Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 – 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board.
Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on.
Generally, the thick copper plate is about 3oz, and the larger current is 3oz~6oz. To achieve 15 ounces, the requirements for process and manufacturers are more stringent. Best provides 3-15oz 1-99 layers of PCB. It is a professional PCB manufacturer with 18 years of experience, providing one-stop PCB and PCBA services from design, manufacturing to after-sales.
Common copper foil thicknesses have the following options:
1 oz (35 μm): This is the most common and standard copper foil thickness, widely used in general electronic product manufacturing. It has good electrical and thermal conductivity.
2 oz (70 μm): This thickness of copper foil is usually used in circuits that require higher current carrying capacity, such as power amplifiers, high-power LEDs, etc.
0.5 oz (18 μm): This thinner copper foil thickness is suitable for some light and small electronic products, such as electronic watches, mobile phones, etc.
Other thicknesses: According to special needs, you can also choose copper foil of other thicknesses, such as 3 oz, 4 oz, etc.
What is copper foil
Copper foil is a cathodic electrolytic material, a thin, continuous metal foil deposited on the substrate layer of the circuit board, which serves as the conductor of the PCB. It is easy to adhere to the insulating layer, accept the printed protective layer, and form a circuit pattern after corrosion. The copper mirror test is a flux corrosion test, using a vacuum precipitation film on a glass plate. Copper foil is made of copper and a certain proportion of other metals. Copper foil generally has two types: 90 foil and 88 foil, that is, the copper content is 90% and 88%, and the size is 16*16cm.
How thick is the PCB copper foil
The commonly used international PCB copper foil thicknesses are: 35um, 50um, and 70um. Generally, the thickness of copper foil (copper cladding) of single-sided and double-sided PCB boards is about 35um (1.4mil), and the other specifications are 50um and 70um. The surface thickness of multilayer boards is generally 35um=1oz (1.4mil), and the inner layer is 17.5um (0.7mil). 70% of circuit boards use a copper foil thickness of 35um, which mainly depends on the purpose of the PCB and the voltage and current of the signal; in addition, for PCBs that need to pass large currents, some will use 70um copper thickness, 105um copper thickness, and rarely 140um, etc. The copper foil thickness is usually expressed in oz (ounces). 1oz refers to the thickness of 1oz of copper evenly covering an area of 1 square foot, which is about 1.4mil. It uses the weight per unit area to express the average thickness of the copper foil. Expressed in formula, that is, 1oz=28.35g/ FT2 (FT2 is square feet, 1 square foot = 0.09290304 square meters).
Different uses have different copper foil thicknesses,
Ordinary 0.5oz, 1oz
2oz, mostly used in consumer and communication products. Thick copper products above
3oz are mostly used for large currents, such as high-voltage products and power boards!
Copper foil thickness (track width) affects the current size. Although there is a formula that can directly calculate the current load capacity of copper foil, it is not so simple when actually designing the circuit. Therefore, safety should be fully considered when designing.
How thick is 2 oz of copper for PCB?
In the PCB industry, 1OZ means the thickness of 1OZ of copper evenly laid on an area of 1 square foot (FT2). It uses the weight per unit area to express the average thickness of the copper foil. Expressed in formula, 1OZ=28.35g/FT2 (FT2 is square feet, 1 square foot=0.09290304 square meters). First, we know that the density constant of copper and the conversion formula of related units are as follows: 1 cm = 10 mm; 1 mm = 1000 um 1 FT2≈929.0304cm2 According to the mass calculation formula m=ρ×V(volume)=ρ×S(area)×t(thickness), we know that the weight of copper foil divided by the density and area of copper is the thickness of copper foil! So, t=28.35÷929.0304÷8.9cm≈0.0034287cm=34.287um≈34.287÷25.4mil≈1.35mil Copper thickness 1.OZ(0.035mm) Copper thickness 1.5OZ(0.05mm) Copper thickness 2.OZ (0.07mm)
What are the materials of PCB board
FR-1——phenolic cotton paper, this base material is commonly known as bakelite (more economical than FR-2) FR-2——phenolic cotton paper FR-3——cotton paper, epoxy resin FR-4——glass cloth, epoxy resin FR-5——glass cloth, epoxy resin FR-6——matte glass, polyester G-10——glass cloth, epoxy resin CEM-1——cotton paper, epoxy resin (flame retardant) CEM-2——cotton paper, epoxy resin (non-flame retardant) CEM-3——glass cloth, epoxy resin CEM-4——glass cloth, epoxy resin CEM-5——glass cloth, polyester AIN——aluminum nitride SIC——silicon carbide
Theled light circuit board, also called the LED circuit board, is actually the abbreviation of the printed circuit board (PCB). PCB is a stable carrier of electronic components, which not only realizes electrical connection, but also plays a supporting role. In LED lamps, the PCB board integrates LED components, and through this integrated PCB board, the LED lamp can realize its function. The driving circuit of the LED lamp, such as constant voltage drive, constant current drive, PWM drive, etc., are all integrated on this small circuit board, which is necessary to light up the LED lamp beads. Therefore, it can be said that the circuit board of the LED lamp is the printed circuit board inside it, which is responsible for converting electrical energy into visible light, and controlling the brightness and performance of the LED through different driving methods.
Customized process of led light circuit board
Support small and medium batch orders of 1-14 layers, consult customer service for more layers;
Can do HDI blind buried hole process;
The board uses Jiantao A-grade board (KB-6164), which can be made into halogen-free board;
The maximum size can be one meter;
Various ink colors such as pink, transparent, purple, etc.;
Support copper thickness of 10oz, hole copper 35μm;
Multi-layer board can be customized with pressing structure;
Support multi-level impedance matching;
Board edge copper package, two-color ink, plug hole, countersunk hole, square groove, stepped hole, stepped groove, nickel palladium gold and other special processes;
PCBA can be pasted in one set, single and double sides can be pasted;
led light circuit board
What fields can led light circuit board be applied in?
PCB LED lamp has excellent energy efficiency, low cost and maximum design flexibility, so it can be incorporated into many lighting applications.
Telecommunications: LED indicators and displays are always used in telecommunications equipment due to the surrounding machinery, and they have great heat transfer capabilities. Therefore, aluminum-based LED PCBs play an important role in their applications. Automotive: Aluminum PCB LEDs are also used in the indicator lights, brake lights, and headlights of automobiles, among other applications. There are factors that make aluminum PCBs ideal in the automotive industry, such as durability and competitive pricing. Computers: LED displays and indicator lights are becoming increasingly popular in computer applications. Aluminum PCB LEDs are an ideal solution due to the heat sensitivity of computer machinery. In addition to LED applications, aluminum PCBs are also used in computer components such as power supply units and CPU boards due to their ability to dissipate and transfer heat. Medical: Lighting tools used in surgical procedures and medical examinations often use high-power LED lights, which often use aluminum PCBs, mainly because of the durability and heat transfer capabilities of aluminum PCB LEDs – this ensures that medical equipment operates properly, regardless of the number of patients that are cycled through the medical office. In addition to lighting tools, medical scanning technology also often uses aluminum PCBs.
What fields can LED PCB be applied in?
Advantages of led light circuit board
Lower power consumption: Replacing incandescent lamps with LED lamps can reduce power consumption by more than 80%.
Longer life: The service life of LEDs can generally exceed 20,000 hours, and they can be used around the clock for 3 years, which is 25 times longer than incandescent lamps. Not only can it save costs, but it also reduces the frequency of replacement.
Higher efficiency: Incandescent lamps release more heat. LED lamps can reduce it by up to 20%. This means that while using more powerful LED lamps, unnecessary heating can be reduced.
Smaller size: Due to their small size, LED lamps can have various sizes and can be used in different places. Manufacturers can add LEDs to anything, whether it is electronic equipment or cars, and even traffic lights and signs on the road.
Environmental protection: Compared with other bulbs, LED lamps do not contain mercury. Therefore, LEDs have less impact on the environment and are easier to handle.
LED is the abbreviation of light-emitting diode, which is a semiconductor diode. LEDs are soldered to a printed circuit board and equipped with a chip that generates light through electrical connections. A heat sink and a ceramic base are used to connect the chip. Undoubtedly, LED PCB is the core of LED lighting. An LED PCB tends to generate a lot of heat, but it is difficult to cool it by traditional methods. Metal core PCB is widely used in LED applications due to its strong heat dissipation ability, especially aluminum is often used in the production of PCB for LED lamps. Usually, aluminum PCB contains a thin layer of thermal conductive medium material, which can transfer and dissipate heat much more efficiently than traditional rigid PCB.
