Posts Tagged ‘rigid flex pcb manufacturer’

Rigid Flex PCB, Rigid Flex PCB Manufacturer & Fabrication

Friday, May 30th, 2025

Looking for rigid flex PCB solutions? Explore its definition, material, stack-up, benefits, disadvantages, cost reduction solution, manufacturer selection tips.

Best Technology is the leading rigid flex PCB manufacturer that delivers exceptional speed, quality, and transparency. With our industry-leading ‌24-hour rapid prototyping‌, we ensure your projects move forward without delay. Our advanced manufacturing processes guarantee high-performance PCBs with precision and reliability, while our ‌transparent pricing‌ means no hidden costs—just fair, competitive rates. Whether you need a ‌single prototype or mass production‌, we support ‌1-piece minimum orders‌, making us the ideal partner for startups and enterprises alike. Fast turnaround, cutting-edge technology, and honest pricing—trust Best Technology to power your innovations efficiently and affordably.

What Is Rigid Flex PCB?

Rigid flex PCB merges rigid and flexible regions into a single board, allowing dynamic bending in specific areas while providing stable support for components. Unlike traditional rigid PCBs, which lack flexibility, or pure flexible PCBs, which may lack structural integrity, Rigid Flex PCB achieves a balance through layer-by-layer integration. This design is particularly valuable in applications where space is constrained or dynamic movement is required, such as wearable devices and automotive electronics. The technology relies on advanced materials and manufacturing processes to ensure both mechanical durability and electrical performance.

What Is Material of Rigid Flex PCB?

Here’s material of rigid flex PCB:

Flexible Substrates:

Polyimide (PI): A high-temperature-resistant material with excellent flexibility and dimensional stability, ideal for dynamic bending applications.
FCCL (Flexible Copper Clad Laminate): Composed of PI or polyester film bonded to copper foil, FCCL forms the base of flexible layers. Options include adhesive-based FCCL (cost-effective but thicker) and adhesive-less FCCL (thinner and more flexible) .
Polyamide: A cost-effective alternative to PI, suitable for low-flex applications.

Rigid Substrates:

FR-4: The most common rigid material, offering good mechanical strength and thermal stability.
High-Performance Materials: For advanced applications, materials like Rogers RT/duroid or ceramic-reinforced composites are used to meet high-frequency or extreme-temperature requirements.

Copper Foil:

Electrolytic Copper (ED): Cost-effective but less flexible, suitable for static or low-flex regions.
Rolled Annealed (RA) Copper: Exhibits superior ductility, making it ideal for high-flexibility areas .

Adhesives:

Epoxy Resins: Used to bond rigid and flexible layers, ensuring strong adhesion and thermal resistance.
Acrylic-Based Adhesives: Offer transparency and flexibility, suitable for display modules.

Cover Lays:

PI Cover Lays: Protect flexible circuits from environmental factors while maintaining flexibility.
FR-4 Cover Lays: Provide added rigidity in hybrid regions.

Solder Masks:

Liquid Photoimageable (LPI) soldermasks are applied to both rigid and flexible areas to prevent oxidation and ensure solderability.

Stiffeners:

Rigid materials like FR-4 or metal plates are added to reinforce areas where components are mounted, enhancing mechanical stability.

What Is Stack-up of PCB Rigid Flex?

Rigid-Flex PCB Stack-up (Layer-by-Layer Structure)

Rigid Section (e.g., FR-4 Core)

Layer 1: Copper traces (signal/power)
Layer 2: Solder mask (protective coating)
Layer 3: Rigid substrate (FR-4, prepreg)
Layer 4: Adhesive/bonding layer (prepreg)
Layer 5: Copper ground/power plane

Flexible Section (e.g., Polyimide)

Layer 6: Copper traces (flexible circuitry)
Layer 7: Coverlay (protective polyimide film)
Layer 8: Flexible substrate (polyimide, adhesive-less for thinness)
Layer 9: Adhesive layer (bonding to rigid section)

Transition Zone (Rigid-to-Flex)

Staggered or stacked vias connect rigid and flex layers.
Copper thickness reduced in flex zone (e.g., 1/2 oz vs. 1 oz in rigid zones).

