Archive for the ‘PCB Technology’ Category

What is ICT Tester? In Circuit Test vs Flying Probe Testing

Monday, August 18th, 2025

Have you ever wondered why some electronic devices fail even when the PCB looks flawless? Or why high-volume production sometimes delivers inconsistent boards? These issues often trace back to undetected component defects, poor soldering, or faulty connections. Without proper testing, even a single defective part can lead to product failure, costly recalls, or customer dissatisfaction.

This is where an ICT tester equipment comes in. By performing in-circuit testing (ICT), manufacturers can quickly detect missing components, shorts, opens, and incorrect placements before the boards leave the production line. With the right ICT test electronics and in-circuit test fixtures, you gain fast, accurate, and reliable validation of each PCB, saving both time and money.

In this article, we’ll answer key questions such as:

What exactly is an ICT tester, and how does it work?
Why is ICT testing so critical for electronics manufacturing?
How does ICT differ from functional testing or flying probe testing?
When should you use ICT versus functional testing for your boards?

By understanding these points, you’ll see how ICT testing can prevent defects, improve production efficiency, and ensure reliable end products—turning potential headaches into controlled, predictable outcomes.

What is an ICT Tester?

An ICT tester is a system designed to perform in-circuit testing (ICT) on printed circuit boards after assembly. It is often recognized by its “bed-of-nails” fixture, which has hundreds or even thousands of pins arranged to contact specific points on the PCB. Each pin corresponds to a pad, via, or test point, allowing the tester to measure voltages, resistances, and currents at component level.

ICT testers can:

Detect missing, incorrect, or faulty components.
Identify open circuits, short circuits, and soldering defects.
Measure parameters such as resistance, capacitance, and diode orientation.
Verify integrated circuit placement and connectivity.

Because ICT is thorough and fast, it has become an industry-standard approach, especially in high-volume production lines.

Why is the ICT Test Important?

The ICT test is important for several reasons. In large-scale manufacturing, even a single defect can ripple into thousands of defective units. Detecting issues early reduces costs, avoids recalls, and protects brand reputation.

For example, in automotive electronics, where safety systems depend on flawless PCBs, ICT is crucial. An undetected fault in an airbag control system could have serious consequences. In consumer electronics, ICT prevents faulty smartphones, laptops, or home appliances from reaching the market.

The ICT test is also important for process improvement. It provides engineers with statistical data that highlights recurring problems, such as solder bridging or component misplacement. Manufacturers can use this data to refine processes, reduce defect rates, and improve yields.

What is the Purpose of the ICT Test?

The main purpose of ICT testing is to validate the quality and functionality of each component on the PCB. Unlike functional testing, which looks at the board’s overall behavior, ICT digs into details at component level.

ICT ensures that:

Every resistor has the correct value.
Capacitors and inductors are present and within tolerance.
Diodes and transistors are oriented properly.
Integrated circuits are placed in the right sockets and connected.

By catching defects at the source, ICT reduces the risk of failures at the product’s final stage. This is especially valuable in industries where long-term reliability is critical, such as aerospace, defense, and medical devices.

How Does an ICT Tester Work?

An ICT tester works by pressing the in-circuit test fixture against the PCB, making contact with the test pads or vias. Once contact is established, the system injects signals into the board and records the response.

Here’s a breakdown of the process:

Fixture Setup – The board is placed into a bed-of-nails fixture designed for its exact layout.
Signal Injection – Test probes inject electrical signals into various nodes of the circuit.
Measurement – The tester measures voltage, current, resistance, and capacitance at each point.
Analysis – Software compares the measured values with predefined thresholds.
Reporting – The system highlights any failures or deviations for quick troubleshooting.

ICT is highly automated, with a cycle time ranging from a few seconds to less than a minute. This makes it efficient for high-volume production, where time savings directly translate to lower manufacturing costs.

