

RF (Radio Frequency) PCBs

Optimized for high-frequency signals, these are used in communication devices, antennas, and microwave applications. They’re designed to minimize signal loss and interference, ensuring optimal performance in wireless communication systems.

High Tg PCBs

These have a high glass transition temperature, making them suitable for high-temperature environments. Used in automotive, aerospace, and industrial applications, high Tg PCBs maintain structural integrity and performance at elevated temperatures.

Impedance Control PCBs

These are designed to maintain consistent impedance for high-speed signal transmission. They’re used in communication devices, high-speed digital circuits, and advanced computing systems. Impedance control PCBs ensure signal integrity and reduce signal loss and reflection.

What is a PCB Board?

Why Are PCB Boards So Expensive?

Material Quality

High-grade materials like FR4 (fiberglass), ceramics, and high-quality copper foil are used to ensure durability and performance. These materials are essential for withstanding environmental stress and ensuring reliable operation, but they are expensive. For example, ceramic substrates can cost up to 10 times more than standard FR4 materials due to their superior thermal conductivity and electrical properties.

Complexity of Design

Multi-layer PCBs and advanced designs such as HDI (High-Density Interconnect) boards require complex manufacturing processes. The process involves precise alignment of layers and sophisticated techniques like laser drilling for micro-vias. The added complexity increases the production costs significantly. For instance, a standard 4-layer PCB might cost $50 per square meter, while a 12-layer HDI PCB could cost over $200 per square meter.

Precision and Technology

Manufacturing high-precision PCBs involves advanced machinery for etching, drilling, and plating. This machinery requires significant investment, and the skilled labor needed to operate it adds to the cost. The precision required in the production process ensures that the PCBs meet exacting standards, crucial for high-performance applications. A single advanced PCB drilling machine can cost upwards of $500,000.

Volume of Production

Smaller production runs generally have higher costs per unit because the setup and tooling expenses are spread over fewer units. For example, a low-volume production run of 10 PCBs might cost $100 per board, whereas a high-volume run of 10,000 boards might reduce the cost to $10 per board due to economies of scale.

Testing and Quality Assurance

Rigorous testing, including electrical, thermal, and functional tests, ensures that the PCBs meet strict performance standards. This testing process is vital to ensure reliability, especially in critical applications like medical devices and aerospace. Quality assurance processes can add 20-30% to the overall production cost, but they are essential for maintaining high standards.

What is the Difference Between PCBA and PCB Board?

The terms PCB and PCBA are often used interchangeably, but they refer to different stages of the board’s life cycle. The PCB is the bare board itself, with no electronic components attached. It consists of a non-conductive substrate, copper traces, solder mask, and silkscreen. A PCB serves as the foundation for assembling electronic components.

On the other hand, a PCBA (Printed Circuit Board Assembly) is a PCB that has undergone the assembly process, where all necessary electronic components like resistors, capacitors, diodes, and integrated circuits are soldered onto the board. Essentially, a PCBA is a functional circuit board ready for use in electronic devices. The transition from a PCB to a PCBA involves component placement, soldering, and quality testing, transforming the bare board into an operational assembly. Below is a typical PCBA product for your reference.

What is a PCB Board?

What is PCB Board Common Use?

PCB boards are existing in everywhere what we live, for example, the global smartphone market, which relies heavily on PCBs, was valued at approximately $520 billion in 2020. Here are some common applications that PCB used in:

Automotive Industry

In the automotive sector, PCBs are used in engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). These applications enhance vehicle performance, safety, and connectivity.

Medical Devices

PCBs are integral to medical devices such as diagnostic equipment, patient monitoring systems, and implantable devices. They ensure precise and reliable operation, which is critical for patient safety and effective treatment.

Industrial Applications

PCBs are used in control systems, machinery, and power distribution units in industrial settings. They provide robust and durable solutions capable of withstanding harsh conditions and continuous operation.

Telecommunications

In telecommunications, PCBs are essential in routers, switches, and communication devices, ensuring efficient and reliable data transmission. As the demand for faster and more reliable communication networks grows, so does the need for high-quality PCBs.

