How does a DPC Ceramic PCB Manufactured?

July 6th, 2024

Direct Plating Copper (DPC) is a ceramic circuit board developed on the basis of ceramic film processing. Aluminum nitride/alumina ceramic is used as the substrate of the circuit, and the composite metal layer on the surface of the substrate is sputtered, and the circuit is formed by electroplating and lithography. Its basic processes are:

Incoming Quality Control (IQC)

The process begins with the inspection of raw materials to ensure they meet strict quality standards. This step involves checking ceramic substrates for physical defects such as cracks, chips, or surface irregularities, and verifying material properties like thermal conductivity and dielectric strength. Advanced equipment such as microscopes and X-ray fluorescence (XRF) analyzers are used for thorough inspection, ensuring only the best materials proceed to the next stage.

Laser Drilling

Before laser drilling, a water-soluble, food-grade substrate pigment is brushed onto the ceramic substrate to reduce reflectivity and enhance laser drilling effectiveness. After drying in an oven, a laser drilling machine is used to drill through the substrate, creating pathways for connections between the upper and lower surfaces. Depending on the ceramic material, different laser wavelengths such as infrared, green light, ultraviolet, or CO2 are used to burn away the material with each laser pulse.

How does a DPC Ceramic PCB Manufactured?

Laser Marking

Laser marking involves using a laser marking machine to engrave product QR codes onto the ceramic substrate. This step ensures precise and permanent identification marks on the PCB.

Ultrasonic Cleaning

After laser drilling and marking, the substrates are cleaned to remove any attached particles or residues. This involves coarse and fine debris removal using ultrasonic cleaning, followed by water washing to eliminate any remaining particles. The cleaned substrates undergo micro-etching to roughen the surface, enhancing the effectiveness of subsequent magnetron sputtering, and are then dried to remove surface moisture.

Magnetron Sputtering

In the magnetron sputtering process, a high-vacuum chamber is used to ionize argon gas, producing an ion stream that bombards a target cathode. This causes atoms of the target material to be ejected and deposited as a thin film on the ceramic substrate. Pre-sputtering treatments such as dust removal, degreasing, and slow pulling are conducted to ensure optimal results.

Chemical Copper Plating

Chemical copper plating thickens the copper layer, improving the conductivity of the vias and ensuring better adhesion with the sputtered copper layer. This catalytic redox reaction involves pre-treatment steps like degreasing, micro-etching, pre-immersion, activation, and acceleration to ensure proper copper deposition.

Full-Panel Electroplating

Full-panel electroplating increases the thickness of the copper layer. This involves processes such as degreasing, micro-etching, acid washing, copper plating, and stripping excess copper from the fixtures. The copper plating uses copper balls as anodes and an electrolyte solution of CuSO4 and H2SO4, with the primary reaction being Cu2+ + 2e- → Cu.

Grinding, Laminating, Exposure, and Developing

Post electroplating, the copper layer is prepared for patterning. This includes acid washing to remove oxides, grinding to roughen and clean the surface, laminating with a photoresist dry film, UV exposure through a photomask to create the desired pattern, and developing to dissolve unexposed areas, leaving behind the patterned photoresist.

Pattern Plating (Electroplating Copper)

The exposed and developed areas of the substrate where the circuit pattern is defined undergo further copper electroplating to thicken the circuit traces.

Etching and Stripping

Unwanted copper and dry film are removed through etching, stripping away excess copper deposited in previous steps. This includes rough grinding, film stripping, copper etching, and titanium etching, ensuring only the desired circuit pattern remains.

Annealing

The ceramic boards are annealed in a furnace to relieve stresses introduced during electroplating, enhancing the ductility and toughness of the copper layer and ensuring dense copper grain packing.

Belt Grinding

Post-annealing, the substrate surface may have an oxide layer and rough texture. Belt grinding is used to remove these oxides and smoothen the surface, ensuring the quality of subsequent gold or silver surface treatments.

Flying Probe Testing

High-speed flying probe testers check for continuity and shorts in the vias and circuit traces, ensuring electrical integrity.

Sandblasting Before Solder Mask

Prior to solder mask application, the substrate undergoes sandblasting to roughen and clean the surface, removing oxides and contaminants. This includes acid washing, sandblasting, and micro-etching.

Solder Mask Printing

Solder mask is printed on areas of the PCB that do not require soldering, protecting the circuits during soldering and assembly. Screen printing applies solder mask ink, which is then UV-cured and developed to remove unexposed areas.

Sandblasting After Solder Mask

After solder mask application, exposed areas that need surface treatments undergo sandblasting to roughen the surface and remove oxides, preparing for gold or silver plating.

Surface Treatment

Surface treatments like electroless or electrolytic plating of gold, silver, or other metals are applied to the solder pads, enhancing solderability and preventing oxidation.

Laser Cutting

Laser cutting equipment precisely cuts the finished PCBs from the manufacturing panel, ensuring accurate dimensions and clean edges.

Testing

Various testing equipment, including thickness gauges, Automated Optical Inspection (AOI) machines, and ultrasonic scanning microscopes, are used to inspect the PCBs’ performance and appearance, ensuring they meet quality standards.

Packaging and Shipping

Finally, the PCBs are vacuum-packed using packaging machines to protect them during transport. They are then stored and shipped to customers, ensuring they arrive in perfect condition.

Above is the all the processes of DPC muanufacturing. If you are interested in process of other PCBs, welcome to contact us.

Tags: ceramic pcb manufacturing, dpc ceramic pcb
Posted in best pcb, bestpcb, Ceramic PCB, DBC substrate, Design Guide, PCB News, PCB Technology | No Comments »

What are the advantages of ceramic PCB?

July 6th, 2024

Ceramic PCB is a type of emerging PCB in the recent years, they are known for their high thermal conductivity and low expansion coefficient. Except this, it has numerous advantages that normal FR4 PCB can not achieved. And even for metal core PCB (MCPCB). Today, we are going to introduce their characteristics in detail.