Multi-Layer Variants

Example: 6-layer rigid-flex (4 rigid + 2 flex):
- Rigid layers: FR-4 with 1 oz copper.
- Flex layers: Adhesive-less polyimide with 0.5 oz copper.
- Prepreg bonding between rigid/flex zones.

What Are Advantages of Rigid-Flex PCB?

Rigid Flex PCB offers numerous benefits over traditional PCB designs:

Space Optimization: The ability to bend allows circuits to fit into irregular spaces, reducing overall device size.
Enhanced Reliability: Fewer connectors and solder joints minimize failure points, improving long-term durability .
Weight Reduction: Eliminating bulky connectors and harnesses leads to lighter assemblies, critical for aerospace and portable electronics.
Improved Thermal Management: Rigid layers provide better heat dissipation, while flexible layers prevent thermal stress in dynamic areas.
Design Flexibility: Complex 3D layouts are possible, enabling innovative product designs.
Cost-Effectiveness in Volume: While initial costs are higher, mass production reduces per-unit expenses due to simplified assembly.
High Performance: Supports high-frequency signals and dense routing, meeting demands of advanced electronics.

What Are Disadvantages of Rigid Flex PCB?

Despite its advantages, Rigid Flex PCB has limitations:

Higher Initial Costs: Material and manufacturing complexity drive up prototype and low-volume production costs.
Design Complexity: Requires specialized expertise to balance rigidity, flexibility, and thermal expansion.
Manufacturing Challenges: Precise alignment and lamination processes are critical, increasing the risk of defects.
Limited Flexibility Cycles: Repeated bending can degrade performance over time, especially in high-stress applications.
Thermal Expansion Mismatch: Differences in CTE (Coefficient of Thermal Expansion) between rigid and flexible layers may cause delamination.
Testing Difficulty: Inspecting and repairing hybrid boards is more challenging than standard PCBs.
Environmental Sensitivity: Flexible materials may degrade in harsh conditions (e.g., extreme temperatures or humidity).

How to Design Rigid-flex PCB to Reduce Production Cost?

Designing for cost efficiency in Rigid Flex PCB involves balancing performance requirements with manufacturing feasibility. Here are practical strategies to minimize production costs:

Simplify Layer Stack-Up: Use the minimum number of layers necessary for your design. A 4-layer configuration (2 rigid + 2 flex) is often sufficient for most applications, avoiding the premium costs of multi-layer boards unless advanced routing is essential.
Standardize Material Selection: Choose widely available materials like FR-4 for rigid sections and PI for flex layers to leverage economies of scale. Reserve high-performance materials for specific critical regions rather than the entire board.
Optimize Flex Zone Size: Limit flexible regions to areas where bending is absolutely necessary. Use rigid sections for component-heavy zones to reduce the amount of expensive flex material and processing.
Choose Cost-Effective Copper Foil: Use electrolytic copper (ED) for rigid and low-flex areas, and reserve rolled annealed (RA) copper for high-flex zones only, where its superior ductility is truly needed.
Simplify Via Design: Prioritize through-hole vias in rigid sections, as they are cheaper than microvias or blind vias. Minimize vias in flex layers to reduce the need for complex coverlay processing.
Maximize Panel Utilization: Work with manufacturers to design boards that fit efficiently on standard panels, reducing material waste. Symmetrical or modular designs are ideal for maximizing the number of boards per panel.
Relax Non-Critical Tolerances: Specify achievable bend radii (typically 3-5 times the flex layer thickness) and allow looser dimensional tolerances where possible to avoid costly precision manufacturing adjustments.
Leverage Adhesive-Based FCCL for Prototyping: Use cost-effective adhesive-based flexible copper clad laminates for initial prototypes to validate designs before committing to more expensive adhesive-less materials.
Integrate Passive Components: Embed resistors, capacitors, or inductors into the PCB layers to reduce the number of surface-mount components, lowering assembly costs and simplifying the manufacturing process.
Collaborate Early with Manufacturers: Engage manufacturers in the design phase for DFM (Design for Manufacturability) feedback. They can suggest cost-effective alternatives, such as standardizing hole sizes or avoiding complex surface finishes.