Why led light circuit board use mcpcb
Aluminum substrate is a metal-based copper-clad board with good heat dissipation function. Generally, a single-sided board consists of three layers, namely circuit layer (copper foil), insulation layer and metal base layer. There are also designs for high-end use as double-sided boards, with the structure of circuit layer, insulation layer, aluminum base, insulation layer and circuit layer. Very few applications are multi-layer boards, which can be made of ordinary multi-layer boards with insulation layer and aluminum base. LED aluminum substrate is PCB, which also means printed circuit board, but the material of the circuit board is aluminum alloy. In the past, our general circuit board material was glass fiber, but because LED generates more heat, the circuit board used for LED lamps is generally aluminum substrate, which can conduct heat quickly. The circuit boards used for other equipment or electrical appliances are still glass fiber boards!
How are LED patches installed on PCB boards?
Use double-sided PCB board, patch LED on the front, and drive power circuit on the back. LED can be designed into a circle shape, through metallized holes to the back, there are plenty of places to handle these leads On the corresponding pads of PCB board, brush tin, use patch machine to apply it, and then reflow soldering, it is on, but in actual operation, you need to pay attention to many problems, anti-static, equipment quality, etc.
A zero PCB, also known as a prototype PCB or breadboard, is a type of circuit board used for building and testing prototypes. Unlike traditional PCBs, which have pre-defined paths for electric connections, zero PCBs offer a grid of holes. This grid allows for custom circuit designs using wires and components. Engineers and hobbyists use zero PCBs to experiment and develop new electronic circuits without committing to a specific design.
What is a zero PCB?
Zero PCBs are particularly helpful in testing circuit designs for any shortcomings. They provide a cost-efficient way to evaluate the circuitry before committing to a final solution. The term ‘zero’ in this context signifies a fundamental distinction. It implies that there are no predefined connections, layouts, or functions on the PCB.
Generally, there is no solder mask and silkscreen on the zero board. The primary purpose of a zero PCB is to offer a blank canvas for users to create and test custom circuits. As a result, they are intentionally kept simple in structure to allow for maximum customization. Users are free to design and solder their circuits and components directly onto the board without the constraints of a predefined layout or solder mask.
What is the use of a zero board?
Zero boards serve a variety of purposes in the electronics industry. They are particularly useful for prototyping and testing new circuit designs. Here are some common uses:
Prototyping
Educational purposes
Quick fixes
Small-scale production
Zero PCBs have a layer of copper traces or pads on the substrate. These copper elements provide the conductive pathways for soldering electronic components and forming connections. However, the copper traces on zero PCBs are usually unconnected, meaning there is no predefined circuit layout. You can build a circuit on them by inserting components into the holes and then connecting them with wires.
What is the cost of a zero PCB board?
The cost of zero PCB boards varies based on size, material, and supplier. Generally, they are quite cost-effective, so that both professional engineers and hobbyists can afford it. Prices can range from a few cents for small boards to several dollars for larger or more specialized versions. Bulk purchasing often reduces the cost per unit. Additionally, different materials, such as fiberglass or phenolic, can affect the price.
What size is a zero PCB board?
Zero PCB boards come in various sizes to accommodate different project needs. Common sizes include:
Small: Typically around 5×7 cm, ideal for simple projects.
Medium: Sizes like 10×15 cm offer more space for complex circuits.
Large: Boards as large as 30×30 cm are available for extensive projects.
The grid pattern usually remains consistent, with a standard pitch of 2.54 mm (0.1 inches) between holes, regardless of the board’s overall size.
What is a bare board?
A bare board, also known as a blank PCB, is a printed circuit board that has not yet been populated with any electronic components. It is essentially the foundation of a PCB, consisting only of the substrate material (such as fiberglass) and the copper traces that form the circuit pathways. A bare board typically include base core, prepreg and copper trace layer.
Features of a bare board
Substrate material
The base material of a bare board is usually fiberglass, FR4, or other insulating materials that provide mechanical support.
Copper traces
These are the conductive pathways etched onto the substrate. They form the circuit’s electrical connections but are not yet connected to any components.
Pads and holes
Bare boards include pads (flat areas of copper for soldering components) and drilled holes for through-hole components.
Pre-defined layout
The copper traces and pads are arranged according to a specific design, determined during the PCB design process.
No components
A bare board does not have any electronic components soldered onto it yet. It is essentially a “blank slate” ready to be populated.
Coated solder mask and silkscreen
Most bare boards have a solder mask, a protective layer that prevents solder from bridging between conductive areas, and a silkscreen, which provides component labels and other information.
If you are looking for a reliable supplier for your PCB needs, consider companies like EBest Circuit (Best Technology), who is known for their quality and customer service. EBest Circuit (Best Technology) offers a range of options to support your electronic projects from prototyping to production. Contact us right now to get your quotation.
Metal core printed circiut boards are used where a large of heat are generated in the circuit, and the heat needs to be dissipated quickly to avoid overheat. These boards offer good thermal conductivity and dimensional stability. The aluminum core can reduce the overall weight of your board.
What is Metal Core Printed Circuit Board?
A metal core printed circuit board (MCPCB) is a type of PCB that incorporates a metal core, usually aluminum or copper, as its base material. This core helps to enhance the board’s thermal management capabilities. Unlike traditional PCBs made of fiberglass (FR4), MCPCBs are designed to dissipate heat more effectively, making them ideal for applications where heat dissipation is crucial.
MCPCBs are also referred to as insulated metallic substrate (IMS), or insulated metal PCBs (IMPCB), thermal-clad PCBs. A typical metal core PCB is made of thermal insulating layer (dielectric layer), metal base and copper foil.
The basic constructure of a metal core circuit board includes:
Silkscreen
Solder mask (S/M)
Circuit layer (copper foil layer)
Dielectric layer
Metal core base
What are Metal Core PCBs Used For?
Metal core PCBs are popular because of its good thermal management. It utilizes in various applications that demand efficient heat dissipation and high thermal performance. Here are some common applications that metal core printed circuit board will be used in.
LED lighting
MCPCBs are widely used in LED lighting systems due to their excellent thermal management properties. LEDs generate a significant amount of heat, and metal core PCBs help to dissipate this heat effectively, ensuring longer lifespan and consistent performance of the LEDs.
Power supplies
High-power supply units benefit from MCPCBs as they can handle the heat generated by power components. This helps in maintaining the stability and efficiency of the power supply over time.
Automotive electronics
In the automotive industry, MCPCBs are used in various electronic control units (ECUs), lighting systems, and other high-power applications. The robust nature of MCPCBs makes them suitable for the harsh conditions experienced in automotive environments.
Industrial equipment
Industrial machinery and equipment that operate under high temperatures or require high power output use MCPCBs for their thermal management capabilities. This ensures the reliability and longevity of the equipment.
Telecommunications
Telecommunications equipment, such as base stations and routers, use MCPCBs to manage the heat generated by high-speed and high-frequency operations, ensuring uninterrupted performance and reliability.
Consumer electronics
High-performance consumer electronics, including laptops, smartphones, and gaming consoles. They install with MCPCBs to manage heat and improve device performance and lifespan.
What are the Advantages of Metal Core PCB?
Metal core PCBs are preferred for several reasons, primarily revolving around their superior heat dissipation capabilities and mechanical strength. Here are some main advantages of metal core PCBs.
Superior thermal management
Mechanical strength
Compact design
Enhanced performance
Improved reliability
Higher recyclability
Cost Efficiency
Dimension stability
Size reduction
Longer lifetime
What Metal is Used in PCBs?
The choice of metal in PCBs significantly affects their thermal and mechanical properties. The most commonly used metals in MCPCBs are aluminum and copper. Here’s a closer look at these materials:
Aluminum
Thermal Conductivity: Aluminum has a thermal conductivity of approximately 1.0 to 2.0 W/mK, making it an excellent material for heat dissipation.
Cost-Effective: Aluminum is relatively inexpensive compared to other metals, making it a cost-effective choice for many applications.
Lightweight: Aluminum is lighter than copper, which can be beneficial in applications where weight is a concern.
Corrosion Resistance: Aluminum naturally forms a protective oxide layer, enhancing its resistance to corrosion.
Copper
Thermal Conductivity: Copper has a higher thermal conductivity than aluminum, ranging from 3.0 to 5.0 W/mK, providing superior heat dissipation.