Advantages of ICT Testing

High Accuracy – Detects even subtle component defects.
Fast Cycle Time – Ideal for mass production.
Detailed Data – Provides insight into manufacturing trends.
Early Detection – Reduces rework and repair costs.
Reliability – Improves long-term performance of products.

What is the Difference Between Functional Testing and ICT Testing?

Both functional testing and ICT testing play important roles in quality assurance, but they target different aspects of the PCB.

ICT Testing – Focuses on component-level verification. It checks each resistor, capacitor, diode, transistor, and IC independently. ICT identifies defects like shorts, opens, wrong components, or poor solder joints.
Functional Testing – Evaluates the overall system behavior. It simulates real-world operating conditions, ensuring the PCB performs its intended function. Functional testing may involve powering up the device, running software, or checking communication protocols.

To put it simply: ICT looks at how the board is built, while functional testing checks how the board behaves. Both tests are complementary, and many manufacturers use them together.

Functional Testing vs ICT Testing

When to Use ICT and Functional Testing?

Choosing between ICT and functional testing depends on project goals and production stage.

Use ICT testing when:

Boards are still in the manufacturing phase.
Component-level accuracy needs to be validated.
High-volume production demands fast, repeatable results.

Use functional testing when:

The assembly is nearly complete.
The product’s performance under real operating conditions needs to be verified.
System-level testing is required, such as communication between multiple boards.

For best results, many manufacturers use a combination of ICT and functional testing. ICT catches early-stage defects, while functional testing provides final validation before shipment.

In-Circuit Test vs Flying Probe: What are Differences?

When comparing in-circuit testing (ICT) with flying probe testing, the differences come down to cost, speed, and flexibility.

In-Circuit Test (ICT):

Uses a custom in-circuit test fixture.
Offers fast cycle times (seconds).
Best for high-volume production.
High upfront cost for the fixture, but lower cost per test afterward.

Flying Probe Test:

Uses moving probes instead of a fixture.
Slower than ICT, since probes move sequentially.
Excellent for prototypes and low-volume runs.
No fixture cost, making it more flexible and cost-effective for small batches.

In practice, many manufacturers start with flying probe testing during prototyping. Once the design is finalized and volumes increase, they shift to ICT testing for efficiency.

In-Circuit Test vs Flying Probe

Applications of ICT Testing

ICT testing is used in a wide range of industries:

Automotive – For safety-critical systems like airbags, ABS, and engine control units.
Medical Devices – For life-support systems, imaging equipment, and diagnostic tools.
Aerospace and Defense – Where reliability under extreme conditions is non-negotiable.
Consumer Electronics – From smartphones to laptops, ensuring consistent quality.
Industrial Equipment – For automation controllers and power management systems.

In each of these cases, ICT contributes to higher reliability, lower failure rates, and better compliance with international standards.

Why Choose Best Technology for ICT and PCB Testing?

Best Technology is a reliable PCB manufacturer in China, trusted by more than 1,000 customers across industries worldwide. We specialize in small to medium-volume PCB manufacturing, PCB assembly, and complete electronic manufacturing services.

As one of the most experienced circuit board suppliers, our capabilities cover a wide range of PCB types, including rigid PCBs, flex PCBs, rigid-flex PCBs, aluminum PCBs, RF/microwave PCBs, high-speed and high-frequency PCBs, and HDI PCBs. Beyond manufacturing, we also provide turnkey assembly, component sourcing, box build assembly, PCBA testing, and full electronic testing services.

With over 19 years of experience, our engineering, production, and quality teams fully understand the unique needs of industries such as medical, automotive, and aerospace. We strictly follow international standards, working under IPC-A-600 for PCB manufacturing and IPC-A-610 for PCB assembly. All of our products meet IPC Class 2 standards, and for projects requiring higher reliability, we also deliver Class 3 or Class 3A compliance. Combined with strong engineering support and competitive pricing, we help customers achieve both reliability and cost-effectiveness.

FAQs

1. What does ICT stand for in electronics testing?

ICT stands for in-circuit testing, which validates the quality of individual PCB components.