How to Choose A Trusted Rigid Flex PCB Manufacturer?

Below are methods about how to choose a trusted rigid flex PCB manufacturer:

Technical Expertise: Look for manufacturers with a proven track record in Rigid Flex PCB fabrication, including experience with complex stack-ups, materials like PI and FR-4, and advanced processes such as laser drilling and automated lamination.
Certifications and Compliance: Ensure the manufacturer adheres to industry standards like IPC-6012 (rigid PCBs), IPC-6013 (flexible PCBs), and ISO 9001 for quality management, demonstrating a commitment to consistency and reliability.
Advanced Equipment: State-of-the-art facilities with equipment like CNC drilling, automated optical inspection (AOI), and vacuum lamination machines are essential for precise fabrication, especially for intricate flex zones.
Prototyping Capabilities: A manufacturer offering rapid prototyping services allows you to test designs quickly and cost-effectively, identifying and resolving issues before full-scale production.
Quality Control Processes: Robust testing procedures, including bend cycle testing, thermal shock testing, and impedance control verification, ensure that the final product meets performance and reliability standards.
Supply Chain Stability: Choose manufacturers with strong relationships with material suppliers to minimize delays and cost fluctuations, particularly for specialized components like high-temperature adhesives or premium copper foils.
Transparent Communication: A responsive team that provides clear updates on production timelines, cost breakdowns, and design feedback is essential for a smooth collaboration and successful project execution.

How Much Does Rigid Flex PCB Cost?

The cost of Rigid Flex PCB varies based on factors such as layer count, material selection, design complexity, and production volume. Here’s a general cost overview in USD for small to medium batches:

4-Layer Rigid Flex PCB: $10 to $30 per board, suitable for basic designs with moderate flex requirements.
6-Layer Rigid Flex PCB: $20 to $60 per board, ideal for mid-level complexity with dual-sided routing and multiple flex zones.
8-Layer Rigid Flex PCB: $40 to $120 per board, designed for high-density interconnects and advanced functionalities like embedded components.

To reduce costs effectively:

Increase Order Volume: Larger batches lower per-unit costs by spreading setup and tooling expenses across more boards.
Simplify Design: Reduce the number of flex zones, use standard materials, and avoid unnecessary features like exotic surface finishes.
Optimize Panelization: Maximize the number of boards per panel to minimize material waste and improve production efficiency.
Negotiate with Suppliers: Long-term partnerships with manufacturers can lead to discounted pricing, especially for repeat orders or large-scale projects.

Conclusion

Rigid Flex PCB represents a leap forward in PCB technology, offering unmatched flexibility and reliability for modern electronic devices. By understanding its core components, design strategies, and manufacturer selection criteria, engineers can harness its full potential while keeping costs in check. From material choice to layer stack-up, every decision plays a role in creating a balance between performance and affordability. For businesses seeking high-quality Rigid Flex PCBs tailored to their unique needs, Best Technology stands ready to deliver innovative solutions. With a focus on precision manufacturing, cost efficiency, and technical expertise, our team is committed to bringing your designs to life. Contact us today at sales@bestpcbs.com for a detailed quote and let’s transform your concepts into cutting-edge electronic products.

What Is Rigid Flex PCB?

A rigid flex PCB is a composite type of circuit board that combines flexible printed circuit boards (FPC) with rigid printed circuit boards (PCB) through specific processes. It integrates the flexibility of FPC and the rigidity of PCB, possessing both characteristics of FPC and PCB. It can be folded or bent to reduce space occupation and can solder complex components, offering higher stability and reliability.

Best technology focus on high quality rigid-flex PCB design, prototype and manufacturing over 18 years. So we can flexibly handle various emergencies encountered in production based on our rich work experience to achieve fast delivery. Meanwhile, we have our own complete PCB manufacturing industry chain and advanced production machines, so we can control the cost of the entire production process well and provide customers with high-quality products at competitive prices. Please feel free to contact us at sales@bestpcbs.com if you have any request for rigid flex PCB.