1. High thermal conductivity

The core metal content of ceramic circuit boards is as high as 96-98%, which makes them have extremely high thermal conductivity. Compared with ordinary FR4 circuit boards, the thermal conductivity of ceramic circuit boards can reach 170-230 W/mK, while the thermal conductivity of FR4 boards is usually only 0.3-0.4 W/mK. Higher thermal conductivity allows for more efficient heat dissipation, avoiding the problem of damage to electronic components due to overheating. This is particularly important in high-power applications, such as LEDs and power semiconductors.

2. Low thermal expansion coefficient

Ceramic materials have a very low coefficient of thermal expansion (CTE), usually between 6-8 ppm/°C. In contrast, FR4 material has around 14-16 ppm/°C CTE. This means that ceramic materials hardly expand or contract when temperature changes. The low thermal expansion coefficient improves the reliability of the circuit board, reduces the influence of the thermal cycle on the circuit board structure and the connection of electronic components. Especially suitable for use in the environment with frequent temperature changes.

3. High surface hardness

The surface hardness of ceramic materials is up to 9 Mohs, which is harder than aluminum oxide and silicon. It means ceramic PCB has more wear-resistant, scratch resistant, and not easy to damage. It enables to run stably for a long time even in harsh physical environments, extending the service life of the board. That is why ceramic PCB is always recommended to use in military.

4. High compressive strength

The compressive strength of the ceramic circuit board can reach 450-500 MPa, which can withstand large mechanical pressure without deformation or rupture. This characteristic makes them excellent in applications that require them to withstand mechanical stress, such as industrial automation and aerospace.

5. High dielectric strength

Ceramic PCB has very high dielectric strength, usually between 15-25 kV/mm. And it can withstand higher electric fields without electrical breakdown.

6. Ability to withstand higher temperatures

Ceramic circuit boards can operate at temperatures up to 1000°C without degradation or damage. While FR4 circuit boards typically operate at an upper limit of 140-170°C. Ceramic circuit boards are suitable for electronic devices in high temperature environments, such as electric vehicles and high-power lasers.

7. High breakdown voltage

The high breakdown voltage of the ceramic circuit board can reach 20-35 kV, ensuring reliable operation under high voltage conditions. It is well suitable for use in high-voltage power supplies and power electronic equipment, providing higher safety.

8. Does not absorb water

The water absorption of ceramic materials is usually less than 0.1%, while the water absorption of FR4 materials is 0.1-0.2%. The non-water absorbing feature prevents performance degradation and damage caused by water absorption in a humid environment. It is ideal for Marine, medical, and other applications that require moisture resistance.

9. Low loss at high frequency

In high-frequency applications, the dielectric loss Angle tangent (Df) of ceramic circuit boards is usually between 0.0001-0.001, while the loss Angle tangent of FR4 materials is 0.02-0.03. Low loss ensures signal integrity and transmission efficiency, which is suitable for communication equipment and high-frequency electronic equipment.

10. Resistance to cosmic rays

Ceramic materials can resist the impact of cosmic rays, will not be degraded or damaged by rays. They are suitable for satellite electronic equipment, ensuring the stability and reliability of the circuit board in a high radiation environment.

11. No organic ingredients

Ceramic circuit boards do not contain organic components, so they have high chemical stability, are not susceptible to chemical corrosion and decomposition. They are good choice to use in harsh chemical environments.

12. High-density assembly

Ceramic circuit boards support high-density assembly with line/pitch resolution of 20 microns. This allows them to be adapted to more complex and refined circuit designs, suitable for microelectronics and high-precision applications.

Best Technology provides professional one-stop ceramic PCB design and manufacturing service all around the world. We welcome all the friends and partners from domestic and abroad to visit our ceramic circuit board workshop.

Tags: advantages of ceramic pcb, ceramic pcb deisgn
Posted in best pcb, bestpcb, Ceramic PCB, DBC substrate, Design Guide, FR4 PCB, Metal Core PCB, Special PCB | No Comments »

What Are the Different Types of Ceramic PCBs?

July 6th, 2024

Ceramic PCBs are a special breed of printed circuit boards known for their exceptional thermal resistance and durability. These PCBs are used in industries where high performance is critical, such as aerospace, automotive, medical devices, and power electronics. Nowadays, the most common types of ceramic PCB are thick film, DCB, DPC, AMB, HTCC, LTCC and thin film. In this article, we will introduce each of them in details.

What are the different types of ceramic pcbs?

Thick Film Ceramic PCB

Thick film technology is a process by using screen printing conductor paste and directly deposit slurry (conductor) on the ceramic substrate. Then sintering it under high temperature to form conductive circuit traces and electrodes, which is suitable for most ceramic substrates.

After the material is sintered at high temperature, a strong adhesion film will be formed on the ceramic circuit board, repeat this step for many times, a multi-layer circuit is generated.

You can print resistor or capacitor on the surface to get a interconnected structure. At Best Technology, we can make all the resistors with the same value, or different value for different resistor on the same board.

Thick film ceramic PCB has advantages on the simple manufacturing process, but it has some drawbacks that can’t be ignored:

Limited by the conductive paste and screen size
Line width less than 100um is difficult to achieved
Three-dimensional patterns are not available
Not suitable for fine-trace project

DBC / DCB Ceramic PCB

Direct Bonded Copper (DBC) or Direct Copper Bonded (DCB) ceramic PCBs are known for their excellent thermal conductivity. They are made by bonding a layer of copper directly onto a ceramic substrate, typically aluminum oxide or aluminum nitride. Due to the DBC technology is directly bond copper on the ceramic substrate, it can achieve thicker copper thickness to 300um. So, it is very suitable for high power applications.

