Archive for the ‘Metal Core PCB’ Category

PCB Quote Packaging is What Type of Engineering?

Tuesday, September 10th, 2024

PCB Full Form

PCB stands for Printed Circuit Board, a key component in almost all electronic devices. It connects and supports electronic components using conductive tracks, pads, and other features. The design and production of PCBs require precise engineering, as they are crucial for the functionality of the final product.

What is PCB Quote Packaging?

PCB quote packaging refers to the process of gathering and organizing all the details needed to estimate the cost of producing a PCB. This includes not only the design specifications but also the materials, manufacturing processes, and other engineering considerations. It’s not just a financial calculation but a complete engineering analysis that ensures the quote is accurate, feasible, and optimized for production.

The quote must consider every detail that affects production—like material types, size, complexity, and production volume. The aim is to package all these details into a clear, comprehensive quote, ensuring the client understands what they are paying for and why.

Why is Engineering Important in PCB Quote Packaging?

Engineering plays a vital role in the PCB quoting process because it’s not just about estimating costs. It’s about understanding the technical requirements and ensuring that every aspect of the design and production is accounted for. Engineers analyze the design, materials, and manufacturing methods to ensure the quote reflects the real cost of production.

Without engineering insight, a quote could be inaccurate, leading to cost overruns or production delays. Engineers make sure that all technical details, such as layer count, trace width, and component placement, are properly considered.

What Are the Key Factors in a PCB Quote?

Several factors come into play when preparing a PCB quote:

PCB Quote Packaging is What Type of Engineering?

1. Type of manufacturing process

The technical type of PCB determines its complexity and cost. For example, simple single panels cost much less than multi-layer panels, while flexible circuits (FPC) or rigid and flexible panels require more complex manufacturing processes and naturally cost more. In addition, whether advanced technologies such as microvias, laser drilling, blind holes or buried holes are required can also have a significant impact on the quotation.

2. Material type

Materials are an important part of PCB costs. Common materials include FR4, ceramics, metal substrates, etc. FR4 is the most common base material and is suitable for most conventional applications, but for high-frequency, high-temperature environments, ceramic or metal-based materials may be more suitable, but their price is relatively high. Choosing the right material not only affects the performance, but also directly affects the cost.

3. IPC level

IPC grades reflect the quality standards of PCB manufacturing, commonly used are IPC-A-600 grades 1, 2 and 3. The higher the grade, the more stringent the manufacturing requirements, and the corresponding increase in cost. For example, grade 3 PCBS are usually used in high-demand fields such as aerospace and medical equipment, which require higher accuracy and quality control, so the price is higher.

4. Circuit design

PCB circuit design complexity directly affects manufacturing costs. Including wire width, spacing, hole size and so on, the production process has put forward different requirements. High density interconnect (HDI) boards typically require more elaborate wiring techniques and may involve the use of microvias, which will increase the difficulty and cost of manufacturing.

5. PCB size and yield

The size of the PCB directly affects the amount of material used, and the larger the board, the more material is needed. In addition, the yield is also an important factor affecting the quotation. PCB manufacturing with complex design or high density lines is prone to defects, resulting in decreased yield. That means manufacturers may need to produce more boards to meet orders, increasing costs.

6. Material thickness

Different applications require different thicknesses of PCB materials. The standard FR4 thickness is usually 1.6mm, but thinner or thicker boards are sometimes used. Changes in material thickness can affect the overall cost, especially if thicker sheets require special processing or higher strength, and manufacturing expenses will increase accordingly.

7. Copper thickness

The copper thickness in the PCB usually has a standard choice, such as 1oz, 2oz or even thicker copper layers. The higher the copper thickness, the better the conductivity of the PCB, suitable for high-current applications, but the increase in copper thickness will significantly increase the manufacturing cost, especially in the plating and etching process requires additional materials and processes.

8. Stack-up method

The stacking mode determines the number of layers and the interlayer structure of the PCB. Complex multilayer boards or HDI boards require more complex lamination processes. For example, the lamination method may involve multiple pressing, the use of prepregs or special insulation materials. Each additional layer requires more manufacturing steps, resulting in increased costs.

9. Quantity

The quantity of the order has a direct impact on the PCB quotation. High-volume production can reduce unit prices by spreading tooling and setup costs, while small-batch orders are typically more expensive due to relatively high production preparation and start-up costs.

10. Delivery date

The shorter the delivery time, the higher the quotation. Rush orders require prioritizing production, which can disrupt the plant’s production schedule and require additional resource deployment. To meet urgent delivery deadlines, manufacturers may need to work overtime or speed up production, increasing overall production costs.

These are just a few examples, but they show how engineering considerations are woven into every part of the quoting process.

PCB Manufacturing Process

How Do Engineers Calculate PCB Manufacturing Costs?

Engineers calculate PCB manufacturing costs by considering the design specifications and the production methods needed to meet those requirements. They start by analyzing the PCB’s layout and design, which determines factors like layer count, trace width, and hole size. Each of these elements has a direct impact on the materials used and the manufacturing process.

They also consider the assembly process—whether it’s surface-mount or through-hole—and what testing will be required. After evaluating these details, they calculate the costs associated with each step of the manufacturing process. This ensures the final quote is both accurate and comprehensive.

What Type of Engineer Designs PCBs?

Engineers who design PCBs typically have a bachelor’s degree or above in electrical engineering, automation, computer science, or a related field ‌ and understand the basics of electronic design, printed circuit board (PCB), and electronics manufacturing in the PCB industry. These engineers need to master PCB design software such as Altium Designer, Eagle PCB, PADS, or CAD, etc., as well as the use of related manufacturing and testing tools. At the same time, they need to have a knowledge of the PCB industry, a certain circuit design and electronic components knowledge, including digital and analog circuits, signal processing, power electronics, embedded systems, communication technology, etc. In addition, holding certificates such as IPC-2221/2222, IPC-A-600/610, and CID (Certified Interconnect Designer) can prove that they have relevant professional knowledge and skills, which can help improve their career competitiveness.

These engineers also need to have a strong sense of responsibility and team spirit, have good communication and coordination skills, and be able to work effectively with customers, manufacturers, and other team members. For junior engineers, it is recommended to study in a single point of depth, such as PCB design, SI simulation, thermal design, EMC design, product testing, etc., and then start from this advantage point to expand the scope of knowledge

What Materials Are Considered During PCB Quote Packaging?

The type of material used for a PCB is a major cost driver. Common materials include:

This is the most common material used in PCBs due to its balance of cost and performance. It’s versatile and reliable for most standard applications.

Metal Core

Metal core PCBs are used in applications where heat dissipation is a concern, such as LED lighting. These boards are more expensive due to the metal layer.

Ceramic

Ceramic materials are used for high-frequency or high-temperature applications. They are more costly but offer better performance in extreme conditions.

Each material has its own manufacturing process, which also affects the cost. For instance, metal core boards may require different drilling techniques compared to standard FR4 boards. Engineers must consider these details when preparing a quote.

How Does the Choice of PCB Manufacturing Methods Impact the Quote?

The method used to manufacture the PCB can greatly impact the final cost. Common methods include:

Surface-Mount Technology (SMT): This is the most common method for modern PCB assembly. It’s efficient and cost-effective for most applications.

Through-Hole Technology (THT): This method is used for components that require a stronger mechanical bond. It’s more labor-intensive and, therefore, more expensive.

Flexible and Rigid-Flex Manufacturing: These types of PCBs require specialized processes and materials, which can increase the cost.

Additionally, advanced techniques like laser drilling for microvias or selective soldering for complex assemblies may be necessary for high-precision designs. Each of these methods requires careful consideration, and engineers must choose the best process for both the design and the budget.

Who Designs PCB?

Since 2006, Best Technology has been the leading PCB quick turn manufacturer specializing in both PCB prototype and production quantities, initially produced single-sided and double-sided printed circuit boards for the consumer electronics market. Now, we provide not only FR4 PCB, but also some special PCB like flex circuit, metal core PCB, ceramic PCB, extra thin PCB, HDI PCB, IC substrate, busbar PCB, heavy copper PCB and so on. We can make 50 layers PCB, and it is not our limit.

Nowadays, Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base such as electronics appliance, communication, educational electronics, power supplies, automations.

For more information about PCB, or to learn more about the online quote and ordering process, please visit www.bestpcbs.com

Tags:PCB ful form, PCB Quote Packaging
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What is MCPCB? Its function and performance

Friday, September 6th, 2024

MCPCB (Metal Core Printed Circuit Board) is a key component in modern electronics, especially in terms of heat management. It is widely used in LEDs and can be found in almost all LED products. From LED applications to power electronics, MCPCB plays a vital role in ensuring that devices remain cool, efficient and long-lasting.

What is MCPCB?

‌MCPCB‌, full name Metal Core PCB, is also known as aluminum substrate or aluminum-based circuit board. It is a type of circuit board that attaches the original printed circuit board to a metal with better thermal conductivity to improve the heat dissipation performance at the circuit board level.

This metal-based printed circuit board usually uses aluminum as the substrate, but also includes the use of other metals such as copper or other high thermal conductivity materials. The design of MCPCB combines the high thermal conductivity of metal with the flexibility of printed circuit boards, making it widely used in various industrial electronic devices.

Especially in the LED industry, MCPCB has become an indispensable component due to its strong magnetic conductivity and excellent heat dissipation. In addition, in the production process of MCPCB, in addition to using aluminum substrates, fiberglass boards (FR-4) are also used for some designs, but special heat dissipation pads need to be designed and fixed by screws or glue.

What is the use of MCPCB?

The main use and advantage of MCPCB (metal core printed circuit board) lies in its excellent heat dissipation performance. ‌

MCPCB, full name Metal Core PCB, is a printed circuit board attached to a metal with better heat conduction effect, thereby improving the heat dissipation at the circuit board level.

This design not only improves the heat dissipation performance of the circuit board, but also has some specific application restrictions, such as the temperature cannot exceed 140℃ when the circuit system is operating, which is determined by the characteristic limitations of the dielectric layer.

During the manufacturing process, the temperature must not exceed 250℃~300℃, which must be understood in advance before passing the tin furnace. This design of MCPCB makes it widely used in many fields, including but not limited to:

‌LED lights‌: used for spotlights, high-current PCBs, high-current LEDs, street safety applications, etc.