Rigid Flex PCB Layer Stackup

1. Basic layered architecture

The stacked structure of the rigid-flexible board achieves functional partitioning through the alternating combination of rigid materials and flexible materials:

‌Outer rigid layer‌: Usually uses FR4 fiberglass board to provide mechanical support and component installation stability, while achieving electrical isolation‌.

‌Intermediate flexible layer‌: It is composed of polyimide (PI) film or polyester (PET), and is combined with rolled & annealed copper or electrolytic copper to form a conductive line to achieve bending connection function‌.

‌Adhesive layer‌: Use thermosetting adhesive (such as epoxy resin) or low-flow adhesive semi-cured sheet to seamlessly combine the rigid layer and the flexible layer to enhance structural stability‌.

Typical example:

Five-layer structure (5-4-1 type): outer rigid board → thermosetting adhesive → inner electrical layer rigid board → thermosetting adhesive → middle signal layer flexible board → thermosetting adhesive → outer rigid board

Four-layer structure: double-layer FPC substrate + gold finger interface + FR4 filling area + hollow layered design, taking into account plug-in stability and flexibility.

2. Material configuration and function

Rigid substrate

FR4 fiberglass board: high temperature resistance, good insulation, thickness 0.2–3.2 mm, used for support and heat dissipation.

Flexible substrate

Polyimide (PI) film: high temperature resistance (>300°C), low deformation, thickness 12.7–127μm, suitable for dynamic bending scenarios.‌

Conductive layer

Rolled copper (smooth and ductile) or electrolytic copper (low cost), thickness 12–35 μm, used for signal transmission.

Protective layer

Coverlay: PI or PET material, thickness 12.7–127 μm, moisture-proof, anti-pollution and solder-resistant.

3. Layer classification and typical application

Single-sided board

Structural features: There is a conductive circuit layer on only one side, and the other side is covered with a substrate or insulating ink, which is transparent under strong light (excluding special process requirements).

Application scenarios: Simple circuit connection scenarios, such as low-complexity sensor modules.

Double-sided board

Structural features: There are conductive circuit layers on both sides, and the electrical connection between layers is achieved through metallized holes (PTH holes).

Application scenarios: General electronic devices, such as basic communication modules.

Multi-layer board

Definition: 3 or more circuit layers are superimposed through a “sandwich” structure, combining rigid substrates with flexible substrates.

Typical layer range: 4, 6, and 8 layers are common, and high-complexity designs can reach 12 or more layers.

Rigid Flex PCB Layer Stackup

What Are the Advantages of Rigid Flex PCB?

Space optimization and lightweight design

Space saving: Through the integrated design of flexible circuits and rigid circuits, the connection requirements of traditional hard boards and flexible boards are reduced, and the space utilization rate is optimized.

Light weight: The weight of flexible materials is only about 10% of that of hard boards, which greatly reduces the overall weight of the equipment.

Shrinkage: Supports three-dimensional folding design, suitable for miniaturized products such as wearable devices and folding screen mobile phones.

Improved reliability

Reduce connection point failures: The integrated structure of the whole board reduces the risk of poor welding or connector failure and improves long-term stability.

Environmental impact resistance: Resistant to high and low temperatures (-55℃~125℃), chemical corrosion and ultraviolet rays, suitable for harsh environments such as automotive electronics and aerospace.

Vibration resistance: The flexible area can absorb mechanical resonance and reduce the impact of vibration and impact on components.

Cost-effectiveness

Reduce assembly costs: Reduce the number of connectors, simplify the production process, and reduce labor and procurement costs.

Reduce maintenance costs: High reliability design extends product life and reduces the frequency of later repairs.

Signal and heat dissipation performance optimization

‌Signal integrity‌: Short transmission path and controlled impedance reduce signal attenuation and support high-speed data transmission (such as industrial camera image processing).

‌EMC performance enhancement‌: The shielding design of the flexible area reduces electromagnetic interference (EMI) and improves the ability to resist radio frequency interference.