2. Can ICT testing replace functional testing?

No. ICT and functional testing serve different purposes. ICT checks construction, while functional testing checks performance.

3. How long does an ICT test take?

Most ICT tests take only a few seconds, depending on the number of test points.

4. Is an in-circuit test fixture reusable?

Yes, but each fixture is custom-designed for a specific PCB layout.

5. Which is better: in-circuit test or flying probe?

ICT is best for high-volume runs due to speed. Flying probe is better for prototypes or small batches.

Tags:Ict test electronics, in circuit testing, In-circuit test fixture, PCB testing
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What is Double-sided copper substrate? Metal Core PCB

Friday, August 15th, 2025

If you need a double-sided copper PCB, are you curious?

What are the core advantages of a double-sided copper PCB?
How much better is the heat dissipation performance of a double-sided copper PCB than a single-sided one?
What complex designs can a double-sided copper PCB support?
What applications are double-sided copper PCBs suitable for?

BEST Technology, a professional copper PCB manufacturer, can answer your questions:

Double-sided wiring + dual copper surfaces for heat dissipation improves space utilization and doubles heat dissipation efficiency.
Dual copper layers for conduction + a highly conductive base material with a thermal resistance of ≤0.6°C/W improve heat dissipation efficiency by over 40% compared to single-sided PCBs.
Double-sided fine lines (line width/line spacing ≥3 mils) support via interconnects and locally thickened copper.
High-power LEDs, power modules, automotive electronics, and other applications require high-density wiring and strong heat dissipation.

What is a double sided copper substrate?

Double-sided copper substrate is a type of metal core PCB that has copper layers on both sides of a central core. The core is usually made from aluminum or copper, which provides strength and excellent thermal conductivity. This structure allows components to be mounted and circuits to be routed on both the top and bottom, giving more design flexibility and improving performance.

Because the core can spread heat quickly, it helps keep components cool even under heavy loads. This makes it suitable for demanding applications such as LED lighting, power modules, automotive systems, and industrial controls.

The ability to work on both sides allows for more compact designs, reducing the size of devices without compromising functionality.

What is the difference between single and double sided copper substrate?

The most obvious difference is the number of copper layers and how the circuits are arranged.

Single-sided copper substrate: Copper is applied to only one side of the core. It is simpler, less expensive, and ideal for straightforward designs with low component density.

Double-sided copper substrate: Copper is applied to both sides, and plated through-holes connect circuits between them. This design supports more complex routing, higher power handling, and better thermal management.

The choice between them depends on the product’s complexity, size constraints, and performance requirements. If you need to pack more functionality into a smaller space while keeping components cool, the double-sided option is the better choice.

What is the standard copper thickness for copper substrate?

Copper thickness is one of the most important specifications for any substrate. Common standards include:

1 oz/ft² (about 35 μm): widely used for general electronics.

2 oz/ft² (about 70 μm): for higher current and thermal demands.

3 oz or more: for heavy-duty power applications.

What is Double-sided copper substrate? Metal Core PCB

Thicker copper improves current capacity and heat dissipation but can increase cost and weight. Thinner copper is lighter and cheaper but less capable of carrying high currents. The choice must be made based on application requirements, balancing performance and cost-effectiveness.

How thick is a Double-sided copper substrate?

The total thickness depends on several layers:

Metal core: Usually 1.0 mm to 3.2 mm.

Copper layers: Typically 35 μm to 105 μm each.

Dielectric layer: 75 μm to 150 μm, thermally conductive but electrically insulating.

Combined, a double-sided copper substrate is often between 1.5 mm and 4.5 mm thick. Thinner boards are ideal for compact devices, while thicker ones offer more strength and better heat management.

What are the advantages of single-side copper substrates?

Although double-sided boards are more advanced, single-sided copper substrates still have clear benefits:

Lower production costs due to simpler manufacturing.

Faster fabrication timelines.

Easier inspection and repair since all traces are on one side.

Good durability in low-demand environments.