Why Are Circuit Boards Green?

The characteristic green color of most PCBs comes from the solder mask, a protective layer applied over the copper traces to prevent oxidation, short-circuiting, and to protect the board during soldering.

The green color is traditional, largely due to historical reasons and practical benefits. Green solder mask provides a good contrast against the white silkscreen and the shiny copper traces, making it easier for technicians to inspect and identify components during assembly and troubleshooting. Additionally, green solder mask was one of the first colors to be developed and standardized in the industry, leading to its widespread adoption. However, PCBs are not limited to green; they can also be found in other colors such as red, blue, black, and white, depending on the specific requirements and aesthetic preferences of the project. The choice of solder mask color does not affect the performance of the PCB, but green remains popular due to its well-established manufacturing process and visual advantages.

How to Get Started with Best Technology?

Here at Best Technology, we are experienced in designing all types of PCBs, including standard rigid PCBs, special PCBs, and irregular PCBs. We can design and develop PCBs according to customer specification and offer suggestions on the right materials for your project.

We provide the full series of PCB manufacturing, from the initial PCB design, PCB layout, to custom PCB fabricate, PCB assembly, box building and so forth. By the way, we have our own factory in Vietnam, that means we can ship out the PCBs directly from Vietnam.

Welcome to contact us when you want to get a quote!

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Posted in best pcb, bestpcb, Ceramic PCB, FAQ, FR4 PCB, HDI PCB, mcpcb, Metal Core PCB, PCB News, PCB Technology, PCBA, RF Board, Rigid Flex Circuit, Special PCB | No Comments »

High Speed PCB: How to Design It?
Wednesday, July 3rd, 2024

In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.

What is a High Speed Circuit PCB?

High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.

Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.

high speed pcb for Iradar

Features of High-Speed PCB

  • High frequency
  • Low permittivity and low loss factor
  • Multilayer design
  • Strict impedance control
  • High-precision manufacturing
  • Low noise characteristic
  • High density circuit layout (micro-vias)
  • High performance

What is Considered High-Speed PCB Design?

High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:

– Signal Integrity: Ensuring signals travel without distortion or loss.

– Power Management: Distributing power effectively to minimize noise and voltage drops.

– Heat Handling: Managing heat from high-speed components to prevent overheating.

– Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.

– Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.

This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, Best Technology offers expert guidance and solutions.

What’s the Best Material for High-Speed PCB Design?

Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

– FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

– Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

– Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

Where is the High-Speed PCB Commonly Used in?

High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:

1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.

2. Data center – like high-performance computing, storage servers, etc.

3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.

4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.

What is the 3H Rule in High Speed PCB Design?

The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:

– Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.

– Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.

– Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.

For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.

How to Design a High-Speed Board?

Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:

Component Placement and Layer Stack-Up

Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.

Trace Routing and Impedance Control

Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.

High Speed PCB: How to Design It?

Power Distribution and EMI Mitigation

Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.

Simulation and Testing

Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.

High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. Best Technology is here to assist you with expert advice and solutions for your high-speed PCB needs.

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PCB Design for PICE Card, Industrial PCB Design Cases
Tuesday, June 25th, 2024

Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.

PICE card

[1]: Main chip: XCKU11P

[2]: 30A maximum current

[3]: Single pair differential line, 10G optical network

[4]: 14 layers PCB

If you need a custom industrial PCB design, please feel free to contact us.

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Video Decoder Hardware PCB Design Case Example
Tuesday, June 25th, 2024

A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:

Video decoder

[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI

[2]: Single pair differential line, 10G optical network, memory of DDR4

[3]: 12 layers PCB

Why choose us?

We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:

  • Professional engineer evaluation
  • DFM analysis
  • One-time successully on prototyping
  • SI analysis of signal integrity
  • Electromagnetic compatibility (EMC) analysis

Contact us if you have any questions.

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Posted in best pcb, bestpcb, Design Guide, FAQ, FR4 PCB, HDI PCB, PCB News, PCB Technology | No Comments »

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