Electrical Conductivity: Copper is also an excellent conductor of electricity, which can improve the electrical performance of the PCB.
Durability: Copper is more durable and resistant to wear and tear compared to aluminum, making it suitable for more demanding applications.
Higher Cost: Copper is more expensive than aluminum, which can increase the cost of the PCB but is justified in applications requiring superior performance.
Other Metals
In some specialized applications, other metals like stainless steel or alloys might be used, but these are less common due to their specific properties and higher costs.
What is the difference between FR4 PCB and Aluminum PCB?
Aluminum PCB is a material based on aluminum base material, coated with an insulating layer and other conductive layers on the aluminum base material. FR4 is a glass fiber reinforced laminate, made of multi-layer fiber cloth and resin composite. In the following, we will introduce the difference between aluminum substrate and FR4 in terms of thermal conductivity, mechanical strength, manufacturing difficulty, application range and thermal expansion coefficient.
1. Aluminum substrate has good heat dissipation, and its thermal conductivity is about 10 times that of FR4.
2. The mechanical strength and toughness of the aluminum substrate are better than FR4, which is suitable for installing large components and making large-area pcb boards.
3. The production of aluminum substrate requires more process steps, and its production process is more complex than FR4, and the production cost is higher than FR4.
4. The aluminum substrate is suitable for high-power electronic products such as LED lighting, power supplies, inverters and solar inverters, and FR4 is suitable for low-power electronic products such as televisions, telephones and electronic game consoles.
5. The thermal expansion coefficient of aluminum substrate is close to that of copper foil, which is smaller than that of FR4, which is good for ensuring the quality and reliability of the circuit board.
How to Design Metal Core PCB?
Designing a metal core PCB is a complex process that includes several crucial steps. During the design, we should ensure the board meets the thermal, electrical, and mechanical requirements of the application. Below is a detailed guide to the MCPCB design process.
1. Define the Application Requirements
Before starting the design process, it’s essential to clearly define the requirements of your application. This includes understanding the thermal, electrical, and mechanical needs of the project. Determine the maximum operating temperature and the amount of heat that needs to be dissipated, ensuring the MCPCB can handle the thermal load effectively. Specify the electrical characteristics such as current load, voltage levels, and signal integrity requirements to ensure the board can deliver the necessary performance.
2. Select the Core Material
As mentioned above, there are two common metal materials used in this industry: aluminum alloy and copper core. They have unique characteristics and properties when used in device. So. choosing the appropriate metal core material is crucial for the performance of your electronic device. This table provides a side-by-side comparison of aluminum alloy and copper core materials, helping to choose the appropriate material when designing MCPCBs.
Property
Aluminum
Copper
Thermal Conductivity
1.0 – 2.0 W/mK
3.0 – 5.0 W/mK
Electrical Conductivity
Lower than Copper
High
Weight
Light
Heavy
Cost
Lower
High
Mechanical Strength
Good
Excellent
Corrosion Resistance
Natural Protective Oxide Layer
Requires Additional Protection
Thermal Expansion Coefficient
Higher
Lower
Machinability
Good
More Difficult
Environmental Impact
Recyclable
Recyclable
Application Areas
LED Lighting, Consumer Electronics, High-Performance
Electronics, Industrial Equipment
3. Determine the Layer Stack-Up
The layer stack-up defines the arrangement of the different layers in the PCB. A typical MCPCB stack-up includes:
Top Copper Layer: The conductive layer where components are mounted.
Dielectric Layer: An insulating layer that separates the copper layer from the metal core. It has good thermal conductivity to transfer heat from the components to the metal core.
Metal Core: The central layer made of aluminum or copper, which acts as a heat spreader.
Bottom Copper Layer (optional): Used in double-sided MCPCBs for additional routing of traces.
4. Design the Circuit Layout
The circuit layout includes placing components and routing traces on the PCB. Key considerations include strategically placing heat-generating components to ensure efficient heat dissipation and keeping sensitive components away from high-heat areas. Trace routing should minimize electrical interference and maintain signal integrity, using wider traces for high-current paths to reduce resistance and heat generation. Implementing thermal vias enhances heat transfer from the top copper layer to the metal core by using plated through holes that connect the copper layer to the metal core, facilitating better heat dissipation.
5. Design for Manufacturability (DFM)
Ensuring that your design can be efficiently manufactured is critical. Maintain adequate clearances between traces, pads, and other features to meet MCPCB manufacturing capabilities and avoid short circuits. Use standard drill sizes to reduce manufacturing complexity and cost. Apply a solder mask to prevent solder bridges and protect the copper traces from oxidation. Use clear and legible silkscreen markings for component identification and assembly instructions. You can communicate with your supplier and ask for a capability chart, so that can save much time on design phase.
6. Prototype and Test
Once the design is validated, create a prototype of the MCPCB and conduct thorough testing. Measure the actual thermal performance under operational conditions to verify the simulation results. Test the functionality of the PCB in the intended application environment to ensure it meets all performance requirements. Conduct reliability tests such as thermal cycling, vibration testing, and humidity testing to assess the durability of the MCPCB.
EBest Circuit (Best Technology) – A Leading MCPCB Manufacturer in Asia
With 18+ years of experience in the PCB industry, EBest Circuit (Best Technology) has a deep understanding of the complexities involved in MCPCB production. Our team of experts is adept at designing and manufacturing MCPCBs that deliver optimal performance. EBest Circuit (Best Technology) offers customized turn-key solutions tailored to the specific needs of our clients. Whether it’s a unique design requirement or a specific material preference, we provide flexible options to meet diverse demands.
Contact EBest Circuit (Best Technology), get your quote right now to make your own metal core circuit boards!
In our daily life, the electronics has been gradually infiltrated our lives. Between them, the PCB board plays an important role in it, and we must say, PCB is the foundational element of electronics. From the simplest gadgets to the most complex machinery, PCBs play a crucial role.
What is a PCB Board?
A printed circuit board (PCB) is an electronic that uses metal conductors to create electrical connections between components. Generally, a PCB is a flat, laminated composite made of non-conductive substrate materials with conductive pathways etched or printed onto it. These pathways, also known as traces, enable the electronic components mounted on the board to communicate with each other.
PCBs are designed to support and electrically connect various components such as resistors, capacitors, diodes, and integrated circuits. The intricate network of copper tracks forms circuits that dictate the device’s functionality. PCBs can range from simple single-sided boards used in basic electronics to complex multi-layered structures found in advanced applications.
Common PCB Structure
A PCB’s structure is composed of several key layers, each serving a distinct purpose. Here is a detailed breakdown of these layers:
Substrate (Base Material)
The substrate, usually made of fiberglass (FR4), provides the board with its rigidity and thickness. It is the foundational layer upon which all other materials are built.
Copper Layer
This conductive layer is typically made of copper foil. For single-sided PCBs, the copper layer is only on one side of the substrate, whereas double-sided and multi-layer PCBs have copper layers on both sides or between multiple layers of substrate.
Solder Mask
The solder mask is a protective layer applied over the copper traces to prevent oxidation and accidental short-circuiting. It insulates the copper traces and leaves the component pads exposed for soldering. The green color commonly associated with PCBs comes from this layer, though it can also be found in other colors like red, blue, black, and white.
Silkscreen
The silkscreen layer is used to add labels, symbols, logos, and other markings to the PCB. This layer helps in identifying component locations and orientations during assembly and troubleshooting.
Components and Connectors (PCBA)
Components such as resistors, capacitors, diodes, and integrated circuits are soldered onto the PCB. Connectors allow the PCB to interface with other boards, power supplies, and external devices.
How Many Types of PCB?
Single-Sided PCBs
These are the simplest types of PCBs, with copper on only one side of the board. You’ll find them in basic, low-cost electronics like calculators, radios, and power supplies. They’re easy to design and manufacture, which keeps costs down and makes them great for straightforward applications.
Double-Sided PCBs
These boards have copper layers on both sides, allowing for more complex circuits. They’re common in more sophisticated electronics like amplifiers, power monitoring systems, and HVAC systems. With increased circuit density and flexible design options, they can handle more complex tasks.
Multi-Layer PCBs
When you need to pack in a lot of circuits, multi-layer PCBs are the way to go. They consist of three or more layers of copper, separated by insulating layers. You’ll see these in high-tech devices like computers, servers, medical equipment, and aerospace electronics. They offer high circuit density, reduced size and weight, and better signal integrity.