Perfect for applications where complexity and heat output are low.

For basic products, this can be the smarter and more economical choice.

What are the disadvantages of double-sided copper substrate?

Double-sided boards offer many strengths, but there are some limitations.

They cost more to produce due to the extra copper layer, drilling, and plating processes. Manufacturing time is also longer. Repairs can be challenging because components are placed on both sides, making rework more complex.

However, for high-performance products, these disadvantages are often outweighed by better circuit density, improved thermal performance, and extended lifespan. By choosing BEST Technology, these challenges can be effectively addressed.

How to do double-sided copper substrate?

Manufacturing involves precise steps to ensure quality:

Core preparation: Clean and treat the metal surface for adhesion.

Dielectric lamination: Apply thermally conductive, electrically insulating layers to both sides.

Copper foil bonding: Laminate copper sheets to each dielectric under heat and pressure.

Drilling: Create holes where circuits need connection between sides.

Plating: Coat hole interiors with copper to form conductive vias.

Circuit patterning: Use photolithography to define circuit traces.

Etching: Remove excess copper, leaving only the designed paths.

Solder mask application: Protect copper from oxidation and short circuits.

Surface finishing: Apply HASL, ENIG, or other finishes for solderability.

Each step requires accuracy, especially in drilling and plating, to guarantee electrical reliability.

How are double-sided copper substrates soldered?

Soldering methods vary depending on component type:

Reflow soldering is common for SMD components. Solder paste is applied, parts are placed, and the board is heated to melt the solder.

Wave soldering is often used for through-hole components, passing the board over molten solder.

Selective soldering is used for boards combining surface-mount and through-hole parts, targeting specific joints without affecting sensitive areas.

In all cases, heat control is critical to prevent damage to dielectric layers or plated through-holes.

What connects the metallic parts on the double-sided board of copper substrates?

The top and bottom copper layers are linked by plated through-holes (PTHs). These are drilled holes lined with copper to form a continuous electrical path.

PTHs carry signals, supply power, and provide grounding between sides. In thermal designs, thermal vias transfer heat from components to the metal core for dissipation. High-quality plating and precise drilling ensure these connections remain reliable throughout the board’s life.

Conclusion:

Double-sided copper substrate combines the strength of a metal core with the versatility of two copper layers. It delivers superior heat dissipation, higher circuit density, and better reliability for demanding applications. While more complex to produce than single-sided boards, its benefits make it an excellent choice for advanced electronics.

Contact: sales@bestpcbs.com for expert manufacturing support.

Tags:copper substrate, Double-sided copper substrate, Metal Core PCB, metal core substrate
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What is bendable aluminum substrate? Flexible Aluminum PCB

Friday, August 15th, 2025

Bendable aluminum substrate is a metal-based copper-clad laminate with folding or bending functions. It is bent and shaped through a special process. It has the advantages of good thermal conductivity, lightweight, and bending resistance. It is mainly used in the bendable structure of LED lamps and lightweight foldable components of electronic devices such as mobile phones.

What is bendable aluminum substrate? Flexible Aluminum PCB

Are you curious about:

What are the core advantages of bendable aluminum substrates?
How many bends can they last?
What is their heat dissipation performance?
What applications are they generally suitable for?

BEST Technology can provide you with high-performance bendable aluminum substrates. Our aluminum substrates offer the following properties:

High heat dissipation from the aluminum substrate combined with flexibility and bendability, ensuring both heat dissipation and surface adaptability.
Dynamic bending resistance of ≥80,000 times (R=1.5mm), ensuring continuous circuitry.
The aluminum substrate’s thermal conductivity and high adhesive layer provide a thermal resistance of ≤1.0°C/W, improving heat dissipation by 25% or more compared to ordinary flexible substrates.
LED flexible light strips, curved automotive lights, wearable devices, and other applications require both bending and heat dissipation.

What is flexible aluminum substrate?