‌Automotive electronics‌: used in power conditioners, ignition tools, switching converters, variable optical systems, and motors for electric and hybrid vehicles.

‌Power supply equipment‌: such as DC-DC converters, voltage regulators, high-density power conversion, and switching regulators.

‌Audio equipment‌: balanced, input-output, audio, power supply, and pre-shielded amplifiers.

‌Home appliances‌: flat panel displays, motor controls, etc.

‌OA equipment‌: large electronic display substrates, thermal print heads, and printer drivers.

The unique combination of MCPCB (metal plate, insulation layer, and additional copper foil) provides strong magnetic conductivity and excellent heat dissipation, which is particularly important in the LED industry.

In addition, the high thermal conductivity of MCPCB allows the generated heat to dissipate quickly, preventing heat accumulation and ensuring that the LED operates within the optimal temperature range, which plays an important role in improving the performance, thermal management, and overall reliability of UV LEDs.

What is the difference between FR4 and MCPCB?

The main difference between FR4 and MCPCB (metal matrix printed circuit board) is their heat dissipation performance, material composition, and application areas. ‌

1. Heat dissipation performance:

FR4 has a low thermal conductivity and its heat dissipation performance is not as good as MCPCB. MCPCB is based on its metal core (usually aluminum or copper), and transfers heat to the heat sink through the thermal conductive dielectric layer and the metal substrate, and has good heat dissipation ability.

2. Material composition:

FR4 is a multi-layer printed circuit board material composed of glass fiber cloth and epoxy resin. It has good electrical and mechanical processing performance, but general heat dissipation performance.

MCPCB attaches the original printed circuit board to a metal with better thermal conductivity. The design of the metal substrate and the thermal conductive dielectric layer significantly improves the heat dissipation efficiency.

3. Application field:

FR4 is widely used in electronic equipment that requires basic heat dissipation requirements due to its low cost and good electrical performance.

MCPCB is often used in high-power, high-heat-intensive application scenarios due to its excellent heat dissipation performance, such as TVs, monitors and other cost-sensitive products.

In summary, MCPCB has better heat dissipation performance than FR4 through its metal substrate and optimized thermal conductivity design, and is particularly suitable for application scenarios that require high-performance heat dissipation.

What is the structure of MCPCB?

The structure of MCPCB consists of a circuit layer (copper foil layer), a thermal insulation layer and a metal base layer. ‌

‌Circuit layer‌ (copper foil layer): It requires a large current carrying capacity, so thicker copper foil should be used, and the thickness is generally between 35μm~280μm.

‌Thermal insulation layer‌: This is the core technology of PCB aluminum substrate, usually composed of special polymers filled with special ceramics, with low thermal resistance, excellent viscoelastic properties and resistance to thermal aging, and can withstand mechanical and thermal stress.

‌Metal base layer‌: Aluminum or copper metal is used as the base material of the circuit board, and a layer of copper foil or copper plate metal plate is attached to the substrate as a circuit to improve problems such as poor heat dissipation.

How thick is the copper in MCPCB?

The thickness of copper foil in MCPCB is generally 35μm~280μm. ‌

The structure of MCPCB (Metal Core PCB) consists of circuit layer (copper foil layer), thermal conductive insulation layer and metal base layer. The circuit layer requires a large current carrying capacity, so thicker copper foil should be used.

Such thickness can meet the demand of high current carrying capacity. The use of such copper foil guarantees the superiority of MCPCB in electrical performance and thermal conductivity.

What is the thermal conductivity of MCPCB?

The thermal conductivity of MCPCB varies with the materials used, but is generally much higher than that of standard FR4 PCB. Most MCPCBs have a thermal conductivity in the range of 1 W/mK to 5 W/mK. In contrast, the thermal conductivity of FR4 boards is about 0.3 W/mK, which makes them much less efficient in heat dissipation.

The advantage of MCPCB is that its heat dissipation performance is significantly better than that of standard FR-4 structure. This advantage is not only reflected in the thermal conductivity of the dielectric used, which is far higher than that of conventional epoxy glass, but also in its heat transfer efficiency, with a thermal transfer index of one-tenth the thickness being more efficient than that of traditional rigid PCB.

What is MCPCB led?

MCPCB LED refers to a light-emitting diode (LED) that uses a metal core printed circuit board (MCPCB) as a heat dissipation substrate. This technology uses a metal core printed circuit board as a heat dissipation substrate for LEDs to improve the heat dissipation performance of the LED, thereby ensuring stable operation and extending the service life of the LED.

MCPCB is a special printed circuit board in which the metal core acts as a thermal conductive layer, which can effectively conduct the heat generated by the LED to avoid overheating that affects the performance and life of the LED.

In addition, the design and manufacture of MCPCB also consider the needs of electrical connections and physical support to ensure the reliability and stability of the LED module. With the increasing application of high-power LEDs, MCPCB technology has been favored for its excellent heat dissipation performance and has become one of the key technologies in high-power LED packaging.

Conclusion:

MCPCB has a unique structure, including a conductive metal base, a dielectric insulation layer, and a copper circuit layer, which can provide a reliable solution to the heat dissipation challenges in modern electronic products. As the demand for high-performance electronic products continues to grow, the demand for advanced materials such as MCPCB will also continue to grow to meet these thermal management challenges.

Tags:MCPCB, Metal Core, PCB, PCBA
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What is an LED circuit board?

Tuesday, September 3rd, 2024

In today’s fast-growing electronics industry, LED (light-emitting diode) technology has become a game-changer in lighting and display applications. LED PCB (printed circuit board) is essential for effectively powering and controlling LEDs. It plays a key role in ensuring the efficiency, lifespan and performance of LED lighting systems.

As the demand for energy-efficient lighting solutions continues to increase, understanding the complexity of LED light PCB design has become critical for engineers, designers and manufacturers. These circuit boards require special manufacturing steps in addition to design guidelines.

What is led light circuit board?

LED light circuit board is the abbreviation of printed circuit board, which is mainly used to carry and connect electronic components of LED lamps. ‌LED light circuit board is usually made of aluminum substrate and FR-4 fiberglass circuit board, where the LED aluminum substrate is printed on the aluminum plane with good thermal conductivity, and then the electronic components are soldered on it. ‌This design helps to improve the heat dissipation performance and stability of LED lamps, and ensure that the LED lamps can work stably for a long time.

What is an LED circuit board? How to make it?

The main function of LED light circuit board is to provide power to LED lamp beads and control the brightness and color of its LED lamp beads. In order to light up the LED lamp beads, an LED driving circuit is required, which includes constant voltage driving, constant current driving, PWM driving and other methods, which are usually integrated on the small circuit board of the LED lamp.

In addition, the design and manufacture of the LED lamp circuit board take into account the characteristics of LED, such as long life, high light efficiency, no radiation and low power consumption. Compared with traditional light sources, such as incandescent lamps and fluorescent lamps, LED lamps have significant advantages in efficiency, life and environmental protection.

How to make led light circuit board?

The process of making LED lamp circuit boards involves multiple steps, including welding, self-inspection, mutual inspection, cleaning, friction, wiring, etc.

Determine the direction of the lamp: the front side is facing up, and the side with the black rectangle is the negative end.

Determine the direction of the circuit board: the front side is facing up, and the end with two internal and external wiring ports is the upper left corner.

Welding: Carefully weld each solder joint to ensure fullness, cleanness, and no false soldering or leaking. ‌

Self-inspection: After completing the welding, first check whether there is a cold solder joint, leaking solder joint, etc. Use a multimeter to touch the positive and negative terminals of the circuit board to check whether the LED lights are on at the same time. ‌

Mutual inspection: After the self-inspection, it will be handed over to the person in charge for inspection. Only with the consent of the person in charge can it flow into the next process. ‌

Cleaning: Use 95% alcohol to scrub the circuit board to remove residues and keep the circuit board clean.

Friction: Use fine sandpaper (coarse sandpaper if necessary) to grind off the burrs on the edge of the circuit board so that the circuit board can be placed flatly in the fixing seat. ‌

Wiring: Use blue and black thin wires to connect the circuit board. The wiring point close to the inner circle is negative and connected to the black wire; the wiring point close to the outer circle is positive and connected to the red wire. ‌ Make sure the wires are connected from the back to the front. ‌

Self-check and mutual check: Check the wiring to ensure that each wire passes through the pad, the length of the wires on both sides of the pad that remain on the surface should be as short as possible, and the thin wires will not break or loosen when gently pulled. ‌‌

Through the above operations, the production of the LED lamp circuit board can be completed. ‌Each step is crucial, especially the welding and wiring parts. It is necessary to ensure the quality of the welding points and the correct connection of the wires to ensure the normal operation of the circuit board and the normal lighting of the LED lamp.

Why do you need a resistor with an LED?

When using LED, a resistor needs to be connected in series to control the current, prevent excessive current from damaging the LED, and ensure that the LED can emit light normally. ‌

LED is a semiconductor device that can directly convert electrical energy into light energy. Due to its special material properties, LED is very sensitive to current, and excessive or insufficient current may cause the LED to malfunction or be damaged.

Therefore, when the LED is connected to the power supply, a resistor is needed to limit the current to ensure that the LED can work stably and safely.

The main function of this resistor is voltage division and current limiting. It is used to adjust the current passing through the LED to prevent the LED from burning out due to excessive current, while also ensuring that the LED can emit light of appropriate brightness.

Specifically, when current passes through the LED, the resistor will produce a certain voltage drop, thereby reducing the voltage applied to both ends of the LED, thereby controlling the current passing through the LED.

What resistor to use with LED?

Use an LED resistor calculator to help determine the required resistor value. ‌

When using LEDs, in order to protect the LED and ensure its normal operation, it is usually necessary to limit the current by connecting an appropriate resistor in series. This is because each LED has a maximum current value, exceeding which may cause the LED to be damaged.

Using an LED resistor calculator can help you determine the required resistor value to ensure that the current does not exceed the maximum tolerance of the LED.

By entering the relevant parameters of the LED (such as the rated current and voltage), the calculator will automatically calculate the required resistor value to protect the LED from overcurrent damage.

This method is a common practice and is applicable to any situation where a number of LEDs are used in series. In this way, the safe operation of the LED can be ensured while avoiding damage caused by excessive current.‌

How to improve the heat dissipation performance of LED light circuit boards?

The key to improving the heat dissipation performance of LED light circuit boards is to optimize the heat dissipation path, use efficient heat dissipation materials, and adopt advanced heat dissipation technology.