‌High heat dissipation efficiency‌: By extending the copper layer area, the heat dissipation path is expanded and the thermal resistance is reduced, which is suitable for high-power equipment.

Structural flexibility and multi-functional integration

‌Dynamic bending design‌: Foldable and curled, adaptable to complex spatial layout (such as laser radar, medical endoscope)

‌High-density wiring‌: HDI technology (blind vias, buried vias) supports multi-layer signal layer and power layer integration to meet complex circuit requirements.

‌Multi-functional adaptation‌: The flexible area and the rigid area are freely combined, compatible with complex component installation and dynamic mechanical structure.

‌Production and design advantages

‌Simplified assembly process‌: Reduce the use of cables and connectors and reduce the assembly error rate.

‌Design freedom‌: Supports three-dimensional wiring and flexibly matches different device forms (such as hearing aids and folding screen hinges.

Through material and process innovation, the rigid-flexible board has achieved breakthroughs in space, reliability, cost and performance, becoming a core solution for high-tech fields such as consumer electronics, automobiles, and medical care.

What Are the Advantages of Rigid Flex PCB?

Rigid-Flex PCB Design Guidelines

1. Preliminary planning and tool configuration

Definition of stack structure:

Use EDA tools such as Altium Designer to define rigid and flexible layers through the stack manager (shortcut D+K), and check the “Is Flex” property to divide the soft and hard areas.

Panel Division and Area Locking:

Use “dividing line” (shortcut D+S) to divide the board surface, fix the rigid area through the 3D lock function, and retain the dynamic bending characteristics of the flexible area.

2. Three-dimensional layout and structural design

3D modeling verification

Enable 3D view in EDA tools, simulate folding paths and bending radii, ensure that the direction of flexible region lines is perpendicular to the bending axis, reduce stress concentration.

It is forbidden to place vias in the dynamic bending area, and the vias should be kept away from the soft and hard combination area ≥ 50mil (high reliability scenarios ≥ 70mil).

Material matching and stacking

The flexible area selects rolled copper (with excellent ductility) as the conductive layer, with a thickness of 12-35μm; the cover film (Coverlay) uses PI material, with a thickness of 12.7-127μm.

The hard plate area is pressed with PP glue (semi-cured sheet) and the flexible plate, and the hollow layered design is used to reduce the bending stress.

3. Routing and through hole design rules

Circuit Optimization

The flexible region conductors use a teardrop transition, with the width maximized (≥4mil), evenly distributed to disperse stress.

Signal lines are preferred to be perpendicular to the bending direction, and multi-layer cross-wiring uses an ‘I-Beam’ structure to enhance fatigue resistance.

Transition Area Treatment

At the junction of rigid and flexible sections, the circuit transitions smoothly to avoid right angles or through-hole (PTH) design; the cover film must have a 0.5–1mm excess for overflow when opening windows.

Stainless steel stiffener strips or PI stiffener films are added on both sides of the bending area to enhance mechanical support.

4. Verification and Production Alignment

Simulation and Test Rules

Verify impedance continuity through TDR testing, with dynamic bending areas requiring more than 100,000 cycles of simulation.

Use tools such as Mentor Xpedition for lamination simulation to check the risk of glue overflow.

Production File Output

Provide layered Gerber files, marking the boundaries of soft and hard regions and the positions of stiffener. CAM engineers need to handle parameters for inner shrinkage due to glue overflow.

Laser cutting parameters for rigid board areas must be precisely controlled in depth to avoid damaging internal layers.

The design of flexible-hard combination boards should combine three-dimensional simulation, material properties, and process limitations, achieving high-density interconnection and reliability balance through layered lamination and dynamic bending rules.

Rigid Flex PCB Manufacturing Process

1. Material preparation and inner layer production

Cutting and drilling

Cutting: Cut the substrate (FR4, PI film, etc.) according to the design parameters, adjust the equipment parameters and clean the surface of the board.

Drilling: Use laser or mechanical drilling technology to make through holes (PTH) or blind holes. The hard board area needs to be cut with controlled depth to avoid damaging the inner layer circuit.

Inner layer circuit formation

Pressure dry film and exposure: Press dry film on the copper clad board, and define the circuit pattern through film alignment exposure.