Rigid PCBs
Made from solid, inflexible materials like fiberglass, rigid PCBs keep their shape and provide strong support for components. They’re durable and used in everything from simple toys to complex industrial equipment.
Flexible PCBs
These are made from flexible plastic materials like polyimide, allowing them to bend and flex. Perfect for wearable electronics, flexible displays, and compact devices where space is tight. They’re lightweight, can fit into small, irregular spaces, and can handle being bent repeatedly.
Rigid-Flex PCBs
Combining the best of both rigid and flexible PCBs, these are great for devices that need both stability and flexibility, like smartphones, cameras, and medical devices. They save space, reduce the need for connectors and interconnections, and improve reliability.
High-Frequency PCBs
Designed to operate at frequencies above 1 GHz, these are used in communication systems, microwave technology, and high-speed devices. They provide low signal loss and high performance, making them crucial for advanced communication technologies.
Ceramic PCBs
Using ceramic as the substrate material, these PCBs offer excellent thermal conductivity and stability. They’re perfect for high-power applications and environments with extreme temperatures, like LED lighting, power electronics, and aerospace systems. Ceramic PCBs ensure reliable performance in harsh conditions.
Metal Core PCBs
Featuring a metal core, usually aluminum or copper, these PCBs improve heat dissipation. They’re used in high-power applications where efficient thermal management is crucial, such as LED lighting, power supplies, and automotive electronics.
Special PCBs
Bus Bar PCBs
These integrate bus bars for high-current applications, ensuring efficient power distribution and minimal voltage drop. They’re used in heavy-duty power supplies, electric vehicles, and industrial machinery. Bus bar PCBs provide robust and reliable connections for high-power systems.
Heavy Copper PCBs
With thicker copper layers, typically 3 ounces per square foot or more, these PCBs can handle higher currents and enhance thermal management. They’re used in power distribution, automotive, and industrial applications where durability and performance are critical. Heavy copper PCBs ensure reliable operation under high-stress conditions.
HDI (High-Density Interconnect) PCBs
These feature finer lines and spaces, smaller vias, and higher connection pad density. They’re used in advanced electronics like smartphones, tablets, and medical devices where space and performance are paramount. HDI PCBs enable miniaturization and improved electrical performance.
Extra Thin PCBs
Designed with minimal thickness, these PCBs are perfect for fitting into compact and lightweight devices. You’ll find them in flexible displays, wearables, and miniaturized electronic gadgets. Extra thin PCBs allow for innovative design solutions and space-saving configurations.
RF (Radio Frequency) PCBs
Optimized for high-frequency signals, these are used in communication devices, antennas, and microwave applications. They’re designed to minimize signal loss and interference, ensuring optimal performance in wireless communication systems.
High Tg PCBs
These have a high glass transition temperature, making them suitable for high-temperature environments. Used in automotive, aerospace, and industrial applications, high Tg PCBs maintain structural integrity and performance at elevated temperatures.
Impedance Control PCBs
These are designed to maintain consistent impedance for high-speed signal transmission. They’re used in communication devices, high-speed digital circuits, and advanced computing systems. Impedance control PCBs ensure signal integrity and reduce signal loss and reflection.
Why Are PCB Boards So Expensive?
Material Quality
High-grade materials like FR4 (fiberglass), ceramics, and high-quality copper foil are used to ensure durability and performance. These materials are essential for withstanding environmental stress and ensuring reliable operation, but they are expensive. For example, ceramic substrates can cost up to 10 times more than standard FR4 materials due to their superior thermal conductivity and electrical properties.
Complexity of Design
Multi-layer PCBs and advanced designs such as HDI (High-Density Interconnect) boards require complex manufacturing processes. The process involves precise alignment of layers and sophisticated techniques like laser drilling for micro-vias. The added complexity increases the production costs significantly. For instance, a standard 4-layer PCB might cost $50 per square meter, while a 12-layer HDI PCB could cost over $200 per square meter.
Precision and Technology
Manufacturing high-precision PCBs involves advanced machinery for etching, drilling, and plating. This machinery requires significant investment, and the skilled labor needed to operate it adds to the cost. The precision required in the production process ensures that the PCBs meet exacting standards, crucial for high-performance applications. A single advanced PCB drilling machine can cost upwards of $500,000.
Volume of Production
Smaller production runs generally have higher costs per unit because the setup and tooling expenses are spread over fewer units. For example, a low-volume production run of 10 PCBs might cost $100 per board, whereas a high-volume run of 10,000 boards might reduce the cost to $10 per board due to economies of scale.
Testing and Quality Assurance
Rigorous testing, including electrical, thermal, and functional tests, ensures that the PCBs meet strict performance standards. This testing process is vital to ensure reliability, especially in critical applications like medical devices and aerospace. Quality assurance processes can add 20-30% to the overall production cost, but they are essential for maintaining high standards.
What is the Difference Between PCBA and PCB Board?
The terms PCB and PCBA are often used interchangeably, but they refer to different stages of the board’s life cycle. The PCB is the bare board itself, with no electronic components attached. It consists of a non-conductive substrate, copper traces, solder mask, and silkscreen. A PCB serves as the foundation for assembling electronic components.
On the other hand, a PCBA (Printed Circuit Board Assembly) is a PCB that has undergone the assembly process, where all necessary electronic components like resistors, capacitors, diodes, and integrated circuits are soldered onto the board. Essentially, a PCBA is a functional circuit board ready for use in electronic devices. The transition from a PCB to a PCBA involves component placement, soldering, and quality testing, transforming the bare board into an operational assembly. Below is a typical PCBA product for your reference.
What is PCB Board Common Use?
PCB boards are existing in everywhere what we live, for example, the global smartphone market, which relies heavily on PCBs, was valued at approximately $520 billion in 2020. Here are some common applications that PCB used in:
Automotive Industry
In the automotive sector, PCBs are used in engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). These applications enhance vehicle performance, safety, and connectivity.
Medical Devices
PCBs are integral to medical devices such as diagnostic equipment, patient monitoring systems, and implantable devices. They ensure precise and reliable operation, which is critical for patient safety and effective treatment.
Industrial Applications
PCBs are used in control systems, machinery, and power distribution units in industrial settings. They provide robust and durable solutions capable of withstanding harsh conditions and continuous operation.
Telecommunications
In telecommunications, PCBs are essential in routers, switches, and communication devices, ensuring efficient and reliable data transmission. As the demand for faster and more reliable communication networks grows, so does the need for high-quality PCBs.
Why Are Circuit Boards Green?
The characteristic green color of most PCBs comes from the solder mask, a protective layer applied over the copper traces to prevent oxidation, short-circuiting, and to protect the board during soldering.
The green color is traditional, largely due to historical reasons and practical benefits. Green solder mask provides a good contrast against the white silkscreen and the shiny copper traces, making it easier for technicians to inspect and identify components during assembly and troubleshooting. Additionally, green solder mask was one of the first colors to be developed and standardized in the industry, leading to its widespread adoption. However, PCBs are not limited to green; they can also be found in other colors such as red, blue, black, and white, depending on the specific requirements and aesthetic preferences of the project. The choice of solder mask color does not affect the performance of the PCB, but green remains popular due to its well-established manufacturing process and visual advantages.
How to Get Started with EBest Circuit (Best Technology)?
Here at EBest Circuit (Best Technology), we are experienced in designing all types of PCBs, including standard rigid PCBs, special PCBs, and irregular PCBs. We can design and develop PCBs according to customer specification and offer suggestions on the right materials for your project.
We provide the full series of PCB manufacturing, from the initial PCB design, PCB layout, to custom PCB fabricate, PCB assembly, box building and so forth. By the way, we have our own factory in Vietnam, that means we can ship out the PCBs directly from Vietnam.
Welcome to contact us when you want to get a quote!
FR4 is a commonly used material in the printed circuit boards (PCBs) manufacturing. If you’re in the electronics field, you’ve likely heard of it. It is the footstone of a circuit board, provides good mechanical strengthen and electrical insulation properties. Today, we will share informational about FR4 material, its types, advantages and alternatives. Keep reading if you are interested in.
What does FR4 stand for?
FR4 stands for “Flame Retardant 4”, also called FR-4 Epoxy Glass Cloth by PCB manufacturers. It is not a material name, but a material grade, so there are many types of FR-4 grade materials used in general circuit boards. But most are composites made with so-called Tera-Function epoxy resins plus fillers and glass fibers. FR4 is made from woven glass-reinforced epoxy resin. The typical composition of FR4 includes approximately 60% glass fabric and 40% epoxy resin by weight.