Optimize the heat dissipation path:

Understanding the heat transfer path of the heat generated by LED components is the first step to improve heat dissipation performance. Heat moves from the LED components through the package wires to the circuit board, and then dissipates through the heat sink.

The heat dissipation efficiency can be effectively improved by using materials with good thermal conductivity, expanding the cross-sectional area of the path (such as using thick copper wire), and applying thermal lubricants to reduce the gaps in the connection parts.

Use efficient heat dissipation materials:

Metals such as copper and aluminum are often used to make heat sinks because of their good thermal conductivity. In addition, new materials such as graphene are also used to make heat sinks because of their excellent thermal conductivity. These materials can significantly improve heat dissipation efficiency. ‌

Adopting advanced heat dissipation technology:

Micro-groove group composite phase change integrated cooling technology is an advanced heat dissipation technology. It effectively removes the heat of high-power electronic devices by changing the closed-circulation cooling medium into a nano-scale water film and utilizing its strong evaporation ability and latent heat exchange ability.

As an excellent thermal conductive medium, thermal conductive silicone grease has excellent electrical insulation and thermal conductivity. It can penetrate into the tiny depressions on the metal surface, increase the contact area, and improve the efficiency of heat conduction from the LED chip to the aluminum substrate.

Are LED PCBs only used in lighting systems?

The application range of LED PCB (printed circuit board) is far more than lighting systems. In addition to lighting systems, LED PCB is also widely used in other fields. For example, LED lamps are one of the most common products using LED PCBs. Whether it is home lighting, commercial lighting or outdoor lighting, LED lamps occupy a large market share.

Compared with traditional incandescent lamps and energy-saving lamps, LED lamps have higher luminous efficiency, longer service life and lower energy consumption. They also have features such as dimming and color change, which can meet the needs of different scenarios. ‌

In addition, LED PCB is also used in LED display screens, LED backlight sources and automotive lighting. LED display screens provide high-definition and high-brightness display effects in large-scale events such as sports events, concerts, and exhibitions, bringing a shocking visual experience to the audience.

LED backlight sources have become the mainstream choice in electronic products such as LCD monitors, mobile phones, and tablet computers. Compared with traditional cold cathode fluorescent lamps, LED backlight sources have higher brightness, longer service life and lower energy consumption. At the same time, they can achieve local dimming, improve display effects and reduce energy consumption.‌

In the field of automotive lighting, with the advancement of automotive lighting technology, more and more cars are beginning to use LED lamps. Compared with traditional halogen and xenon lamps, LED car lights have higher brightness, longer service life, lower energy consumption, faster response speed and better heat dissipation performance, which improves driving safety. ‌

From this we can know that the application of LED PCB is not limited to lighting systems, but is widely used in many fields, including but not limited to lighting, display technology, backlight sources of electronic products, and automotive lighting. ‌

Conclusion:

Designing PCB for LED lights is a complex but critical task that requires careful consideration of various influencing factors, from the selection of manufacturing materials to the testing of thermal conductivity and the quality testing of finished products. Choosing Best Technology has expert design assistance and reliable manufacturing processes, which will allow you to obtain the best results for LED light PCB design. ‌

Tags:LED, LED circuit board, PCB, pcb design, PCBA
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Aluminum Printed Circuit Board Design＆Prototyping

Monday, September 2nd, 2024

As a leading aluminum printed circuit boards manufacturer with over 18 years experience, we provide full turn-key service for all the world. In our aluminum base print circuit boards factories, we equipped with advanced high precision manufacturing and testing equipment to ensure the high quality and fast delivery.

What is Aluminum Printed Circuit Board

Aluminum printed circuit board is a metal-based copper-clad board with good heat dissipation function. Generally, a single-sided board consists of three layers, namely the circuit layer (copper foil), the insulation layer and the metal base layer. There are also designs for high-end use as double-sided boards, with the structure of circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. Very few applications are multi-layer boards, which can be made of ordinary multi-layer boards, insulation layers, and aluminum bases.

LED aluminum printed circuit boards are just circuit boards made of aluminum alloy. In the past, our general circuit boards were made of fiberglass, but because LEDs generate a lot of heat, the circuit boards used for LED lamps are generally aluminum printed circuit boards, which can conduct heat quickly. The circuit boards used for other equipment or electrical appliances are still fiberglass boards!

What are the advantages of aluminum PCB?

Heat dissipation
Many double-sided boards and multi-layer boards have high density and high power, and it is difficult to dissipate heat. Conventional printed circuit board substrates such as FR4 and CEM3 are poor conductors of heat, with insulation between layers, and heat cannot be dissipated. If local heating of electronic equipment is not eliminated, electronic components will fail at high temperatures, and aluminum printed circuit boards can solve this heat dissipation problem.
Thermal expansion
Thermal expansion and contraction are the common nature of materials, and the thermal expansion coefficients of different materials are different. Aluminum-based printed circuit boards can effectively solve the heat dissipation problem, thereby alleviating the thermal expansion and contraction problems of different materials of components on the printed circuit board, and improving the durability and reliability of the whole machine and electronic equipment. In particular, it solves the thermal expansion and contraction problems of SMT (surface mount technology).
Dimensional stability
Aluminum-based printed circuit boards are obviously much more stable in size than printed circuit boards made of insulating materials. Aluminum-based printed circuit boards and aluminum sandwich panels, heated from 30℃ to 140~150℃, have a dimensional change of 2.5~3.0%.
Other advantages
Aluminum-based printed circuit boards have a shielding effect; high strength, replacing brittle ceramic substrates; ease of use, safe use of surface mounting technology; reducing the truly effective area of the printed circuit board; replacing components such as radiators, improving product heat resistance and physical properties; reducing production costs and labor.

How does an aluminum PCB work?

‌The working principle of aluminum printed circuit boards mainly relies on its unique three-layer structure: circuit layer (copper foil), insulation layer and metal base layer. This structure enables aluminum printed circuit boards to have good heat dissipation function.

Specifically, the power device is mounted on the circuit layer. When the device is running, the heat generated is quickly transferred to the metal base layer through the insulation layer, and then the metal base layer transfers the heat away, thereby achieving effective heat dissipation of the device. This design enables aluminum printed circuit boards to significantly reduce thermal resistance, provide excellent thermal conductivity, and maintain excellent mechanical properties.

Aluminum printed circuit boards also comply with RoHS requirements and are more suitable for SMT processes. In the circuit design scheme, heat diffusion is extremely effectively processed, the module operating temperature is reduced, the service life is extended, and the power density and reliability are improved. By reducing the configuration of heat sinks and other hardware, aluminum printed circuit boards can also reduce product size, reduce hardware and assembly costs, and optimize the combination of power circuits and control circuits.

Types of printed circuit board aluminum

‌The classification of aluminum printed circuit boards mainly includes flexible aluminum printed circuit boards, hybrid aluminum printed circuit boards, multi-layer aluminum printed circuit boards and through-hole aluminum printed circuit boards.
‌1. Flexible aluminum printed circuit boards ‌
Utilize flexible dielectric materials to provide excellent electrical insulation, flexibility and thermal conductivity, suitable for a variety of shapes and angles, and eliminate the need for expensive fixtures, cables and connectors.
‌2. Hybrid aluminum printed circuit boards ‌
In a “hybrid” IMS structure, “sub-assemblies” of non-thermal substances are processed independently and then bonded to an aluminum substrate using thermal materials. Common structures are 2-layer or 4-layer sub-assemblies made of FR-4, bonded to an aluminum substrate with thermal dielectrics, which helps dissipate heat, improve rigidity and act as a shield.
‌3. Multi-layer aluminum printed circuit boards ‌
In the high-performance power supply market, it is made of multi-layer thermally conductive dielectrics, with one or more layers of circuits buried in the dielectric, and blind holes are used as thermal vias or signal paths to provide effective heat dissipation solutions for complex designs.
‌4. Through-hole aluminum printed circuit boards‌
Before lamination, the aluminum is plated and filled with dielectric, thermal materials or sub-components are laminated to both sides of the aluminum using thermal bonding materials, and plated through holes pass through the gaps in the aluminum to maintain electrical insulation.

Aluminum PCB Structure

Circuit layer
The circuit layer (generally electrolytic copper foil) is etched to form a printed circuit for assembly and connection of devices. Compared with traditional FR-4, with the same thickness and line width, aluminum printed circuit boards can carry higher currents.
Insulation layer
The insulation layer is the core technology of aluminum printed circuit boards, which mainly plays the role of bonding, insulation and heat conduction. The insulation layer of aluminum printed circuit boards is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulation layer, the more conducive it is to the diffusion of heat generated by the device during operation, and the more conducive it is to reduce the operating temperature of the device, thereby achieving the purpose of increasing the power load of the module, reducing the volume, extending the life, and increasing the power output.
Metal base
The type of metal used for the insulated metal substrate depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

Aluminum Printed Circuit Board Process

Material: Aluminum printed circuit board is a heat dissipation material with excellent thermal conductivity. Aluminum alloy materials with high thermal conductivity, high strength and good corrosion resistance are usually selected. Choosing the right substrate material has a very important influence on the stability and heat dissipation performance of aluminum printed circuit boards.

‌Cutting‌: Cut the substrate into plates of appropriate size and into the shape of the entire circuit board. Cutting methods include laser cutting, mechanical cutting, etc. After cutting, it needs to be polished to meet the requirements of the next drilling.

Grinding‌: Grinding is to form a smooth surface on the substrate material and facilitate the next drilling operation. Factors affecting the grinding effect include the type and accuracy of the tool, the type and concentration of the grinding fluid, the pressure, etc.

Drilling‌: Drilling is to form wiring holes for components on the circuit board. Most of them are now using CNC drilling machines, which can make the drilling accuracy higher. Factors affecting the drilling quality include the material and geometric characteristics of the drill bit, the drilling speed, the drilling depth, and the drilling position accuracy.

Chemical treatment: Chemical treatment is an extremely important step in the manufacturing process of aluminum printed circuit boards. The appropriate circuit layer structure is prepared by etching, copper plating, surface treatment and other methods. This step requires strict control of parameters such as the concentration, temperature and time of the corrosive agent and electrolyte to obtain the required surface structure and quality.