The basic chemistry principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the application process. Copper and oxygen will form Cu-O eutectic liquid under 1065℃~1083℃. This is an important element in the manufacturing. DBC ceramic circuit board uses this eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4, achieving the combination between substrate and copper foil.

However, it is easy to generate micro-porosity between Al2O3 and Copper during the copper bonded process, and it doesn’t have a good solution by far. That is why the yield of DBC ceramic PCB is not good than DPC.

DPC (Direct Plated Copper Ceramic PCB)

DPC ceramic PCB utilizes direct copper plating technology, deposit copper foil on the alumina oxide (Al2O3) substrate. It is the most commonly used ceramic PCB in recent years. The circuit generated process is: pre-treatment – sputtering – exposure – develop – etch – strip – electroplating.

AMB (Active Metal Brazed Ceramic PCB)

AMB ceramic copper clad plate adopts the active brazing process, and the copper layer bonding force is higher than that of DPC, which is around 18n/mm – 21n/mm. AMB ceramic copper clad plate usually has a high binding force, usually makes thicker copper, between 100um and 800um. The AMB ceramic PCB generally rarely design traces or holes, even if there is a trace is very simple, the spacing is relatively wide.

HTCC (High Temperature Co-fired Ceramic PCB)

HTCC is a relatively early development technology, but due to the high sintering temperature (1300~1600℃), the choice of electrode materials is limited. Meanwhile, its cost is more expensive, these promotes the development of HTCC is relatively slow.

LTCC (Low Temperature Co-fired Ceramic PCB)

Although LTCC reduces the co-firing temperature to about 850 ° C, the disadvantage is that the dimensional accuracy and product strength are not easy to control.

Thin Film Ceramic Circuit Board

The thin film ceramic PCB is to deposit a metal layer directly on the surface of substrate by sputtering process. Through lithography, development, etching and other processes, the metal layer can also be graphed into a circuit pattern. Due to the low deposition speed of sputtering coating (generally less than 1μm/h), thin film substrate surface metal layer thickness is small and can prepare high pattern accuracy (line width/line space less than 10μm).

Common Ceramic Substrates

Best Technology is a leading ceramic PCB manufacturer in Asia, our core members has over 20 years manufacturing experience in ceramic PCB fabricating. “High mixed, low volume, high quality, fast delivery” is our advantages and we always try our best to do that, make ourselves better and better. If you are interested in it, feel free to contact us, we are always online.

Tags: amb pcb, ceramic PCB, htcc ceramic pcb, ltcc ceramic pcb, thick film ceramic pcb, thin film ceramic pcb
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Leading Ceramic PCB Board Manufacturer – Best Technology

July 5th, 2024

With the gradual deepening of electronic technology in various application fields, the highly integrated circuit board has become an inevitable trend. Under this situation, the disadvantage of traditional circuit board FR-4 and CIM-3 in TC (thermal conductivity) has become a drawback to delay the development of electronic technology. Though the metal core PCBs are known for their good thermal management, they hard to meet the fast heat dissipation and miniaturization of the devices at the same time. This is why ceramic PCB stands out.

What is Ceramic PCB?

A ceramic PCB is a type of PCB made from ceramic materials, such as alumina (Al2O3), ALN (aluminum nitride), or Beryllium Oxide (BeO). These materials are prepared by using thermal conductive ceramic powder and organic adhesive under the condition of below 250℃. Ceramic powders are not easy to made, especially for aluminum nitride powder, this is one of reasons that why ALN ceramic PCB is more expensive.

There are some different methods to make ceramic PCBs, commonly in the market are thick film, DBC, DPC and thin film technology. Different types of ceramic circuit boards have its unique characteristics. May you heard about HTCC, LTCC and AMB, they are also the ways to make ceramic PCBs, but there just a few manufacturers can make. Here is a HTCC ceramic PCB that we made.

Why Ceramic PCBs are popular used?

Different from the traditional FR-4 PCB (wave fiber), ceramic PCBs have good high-frequency properties, electrical properties that organic materials can’t achieved. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The main advantages of ceramic circuit board including:

Higher thermal conductivity
More matched thermal expansion coefficient (CTE)
Lower resistance
Good weldability and can be used in high temperature
Good insulation
Lower high-frequency loss
High density assembly available
No organic ingredients, resistance to cosmic rays, high reliability in aerospace
No oxide layer in copper layer, so it can be used for a long time in a reducing atmosphere

Who is the Best Ceramic PCB Manufacturer?

There are so many PCB manufacturers in the domestic and aboard, but reliable ceramic PCB vendors with good quality and reasonable price are very few. If you are looking for an experienced one, then keep the change. We’re the best option! Best Technology offers ceramic PCBs for our customers more than 100k every year, and we are high mixed from thick film ceramic PCB, DPC ceramic PCB, DBC/DCB ceramic PCB to AMB. Your PCBs need to use in automotives? Don’t worry, we gained IATF16949 and ISO13485 certifications, and all the manufacturing processes are strictly followed by ISO9001 quality control system. We welcome all the questions and inquiries from everyone.

Here is our ceramic PCB manufacturing capability for your reference.