This composite material is known for its high mechanical strength and flame-retardant properties. The “4” in FR4 signifies the level of flame retardancy. It means the material is resistant to catching fire, which is critical in preventing electrical fires in electronic devices.
What are the classifications of FR4 materials?
FR4 materials are classified based on various properties and specifications to cater to different applications and requirements. These classifications help in selecting the right type of FR4 material for specific PCB needs. Here are the primary classifications of FR4 materials:
1. Standard FR4
Standard FR4 is the most commonly used classification. It offers a good balance of electrical insulation, mechanical strength, flame retardancy, and cost-effectiveness. Standard FR4 materials have a glass transition temperature (Tg) typically around 130°C to 140°C. They are suitable for general-purpose PCBs used in consumer electronics, industrial controls, and telecommunications equipment.
2. High Tg FR4
High Tg FR4 materials are designed for applications requiring higher thermal performance. These materials have a higher glass transition temperature, usually above 170°C. High Tg FR4 is used in applications where the PCB is exposed to higher temperatures, such as automotive electronics, aerospace, and high-power devices. The increased Tg provides better stability and performance at elevated temperatures. This is the high Tg FR4 PCB that we made before.
3. Low Dk FR4
Low Dk (Dielectric Constant) FR4 materials are used in high-frequency applications where signal integrity is crucial. So, we called it as “High-frequency FR4”. These materials have a lower dielectric constant, which reduces signal loss and improves signal transmission. Low Dk FR4 is often used in RF and microwave circuits, where maintaining signal integrity is essential.
4. High CTI FR4
High CTI (Comparative Tracking Index) FR4 materials have an improved resistance to electrical tracking. These materials are used in applications where the PCB is exposed to high voltages and harsh environments. High CTI FR4 provides better insulation and reduces the risk of electrical failure due to tracking.
5. Halogen-Free FR4
Halogen-free FR4 materials are designed to meet environmental and safety requirements by eliminating halogens. Which can be harmful if released during PCB manufacturing or disposal. These materials are used in applications where reducing environmental impact is a priority. Halogen-free FR4 offers similar performance to standard FR4 but without the use of halogenated flame retardants.
Benefits of using FR4 as PCB material
Excellent Electrical Insulation
High Mechanical Strength
Flame Retardancy
Moisture Resistance
Cost-Effectiveness
Thermal Stability
Ease of Fabrication
Properties of FR4 material
Property
Parameter
Vertical flexural strength
Normal State: E-1/150, 150±5℃≥340Mpa
Parallel layer impact strength
≥230KJ/m
Insulation resistance after water immersion (d-24/23)
≥5.0×108Ω
Vertical electrical strength
≥14.2MV/m
Parallel layer breakdown
≥40KV
Relative Dielectric Constant (50hz)
≤5.5
Relative Dielectric Constant (1mhz)
≤5.5
Dielectric Loss Factor (50hz)
≤0.04
Dielectric Loss Factor (1mhz)
≤0.04
Water Absorption (D-24/23, 1.6mm Thickness)
≤19mg
Density
1.70-1.90g/cm³
Flammability
FV0
What is the Difference Between IMS and FR4 PCB?
IMS (Insulated Metal Substrate) and FR4 PCBs serve different purposes. IMS PCBs are designed for applications requiring efficient heat dissipation. They have a metal base layer that helps manage heat more effectively than FR4. This makes IMS ideal for high-power applications like LED lighting.
On the other hand, FR4 PCBs are used in general electronic applications due to their balance of performance and cost. While IMS excels in thermal management, FR4 is preferred for its electrical properties and versatility.
What is the Cost of FR4 PCB Per Square Inch?
The cost of an FR4 PCB can vary based on several factors. These include the board’s thickness, the number of layers, and the complexity of the design. On average, the cost per square inch of FR4 PCB ranges from $0.10 to $0.50. However, this is a rough estimate. For a precise quote, it’s best to contact PCB manufacturers with your specific requirements. If you are searching for a PCB supplier, EBest Circuit (Best Technology) is here to waiting for you.
Why is Rogers Better Than FR4 Material?
Rogers material is often considered superior to FR4 in high-frequency applications. Here are some key reasons why Rogers might be chosen over FR4.
Lower Dielectric Loss
Higher Thermal Conductivity
Improved Dimensional Stability
Consistent Dielectric Constant
Superior Performance in High-Frequency Applications
Compliance with Stringent Industry Standards
What Material is Similar to FR4?
Several materials are similar to FR4 and can be used as alternatives. One such material is CEM-1, which is also a composite material made from epoxy and fiberglass. It offers good mechanical strength and electrical properties but is less flame retardant than FR4.
Another alternative is polyimide, known for its excellent thermal stability and flexibility. It is often used in applications requiring high-temperature resistance. However, polyimide is more expensive than FR4. For specific applications, materials like PTFE (Teflon) can also be considered, especially in high-frequency applications.
FAQs
1. Can FR4 be used in high-temperature applications?
FR4 can withstand moderate temperatures, but for high-temperature applications, materials like polyimide are preferred.
2. Is FR4 environmentally friendly?
FR4 is not biodegradable but can be recycled to some extent. Proper disposal and recycling methods should be followed.
3. How does the thickness of FR4 affect PCB performance?
The thickness of FR4 can impact the board’s mechanical strength and thermal dissipation. Thicker boards offer more durability but may also increase the cost.
4. Are there any disadvantages to using FR4?
FR4 has limitations in high-frequency and high-temperature applications. It is also less effective in thermal management compared to materials like IMS.
5. Can FR4 PCBs be used in flexible circuits?
FR4 is rigid and not suitable for flexible circuits. For flexible applications, materials like polyimide are used. But recently, EBest Circuit (Best Technology) developed a new product called “semi-flexible FR4 PCB”, its flex area is made by FR4 material.
Is FR4 RoHS Compliant?
Yes, FR4 is RoHS compliant. This means that it meets the regulations set by the European Union to limit the use of specific hazardous materials found in electrical and electronic products.
What is FR4 Tg?
The glass transition temperature (Tg) of FR4 is a critical property that indicates the temperature at which the material transitions from a hard, glassy state to a soft, rubbery state.
EBest Circuit (Best Technology) excels not only in PCB and assembly manufacturing, but also in offering top-quality PCB design services. Our professional engineering team is ready to support your innovation across various industries, including communications, healthcare, industrial, and consumer electronics. We welcome all the questions or inquiries from you.
In the world of printed circuit boards (PCBs), understanding material properties is crucial. One such property is Tg, or glass transition temperature. For FR4 PCBs, knowing what Tg means can significantly impact design and performance. In this blog, we’ll explore what Tg is, how it’s measured, its importance, and other related questions.
What Does Tg Mean in PCB Manufacturing?
Tg stands for glass transition temperature. It refers to the temperature at which a polymer material, such as the resin in a PCB substrate, transitions from a hard, glassy state to a softer, rubbery state.
For the circuit board, the Tg value reflects the highest temperature it can withstand. When the temperature exceeds Tg values, the molecular structure of the circuit board material will be changed, lead to changes in its physical properties. Such as mechanical strength, size stability, adhesive, water imbibition, thermal expansion, etc. Therefore, the level of TG value of the PCB directly affects the stability and high temperature resistance of the circuit board.
In the high temperature environment, if the TG value of the circuit board is too low, it is easy to cause PCB deformation, fracture, cracking and other problems, affecting the reliability and life of the printed circuit board. If the TG value of the circuit board is too high, the PCB is easy to become hard and brittle, affecting the processability and flexibility of the circuit board.
How is Tg Measured in FR4 Materials?
Accurate measurement of Tg is crucial for ensuring the performance and reliability of FR4 PCBs. Knowing the exact Tg helps in selecting the appropriate material for specific applications, particularly those involving high temperatures and thermal cycling. Using materials with a Tg well above the operating temperature ensures the PCB will maintain its mechanical and electrical properties under expected conditions.
The primary method for measuring Tg in FR4 materials is by differential scanning calorimetry (DSC). It involves heating a small sample of the material at a controlled rate, typically between 10°C to 20°C/min. As the sample heats, the DSC measures the heat flow into the material and records it as a thermogram. The Tg is identified as the temperature where there is a noticeable change in heat capacity, appearing as a step or inflection point on the thermogram. DSC is widely used because it provides precise and reliable Tg measurements.