Copper plating: Copper plating is to form a copper layer that connects the circuit and the ground wire, usually using methods such as chemical copper plating. Adverse factors of copper plating include uneven copper layer, excessive roughness, pinholes, and deformation of the copper layer.

Welding: Welding is a necessary step to directly solder electronic devices to aluminum printed circuit boards. Welding methods include manual welding and automated welding. During the welding process, the welding temperature, time and welding quality need to be strictly controlled to ensure reliable solder joints.

What is the thermal conductivity of aluminum PCB?

‌‌The thermal conductivity of aluminum printed circuit boards refers to the amount of heat transferred by a material per unit time and per unit area, usually expressed in W/m·K. The difference between 1.0, 1.5, and 2.0 thermal conductivity.

‌1.0 W/m·K‌: The insulation layer of the general-purpose aluminum-based copper-clad laminate is composed of an epoxy glass cloth bonding sheet, which is suitable for the heat dissipation needs of general electronic products.
‌1.5 W/m·K‌: The insulation layer of the high-heat dissipation aluminum-based copper-clad laminate is composed of a high-thermal-conductivity epoxy resin or other resin, which is suitable for occasions requiring higher heat dissipation performance.
‌2.0 W/m·K‌: The insulation layer of the aluminum-based copper-clad laminate for high-frequency circuits is composed of a polyolefin resin or polyimide resin glass cloth bonding sheet.

What is the difference between aluminum PCB and FR4?

The main differences between aluminum printed circuit boards and FR-4 circuit boards are materials, thermal conductivity, mechanical properties, cost, and application areas. ‌

Materials‌:
Aluminum printed circuit boards are mainly composed of aluminum alloys, and the surface is usually coated with an insulating layer with good thermal conductivity, such as aluminum oxide (Al2O3).
The substrate of FR-4 circuit boards is a glass fiber reinforced epoxy resin, which is formed by impregnating glass fiber cloth with epoxy resin to form a composite material.

Thermal conductivity‌:
Aluminum printed circuit boards have good thermal conductivity and are suitable for applications with high heat dissipation requirements, such as LED lighting and electronic power supplies.
FR-4 circuit boards have relatively poor thermal conductivity and are usually used in general electronic devices, not suitable for scenarios with high heat dissipation requirements.
Mechanical properties‌:
Aluminum printed circuit boards are relatively hard and have good mechanical properties, and are suitable for applications that require a certain mechanical strength.
FR-4 circuit boards are relatively soft and easy to process, but may not be as good as aluminum printed circuit boards in terms of mechanical strength.
Cost‌:
Due to the high manufacturing process and material costs of aluminum printed circuit boards, the cost of aluminum printed circuit boards is relatively high.
FR-4 circuit boards have relatively low manufacturing processes and material costs, and are usually an affordable choice.
Application areas:
Aluminum printed circuit boards are mainly used in applications that require good heat dissipation performance, such as LED lamps, power modules, automotive electronics, etc.
FR-4 circuit boards are suitable for general electronic products, such as computer hardware, communication equipment, consumer electronics, etc.

What are aluminum PCBs used for?

Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
Power supply equipment: voltage stabilizers, regulators, DC-AC adapters, etc.
Communication electronic equipment: high-frequency amplifiers, filter appliances, and transmission circuits.
Office automation equipment: motor drivers, etc.
Computers: power supply devices, floppy disk drives, motherboards, etc.
Power modules: inverters, solid-state relays, rectifier bridges, etc.
Electronic control: relays, transistor bases, and cooling of components in various circuits;
Switches, microwaves: radiators, semiconductor device insulation heat conduction, motor controllers;
Industrial vehicles: igniters, voltage regulators, automatic safety control systems, and lighting conversion systems;
LED displays (two modes: LED display; display using LED light sources)
Lamps and lighting: With the promotion of energy-saving lamps, various energy-saving and gorgeous LED lamps are very popular in the market, and aluminum printed circuit boards used in LED lamps have also begun to be used on a large scale.

Aluminum printed circuit boards supplier

Best Technology specializes in providing prototyping service of customized aluminum PCB solutions to meet the diverse needs of our clients. To make sure the one-time success of pcb prototyping, we proceed SI, PI, EMC, DFM analysis during the production. We are committed to be the most reliable aluminum printed circuit boards supplier in the world!

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What is MCPCB prototype circuit board?

Friday, August 16th, 2024

What is MCPCB prototype circuit board?

MCPCB prototype refers to the manufacture of a small number of sample PCB boards before formal mass production, and actual welding and testing to verify the correctness, performance and reliability of the design. This process is usually called “proofing” or “prototype production”. The main purpose of MCPCB prototype is to conduct trial production before mass production of circuit boards to ensure the feasibility of the design and the quality of the product. Through MCPCB prototype, design engineers can find and solve potential problems before actual production, thereby ensuring the performance and reliability of the final product.

Why do we need prototype model?

MCPCB prototypes are to verify the correctness and performance of the design and ensure the quality and reliability of the final product. ‌By making MCPCB prototypes, developers can better optimize product designs, discover potential problems and deficiencies through testing, and make targeted improvements and optimizations.
‌1. Verify the correctness of the design: By making sample boards for testing, design problems can be found, such as errors in component layout and line connection. By discovering problems in advance and making modifications, problems can be avoided during mass production, saving time and cost. ‌
‌2. Evaluate the performance of the circuit board: Through proofing tests, the working condition of the circuit board, signal transmission quality, power supply stability and other aspects can be checked to ensure the reliability and stability of the final product. ‌
‌3. Improve the manufacturing process: During the sample board production process, manufacturing problems can be found, such as poor pads and unreliable line connections, so as to adjust the manufacturing process and workflow in time to improve the overall manufacturing quality and efficiency.

What files are needed to MCPCB prototype ?

‌1. Gerber file: contains the layer information of PCB, such as pads, connections, jacks, etc., and is the basic file for PCB manufacturing.

BOM (Bill of Materials) list: lists the detailed information of all components on the PCB, including component model, quantity, etc., for procurement and assembly.

‌3. Drilling file: contains the location and size information of all holes punched on the PCB, which is very important for the manufacturer to perform drilling processing.

‌4. Circuit diagram: provides the connection method of the design, which is very important for checking whether the connection of the design is correct.

‌5. Special layer file: If the design requires special processes, such as impedance control or metallized hole wall, the corresponding special layer file needs to be provided. ‌

★★Detailed explanation of the role and importance of each file:
★★Installation instructions and precautions: Provide detailed installation instructions, including information such as component direction and polarity, as well as the processing methods of special components
★★Material and thickness instructions: Specify the substrate material, plate thickness, copper foil thickness and other information used to ensure the accuracy of the production process.

What files are needed to MCPCB prototype ?

Prototype pcb manufacturing process

Design phase:

Draw schematics: Use PCB design software (such as Altium Designer, Eagle, KiCad, etc.) to draw circuit schematics and perform error checking.

Generate PCB files: Generate PCB files based on schematics and component libraries, and set parameters such as number of layers, size, line width, and vias.

Export Gerber files and drill files: Gerber files describe PCB layers, and drill files describe via positions and sizes. These files are the main files required by board manufacturers.

Production phase:

Place an order to make PCBs: Package and compress Gerber files and drill files, upload them to the website or software of the board manufacturer, and select appropriate parameters and quantities to place an order and pay.

Wait for delivery: The board manufacturer produces PCBs according to the order and sends them to customers by express delivery, which usually takes a few days to a week. ‌

Subsequent processing (if SMT patch is required): ‌

Transform the schematic diagram and package library: Identify the component type and direction for the patch machine, and modify the schematic diagram and package library. ‌

Export SMT patch coordinate file and bill of materials (BOM): The SMT patch coordinate file describes the component position and angle, and the bill of materials describes the component type and quantity. ‌

Order SMT patch: On the website or software of the board manufacturer, select whether SMT patch is required, and upload relevant files to place an order. ‌

Waiting for delivery: The patch manufacturer performs SMT patch according to the order and sends it to the customer by express delivery. ‌

Testing phase: Test with a flying probe tester to detect defects that affect functionality, such as open circuits and short circuits.

The difference between MCPCB prototype and copy board

The main differences between MCPCB prototypes and copy boards lie in the process flow, production cycle, cost, and applicable scenarios.

Different process flow: Proofing is produced according to the design documents, usually through preparation, board making, drilling, plug-in, welding, coating and other process flows, and finally form a sample consistent with the design documents. Copy board is to reverse design and produce the existing PCB board, generally only need to carry out two process flows of plate making and etching.
Different production cycle: Proofing has a longer production cycle, generally it takes 1-2 weeks to produce samples, mainly because it needs to go through multiple process flows, and the manufacturer needs to carry out strict quality control. Copy board production cycle is relatively short, generally only 3-5 days to produce a copy of the same effect as the original board.
Different cost: Proofing costs are higher, because proofing requires multiple sample production and testing, plus the production cycle is longer, manufacturers need to invest more manpower and material resources. ‌
‌Copy board costs less, because it only needs to be reverse designed and produced once, and the production cycle is short, so the cost is lower. ‌
Different applicable scenarios: ‌
‌Proofing is suitable for scenarios where the performance and reliability of PCB boards need to be verified and tested, such as the research and development stage of new products, verification of new technologies, etc. ‌
‌Copy board is suitable for scenarios where a large number of PCB boards consistent with the original need to be produced quickly, such as mass production, repair and replacement, etc. ‌

How much does a MCPCB prototype cost?

Basic costs: including manufacturing costs, material costs and labor costs. Manufacturing costs include depreciation of production equipment and equipment maintenance costs; material costs mainly refer to the costs of PCB boards, and the prices of different types of boards vary greatly; labor costs include the labor costs of design, board making, welding and other processes. ‌
Process costs: calculated according to the customer’s special requirements for PCB boards, such as multi-layer boards, blind holes, buried holes, impedance control and other advanced processes will increase costs. The more layers, the higher the manufacturing difficulty and cost; the processing of special holes requires more sophisticated equipment and technology, so it will increase costs; impedance control In order to meet the stability of signal transmission, impedance control of PCB boards is sometimes required, which will also increase certain costs.
Logistics costs: mainly include express delivery costs and insurance costs. It is calculated based on the number and weight of PCB boards, as well as the distance between the place of shipment and the place of receipt. In order to ensure the safety of goods during transportation, customers can choose to purchase insurance, and this part of the cost will also be added to the proofing price.
Other costs: including taxes, surcharges, etc. According to the tax laws of different countries and regions, customers may need to pay corresponding taxes; if customers require expedited services or special services, additional fees may be incurred.