Ceramic PCB Manufacturing Capability
No.	Item		General Parameter	Special Process
1	Substrate	High insulation, chemical corrosion resistance, high-temperature resistance	Al2O3	Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
2		Excellent thermal conductivity, low thermal expansion coefficient, and high-temperature resistance	AIN
3		Insulation performance and high-temperature stability	ZTA
4		High strength, high hardness, high thermal conductivity, and low dielectric loss	Si3N4
5		Conductor	Tungsten（LTCC/HTCC)、Au、Au&Pd、Au&Pb、Ag、Ag&Pd、Ag&Pb
6	Layer Count	DPC	Single – Double sided
7		DBC	Single – Double sided
8		AMB	Single – Double sided
9		Thick film	Single – Double sided, 4L
10		LTCC	Single – Double sided, 4L, 6L	6L – 14L
11		HTCC	Single – Double sided, 4L, 6L
12	Copper Thickness	Inner layer	/
13	Copper Thickness	Outer layer	Hoz-3oz (DPC), 3oz-12oz(DBC/AMB)
14	Dimension	Max. dimension	130*180	Larger dimension available (pass evaluation)
15		Min. dimension	2*2	Shipped in panel
16		Substrate thickness	Al2O3/AIN 0.38. 0.635, 1.0mm, Si3N4 0.25、0.32mm	>1.5
17	Surface Treatment (thickness)	OSP	0.2-0.5um	/
18		ENIG	1-3u”（Au）120-320u”（Ni）	/
19		Immersion silver	6-12u”	/
20		Immersion tin	≥1um	/
21		ENEPIG	Au 2u”, Pd 1U”, Ni 100u”	/
22		Hard gold	5-30u”（Au）、120-200u”（Ni）	/
23	Drill	Min. PTH	0.05MM	/
24		Min. NPTH	0.05MM	/
25		Max. aspect ratio (PTH PCB)	5:1	/
26		NTPH tolerance	±0.05	/
27		PTH tolerance	±0.05	/
28	Line width/ Line spacing	Inner layer	Line width≥0.1mm; Line space≥0.1mm	0.076/0.076mm
29		Outer layer	1OZ; Line width≥0.12mm; Line space≥0.12mm	0.1/0.1mm
30			2OZ；Line width≥0.2mm; Line space≥0.2mm	0.15/0.15mm
31			3OZ；Line width≥0.25mm; Line space≥0.25mm	0.2/0.2mm
32			4OZ；Line width≥0.35mm; Line space≥0.35mm	0.3/0.3mm
33			5OZ；Line width≥0.45mm; Line space≥0.45mm	0.4/0.4mm
34			6OZ；Line width≥0.55mm; Line space≥0.55mm	0.5/0.5mm
35			Thick film; Line width≥0.1mm; Line space≥0.1mm	0.076/0.076mm
36		Line width tolerance	±20%	/
37	Solder Mask (SM) /Silkscreen	Conductor	Glass glaze, medium, solder mask ink	/
38		SM color	White, black, green	Mixed color
39		Silkscreen color	White, black	Mixed color
40		Silkscreen height, width	Line width≥0.13mm; Height≥0.8mm	/
41		SM thickness	≥20um	/

Tags: ceramic PCB, ceramic pcb board, ceramic pcb board manufacturer
Posted in best pcb, bestpcb, Ceramic PCB, DBC substrate, Design Guide, FAQ, FR4 PCB, UVC Ceramic pcb | No Comments »

Your Reliable LED PCB Board Manufacturer – Best Technology

June 27th, 2024

Nowadays, LED lighting has become increasingly popular in our daily life. With its rapidly rise in popularity, the term LED PCB has become commonplace. LED PCB also referred to as LED circuit board, LED aluminum PCB, or simply LED PCB board. Today, our team will share some informational knowledges about LED PCB circuit board, let’s keep reading if you are interested!

What is a LED PCB Circuit Board?

A LED PCB circuit board is a unique type of board crafted to hold and connect light-emitting diodes (LEDs). They are specially designed for lighting applications, like LED car headlights, pool lighting, UV LED, hotel lighting, grow light, high bay lights, stair lights, supermarket lighting, street light, etc. They are used almost everywhere. These boards provide the support and connections needed for LEDs to function efficiently and last longer. They are crucial in areas like lighting, automotive, and electronics, thanks to their ability to manage heat effectively and enhance the lifespan of LEDs.

What are the Different Types of LED PCB?

LED PCB boards are preferred over traditional lighting methods like fluorescent and incandescent bulbs. There are in total five types of LED PCBs, each designed for specific applications:

Aluminum based LED PCB

An LED PCB board, often made of aluminum alloy, serve as the base for mounting LEDs. This is the most common type of LED PCB, since it has good thermal management and cost-effective compared to other materials. The thermal conductivity of aluminum can be 1.0-3.0W/m.k, it can meet the almost heat requirements of low-middle power applications, like streetlights and floodlights. Additionally, Best Technology developed a new product called semi-flexible aluminum PCB for specific device. It can be bent and folded when necessary.

Copper core LED PCB

Copper core LED circuit board can be divided into two types: normal copper core LED PCB and thermoelectric separation copper-based LED PCB. The copper material has higher thermal conductivity than that of aluminum, and it can up to 400W/m.k when made by thermoelectric separation technology. Copper based LED PCB board commonly used in high power devices like new energy vehicles.

Ceramic LED PCB

Ceramic LED PCB boards are made from ceramic substrates like aluminum oxide (Al2O3) or aluminum nitride (AlN). They have superior thermal management, and it can withstand extreme environment when used in high-temp and low temperatures. Ceramic substrates can handle high power and thermal cycling better than other materials, making them ideal for automotive, aerospace, and high-power LED applications.

FR4 LED PCB

FR4 LED PCB boards are made from woven fiberglass cloth with an epoxy resin binder, which provides good mechanical strength and insulation properties. FR4 is a widely used material for general-purpose PCBs due to its cost-effectiveness and versatility. While it has lower thermal conductivity (around 0.3W/m.k) compared to aluminum or copper, FR4 LED PCBs are suitable for low to medium power applications where thermal management is less critical. These PCBs are commonly used in consumer electronics, LED displays, and indoor lighting.

Flexible LED PCB

Flexible LED PCB boards are constructed using flexible plastic substrates like polyimide or polyester. This flexibility allows the PCBs to be bent, folded, and shaped to fit various applications. Flexible LED PCBs are ideal for products that require dynamic or complex designs, such as wearable electronics, flexible displays, and medical devices. Despite their lower thermal conductivity compared to rigid PCBs, flexible LED PCBs offer unique design advantages and are increasingly used in innovative LED applications.