Additionally, Dynamic Mechanical Analysis (DMA) and Thermomechanical Analysis (TMA) also can be used to measure the Tg value.
Why is Glass Transition Temperature Critical in PCBs?
Glass transition temperature is critical because it affects the thermal and mechanical properties of the PCB. If a PCB operates near or above its Tg, it can experience issues like delamination, warping, and electrical failure. Here are some benefits of Tg.
Thermal stability
One of the main reasons is its role in determining thermal stability. During operation, PCBs are subjected to varying temperatures due to power dissipation from electronic components and environmental conditions. Make sure the Tg of the PCB material is well above the maximum operating temperature, it helps maintain mechanical stability and reliable performance under thermal stress.
Mechanical Strength
The Tg value also affects the mechanical strength and durability of the PCB. Below the Tg, the material is rigid and can withstand mechanical stress without significant deformation. This rigidity is essential for maintaining the structural integrity of the PCB, especially during assembly processes like soldering, where the board is subjected to mechanical and thermal stresses.
Thermal Management
Thermal management is very important to electronics, especially for those miniaturized electronic devices. If the PCB itself has good thermal management, then designers no need to install heatsink or coolers. Materials with higher Tg values exhibit lower coefficients of thermal expansion (CTE), meaning less expansion and contraction with temperature changes.
Application-specific requirements
Different applications have varying thermal and mechanical requirements. High-performance computing, automotive, aerospace, and industrial electronics often operate in environments with high temperatures and thermal cycling. For these applications, using PCB materials with appropriate Tg values is crucial.
What is the Typical Tg Value for Standard FR4 PCBs?
Standard FR4 materials generally have Tg values in the range of 130°C to 140°C. For high-performance applications, materials with higher Tg values are necessary. The table below lists some common high Tg materials used in PCB manufacturing, along with their Tg values and characteristics.
Material
Tg Value (°C)
Characteristics
Applications
ISOLA IS410
180
Excellent thermal and mechanical properties
High-reliability applications
Nanya NP-175
175
High thermal stability, good mechanical strength
Automotive, industrial electronics
Shengyi S1000H
170
Cost-effective, widely used
Consumer electronics, industrial applications
Ventec VT-47
170
High Tg and low CTE
High-density interconnect (HDI) PCBs
Rogers 4350B
280
Extremely high Tg, excellent thermal stability
RF and microwave applications
(Common used high Tg materials)
Can You Explain the Difference Between Tg and Td in PCBs?
Tg and Td (decomposition temperature) are two different thermal properties. Unlike the reversible physical change associated with Tg, decomposition is an irreversible chemical process. At Td, the polymer chains in the material break down, leading to a loss of structural integrity and release of volatile compounds. Key points about Td include:
1. Chemical Stability
Td represents the upper thermal limit of a material’s chemical stability. Exceeding Td results in the breakdown of the polymer structure, rendering the material unsuitable for further use.
2. Material Selection
Knowing the Td helps in selecting materials for high-temperature applications. A material’s Td should be well above the maximum operating temperature to prevent degradation.
3. Safety and Reliability
Operating a PCB above its Td can result in catastrophic failure, including charring, delamination, and loss of electrical performance. The operating temperature remains below Td is critical for safety and reliability.
How Do You Choose the Right Tg Value for Your PCB Design?
Choosing the right Tg value depends on the operating environment and thermal demands of your application. Consider factors such as the maximum operating temperature, the thermal cycling the PCB will undergo, and the mechanical stresses it will face. Consulting with material suppliers and using simulation tools can help make an informed decision. According to our 18 years experience in PCB, we summarized a recommend Tg value for each application. Hope this is useful for you guys.
Consumer electronics
If your PCB will be used in standard consumer electronics, just like smartphones and tablets, a Tg value of around 130°C to 140°C is typically sufficient. These devices generally do not encounter extreme temperatures or thermal cycling.
Automotive applications
Automotive PCBs are always exposed to high temperatures and significant thermal cycling. A Tg value of 170°C or higher is recommended to ensure reliability and performance under the hood. So, Rogers material is good for this kind of PCB.
Aerospace and defense
Applications in aerospace and defense require materials that can withstand extreme temperatures and harsh environments. High Tg materials with values of 180°C or more are often used to meet these stringent requirements.
Industrial Electronics
Industrial environments can vary widely, but generally, high Tg materials are preferred due to the exposure to high temperatures and mechanical stress. A Tg value of at least 150°C to 170°C is advisable.
EBest Circuit (Best Technology) is a well-known PCB and PCBA assembly provider in Asia and Vietnam. We have a large facility for handling low-medium to mass production PCBs, and supporting for various kinds of custom PCBs. Some special PCBs are available here, like bus bar PCB for new energy vehicles, heavy copper PCB for high power and high current PCBs, ceramic PCBs for harsh environments, extra thin PCB, RF PCB, microwaves PCB, IC substrate PCB and so on.
For more information, please do not hesitate to contact us.
Direct Plating Copper (DPC) is a ceramic circuit board developed on the basis of ceramic film processing. Aluminum nitride/alumina ceramic is used as the substrate of the circuit, and the composite metal layer on the surface of the substrate is sputtered, and the circuit is formed by electroplating and lithography. Its basic processes are:
Incoming Quality Control (IQC)
The process begins with the inspection of raw materials to ensure they meet strict quality standards. This step involves checking ceramic substrates for physical defects such as cracks, chips, or surface irregularities, and verifying material properties like thermal conductivity and dielectric strength. Advanced equipment such as microscopes and X-ray fluorescence (XRF) analyzers are used for thorough inspection, ensuring only the best materials proceed to the next stage.
Laser Drilling
Before laser drilling, a water-soluble, food-grade substrate pigment is brushed onto the ceramic substrate to reduce reflectivity and enhance laser drilling effectiveness. After drying in an oven, a laser drilling machine is used to drill through the substrate, creating pathways for connections between the upper and lower surfaces. Depending on the ceramic material, different laser wavelengths such as infrared, green light, ultraviolet, or CO2 are used to burn away the material with each laser pulse.
Laser Marking
Laser marking involves using a laser marking machine to engrave product QR codes onto the ceramic substrate. This step ensures precise and permanent identification marks on the PCB.
Ultrasonic Cleaning
After laser drilling and marking, the substrates are cleaned to remove any attached particles or residues. This involves coarse and fine debris removal using ultrasonic cleaning, followed by water washing to eliminate any remaining particles. The cleaned substrates undergo micro-etching to roughen the surface, enhancing the effectiveness of subsequent magnetron sputtering, and are then dried to remove surface moisture.
Magnetron Sputtering
In the magnetron sputtering process, a high-vacuum chamber is used to ionize argon gas, producing an ion stream that bombards a target cathode. This causes atoms of the target material to be ejected and deposited as a thin film on the ceramic substrate. Pre-sputtering treatments such as dust removal, degreasing, and slow pulling are conducted to ensure optimal results.
Chemical Copper Plating
Chemical copper plating thickens the copper layer, improving the conductivity of the vias and ensuring better adhesion with the sputtered copper layer. This catalytic redox reaction involves pre-treatment steps like degreasing, micro-etching, pre-immersion, activation, and acceleration to ensure proper copper deposition.
Full-Panel Electroplating
Full-panel electroplating increases the thickness of the copper layer. This involves processes such as degreasing, micro-etching, acid washing, copper plating, and stripping excess copper from the fixtures. The copper plating uses copper balls as anodes and an electrolyte solution of CuSO4 and H2SO4, with the primary reaction being Cu2+ + 2e- → Cu.
Grinding, Laminating, Exposure, and Developing
Post electroplating, the copper layer is prepared for patterning. This includes acid washing to remove oxides, grinding to roughen and clean the surface, laminating with a photoresist dry film, UV exposure through a photomask to create the desired pattern, and developing to dissolve unexposed areas, leaving behind the patterned photoresist.
Pattern Plating (Electroplating Copper)
The exposed and developed areas of the substrate where the circuit pattern is defined undergo further copper electroplating to thicken the circuit traces.
Etching and Stripping
Unwanted copper and dry film are removed through etching, stripping away excess copper deposited in previous steps. This includes rough grinding, film stripping, copper etching, and titanium etching, ensuring only the desired circuit pattern remains.
Annealing
The ceramic boards are annealed in a furnace to relieve stresses introduced during electroplating, enhancing the ductility and toughness of the copper layer and ensuring dense copper grain packing.