Why do prototypes cost so much?

‌1. Material cost‌: Multilayer PCBs require more substrates and prepregs, and the quality of these materials directly affects the functionality and reliability of the circuit. Although using high TG (glass transition temperature) materials will increase costs, it can improve the stability of PCBs in high temperature environments. ‌
‌2. Manufacturing process‌: The production process of multilayer PCBs is more complicated, involving multiple pressing, drilling, and copper plating processes. ‌These steps require sophisticated equipment and technology, which pushes up production costs. ‌
‌3. Design complexity‌: The design of multilayer PCBs is usually more complex, involving more circuits and more compact spatial layout. Designers need to invest more time and energy in design optimization to ensure signal integrity and electromagnetic compatibility. ‌
‌4. Testing and verification‌: To ensure that the performance of multilayer PCBs meets the standards, rigorous testing and verification are required, including electrical testing, thermal stress testing, etc., which adds additional costs. ‌
‌5. Quantity and delivery time‌: The number of samples and the delivery time required by the customer will also affect the price. ‌Urgent orders often require additional expedited fees. ‌
‌6. Documentation and component research: The quantity and quality of documentation that may need to be completed to accompany the prototype build, and the manufacturer must update or create the necessary documentation to proceed with the build. Components in the design may need to be improved, and component engineers will need to spend time researching suitable alternatives. ‌
‌7. Engineering analysis: The design may be more conceptual rather than production-ready, requiring more engineering analysis to ensure that potential manufacturing errors have been corrected. ‌
‌8. Design and debug: It is often necessary to include more elements, such as design for assembly, design for test, and design for debug. Debugging design is essential in prototyping.

Tags:MCPCB, prototype
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What is the full form of MCPCB

Friday, August 16th, 2024

What is the full form of MCPCB

mcpcb full form is metal core printed circuit board
Attach the original printed circuit board to another metal with better heat conduction effect to improve the heat dissipation at the circuit board level. Metal-based PCBs usually consist of three layers: circuit layer (copper foil layer), thermal conductive insulation layer and metal base layer.

What is MCPCB

Metal Core PCB is a printed circuit board whose substrate uses metal material as a support layer or heat dissipation layer, usually an aluminum substrate or a copper substrate. It has excellent electrical conductivity and thermal conductivity.
Metal Core PCB is usually composed of a metal substrate, an adhesive and copper foil. It is characterized by high reliability, good heat dissipation, and is suitable for high-speed transmission and high-frequency circuits.

What is MCPCB

What is mcpcb led

Metal-based LED lamps are LED lighting fixtures that use metal-based circuit boards (MCPCBs) as light source boards. This type of circuit board, called aluminum-based copper-clad circuit boards (ALPCBs), has excellent thermal conductivity and high cost-effectiveness, and has rapidly become the first choice for light source boards of LED lighting fixtures since 2007. The basic structure of a metal-based circuit board includes a conductive layer (copper foil layer), an insulating heat dissipation layer, and a metal base layer (mostly aluminum or copper), which together provide good electrical insulation and heat dissipation.

In LED lamps, it can conduct heat quickly, which is very effective in dealing with the problem of high heat generation of LEDs. Aluminum substrates also support surface mount technology (SMT), which effectively handles heat diffusion in circuit design solutions, ensuring that LED lamps have better performance and longer service life

What is the thermal conductivity of Mcpcb?

The thermal conductivity of MCPCB ranges from 1.0-4W/mK, while high-performance MCPCB can reach 230W/mK.

The thermal conductivity of MCPCB depends on its design and the materials used. ‌Generally speaking, the thermal conductivity of MCPCB is between 1.0-4W/mK, which can already meet the heat dissipation needs of most electronic devices. ‌However, for applications that require higher thermal conductivity, MCPCBs with thermal conductivity as high as 230W/mK have appeared on the market. This high-performance MCPCB uses special materials and designs to provide better heat dissipation. ‌

MCPCB material

Aluminum substrate: Aluminum substrate is a metal-based copper-clad plate with good thermal conductivity and electrical insulation properties. It is usually composed of an aluminum alloy base layer and an insulating dielectric layer, and is suitable for electronic devices that require efficient heat dissipation, such as LED lighting and power supplies. Aluminum substrates can not only effectively conduct heat from the circuit board to the heat sink, but also have good mechanical strength and electromagnetic shielding effects.
Copper substrate: Copper substrates are known for their excellent electrical conductivity and can provide low-resistance paths, which helps improve circuit performance. Copper’s thermal expansion coefficient is similar to that of many semiconductor materials, which helps reduce thermal stress and increase component reliability.
Tungsten substrate: Tungsten substrate has good high-temperature stability and is suitable for electronic devices in high-temperature environments. Tungsten has a low thermal expansion coefficient, which helps maintain the dimensional stability of components at different temperatures, and is suitable for high-performance electronic devices that require compact designs.
Nickel substrate: Nickel substrate has good magnetic properties and is suitable for the application of magnetic components. Nickel substrates exhibit excellent corrosion resistance and mechanical strength under certain environments, and are suitable for electronic devices in some special environments. ‌
Stainless steel substrate: Stainless steel substrate is well-known for its excellent corrosion resistance and is suitable for electronic devices in some special environments. The durability and stability of stainless steel substrate make it an ideal choice for some harsh environments.

Advantages of MCPCB

High thermal conductivity: The thermal conductivity of metal substrate PCB is much better than that of traditional plastic substrates such as FR4. It can effectively conduct the heat generated by components, reduce the operating temperature of components, and improve the reliability and life of circuit boards.
Good thermal stability: Metal substrate PCB can maintain good dimensional stability and electrical performance in high temperature environments, and is suitable for high temperature working environments.
High strength and rigidity: Metal substrate PCB has high mechanical strength and rigidity, is not easy to deform and break, and can withstand large external forces and vibrations.
Excellent electrical insulation performance: Through the special insulation layer design, good electrical insulation performance is guaranteed to avoid electrical short circuits between components.
Low impedance: The conductive layer of metal substrate PCB is made of metal material, which has low impedance, which is conducive to signal transmission and processing.
Good processability: Metal substrate PCB can be processed by conventional mechanical processing methods such as drilling and cutting, which is convenient for the production of circuit boards with complex shapes and sizes. ‌
Widely used: Aluminum substrates are widely used in audio equipment, computers, automobiles, lamps and lighting. Copper substrates are suitable for high-frequency circuits and areas with large changes in high and low temperatures.

Application of MCPCB

Automotive electronics: The stability and reliability of metal-based PCBs make them an ideal choice in the automotive electronics field, ensuring the stable operation of automotive electronic systems.
Medical devices: In medical devices, the high reliability and good electromagnetic compatibility of metal-based PCBs are essential to ensure the accuracy and safety of medical equipment.
Industrial automation: Industrial automation equipment has high requirements for reliability and performance. The mechanical strength and high thermal conductivity of metal-based PCBs make them the preferred choice in the field of industrial automation.
Communication base stations and radar systems: Communication base stations and radar systems need to process a large amount of data transmission and high-frequency signals. The excellent electrical properties and high-frequency characteristics of metal-based PCBs meet the needs of these applications.
Antennas and filters: In the field of wireless communications, the electromagnetic shielding performance and stability of metal-based PCBs are essential to improving communication quality and reducing electromagnetic interference.

How to make MCPCB

The process flow of metal-based PCB includes inner-layer circuit production, lamination, drilling, hole metallization, outer-layer dry film, outer-layer circuit, silk-screen printing, surface processing and post-processing. ‌

Inner-layer circuit production: This step is mainly to produce the inner-layer circuit of the PCB circuit board, including cutting, pretreatment, lamination, exposure, DE (development, etching, film removal) and other processes, the purpose is to produce the inner-layer circuit of the PCB circuit board. ‌
Lamination: Press the copper foil, prepreg and brown-treated inner-layer circuit board into a multi-layer board. This step is to press multiple inner-layer boards into one board. ‌
Drilling: Use a drilling machine to drill holes of different diameters and sizes on the board according to customer requirements, so that the holes between the boards are convenient for subsequent processing of plug-ins, and can also help the board dissipate heat. ‌
Hole metallization: Metallizing the non-conductor part on the hole wall can make the subsequent electroplating process more convenient. ‌This step is to plate copper in the hole so that the circuits on each layer of the board are conductive. ‌
Outer layer dry film: The required circuit is exposed on the dry film through graphic transfer technology, in order to facilitate the subsequent process to make the circuit. ‌
Outer layer circuit: The purpose is to plate the copper thickness to the thickness required by the customer and complete the circuit shape required by the customer. ‌
Silk screen printing: The protective layer of the outer layer circuit is used to ensure the insulation, protective plate, and solder mask of the PCB. ‌
Surface processing: Complete the processing according to the customer’s requirements, and test it to ensure the final quality audit. ‌Both THT and SMT parts are installed on the PCB using machinery and equipment. ‌
Post-processing: Complete the processing according to the customer’s requirements, and test it to ensure the final quality audit.

Metal PCB Manufacturers

Welcome to our website! With over 18 years of experience in designing and manufacturing MCPCBs, we take pride in being your one-stop supplier. Our original factory spans 30,000㎡, and with a team of 229+ staff and advanced equipment, we achieve a daily peak production of up to 100k pieces.

As a trusted supplier, we hold certifications including UL, ISO13485, ISO9001, IATF16949 and SGS, enabling us to meet the high standards of clients across Europe, America, Israel, India, and so on. Our success is built on core values such as honesty, integrity, teamwork, appreciation, self-confidence, pragmatism, continuous learning, self-discipline, and fostering win-win cooperation. Experience reliability, efficiency, and quality with us. Explore our services and let us help you fulfill your MCPCB needs.

Printed circuit board assembly metal core

The preparation processes of metal matrix composite materials include contact reaction method (CR method), mixed salt reaction method (LSM method), hot pressing preparation process, stirring casting method, semi-solid composite casting method, impregnation solidification method (MI technology) and centrifugal casting method.