What are the Benefits of Using Aluminum LED PCB Boards?

Aluminum LED PCB boards offer numerous advantages that other materials cannot achieved.

1. Better Heat Management: LED PCBs, particularly aluminum ones, help in cooling LEDs, preventing overheating and extending their lifespan.

2. Compact and Light: These boards are small and lightweight, making them perfect for applications with space and weight constraints.

3. Dimensional stability: Aluminum LED PCB board has good dimensional stability compared with flexible LED PCBs. And it has low CTE during the manufacturing.

4. Cost-Effective: Producing aluminum LED PCBs is relatively affordable, making them a budget friendly option for various applications.

5. Versatile: Available in different shapes and sizes, Aluminum LED PCBs can be customized to meet specific needs, enhancing their usefulness in various scenarios.

The Structures of a LED PCB Board in Manufacturing?

A LED PCB is similar to traditional rigid board, the only one difference is the LED mounting on the pads. Herein, we listing the basic composition of a LED pcb board, let’s see it together.

1. Substrate – The base of the PCB, which can be flexible (like polyimide), metal alloy (aluminum, copper), or ceramic, depending on the required thermal performance.

2. Copper foil – A thin layer of copper is used for forming the circuit paths on the PCB.

3. Solder mask – This is a protective layer covers the copper paths to prevent oxidation and short circuits. It also aids in SMT (surface mounted technology) soldering.

4. Silkscreen – Used to print labels, logos, vendors, symbols, and pick and place on the PCB for easy identification during assembly.

5. Adhesives – Aiming to bond different PCB layers, different material used different adhesive, always are prepreg (PP).

6. LEDs: The main components mounted on the PCB, available in various sizes, colors, power ratings, voltages and so on.

Your Reliable LED PCB Board Manufacturer – Best Technology

Best Technology stands out as a leading manufacturer of high-quality LED PCB boards. We offer a wide range of products and services to cater to various needs. With extensive experience and expertise in the industry, we are committed to providing reliable and cost-effective solutions.

Advanced Facilities

We are equipped with advanced machinery and technology, ensuring precision and efficiency in production.

Experienced Team

Our skilled professionals are dedicated to delivering topnotch LED printed circuit boards. Most of our core members has more than 10 years-experience in the PCB manufacturing.

Quality Assurance

We have passed ISO9001, ISO13485, IATF16949 certifications, and integrated them into our daily manufacturing process. These strict quality control measures can make sure every product meets the highest standards of industry.

Customization

We offer tailored customized LED PCB board solutions to meet customer specific requirements.

Competitive Pricing

Best Technology has our own factory in China and Vietnam, we can provide most affordable solutions without compromising on quality.

Choosing Best Technology means opting for excellence, reliability, and superior service. Partner with us for your LED PCB needs and experience the difference we bring.

Tags: flex LED PCB, LED aluminum pcb, LED circuit board, LED flexible PCB, led pcb board
Posted in best pcb, bestpcb, Ceramic PCB, mcpcb, Metal Core PCB, Our News, PCB News, PCB Technology | No Comments »

How Does Thermal Resistance of Solder Mask Effect Ceramic PCBs?

April 23rd, 2024

In the printed circuit board (pcb) fields, thermal management is a key consideration especially in industries such as automotive, aerospace, tele-communications and power electronics. Ceramic PCBs are known for their excellent thermal conductivity and mechanical properties and are becoming increasingly popular in applications where efficient heat dissipation is essential. Under this situation, solder resistance materials play a vital role not only in protecting the circuit, but also in influencing thermal behavior.

What is Thermal Resistance in Ceramic Circuit Board?

Ceramic PCBs are usually composed of materials such as alumina (Al2O3) or aluminum nitride (AlN), which have superior thermal conductivity compared to traditional glass fiber PCB substrates. This inherent thermal conductivity promotes the efficient transfer of heat from heating components, improving the reliability and performance of electronic devices. However, while substrate materials make an important contribution to thermal management, the thermal resistance of solder resistance materials must also be considered.

Solder mask materials are mainly used to isolate conductive wires on the pcb, prevent unexpected electrical connections, and protect the circuit from environmental factors such as moisture, dust, and chemical contaminants. Although solder mask is not generally praised for their thermal conductivity, their thermal resistance can affect the heat dissipation within the PCB components.

What Factors Influencing Solder Mask Thermal Resistance?

Solder resistance thermal resistance is an important feature in the design and performance of printed circuit boards, especially when considering thermal management of electronic devices. There are several factors that affect the thermal resistance of solder pads, and understanding these factors can help optimize the thermal design of the PCB. Here are the key factors:

Solder Mask Composition

The type of resin and fillers used in the solder mask can significantly affect its thermal properties. Epoxy resins are common, but other materials may offer better thermal conductivity.

Thickness

Thicker layers of solder mask can increase thermal resistance because they add more insulating material between the heat source (such as electronic components) and the ambient environment. Thinner layers might improve heat dissipation but could be less effective in protecting against physical damage or corrosion. Generally, solder mask has around 20-25um thickness and has 0.2W/m.k thermal conductivity.

Curing Process

The process conditions under which the solder mask is cured (temperature, time, and environment) can impact its mechanical and thermal properties. Improper curing can lead to reduced heat transfer efficiency.

Dielectric Constant

The dielectric constant of the solder mask material influences its ability to conduct heat. Materials with higher dielectric constants may provide higher thermal resistance.

Interface with Substrate

The interface between the solder mask and the ceramic substrate can affect thermal resistance. Poor adhesion or air gaps may decrease heat transfer between the layers.

What are the Importances of Thermal Resistance in Ceramic PCBs?