Belt Grinding
Post-annealing, the substrate surface may have an oxide layer and rough texture. Belt grinding is used to remove these oxides and smoothen the surface, ensuring the quality of subsequent gold or silver surface treatments.
Flying Probe Testing
High-speed flying probe testers check for continuity and shorts in the vias and circuit traces, ensuring electrical integrity.
Sandblasting Before Solder Mask
Prior to solder mask application, the substrate undergoes sandblasting to roughen and clean the surface, removing oxides and contaminants. This includes acid washing, sandblasting, and micro-etching.
Solder Mask Printing
Solder mask is printed on areas of the PCB that do not require soldering, protecting the circuits during soldering and assembly. Screen printing applies solder mask ink, which is then UV-cured and developed to remove unexposed areas.
Sandblasting After Solder Mask
After solder mask application, exposed areas that need surface treatments undergo sandblasting to roughen the surface and remove oxides, preparing for gold or silver plating.
Surface Treatment
Surface treatments like electroless or electrolytic plating of gold, silver, or other metals are applied to the solder pads, enhancing solderability and preventing oxidation.
Laser Cutting
Laser cutting equipment precisely cuts the finished PCBs from the manufacturing panel, ensuring accurate dimensions and clean edges.
Testing
Various testing equipment, including thickness gauges, Automated Optical Inspection (AOI) machines, and ultrasonic scanning microscopes, are used to inspect the PCBs’ performance and appearance, ensuring they meet quality standards.
Packaging and Shipping
Finally, the PCBs are vacuum-packed using packaging machines to protect them during transport. They are then stored and shipped to customers, ensuring they arrive in perfect condition.
Above is the all the processes of DPC muanufacturing. If you are interested in process of other PCBs, welcome to contact us.
Ceramic PCBs are a special breed of printed circuit boards known for their exceptional thermal resistance and durability. These PCBs are used in industries where high performance is critical, such as aerospace, automotive, medical devices, and power electronics. Nowadays, the most common types of ceramic PCB are thick film, DCB, DPC, AMB, HTCC, LTCC and thin film. In this article, we will introduce each of them in details.
Thick Film Ceramic PCB
Thick film technology is a process by using screen printing conductor paste and directly deposit slurry (conductor) on the ceramic substrate. Then sintering it under high temperature to form conductive circuit traces and electrodes, which is suitable for most ceramic substrates.
After the material is sintered at high temperature, a strong adhesion film will be formed on the ceramic circuit board, repeat this step for many times, a multi-layer circuit is generated.
You can print resistor or capacitor on the surface to get a interconnected structure. At EBest Circuit (Best Technology), we can make all the resistors with the same value, or different value for different resistor on the same board.
Thick film ceramic PCB has advantages on the simple manufacturing process, but it has some drawbacks that can’t be ignored:
Limited by the conductive paste and screen size
Line width less than 100um is difficult to achieved
Three-dimensional patterns are not available
Not suitable for fine-trace project
DBC / DCB Ceramic PCB
Direct Bonded Copper (DBC) or Direct Copper Bonded (DCB) ceramic PCBs are known for their excellent thermal conductivity. They are made by bonding a layer of copper directly onto a ceramic substrate, typically aluminum oxide or aluminum nitride. Due to the DBC technology is directly bond copper on the ceramic substrate, it can achieve thicker copper thickness to 300um. So, it is very suitable for high power applications.
The basic chemistry principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the application process. Copper and oxygen will form Cu-O eutectic liquid under 1065℃~1083℃. This is an important element in the manufacturing. DBC ceramic circuit board uses this eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4, achieving the combination between substrate and copper foil.
However, it is easy to generate micro-porosity between Al2O3 and Copper during the copper bonded process, and it doesn’t have a good solution by far. That is why the yield of DBC ceramic PCB is not good than DPC.
DPC (Direct Plated Copper Ceramic PCB)
DPC ceramic PCB utilizes direct copper plating technology, deposit copper foil on the alumina oxide (Al2O3) substrate. It is the most commonly used ceramic PCB in recent years. The circuit generated process is: pre-treatment – sputtering – exposure – develop – etch – strip – electroplating.
AMB (Active Metal Brazed Ceramic PCB)
AMB ceramic copper clad plate adopts the active brazing process, and the copper layer bonding force is higher than that of DPC, which is around 18n/mm – 21n/mm. AMB ceramic copper clad plate usually has a high binding force, usually makes thicker copper, between 100um and 800um. The AMB ceramic PCB generally rarely design traces or holes, even if there is a trace is very simple, the spacing is relatively wide.
HTCC (High Temperature Co-fired Ceramic PCB)
HTCC is a relatively early development technology, but due to the high sintering temperature (1300~1600℃), the choice of electrode materials is limited. Meanwhile, its cost is more expensive, these promotes the development of HTCC is relatively slow.
LTCC (Low Temperature Co-fired Ceramic PCB)
Although LTCC reduces the co-firing temperature to about 850 ° C, the disadvantage is that the dimensional accuracy and product strength are not easy to control.
Thin Film Ceramic Circuit Board
The thin film ceramic PCB is to deposit a metal layer directly on the surface of substrate by sputtering process. Through lithography, development, etching and other processes, the metal layer can also be graphed into a circuit pattern. Due to the low deposition speed of sputtering coating (generally less than 1μm/h), thin film substrate surface metal layer thickness is small and can prepare high pattern accuracy (line width/line space less than 10μm).
Common Ceramic Substrates
EBest Circuit (Best Technology) is a leading ceramic PCB manufacturer in Asia, our core members has over 20 years manufacturing experience in ceramic PCB fabricating. “High mixed, low volume, high quality, fast delivery” is our advantages and we always try our best to do that, make ourselves better and better. If you are interested in it, feel free to contact us, we are always online.
In our daily life, electronic devices are existing everywhere. And there are many people know the “PCB” nowadays, while very less people know the “PWB”. Unless you’ve been in the PCB business for more than 20 years.
Actually, PWB is another term of circuit board, and it was used commonly before the year 1999. But with the development of electronics, it was replaced by PCB gradually. You want to know more about it? In this article, we will answer it for you. Deeply explain their definitions, manufacturing process, applications and the key differences between PCB and PWB.
What is A Printed Circuit Board (PCB)?
A Printed Circuit Board is a fundamental component in modern electronics, providing the physical and electrical connections for various electronic components. It consists of multiple compositions, including a non-conductive substrate, conductive pathways, and insulating layers, which facilitate the complex circuitry required in contemporary devices. A PCB can be made into single sided PCB, double sided PCB and multilayer PCB.
PCBs are integral to the functionality of a wide range of electronic products, from consumer gadgets like smartphones and computers to industrial machinery, medical devices, and aerospace systems. The advanced design and manufacturing processes involved in PCB production ensure high reliability and performance, making them essential in virtually all electronic applications.
Basic manufacturing process of PCB
Design and Layout
PCBs are designed using sophisticated computer-aided design (CAD) software. Designers create detailed layouts, specifying the placement of components, conductive pathways, and vias (interlayer connections). The design is converted into Gerber files, a standard format for PCB fabrication that contains all the necessary information for manufacturing. These files are essential for ensuring precision and accuracy during the manufacturing process.
Material Preparation
The substrate, typically FR4 (fiberglass epoxy laminate), is prepared. FR4 is known for its excellent mechanical strength and thermal stability, making it an ideal base material for PCBs. Copper sheets are laminated onto the substrate, which will form the conductive pathways after the etching process. This preparation stage is crucial for creating a reliable foundation for the PCB.
Printing the Circuit Pattern
A photoresist, a light-sensitive material, is applied to the copper-clad substrate. The board is exposed to ultraviolet (UV) light through a mask that defines the circuit pattern. The UV light hardens the photoresist in the exposed areas. The board is then developed in a chemical solution that removes the unexposed photoresist, revealing the copper to be etched away. This step accurately transfers the circuit design onto the board.
Etching
The board is immersed in an etching solution, commonly ferric chloride or ammonium persulfate, which removes the unprotected copper, leaving only the desired circuit pattern. This etching process is crucial for defining the conductive pathways on the PCB, ensuring that the correct connections are made according to the design specifications.
Drilling
Precision drilling machines are used to create holes for through-hole components and vias. These holes are then cleaned to remove any debris that could affect electrical connectivity. Drilling is a critical step in the PCB manufacturing process as it ensures proper placement and connection of components across different layers of the board.