Contact reaction method (CR method) is to mix the matrix element or alloy powder and the strengthening element or alloy powder in a certain proportion, cold press into a prefabricated block with a certain density, and then immerse it in an alloy melt at a certain temperature. After the reaction, a fine strengthening phase is generated in the alloy melt, and after stirring and standing, it can be cast into various castings. This method has been used to prepare a variety of metal matrix composite materials, such as Al-based, Mg-based, Cu-based, Ti-based, Fe-based, Ni-based composite materials, showing excellent mechanical properties. ‌
The mixed salt reaction method (LSM method) is to mix salts containing Ti and B, such as KBF4 and K2TiF6, and add them to high-temperature metal melt. The Ti and B in the salt are reduced by the metal under high temperature and react in the melt to form a reinforcing phase. After slag removal, it can be cast to obtain a reinforced metal matrix composite material. ‌
The hot pressing preparation process is a solid phase composite process for preparing metal matrix composite materials by diffusion bonding continuous fibers and matrix alloys at a certain heating temperature and pressure.
The stirring casting method is to add ceramic particles to the molten metal, and after uniform stirring, pour it into the mold to obtain products or secondary processing blanks. This method is easy to achieve mass production and has low cost, but the main disadvantage is that the combination of matrix metal and reinforcing particles is limited. ‌
The semi-solid composite casting method is developed from the semi-solid casting method. Through strong stirring, the dendrite network skeleton is broken and the dispersed granular structure is retained, which improves wettability and promotes interface bonding. ‌
The impregnation solidification method (MI technology) is a method of impregnating a pre-prepared reinforcement phase formed body with a high porosity into a molten matrix metal, allowing the matrix metal to penetrate the preform and then solidify it to prepare a composite material. ‌
The centrifugal casting method is widely used in the casting of hollow parts. It forms a bimetallic layered composite material through a two-step casting method. This method is simple and has the advantages of low cost and high density of the casting, but the interface quality is not easy to control.

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Heat Conductivity Aluminum vs. Copper – Best Technology

Monday, August 12th, 2024

When considering materials for heat transfer applications, both heat conductivity aluminum and copper often come up. These metals are widely known for their ability to conduct heat, making them essential in various industries. However, there are some key differences between the two. While copper is generally recognized for its superior heat conductivity, aluminum offers distinct advantages that make it a popular choice in specific contexts. In this blog, we’ll explore the heat conductivity of aluminum, compare it with copper, and discuss why aluminum remains a top contender in many applications.

Heat Conductivity Aluminum vs. Copper - Best Technology

What is the Heat Conductivity of Aluminum?

Heat conductivity refers to a material’s ability to conduct heat. Aluminum, while not as conductive as copper, still performs remarkably well in transferring heat. The thermal conductivity of aluminum is about 205 W/m·K, which, although lower than copper’s 385 W/m·K, is still sufficient for many applications. This makes aluminum a practical choice for applications where efficient heat dissipation is required.

Aluminum’s thermal conductivity varies slightly depending on the alloy. For example, 6061 aluminum, a commonly used alloy, has a thermal conductivity of about 167 W/m·K. Despite this, aluminum remains a reliable material for heat sinks, radiators, and other components requiring effective heat management.

Is Aluminum a High Conductor of Heat?

Aluminum is considered a good conductor of heat, though it’s not the best. Its heat conductivity is higher than many other metals, such as steel or titanium, but lower than copper. This balance of conductivity and other properties, such as weight and corrosion resistance, makes aluminum a versatile material. In applications where weight is a concern, aluminum’s lower density compared to copper is a significant advantage. This is why aluminum is often chosen for automotive and aerospace applications, where weight reduction is critical.

The combination of adequate heat conductivity and lightweight properties makes aluminum an excellent choice for heat exchangers, power electronics, and other components where both heat dissipation and weight are critical factors.

What is the Thermal Conductivity of Aluminum in K?

The thermal conductivity of aluminum is usually expressed in watts per meter-kelvin (W/m·K). For pure aluminum, the thermal conductivity is approximately 205 W/m·K at room temperature. This value can vary depending on the specific alloy and its temperature. For instance, as the temperature increases, the thermal conductivity of aluminum decreases slightly, but it remains effective for most applications.

Aluminum’s ability to maintain a relatively stable thermal conductivity across different temperatures is one reason it’s preferred in environments where temperature fluctuations are common. Whether in electronics or construction, aluminum’s consistent performance makes it a reliable material for heat management.

What is the Thermal Conductivity of 6061 Aluminum?

6061 aluminum is one of the most widely used aluminum alloys due to its excellent mechanical properties and versatility. Its thermal conductivity is slightly lower than that of pure aluminum, typically around 167 W/m·K. This alloy is often used in applications where a combination of good thermal conductivity, strength, and corrosion resistance is needed.

Despite having lower thermal conductivity than pure aluminum, 6061 aluminum is still effective in dissipating heat. Its ease of machining and ability to be heat-treated makes it a popular choice in the automotive and aerospace industries, where it’s used in components like engine parts and structural frames.

Basic Parameters of 6061 Series Aluminum

Property	Parameter	6061 Aluminum
Chemical Composition	Aluminum (Al)	95.85% – 98.56%
	Magnesium (Mg)	0.8% – 1.2%
	Silicon (Si)	0.4% – 0.8%
	Copper (Cu)	0.15% – 0.4%
	Chromium (Cr)	0.04% – 0.35%
	Iron (Fe)	≤ 0.7%
	Zinc (Zn)	≤ 0.25%
	Manganese (Mn)	≤ 0.15%
	Titanium (Ti)	≤ 0.15%
	Other Elements	Each ≤ 0.05%, Total ≤ 0.15%
Mechanical Properties	Ultimate Tensile Strength (UTS)	290 MPa (42,000 psi)
	Yield Strength (0.2% offset)	241 MPa (35,000 psi)
	Elongation	8% – 12% (depending on temper)
	Hardness (Brinell)	95 HB (T6 condition)
	Shear Strength	207 MPa (30,000 psi)
Physical Properties	Density	2.70 g/cm³ (0.0975 lb/in³)
	Melting Point	582°C – 652°C (1,080°F – 1,206°F)
	Thermal Conductivity	167 W/m·K
	Coefficient of Thermal Expansion	23.6 µm/m·°C (13.1 µin/in·°F)
	Electrical Conductivity	40% IACS
	Specific Heat	0.896 J/g·°C

Why Do Conductors Have a High Heat Capacity?

Conductors typically have a high heat capacity because of their ability to absorb and distribute heat energy efficiently. This property is particularly important in materials used for heat dissipation. While aluminum has a lower heat capacity compared to copper, it still performs well enough to be used in many thermal management applications.

The high heat capacity of aluminum allows it to absorb heat without a significant rise in temperature, making it effective in applications like heat sinks and radiators. Its ability to distribute heat evenly across its surface ensures that hot spots are minimized, contributing to the overall efficiency of the cooling process.

Which Metal is the Best Conductor of Heat?

Copper is widely recognized as the best conductor of heat among common metals, with a thermal conductivity of about 389 W/m·K. This makes it ideal for applications where maximum heat transfer is required. However, copper is heavier and more expensive than aluminum, which can be a disadvantage in certain contexts.

Aluminum, while not as conductive as copper, offers a balance of good heat conductivity, low weight, and cost-effectiveness. In applications where these factors are more important than the absolute best conductivity, aluminum is often the preferred choice. This is why aluminum is commonly used in heat sinks, air conditioning units, and automotive radiators, where its combination of properties provides the best overall performance.

Choosing between aluminum and copper depends on the specific requirements of the application. If weight and cost are significant considerations, aluminum often comes out on top. However, for situations where the highest possible heat transfer is needed, copper might be the better option.

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What is Thermal-Electric Separation Copper Substrate with Flexible PCB?

Saturday, August 3rd, 2024

As electronic devices become increasingly miniaturized and high-performance, traditional circuit boards are no longer sufficient for certain high-demand applications. To address these challenges, the Thermal-Electric Separation Copper Substrate with Flexible PCB has emerged. This innovative composite circuit board combines the efficient heat dissipation characteristics of thermal-electric separation copper substrates with the flexibility of flexible PCBs (FPC). It is widely use for high-performance electronic products, which requires efficient heat dissipation and complex circuit.

What is Thermal-Electric Separation Copper Substrate with Flexible PCB?

The Thermal-Electric Separation Copper Substrate with Flexible PCB is a composite material that combines a rigid thermal-electric separation copper substrate with a flexible circuit board. It integrates the advantages of both, providing superior performance in high-power and high-density applications.

1. Thermal-Electric Separation Copper Substrate

The thermal-electric separation copper substrate is designed for high-power electronic devices, providing an efficient heat dissipation solution. It separates the paths of heat and electrical signals to avoid thermal interference with electrical performance. Its structure typically includes:

Single-sided design: Electronic components are placed on one side of the copper substrate, while the other side is used for heat dissipation.
High thermal conductivity materials: Such as copper or aluminum, which can quickly conduct heat, like copper is 400W/m.k, aluminum is 237W/m.k.
Thermal vias: Vertical heat conduction paths that rapidly transfer heat to the dissipation layer.

2. Flexible PCB (FPC)

Flexible PCBs (Flexible Printed Circuits, FPC) use flexible materials like polyimide (PI) or polyester (PET) that can bend and fold to adapt to complex three-dimensional structures and dynamic application scenarios. Their advantages include:

Lightweight: Reducing the overall weight of the device.
High-density wiring: Achieving complex circuit designs in limited space.
Flexibility: Meeting diverse design needs.

Structure and Characteristics

The structure of the Thermal-Electric Separation Copper Substrate with Flexible PCB includes rigid and flexible parts, connected together using conductive adhesives or other bonding materials to form a unified whole.

1. Rigid Part

The rigid part uses the thermal-electric separation copper substrate, responsible for efficient heat dissipation and mechanical support. This part usually carries high-power components to ensure rapid heat transfer and dissipation.

2. Flexible Part

The flexible part uses the flexible PCB, which can bend and fold to fit the complex internal structure of devices. This part is typically used to connect the rigid part with other modules that require flexible connections.

3. Bonding Method

The flexible and rigid parts are bonded together using conductive adhesives, welding, or mechanical connections. The design of the bonding area ensures stable electrical connections and reliability during bending and dynamic use.

Thermal-Electric Separation Copper Substrate with Flexible PCB Advantages

1. Efficient Heat Dissipation

The thermal-electric separation copper substrate provides excellent heat dissipation, effectively conducting away the heat generated by high-power components to maintain a reasonable operating temperature range. This is especially important for applications like high-power LEDs and power semiconductor devices.