Efficient thermal management is crucial for maintaining the reliability and longevity of electronic devices, especially in applications where high temperatures can degrade components or compromise performance. In ceramic PCBs, where heat dissipation is a key advantage, minimizing thermal resistance throughout the assembly is essential.

While ceramic substrates inherently offer excellent thermal conductivity, the solder mask layer presents a potential bottleneck for heat transfer. Therefore, selecting solder mask materials with optimal thermal properties and ensuring proper application are critical steps in PCB design and manufacturing.

Applications and Considerations:

Ceramic PCBs find applications in various industries, including power electronics, LED lighting, automotive systems, and telecommunications infrastructure. In these applications, where thermal management is critical, careful consideration of solder mask thermal resistance is essential for meeting performance requirements and ensuring reliability under challenging operating conditions.

Designers and engineers must balance the need for thermal management with other considerations such as cost, manufacturability, and compatibility with assembly processes. Collaboration with experienced PCB manufacturers and material suppliers can help optimize the selection of solder mask materials and design solutions tailored to specific application requirements.

The thermal resistance of solder mask materials is an important consideration, especially in applications where heat dissipation is a concern, such as high-power electronics or devices operating in harsh environments.

Solder mask materials are designed to withstand the temperatures encountered during the PCB fabrication process, including solder reflow, typically ranging from around 220°C to 280°C (428°F to 536°F), depending on the specific materials and processes used.

However, when it comes to the thermal resistance of solder mask materials in terms of their ability to dissipate heat away from components or traces on a PCB, they generally have lower thermal conductivity compared to materials like copper or aluminum. This means that they are not as effective at transferring heat away from heat-generating components.

In high-power applications or those where thermal management is critical, additional measures may need to be taken, such as incorporating heat sinks, thermal vias, or selecting solder mask materials with improved thermal properties. Some manufacturers offer solder mask materials with enhanced thermal conductivity for specific applications where heat dissipation is a concern.

As electronic devices continue to evolve with increasing power densities and miniaturization, the demand for advanced thermal management solutions will grow. In the realm of ceramic PCBs, ongoing research and development efforts aim to enhance the thermal properties of solder mask materials, enabling more efficient heat dissipation and further improving the reliability and performance of electronic systems.

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We Will Be Exhibiting at New-Tech Israel 2024

April 12th, 2024

Best Technology, a China-based PCB & PCBA manufacturer will be exhibiting at New-Tech 2024 in EXPO Tel-Aviv, Israel at booth No. 66 from May 28, 2024 to May 29, 2024(Western Time). Actually, we have participated in such exhibition for several years. At our exhibition booth, attendees will be able to learn more about our company for PCB manufacturing and PCB assembly technology. Here are some pictures for your reference.

For interested professionals, Best Technology had on hand experts to offer detailed insights and experience on PCB assembly, covering PCB prototype and low/high-volume production. For more information on PCB assembly and fabrication, welcome to visit our booth.

You will see 10mm to 1,500 mm flexible circuit board, from 2layer rigid-flex circuit to 50 layers, 1/2 OZ copper to 3 OZ, 0.15mm extra thin FR4 PCB to 30 OZ heavy copper, various ceramic PCBs (thick film, thin film, DPC, DBC, HTCC, AMB, LTCC). Our new products also will be shown in this exhibition, like copper/aluminum busbar PCB, transparent/PI/rubber silicone flexible heating film, semi-flexible PCB, semi-flexible aluminum PCB.

In Best Technology, you will enjoy one-stop service from components sourcing, board fabrication (FPC, PCB, MCPCB, Ceramic PCB) and final assembly with programming and testing and metal dome that is used in conjunction with a printed circuit board, flex circuit, or membrane switch, become normally-open tactile switches. we have four types of metal domes: four legs with size from 5mm-20mm; triangle with size 4mm-12mm; round dome with size 4-16mm, oblong dome with size 3.7mm-58.1mm, and we also make dome with adhesive, named dome array, custom membrane switches also available in Best Tech.

You are warmly welcome to see how we can manage the components wastage and efficiency to help save your time, money and energy.

About New-Tech:

The New-Tech Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 150 companies, who lead these fields in Israel and around the world, will take part and exhibit in this trade show.

This exhibition shows a comprehensive array of electronic components, production processes, subcontracting services, clean room equipment, electro-optic devices, test equipment, printed circuit boards, industrial materials, computerization solutions, robotics, power systems, RF/microwave technologies, and more. Attendees can explore cutting-edge innovations in development, design, engineering, and procurement across various industries.

It is important to note:

1. Participation in the exhibition is conditional on prior registration, even for invited customers.

2. After registration and before the conference, a code will be sent to the mobile to confirm participation in the conference.

For more details and registration: https://www.new-techevents.com/exhibition-registration-form/

Welcome to visit us at Booth #66 from May 28, 2024 to May 29, 2024 (Western Time).

Tags: new tech 2024, New-Tech Israel, pcb exhibition
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Do You Know What Is PCB Stiffener Busbar?

March 27th, 2024

Busbar PCB is an electronic component, also known as a socket board or mother board, which is an important part of an electronic device and is used to connect and transmit current and signals, so it plays a crucial role in the design of electronic devices. Busbar PCB is like a PCB coated with an “ear”, which we also call it as stiffener busbar. Want to know more about it? Welcome to reading on!

What is PCB Stiffener Busbar?

A busbar circuit board is a key component used in electrical systems. It usually consists of a main conductive busbar (usually copper or aluminum) that is covered with an insulating material such as prepreg or resin. Busbar boards are used to transmit high currents in power systems, such as in industrial equipment, power distribution systems, and control panels.

These boards typically have multiple slots for inserting electrical connectors or electrical devices. The design of the bus board can be customized according to the specific application requirements to adapt to different current and voltage requirements. They are widely used in the industrial and commercial sectors because they provide reliable power transmission and connectivity solutions.