Flexible aluminum substrate is a special type of circuit board base that uses bendable aluminum as its core layer. Unlike traditional rigid aluminum PCBs, these substrates are engineered to withstand controlled bending without cracking or losing structural integrity.

In PCB manufacturing, the substrate acts as the backbone. It supports copper traces, dissipates heat, and maintains mechanical stability. With bendable aluminum, you get all the advantages of aluminum’s high thermal conductivity and durability—plus the added ability to shape or curve the board during assembly or installation.

This property is particularly valuable in LED lighting strips, automotive electronics, aerospace control systems, and wearable devices. It allows products to fit into tighter spaces, wrap around surfaces, or follow curved housing designs without sacrificing performance.

What grades of bendable aluminum sheets are available?

Not all aluminum grades can be bent easily. The alloy composition and temper determine flexibility. Here are common grades relevant to PCB substrates:

1050 and 1100 Series

High-purity aluminum with excellent corrosion resistance.
Very good bendability, suitable for tight radius bends.
Often used for applications needing high ductility.

3003 Aluminum

Alloyed with manganese for better strength than 1100.
Maintains good bending properties.
Common in lighting and decorative PCB applications.

5052 Aluminum

Stronger than 3003, with excellent corrosion resistance.
Good formability, works well for medium bend radii.
Often selected for outdoor electronics or marine-grade designs.

6061 Aluminum

High strength but less ductile than 5xxx series.
Bendable in annealed tempers (O-temper) but more difficult in T6.
Ideal for structural applications where mechanical strength is critical.

6063 Aluminum

Good surface finish and corrosion resistance.
Easier to bend than 6061 in certain tempers.
Often used in heat sink-integrated boards.

Key takeaway: When choosing a grade, balance strength, bend radius, and thermal performance. In PCB manufacturing, 3003, 5052, and 6063 are common for bendable aluminum substrates.

How to test a bendable aluminum sheet?

Testing ensures the sheet meets your mechanical and thermal requirements before it becomes part of a PCB. Here are standard methods:

Bend Test: The sheet is bent to a specified radius and checked for cracks or surface deformation. For PCBs, smaller radii require more ductile alloys.

Elongation Test: Measures how much the aluminum can stretch before breaking. Higher elongation values mean better bendability.

Hardness Test: Indicates resistance to deformation. Softer aluminum generally bends more easily.

Thermal Cycling Test: Exposes the material to repeated heating and cooling to simulate operating conditions.

Surface Adhesion Test: Checks how well dielectric and copper layers adhere after bending.

These tests help engineers confirm that flexibility does not compromise thermal conductivity or copper adhesion.

How to make bendable aluminum substrate?

The process combines materials science and precision PCB manufacturing.

Select the Aluminum Core: Choose the alloy and thickness based on bending needs. Thinner cores bend more easily but handle less load.

Apply the Dielectric Layer: High thermal conductivity insulation is laminated onto the aluminum. Materials like polyimide or flexible epoxy composites are used.

Add Copper Foil: The copper layer is laminated and patterned through photolithography and etching.

Protect with Solder Mask: Flexible solder mask layer shields the copper and dielectric.

Final Forming: Boards may be partially formed before delivery, or bent during final assembly.

Special care is needed in temperature control, lamination pressure, and adhesive selection. Poor processing can cause delamination when bending, so experienced BEST Technology use advanced bonding techniques.

What are the benefits of bendable aluminum substrate?

The benefits go beyond just flexibility:

Superior Heat Dissipation: Aluminum’s high thermal conductivity allows efficient heat transfer away from heat-generating components.

Lightweight Strength: Maintains structural integrity even at reduced thickness.

Design Freedom: Enables curved or irregular shapes without multiple rigid sections.

Long Service Life: Resistant to corrosion, vibration, and impact.

Reduced Assembly Costs: A single bendable board can replace multiple interconnected rigid boards.

For manufacturers, this means better performance and simpler mechanical integration. For buyers, it means lower total cost and fewer failure points.

What are the applications of bendable aluminum substrate?