2. Flexibility

The use of the flexible PCB offers great design freedom, allowing adaptation to the complex three-dimensional structures and dynamic application needs within devices. This enables designers to achieve more complex circuit designs in limited spaces, increasing device integration and functionality.

3. Reliability

The thermal-electric separation design and high thermal conductivity materials enhance the reliability of the circuit board, reducing the impact of heat on electrical performance. The flexible part reduces the number of connection points, lowering the risk of failure.

4. Space Saving

Combining the advantages of rigid and flexible circuit boards allows for efficient heat dissipation and complex circuit in limited space. This is crucial for modern miniaturized and high-density electronic product designs.

Where Thermal-Electric Separation Copper Substrate with Flexible PCB used?

1. High-Power LED Lighting

High-power LEDs generate a significant amount of heat during operation. The thermal-electric separation copper substrate provides an efficient heat dissipation solution, ensuring the stable operation and long lifespan of LEDs. The flexible part is used to connect different LED modules, accommodating diverse design requirements.

2. Automotive Electronics

In automotive electronics, such as in-vehicle cameras and sensor modules, efficient heat dissipation and compact design are required. The thermal-electric separation copper substrate with flexible PCB can meet these demands, enhancing device reliability and performance.

3. Consumer Electronics

Devices like smartphones and tablets require lightweight and miniaturized designs. The thermal-electric separation copper substrate with flexible PCB offers efficient heat dissipation and flexible circuit, optimizing device performance and user experience.

4. Medical Devices

In applications that require flexibility and reliability, such as portable diagnostic equipment and implantable medical devices, the thermal-electric separation copper substrate with flexible PCB can help to enhancing device performance and reliability.

How does Thermal-Electric Separation Copper Substrate with Flexible PCB manufactured?

The manufacturing process for the thermal-electric separation copper substrate with flexible PCB is complex, typically including the following steps:

Material Preparation: Selecting appropriate rigid and flexible materials and performing pre-treatment.
Circuit Printing: Printing circuit patterns on both rigid and flexible materials.
Lamination and Bonding: Combining the flexible circuit board with the thermal-electric separation copper substrate, usually using conductive adhesives or other bonding materials.
Drilling and Plating: Drilling holes and electroplating to form conductive paths on the combined board.
Surface Treatment: Performing surface treatments such as pad coating on the circuit board.
Testing and Inspection: Conducting electrical and mechanical performance tests to ensure the quality and reliability of the board.

The thermal-electric separation copper substrate with flexible PCB, as an innovative composite circuit board, combines the advantages of efficient heat dissipation and flexible wiring. It is widely used in high-performance and complex design electronic products. With continuous technological advancements and growing market demand, this composite circuit board will play an important role in more fields, driving the ongoing innovation of electronic manufacturing technology. Want know more about it, just feel your free to contact us.

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What Is led ring light pcb

Friday, August 2nd, 2024

led ring light pcb leads the development of lighting industry with its innovative design, high efficiency and flexibility, bringing more intelligent and comfortable lighting experience to our life.

It is not only an integrated platform of electronic components, but also a perfect combination of modern technology and aesthetics, and is the focus of future lighting trends.

led ring light pcb, like a magic wand on the electronic stage, uses precise SMT technology to lightly attach LED components to it. Whether it is a warm small lamp for home decoration, efficient lighting in commercial space, or smart display inside the car, it is indispensable.

Its core structure includes efficient LED lamp beads, power cords that provide electricity, and intelligent controllers that adjust light effects, which together build an excellent lighting solution.

What Is led ring light pcb

Why use mcpcb for led ring light pcb

With the continuous development of LED technology, the heat generated by LEDs has gradually increased. The traditional FR4 printed circuit board (PCB) has been unable to meet the heat dissipation requirements due to its low thermal conductivity (only 0.36W/m.K). In order to solve this problem, the metal core printed circuit board (MCPCB) was proposed. It attaches the original printed circuit board to a metal with better thermal conductivity (such as aluminum and copper) to enhance the heat dissipation effect. The thermal conductivity efficiency of MCPCB is higher than that of traditional FR4 PCB, reaching 1W/m.K to 2.2W/m.K, which effectively improves the heat dissipation performance of LED PCB.

In addition, the use of MCPCB can also reduce the number of LEDs required to generate lighting, making it an ideal choice for street lights, automotive LED applications, and backlight unit applications. The use of metal substrates has practical advantages in heat dissipation, thermal conductivity, reliability, and electrical insulation, especially in harsh environments, and can also achieve reliable operation of LEDs. For example, using a metal substrate can reduce the LED junction temperature by 20-30°C, improve light output and enhance the overall performance of the product, ensure consistent UV light generation, and expand the possibilities of UV applications in various industries.

Unveiling the Components of LED PCBs

LED Chips: The heart of the LED PCB, these semiconductor chips emit light when current passes through them.
Substrate Material: The base layer of the PCB provides mechanical support and thermal conductivity.
Copper Traces: These conductive pathways connect the LEDs and other components, allowing current to flow through the circuit.
Solder Mask: A protective layer that covers the copper traces, safeguarding them from external factors and preventing short circuits.
Silkscreen: This layer contains markings and labels, providing important information about the PCB’s components and assembly.

Advantages of led ring light pcb?

Thermal performance advantages of metal substrate PCB

High thermal conductivity:
The thermal conductivity of metal substrate PCB is much better than that of traditional plastic substrates such as FR4. It can effectively conduct the heat generated by components, reduce the operating temperature of components, and improve the reliability and life of circuit boards.

Good thermal stability:
Metal substrate PCB can maintain good dimensional stability and electrical performance in high temperature environment, and is suitable for high temperature working environment.

Mechanical performance advantages of metal substrate PCB

High strength: Metal substrate PCB has high mechanical strength and rigidity, is not easy to deform and break, and can withstand large external forces and vibrations.

Good processability: Metal substrate PCB can be processed by conventional mechanical processing methods such as drilling and cutting, which is convenient for the production of circuit boards with complex shapes and sizes.

Electrical performance advantages of metal substrate PCB
Excellent electrical insulation performance: Metal substrate PCB has a special insulation layer design to ensure good electrical insulation performance and avoid electrical short circuits between components.

Low impedance: The conductive layer of metal substrate PCB is made of metal material, which has low impedance, which is conducive to signal transmission and processing.

How does led ring light pcb dissipate heat?

Compared with the traditional FR-4, the aluminum substrate can reduce the thermal resistance to the minimum, making the aluminum substrate have excellent thermal conductivity; compared with the thick film ceramic circuit, its mechanical properties are extremely good.

In the circuit design scheme, the heat diffusion is handled very effectively, thereby reducing the module operating temperature, extending the service life, and improving the power density and reliability; reducing the assembly of the heat sink and other hardware (including thermal interface materials), reducing the product volume, and reducing the hardware and assembly costs; combining the power circuit and the control circuit

How to make a LED light circuit board?

Step 1: Design Your LED PCB:
Using PCB design software, create a schematic for your LED circuit and design the PCB layout, considering component placement and signal flow.

Step 2: Choose the Materials:
Select a suitable substrate material and copper-clad board based on your project requirements.

Step 3: Transfer the Design:
Print your PCB layout onto a special transfer paper and transfer it onto the copper-clad board using a heat press.

Step 4: Etch the Board:
Immerse the board in an etching solution to remove the excess copper and reveal the copper traces.

Step 5: Drill Holes:
Drill holes on the board to accommodate the LED chips and other components.

Step 6: Solder the Components:
Carefully solder the LED chips and other components onto the board, ensuring secure connections.

Step 7: Test Your LED PCB:
Connect your LED PCB to a power source and test the LEDs to ensure they light up correctly.

How to make a LED light circuit board?

Capabilities of led ring light pcb?

Item	Capabilities
Layer Count	1 – 10 Layers
Max Board Dimension	2464″(6101625mm)
Min Board Thickness	0.6mm
Max Board Thickness	4.0mm
Conductor Thickness	0.5oz – 10oz
Min Line Width/Line Space	4/4mil (0.10/0.10mm)
Min Hole Diameter	10mil (0.25mm)
Min Punch Hole Dia	0.12″ (3.0mm)
Min Hole Spacing	16mil (0.4mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia	14mil (0.35mm)
Min Soldermask Bridge	8mil (0.20mm)
Min BAG PAD Margin	5mil (0.125mm)
PTH/NPTH Dia Tolerance	PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation	±3mil (0.075mm)
Outline Tolerance	CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio	10:01
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,

	Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm

Capabilities

Applications of led ring light pcb?

Application in medical equipment
The rapid progress of medicine is closely related to the rapid development of the electronics industry. Many medical devices are made of basic PCBs alone, such as pH meters, heart rate sensors, temperature measurements, electrocardiographs, electroencephalographs, MRIs, X-ray machines, CT scanners, blood pressure machines, blood sugar level measuring equipment, etc.
Application in industrial equipment
PCBs are widely used in manufacturing, especially in industries with high-power mechanical equipment; these devices run on high power and require high current circuit drive. Such as arc welding, large servo motor drives, lead-acid battery chargers, clothing cotton machines, etc.
Application in lighting
LED lights and high-intensity LEDs are mounted on PCBs based on aluminum substrates; aluminum has the property of absorbing heat and dissipating it in the air.
Application in the automotive and aerospace industries
Flexible PCBs are lightweight but can withstand high vibrations. Because of their light weight, they can reduce the total weight of spacecraft; flexible PCBs can be adjusted even in narrow spaces. These flexible PCBs are used as connectors, interfaces, and can be assembled even in compact spaces

FAQs About led ring light pcb

What is the thermal conductivities and withstanding voltages of BT/FR4 layer and Dielectric layer?
The SinkPAD conducts heat primarily through the copper base (400W/m.K), the withstanding voltages of Dielectric layer is around 4KV.

What is the placement accuracy for the SMT components?
+/-0.05mm is our SMT accuracy tolerance. You are welcome to come to our SMT factory in Shenzhen China and Vietnam.

Can the aluminum be made as the base of sinkpad MCPCB?

Actually, the sinkpad can only use copper as the base.
As you can see the below manufacturing steps, the SinkPad will etch the copper base into convex platform with Copper Etching Solution, then hollow out the Double Layer FR4 PCB, and do lamination with the convex platform.
However, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching the LED pad platform. Considering the scrap rate, the process of etching LED pad platform with aluminum is more complex and the overall cost is higher.