What Are Benefits of Using a Busbar PCB?

Busbar stiffener pcb serves as a crucial element of conducting electricity, especially when simplifying the power distribution process, saving costs and requiring greater flexibility. They come in a variety of sizes and different coatings, such as aluminum and copper. The material type, dimension, size and shape of the busbar determine the current capacity it can carry. Compared with a coil harness, though it is expensive in manufacturing, but has longer life and does not need to replace in a short time. Here we listing some benefits of busbar PCB:

Efficient Power Distribution

With the fast development of new energy cars and vehicles, the electronic parts in the cars also should updated to meet the demands of renewable energy powers. So the busbar PCB stands out because it can distribute the powers in devices efficiently. Meanwhile, it also can help to reducing the consumption of energy. Because of its integrated nature, it can easily adapt to the integration of renewable energy, which is quite intriguing to consider in this advanced era of energy.

High Conductivity

The busbar stiffener on a PCB is typically crafted from either copper or aluminum. Copper, renowned for its excellent conductivity, stands out as the preferred material for busbars due to its capacity to facilitate the flow of electrons. Moreover, copper’s robust nature enables it to withstand harsh environmental conditions and high temperatures, thus bolstering its longevity and durability. But if you want PCB that can carry higher conductivity, ceramic PCB is the best choice but a little bit higher cost.

Can be Customized

Busbar is a highly customization product in PCB design, it offers various options for its mechanical capability. So maybe you can find it in every industry, such as educations, medical instruments, factories, communications and various electronic devices. Tight space and compact devices require substitute electrical distribution, and busbars serve the purpose right. Due to its high compact and strong mechanical and chemistry, busbar PCB can be used in extremely harsh weather. This makes them a good choice in substations or devices that need to used outdoors.

Space Saving

Due to the copper materials mounted on the PCB, Busbar PCBs can replace multiple traces with a single, wider conductive strip, saving valuable space on the board. This compact design is particularly useful in applications where space is limited. In addition, busbar PCB provides multi-layer structure when your design is complex and has density traces network.

By means our extensive PCB & PCBA manufacturing and professional engineering team, we are highly able to build and design busbar PCBs according to your specific requirements. Meanwhile, we follow the strict quality system to make sure the high-quality of products. You are welcome to contact us or send e-mail if you want to make such busbar stiffener PCB.

Tags: Bus Bar PCB, Busbar PCB, Copper busbar PCB
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2024 Newest Guide to High Thermal Conductivity PCBs

March 18th, 2024

Currently, with the rapid development of the digital era, the demands and requirements for electronics have increased significantly. Many double-sided and multi-layer boards have high density and power, making it difficult to dissipate heat efficiently. Conventional printed circuit board substrates such as FR4 and CEM3 are poor thermal conductors with interlayer insulation, the heat can’t transfer out, which leading to high-temperature failure of electronic components and devices. So, engineers and researchers are aiming to find high thermal conductivity PCBs to solve such problems, and metal core PCB and ceramic PCB stand out at this time.

Metal core PCB is a type of PCB that made by metal alloy material as the base core, commonly are aluminum core or copper core, rarely is iron PCB. They are popular because of its good heat dissipation properties and good mechanical strength.

What is Aluminum PCB and Why Use It?

Aluminum substrate is a low-alloyed Al-Mg-Si series high-ductility alloy sheet. It exhibits excellent thermal conductivity, electrical insulation properties, and mechanical machinability. Compared to traditional FR-4, with the same thickness and line width, aluminum substrate can carry higher currents, withstanding voltages up to 4500V. Its thermal conductivity coefficient exceeds 2.0.

A normal single side (1L) aluminum core PCB consists of three layers, aluminum base, dielectric layer and copper trace layer. Generally speaking, 1L aluminum PCB is always used for LED lighting, high current LED, spotlight, etc. So it also called LED PCB. For high-end applications, there are also designs for double-sided boards, structured as circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. In rare cases, multi-layer boards are used, which can be composed of multi-layer FR4 boards laminated to insulation layers and aluminum base.

The thermal conductivity of aluminum core is range from 1-3W/m.k, the higher conductivity, the better heat dissipation. However, not all the projects is suitable for higher conductivity, it should depend on the specific requirements, such as mechanical strengthen, corrosivity. Nowadays, Best Technology used 6061, 5052, 1060 aluminum alloy as the metal core, others also available if customers have requirements.

How Does Copper Core PCB Works?

Copper substrate is the most expensive type among metal substrates, offering significantly better thermal conductivity compared to aluminum and iron substrates. It is suitable for high-frequency circuits, regions with large temperature variations, and precision communication equipment for heat dissipation purposes, as well as in the construction and decoration industries.

The copper PCB’s circuit layer requires a significant current-carrying capacity, thus necessitating the use of thicker copper foils, typically ranging from 35μm to 280μm in thickness. The thermal insulation layer is the core technology of the copper substrate, composed of aluminum oxide and silicon powder as the main thermal conductive components, filled with a polymer of epoxy resin. It exhibits low thermal resistance (0.15), excellent viscoelastic properties, and possesses the ability to resist thermal aging, withstanding mechanical and thermal stresses.

The metal base layer of the copper substrate serves as its supporting component, requiring high thermal conductivity. It is typically made of copper foil, though copper plate can also be used (with copper PCB offering better thermal conductivity, around 1-400W/m.k). These substrates are suitable for conventional mechanical processing methods such as drilling, punching, and cutting.

What Are Differences Between Copper and Aluminum PCB?

Though both copper and aluminum are metal core PCB, they still have some differences in characteristic and manufacturing. Knowing their differentiation can help you to understanding and making correct decision in material selection.

Material

Copper has excellent electrical conductivity and mechanical strength, so copper PCB is well-suit for high frequency circuits and high-power electronic equipment. While aluminum is slightly inferior to the copper base, so it is a good choice of low-power devices.