Plating
The drilled holes are plated with copper to create electrical connections between the layers, which is especially important for multilayer PCBs. Additional layers of plating, such as nickel or gold, may be applied to improve conductivity and protect against oxidation. This plating process enhances the durability and performance of the PCB.
Solder Mask Applying
A solder mask is applied to protect the copper traces from oxidation and prevent solder bridges between closely spaced solder pads. The solder mask is exposed to UV light and then developed to reveal the solder pads. This layer not only protects the PCB but also improves its appearance and reliability.
Silkscreen Printing
A silkscreen layer is printed on the board to add text, component labels, and other identifiers. This layer helps in the identification and assembly of components, making it easier for technicians to work with the PCB during the manufacturing and repair processes.
Surface Finishing
Generally, a layer of surface finishing is coated on the PCB to protect its surface, it also called surface treatment. The common surface treatments are HASL-LF, ENIG, ENEPIG, OSP, Immersion Silver/Tin. Of course, different treatment offers different function, like OSP is to protect surface from oxidation, HASL-LF provides a good solderability, ENEPIG make sure the chemistry corrosion. Choose a suitable one according to your specific demands.
Assembly and Testing
Components are placed on the board using automated pick-and-place machines, and soldered using techniques like reflow soldering for surface-mount devices (SMD) and wave soldering for through-hole components. The finished PCB undergoes various tests, such as automated optical inspection (AOI), electrical testing, and functional testing, to ensure quality and performance. Want see the whole manufacturing process of a multilayer PCB, click here: Manufacturing Process of Multi-layer PCB.
What is the definition of Printed Wiring Board (PWB)?
A Printed Wiring Board is a term historically used to describe a type of circuit board that focuses primarily on the layout and wiring of electronic connections rather than the overall circuit functionality. PWBs emphasize the physical arrangement of conductive paths to connect various components but do not necessarily include all the integrated features found in modern PCBs.
This term was more prevalent during the earlier stages of electronic development, where the primary concern was establishing reliable electrical connections. As technology advanced, the term PCB became more common, reflecting the expanded capabilities and comprehensive role of these boards in forming complete electronic circuits. Despite being less common today, understanding the term PWB is crucial for historical context and certain niche applications.
How to Manufacture A Printed Wiring Board (PWB)?
Design and Layout
PWBs typically have simpler designs focused on wiring patterns rather than complex circuitry. In some cases, the layout may be done manually or using basic design software.
Material Preparation
Simpler substrates such as phenolic or epoxy resins may be used for PWBs. Copper sheets are laminated onto the substrate to form the conductive pathways. These materials are cost-effective and suitable for applications where advanced performance characteristics are not required.
Printing the Wiring Pattern
Similar to PCBs, a photoresist is applied to the copper-clad substrate. The board is then exposed to UV light through a mask and developed to reveal the copper to be etched away. This process creates the wiring pattern necessary for connecting electronic components.
Etching
The board is immersed in an etching solution to create the wiring pattern. This step is straightforward compared to the more intricate etching processes used in PCB manufacturing, reflecting the simpler requirements of PWBs.
Drilling
Holes for through-hole components are drilled, but the process may not require the precision needed for complex PCBs. This basic drilling process is adequate for the less demanding applications of PWBs.
Plating (if necessary)
Plating is done to ensure electrical connectivity but may not involve advanced techniques like those used for multilayer PCBs. It suffices for the simpler construction of PWBs.
Solder Mask Application
A basic solder mask may be applied to protect the wiring pattern. This layer provides sufficient protection for the relatively simple designs of PWBs, preventing short circuits and oxidation.
Silkscreen Printing
A simple silkscreen layer may be added for component identification. This helps in the assembly process but does not require the detailed labeling often necessary for PCBs.
Assembly and Testing
Components are manually or semi-automatically placed on PWBs and soldered using standard techniques. Basic electrical testing is conducted to ensure functionality. This simpler assembly and testing process aligns with the less complex nature of PWBs.
Which Kind of Materials used in PCB and PWB?
Substrate Materials
FR4 (fiberglass epoxy laminate) is the most common substrate material for PCBs due to its excellent mechanical strength and thermal stability. Phenolic resin, used in PWBs for simpler applications, is less durable and has lower thermal stability compared to FR4, but it is cost-effective and suitable for basic electronic devices. Polyimide is used for flexible PCBs due to its high flexibility and thermal resistance, making it ideal for applications requiring bending and flexing, such as wearable electronics and flexible displays.
Conductive Materials
Copper is the primary conductive material for both PCBs and PWBs. It is used to create the conductive pathways and pads, providing excellent electrical conductivity and reliability. Gold, nickel, and silver are used for plating to enhance conductivity and protect against oxidation, primarily in PCBs. These materials improve the durability and performance of the PCB by providing a reliable contact surface for soldering and component connections.
Insulating Materials
Prepreg, a fiberglass cloth impregnated with resin, is used in multilayer PCBs to bond the layers together. Prepreg provides mechanical strength and electrical insulation between the layers. Dielectric materials are used between layers in multilayer PCBs to provide electrical insulation, maintaining signal integrity and preventing short circuits.
Solder Mask Materials
Liquid Photo Imageable (LPI) solder mask is the most common type used in PCBs, providing excellent protection and durability. LPI solder masks are applied using a photolithographic process, ensuring precise coverage and protection. Dry film solder mask is used for simpler applications and PWBs. This type of solder mask is less expensive and easier to apply but may not offer the same level of protection as LPI solder masks.
Key differences between PCB and PWB
Feature
PCB (Printed Circuit Board)
PWB (Printed Wiring Board)
Design and Layout
Designed using sophisticated CAD tools for complex circuitry, including detailed simulation and optimization.
Simpler designs focused on wiring patterns, often done manually or with basic software.
Layer Count
Can have multiple layers (e.g., double-sided, multilayer) to support intricate circuit designs.
Generally single or double-sided, less commonly multilayer.
Component Types
Supports surface-mount technology (SMT) and through-hole technology (THT) components.
Designed to maintain high signal integrity, minimizing electrical noise and interference.
Basic signal integrity management, sufficient for simple applications.
Flexibility and Rigidity
Includes both rigid and flexible PCBs, allowing for a wide range of applications.
Typically rigid, not commonly used in flexible applications.
Terminology and Usage
Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits. Also called “bare board”.
Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits.
Industry Standards
Recognized by standards organizations like IPC, IEC, and ANSI with specific performance and quality criteria.
Covered under broader standards but with fewer specific guidelines due to limited modern use.
Cost and Efficiency
Higher cost due to advanced materials and processes, offering superior performance and reliability.
More cost-effective for simple applications, but with limited performance and reliability.
Applications
Used in consumer electronics, industrial equipment, medical devices, aerospace, and defense.
Historically used in simpler electronic devices and early computers, still relevant in niche applications.
(Summary Differences: PCB VS PWB)
Other Terms Related to PWB and PCB
Based on the PCB and PWB, you may still hear about CCA, PCA, PWA during the PCB working. These terms are also related to printed circuit board. Here is a detailed explanation of each:
Printed Wiring Assembly (PWA)
PWA is the abbreviation for printed wiring assembly. This is an archaic term that was once used to describe what we now refer to as PCB assembly or PCBA. Although it is less common today, understanding this term is useful for historical context and when dealing with older documentation.
Circuit Card Assembly (CCA)
CCA stands for circuit card assembly. It is essentially the same thing as PCBA, where the PCB is assembled with all necessary components to create a functional unit. CCA is a less frequently used term compared to PCBA but is still recognized in certain industries and contexts.
Printed Circuit Board Assembly (PCBA)
PCBA is the abbreviation for printed circuit board assembly. When the PCB is assembled with all its electronic components by SMT technology, it is called PCBA or PCB assembly. Since a change in terminology in 1999, PCBA has become the standard term used for all assembled circuit boards. From users to technical committees, PCBA is the preferred term for referring to assembled boards. The assembly process involves placing and soldering components onto the PCB, making it a functional electronic circuit.
Printed Circuit Assembly (PCA)
PCA stands for printed circuit assembly, which is another term for PCBA. Like CCA, PCA is not commonly used in modern terminology but refers to the same concept of an assembled printed circuit board.
In a word, whatever for PWB, PCB, or circuit cards, they are refer to bare printed circuit boards (bare boards). While PCA, CCA, PWA, and PCBA refer to assembled circuit boards. Among these terms, PCB and PCBA are the most widely used in both industry and technical documentation.
This is the end of this introduction of PWB and PCB, welcome to contact us if you want more about PCB knowledge.