Development and etching: Develop to remove the unexposed dry film, and the acid etching solution dissolves the unprotected copper layer to form a conductive circuit.

2. Rigid-flexible lamination

Flexible layer processing

Apply cover film: Apply polyimide (PI) cover film to the circuit layer in the flexible area (such as L3/L4), and check bubbles and fitting accuracy after pre-pressing and fixing. ‌

Stiffener and protection‌: Stainless steel stiffener strips or PI reinforcement film are added on both sides of the bending area to improve mechanical strength‌.

‌Multilayer lamination‌

‌Lamination and lamination‌: The flexible board (FPC) and the rigid board (PCB) are alternately laminated through PP glue (semi-cured sheet), and high-temperature lamination is formed into a “sandwich” structure to eliminate the risk of delamination‌.

‌Hollow design‌: The dynamic bending area adopts a hollow layering process to reduce stress concentration‌.

3. ‌Outer layer processing and hole metallization‌

Secondary drilling and hole processing‌

‌Laser cutting‌: The outer layer of the hard board area is exposed to the flexible area through laser uncovering (gong edge), and the cutting depth is controlled to avoid damaging the inner layer circuit‌.

‌Copper deposition and copper plating‌: Chemical copper deposition in the hole is used to achieve conduction, and the outer layer is electroplated with a thickened copper layer (12–35μm) to improve the conductivity reliability‌.

Outer layer circuit production‌

‌Graphic transfer‌: The outer copper clad laminate is exposed, developed, and etched to form surface circuits, and the teardrop-shaped pad design enhances the connection strength‌.

4. ‌Surface treatment and molding‌

‌Solder mask and character printing‌

‌Solder mask (green oil): Print photosensitive solder mask ink to cover non-welding areas and form an insulating protective layer after curing‌.

‌Silk screen text‌: Mark component location, product model and other information‌.

Surface metallization‌

‌Electronic nickel immersion gold (ENIG): Chemical nickel-gold plating in the pad area to prevent oxidation and improve welding performance‌.

Molding and testing‌

‌Edge and punching‌: Cut the shape to remove excess waste and retain the functional area‌.

‌Reliability test‌:

‌Electrical test‌: Verify continuity and impedance continuity‌.

‌Bending test‌: Simulate dynamic bending for more than 100,000 times to detect the risk of breakage or delamination‌.

5. Special process adaptation

High-frequency signal optimization: high-frequency boards (such as Rogers) are combined with blind and buried hole design to reduce signal attenuation.

Automotive grade requirements: pass vibration and high and low temperature cycle tests (-55℃~125℃), and add FR4 reinforcement to the hard board area.

The production of soft and hard boards requires precise control of material matching and process parameters (such as temperature and pressure), and through multi-layer lamination and dynamic bending optimization, it meets the lightweight and reliability requirements of high-density electronic equipment.

Flex Rigid PCB Manufacturer

Best Technology, a flex rigid PCB manufacturer, establish on June 28, 2006, is a Hong Kong registered company, whom focused on FR4 PCB, Flexible PCB, Flex Rigid PCB design, prototype and manufacturing and also provide PCB assembly(PCBA) service.

BEST begin to As a printed circuit board (PCB) vendor in Asia, we are dedicated to be your best partner of advance, high-precision printed circuit boards, such as heavy copper boards, mixed layers, high TG, HDI, high frequency (Rogers, Taconic), impedance controlled board, Metal Core PCB (MCPCB) such as Aluminum PCB, Copper PCB, and so on.

What we provide is not only PCB & MCPCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT).

All the PCB & MCPCB are strictly follow the operation procedures stipulated in ISO9001:2000 in respect to material purchasing, product manufacturing, testing, packing, marketing, etc. All the order placed with us is money-refund-guaranteed.

Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc. At the same time, we purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards.

Currently our monthly productivity is 260,000 square feet (28,900 square meter), more than 100 different boards will be completed. We can also provide fast delivery service, and urgent boards can be shipped out within 24 hours!