Can I plated copper in mcpcb via holes?
Generally speaking, copper plating through holes requires hole rings, otherwise the copper in the hole wall will easily fall off.

In addition, if it is a copper substrate, through the hole first to resin plug before copper plating.

Otherwise there’s no chemical reaction between copper and copper. And if the copper layer is connected to each copper layer, it is easy to short circuit.

Are you UL certified led pcb manufacturer?

Yes, we are UL certified manufacturer, our UL is E475635. We have already passed UL certificated. Meanwhile, we are passed ISO9001, ISO13485 and IATF16949 certifications.

Our LED pcbs are manufactured under highly monitored by these quality system controls.

How does the conveity of sinkpad manufactured?

Actually the sinkpad can only use copper as the base.

As you can see the below manufacturing steps, the SinkPad will etch the copper base into convex platform with Copper Etching Solution, then hollow out the Double Layer FR4 PCB, and do lamination with the convex platform.However, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching.

Tags:MCPCB, PCB
Posted in best pcb, bestpcb, FAQ, FR4 PCB, HDI PCB, Led PCB, mcpcb, Metal Core PCB | No Comments »

What Is led light pcb?

Friday, August 2nd, 2024

led light pcb　, or printed circuit board, is a stable carrier of electronic components. It not only realizes electrical connection but also plays a supporting role. As the core component of electronic products, it is widely used in various electronic devices. In the field of LED lighting, PCB light board provides support and power for LED lamp beads, ensuring their stable operation in scenes such as home, commercial and automotive lighting. PCB with LED is often used to manufacture electronic products such as indicator lights, lighting equipment and display screens. The LED lamp beads on these PCBs are usually precisely soldered by SMT (surface mount technology).

led light pcb

LED PCB light board leads the development of the lighting industry with its innovative design, high efficiency and flexibility, bringing a more intelligent and comfortable lighting experience to our lives. It is not only an integrated platform for electronic components, but also a perfect combination of modern technology and aesthetics, and is the focus of future lighting trends.

Why use mcpcb for led light pcb

With the continuous development of LED technology, the heat generated by LEDs has gradually increased. The traditional FR4 printed circuit board (PCB) has been unable to meet the heat dissipation requirements due to its low thermal conductivity (only 0.36W/m.K). In order to solve this problem, the metal core printed circuit board (MCPCB) was proposed. It attaches the original printed circuit board to a metal with better thermal conductivity (such as aluminum and copper) to enhance the heat dissipation effect. The thermal conductivity efficiency of MCPCB is higher than that of traditional FR4 PCB, reaching 1W/m.K to 2.2W/m.K, which effectively improves the heat dissipation performance of LED PCB.

Why use mcpcb for led light pcb

Advantages of led light pcb?

High thermal conductivity: LED PCB, especially aluminum substrate, uses aluminum alloy material with high thermal conductivity, which can effectively conduct away the heat generated by LED, maintain the stability of LED operation and extend the service life. This high thermal conductivity is essential to prevent heat accumulation and keep LED working at high brightness for a long time.

High efficiency: Compared with traditional incandescent lamps and energy-saving lamps, LED lamps have higher luminous efficiency and can provide better lighting effects while reducing energy consumption. This makes LED PCB have significant advantages in energy saving and environmental protection.

Long life: The service life of LED PCB far exceeds that of traditional lighting products, and it can provide longer continuous lighting, reducing the trouble of frequent bulb replacement and reducing maintenance costs.

Low energy consumption: LED PCB requires much less electricity than traditional lighting equipment while providing the same brightness, which is very important for energy saving, emission reduction and sustainable development

How does led light pcb dissipate heat?

The power device is mounted on the circuit layer. The heat generated by the device during operation is quickly transferred to the metal base layer through the insulating layer, and then the metal base layer transfers the heat to achieve heat dissipation of the device. Compared with the traditional FR-4, the aluminum substrate can reduce the thermal resistance to the minimum, making the aluminum substrate have excellent thermal conductivity; compared with the thick film ceramic circuit, its mechanical properties are extremely good. In the circuit design scheme, the heat diffusion is handled very effectively, thereby reducing the module operating temperature, extending the service life, and improving the power density and reliability; reducing the assembly of the heat sink and other hardware (including thermal interface materials), reducing the product volume, and reducing the hardware and assembly costs; combining the power circuit and the control circuit

How to make a LED light circuit board?

Cutting
Cutting process Picking materials – cutting
The purpose of cutting
Cut the large-sized incoming materials into the size required for production
Precautions for cutting
① Check the size of the first piece of material
② Pay attention to the scratches on the aluminum surface and the copper surface
③ Pay attention to the delamination and flash of the board edge
Drilling
Drilling process
Pinning – drilling – board inspection
The purpose of drilling
Positioning and drilling holes in the board to assist the subsequent production process and customer assembly
Precautions for drilling
① Check the number of holes and the size of the holes
② Avoid scratches on the board
③ Check the flash of the aluminum surface and the hole position deviation
④ Check and replace the drill bit in time
⑤ Drilling is divided into two stages, one drilling: drilling holes after cutting for peripheral tool holes
Second drilling: tool holes in the unit after solder mask
Dry/wet film imaging
Dry/wet film imaging process
Grinding board – film pasting – exposure – development
Purpose of dry/wet film imaging
To present the part required for making circuits on the board
Precautions for dry/wet film imaging
① Check whether the circuit is open after development
② Whether the development alignment is biased to prevent the generation of dry film fragments
③ Pay attention to the circuit defects caused by scratches on the board
④ No air should remain during exposure to prevent poor exposure
⑤ After exposure, it should be still for more than 15 minutes before development
IV. Acid/alkaline etching
Acid/alkaline etching process
Etching-film stripping-drying-board inspection
Purpose of acid/alkaline etching
After imaging the dry/wet film, keep the required circuit part and remove the excess part outside the circuit. During acid etching, attention should be paid to the corrosion of the etching solution to the aluminum substrate;
Precautions for acid/alkaline etching
① Pay attention to incomplete etching and excessive etching
② Pay attention to line width and line thickness
③ Oxidation and scratches are not allowed on the copper surface
④ The dry film should be removed cleanly
V. Silk screen solder mask and characters
Silk screen solder mask and character process
Silk screen-pre-bake-exposure-development-characters
Purpose of silk screen solder mask and characters
① Anti-soldering: protect circuits that do not need soldering and prevent tin from entering and causing short circuits
② Characters: serve as markings
Precautions for silk screen solder mask and characters
① Check whether there is garbage or foreign matter on the board
② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after silk screen printing to avoid bubbles in the circuit
④ Pay attention to the thickness and uniformity of the silk screen
⑤ After pre-bake, the board should be completely cooled to avoid film contamination or damage to the glossiness of the ink surface
⑥ Place the ink side down during development
VI. V-CUT, gong board
V-CUT, gong board process
V-CUT——gong board——tear protective film——remove burrs
Purpose of V-CUT, gong board
① V-CUT: Cut the single PCS circuit and the entire PNL board to leave a small part connected for easy packaging and removal
② Gong board: remove the excess part of the circuit board
Precautions for V-CUT, gong board
① During the V-CUT process, pay attention to the size of the V, the incompleteness and burrs of the edges
② Pay attention to the burrs caused by the gong board, the gong knife is tilted, and the gong knife is checked and replaced in time
③ Finally, avoid scratches on the board when removing the burr
VII. Testing, OSP
Testing, OSP process
Circuit test-voltage resistance test-OSP
Testing, the purpose of OSP
① Circuit test: Check whether the completed circuit is working normally
② Voltage resistance test: Check whether the completed circuit can withstand the specified voltage environment
③ OSP: Allow the circuit to be soldered better
Testing, OSP precautions
① How to distinguish and store qualified and unqualified products after testing
② Placement after OSP
③ Avoid damage to the circuit
VIII. FQC, FQA, packaging, shipment
Process
FQC-FQA-packaging-shipping
Purpose
① FQC conducts full inspection and confirmation of the product
② FQA spot check and verification
③ Pack and ship to customers as required
Note
① FQC should pay attention to the appearance confirmation during the visual inspection and make reasonable distinctions
② FQA should conduct random inspections to verify the inspection standards of FQC
③ Confirm the packaging quantity to avoid mixed boards, wrong boards and packaging damage

Capabilities of led light pcb?

Item	Capabilities
Layer Count	1 – 10 Layers
Max Board Dimension	2464″(6101625mm)
Min Board Thickness	0.6mm
Max Board Thickness	4.0mm
Conductor Thickness	0.5oz – 10oz
Min Line Width/Line Space	4/4mil (0.10/0.10mm)
Min Hole Diameter	10mil (0.25mm)
Min Punch Hole Dia	0.12″ (3.0mm)
Min Hole Spacing	16mil (0.4mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia	14mil (0.35mm)
Min Soldermask Bridge	8mil (0.20mm)
Min BAG PAD Margin	5mil (0.125mm)
PTH/NPTH Dia Tolerance	PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation	±3mil (0.075mm)
Outline Tolerance	CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio	10:01
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,

	Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm

Applications of led light pcb?

Application in medical equipment
The rapid progress of medicine is closely related to the rapid development of the electronics industry. Many medical devices are made of basic PCBs alone, such as pH meters, heart rate sensors, temperature measurements, electrocardiographs, electroencephalographs, MRIs, X-ray machines, CT scanners, blood pressure machines, blood sugar level measuring equipment, etc.
Application in industrial equipment
PCBs are widely used in manufacturing, especially in industries with high-power mechanical equipment; these devices run on high power and require high current circuit drive. Such as arc welding, large servo motor drives, lead-acid battery chargers, clothing cotton machines, etc.
Application in lighting
LED lights and high-intensity LEDs are mounted on PCBs based on aluminum substrates; aluminum has the property of absorbing heat and dissipating it in the air.
Application in the automotive and aerospace industries
Flexible PCBs are lightweight but can withstand high vibrations. Because of their light weight, they can reduce the total weight of spacecraft; flexible PCBs can be adjusted even in narrow spaces. These flexible PCBs are used as connectors, interfaces, and can be assembled even in compact spaces

Tags:MCPCB, PCB
Posted in best pcb, mcpcb, Metal Core PCB | No Comments »