Cost

Compared with copper, aluminum PCB has much advantages in cost, so if you have limited budget and require to use for low-power equipment such as LED lights, aluminum is the better one.

Manufacturing

Due to copper has great hardness and good strengthen, it requires for special technical and complex processes, for example: chemical etching, electro-plating. However, the lightweight of aluminum makes it easy in manufacturing. In addition, PTH (plated through holes) can be created on copper PCBs, but not on aluminum ones.

Physical Property

The difference in elastic modulus between copper and aluminum is significant, resulting in less warping and expansion/contraction in copper substrates compared to aluminum substrates.

Application

Aluminum PCB is lighter than copper substrate, the material cost is lower, often used in daily LED lights or electronic equipment. Because of its strong thermal conductivity and better electrical conductivity, copper substrate is usually used in high-speed circuits and high energy circuits. In addition, copper substrates are also widely used in areas requiring high heat transfer and heat dissipation performance, such as power amplifiers, power supplies, power tools, automotive engine controllers and solar inverters.

What is Ceramic PCB? And Its Thermal Conductivity?

Ceramic PCB is one of the high thermal conductivity PCBs in this industry. They have good high-frequency properties and electrical properties, and have high thermal conductivity, chemical stability and excellent thermal stability of organic substrates without. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The thermal conductivity of the ceramic substrate can reach about 220W/ M.K according to the preparation method and the material formula. Theoretically speaking, the thermal conductivity of ceramic circuit made by alumina is 24-28W/m.k, AlN is 150-240W/m.k and for BeO is 22-250W/m.k.

Ceramic PCB can be divided into various types of PCB according to its different PCB manufacturing process, they are thick film, thin film PCB, DPC, DBC, HTCC and LTCC ceramic circuit board. Different types of PCB made in different temperature and uses different materials, this means they have different chemistry and physical properties. So you should take them into consideration when designing a ceramic PCB for your device.

A Reliable PCB Supplier in China – Best Technology

Whatever you choose metal core PCB or ceramic PCB, a reliable supplier is necessary and needed. Best Technology has extensive manufacturing experience in PCB and we are very confident that we can serve you the best service and high-quality product. With rich experience and strong R&D team, we know how to provide you the best solution and evaluate the design files for you. We have professional DFM (Design For Manufacturing) process to identify the mistakes or inappropriate layout in design. Welcome to contact with us to discuss your PCB projects.

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What Is Immersion Silver? Why Choose It for PCB Coating?

February 26th, 2024

Due to the growing concerns and advocacy for environmental friendliness, as well as the prohibition of harmful substances like lead (tin), an increasing number of industries are moving away from the use of HASL (Hot Air Solder Leveling) technologies for PCB (Printed Circuit Board) surface treatment. The current trend is to use other surface treatments such as OSP, gold plating, immersion tin, immersion silver, ENIG and ENEPIG. Among them, immersion silver becoming a popular choice since it has excellent performance and cost effectiveness.

What is Immersion Silver Finish?

Immersion silver finishing is an environment friendly surface treatment that coating a layer of silver (about 0.1~0.4um) on the copper surface to ensure the good solderability when assembly. When comparing its functional performance with other surface finishes like OSP and ENIG, immersion silver falls between them. It exhibits outstanding solderability and exceptional solder joint strength, surpassing OSP, which lacks a conductive barrier. However, when employed as a contact surface, immersion silver demonstrates lower strength compared to gold.

What is the Working Principle of Immersion Silver?

Immersion silver finishing uses chemical deposition to finish the whole processes. Electrochemical deposition is a method of reducing and depositing metals onto the surface of an object by controlling the current in a solution. In the immersion silver process, the pad serves as the anode (positive electrode), while silver acts as the cathode (negative electrode), with a current applied between them. This causes silver ions (Ag+) to be reduced to silver metal under the influence of the electric field, subsequently adhering to the pad surface and gradually forming a silver layer.

The displacement reaction of immersion silver is:

2Ag⁺ + Cu = 2Ag + Cu⁺⁺

This method utilizes both electrical current and chemical reactions to deposit silver from the solution onto the surface of the PCB pad, creating a uniform and porous silver layer.

Silver Plated Analyzing: Pros vs Cons

Before selecting the immersion silver coating, we should understand its advantages and disadvantages to consider whether it is suitable for your PCB project and end-applications.

Pros of immersion silver:

Cost-effective than immersion gold
Good surface flatness and low contact resistance
Corrosion resistance
Good solderability, especially for BGA chips or smaller components
Environment friendly
High reliability

Cons of immersion silver:

Difficult to handle, must wear gloves
Special storage conditions – if the package is opened and not all PCBs need to be used, it must be resealed quickly or use them within 24h.
Peelable masks can’t to use

Important Points You Must Know About Storage

For storage and handling, it needs more careful than immersion tin and OSP.
It is compliant with ROHS and safer than HASL.
In the dry conditions, it can be stored 6-12months.
PCB with immersion silver must be soldered within 24hours if package is unsealed.
If the immersion silver PCB has been stored for more than 12 months, a solderability testing is must before assembling.

Immersion Silver vs ENIG

ENIG also is a common surface treatment in the PCB manufacturing, its full name is Electroless Nickel/Immersion Gold finishing. The ENIG technology is a relative expensive than immersion silver, and it suitable for more complex layout design.

ENIG plating involves safeguarding the copper pads on PCBs by first applying a layer of nickel and then overlaying the copper surface with a thin layer of gold. In essence, the procedure is akin to immersion silver, but it significantly improves PCBs by providing enhanced resistance to oxidation, superior solderability, and excellent surface planarity.

Let’s review the performance comparison between these two surface treatments:

Welcome to contact us if you have any questions about immersion silver or other surface treatment.

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