More information welcome to contact us if you’re interested in us.(The email is at the beginning of this blog)

What Is the Difference Between Rigid Flex PCB and Flex PCB?

Differences in materials and structures

‌‌Flex PCB

Substrate‌: Single or double-layer PI or PET film

Single or multi-layer flexible circuit, without rigid support

Usually without stiffener

‌Rigid-flex PCB

Substrate‌: The rigid area uses FR4 or high-frequency plates, the flexible area uses PI film, and is bonded with PP adhesive (semi-cured sheet).

Mixed structure with 3 or more layers, including blind hole/buried hole design, interconnecting rigid and flexible areas

Stainless steel stiffener strips or PI reinforcement film need to be added in the bending area.

Differences in design and manufacturing process‌

‌Flexible PCB Board

Graphic transfer‌: Circuits are formed by dry film exposure and etching, without rigid support structure‌.

‌Surface treatment‌: Cover with PI protective film (Coverlay) to prevent oxidation‌.

Applicable process‌: Single-sided or double-sided circuits, low cost but weak environmental impact resistance‌.

‌Rigid-flex PCB board‌:

Lamination difficulties‌: Precise control of the thickness matching of the rigid-flexible area is required to avoid delamination (such as hollow delamination process).

Hole processing‌: Vias are prohibited in the dynamic bending area, and a smooth circuit design is required in the rigid-flexible transition area.

Special process‌: Laser cutting of the rigid board area to retain the flexible area, copper plating to ensure conduction.

Comparison of performance and application scenarios‌

‌Flexible board

Low mechanical strength, easily damaged by external forces.

High-frequency signals are easily attenuated (affected by bending).

Low cost (suitable for mass production)

Used in consumer electronics (headphones, smart watches).

Rigid-flexible board

High mechanical strength, rigid area provides support, flexible area resists bending fatigue

The rigid area can integrate high-speed signal layer, impedance control is more precise

High cost (complex process, low yield)

Used in high reliability areas (aerospace, automotive radar)

What Are the Applications of Rigid Flex PCB?

The versatility of rigid flex PCBs makes them essential in various industries:

Consumer Electronics-Used in smartphones, foldable devices, and wearables.

Medical Devices-Applied in implants, imaging systems, and diagnostic tools.

Automotive Electronics-Integrated into advanced driver-assistance systems (ADAS) and infotainment.

Aerospace & Defense-Utilized in satellite systems, avionics, and military-grade equipment.

Industrial Equipment-Found in robotics, control systems, and automation devices.

A well-designed rigid flex PCB enhances performance, reliability, and space efficiency in modern electronic applications. Selecting the right manufacturer ensures high-quality production and long-term durability.

‌Conclusion

As an integrated carrier of rigid-flexible synergy, the rigid-flexible board is driving electronic devices to iterate towards higher integration and stronger reliability with its unique structural design and performance advantages. In the industrial and medical fields, the precise design of the rigid-flexible transition zone (such as the hollow layering process) has achieved stable signal transmission and vibration resistance in complex environments for equipment such as endoscopes and vehicle-mounted radars; in the consumer electronics field, the rigid-flexible board has broken through the space limitations of traditional rigid boards with its high-density wiring and dynamic bending characteristics (≥100,000 cycle life) in folding screen hinges and mobile phone camera modules.

From the perspective of technological evolution, the material innovation (such as the combination of high-frequency FR4 and ultra-thin PI film) and process upgrade (laser cutting precision control) of the rigid-flexible board will continue to promote its application in high-frequency and high-speed scenarios, such as 5G millimeter wave communications and autonomous driving sensors. At the same time, it significantly improves the reliability of the system-level package (SiP) by reducing connector solder joints and optimizing the rigid-flexible transition zone line design (teardrop-shaped wires and reinforcement strips).

In the future, with the popularization of wearable devices and IoT terminals, the soft-hard combination board will be more deeply integrated into the design philosophy of “rigid-flexible symbiosis” – the rigid area carries the computing core, and the flexible area achieves form adaptation. Ultimately, in the “soft-hard game” of the electronics industry, it will become the ultimate solution to balance function, cost and reliability.