Applications span high-reliability and thermally demanding fields:

LED Lighting: Flexible mounting in architectural, automotive, and display lighting.

Automotive Electronics: Curved dashboard PCBs, lighting assemblies, and under-hood electronics.

Aerospace Systems: Weight-saving designs that fit tight spaces.

Wearable Medical Devices: Flexible yet robust circuits for monitoring and control.

Industrial Controls: Machines that require boards to wrap around mechanical housings.

In each case, the bendable aluminum substrate provides both mechanical adaptability and reliable heat management.

Does bending reduce the strength of aluminum substrate?

Yes, but the effect depends on alloy, temper, and bend radius. When aluminum is bent, it undergoes work hardening, which increases strength in the bend area but can also reduce ductility.

If bending exceeds the material’s formability limit, micro-cracks can form, reducing fatigue life. That’s why BEST Technology design for the proper bend radius based on alloy properties and thickness.

In practice, when using recommended bend parameters and high-quality processing, the strength loss is minimal for most PCB applications.

Why choose BEST Technology to make bendable aluminum substrates?

BEST Technology Co., Ltd. has been a trusted PCB and substrate manufacturer since 2006. We understand that buyers need more than just a supplier—they need a partner who delivers consistent quality.

Our advantages:

Material Expertise: We work with multiple aluminum grades, ensuring the right balance of flexibility and performance.

Precision Manufacturing: Our process maintains ±0.05mm dimensional accuracy, even in bendable designs.

Thermal and Mechanical Reliability: Each substrate undergoes strict bend, adhesion, and thermal tests.

Fast Turnaround: Average delivery in 7 days, faster than the industry standard.

Global Experience: Serving industries in Asia, Europe, and North America with OEM and ODM capabilities.

When you choose BEST Technology, you get a bendable aluminum substrate designed to last—and a team committed to your project’s success.

Do you need BEST Technology to make a bendable aluminum PCB for you? We are waiting for your information, please contact us: sales@bestpcbs.com

Tags:bendable aluminum plate, bendable aluminum substrate
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What factors affect the price of drone aluminum substrate?

Thursday, August 14th, 2025

The price of aluminum substrate for drones depends on the specifications of the aluminum material, the thermal insulation layer process, the thickness of the copper foil and the order size. The thicker the material, the more complicated the process and the smaller the quantity, the higher the unit price.

What factors affect the price of drone aluminum substrate?

Do you need a custom aluminum PCB for a drone? Perhaps you’re wondering:

What key factors influence the pricing of drone aluminum PCBs?
How does the price of drone aluminum PCBs compare to regular PCBs?
How does customization affect the price of drone aluminum PCBs?
How does order volume affect the price of drone aluminum PCBs?

BEST Technology, a professional aluminum PCB manufacturer with over 19 years of experience, can answer your questions:

Prices primarily depend on material quality (aluminum purity, insulation performance), dimensions (standard/custom, large/small), circuit design complexity (number of layers, circuit density), process requirements (surface treatment, special processes), and order size (batch size).
Prices are higher than those of standard FR-4 fiberglass PCBs due to the higher cost of aluminum and heat dissipation processes; however, they are lower than copper PCBs, offering a more cost-effective balance between thermal conductivity requirements and cost.
Special dimensions, complex circuit designs (such as multiple layers, high-precision vias), or specialized processes (immersion gold, thick copper) increase production difficulty and cost, leading to higher prices.
The larger the batch size, the more fully the fixed costs are distributed, and the more advantageous the price is; small batches or sample orders are more expensive because the costs are difficult to spread.

Why are aluminum substrates used in UAVs?

Aluminum substrates are used in drones primarily for their lightweight, heat dissipation, and mechanical strength advantages, while also offering cost-effectiveness.

Lightweight Design

Aluminum substrates have a density of only one-third that of traditional PCBs (0.6g/cm³). The weight of the same area (10cm×10cm) is reduced from 28.8g to 9.6g, a 66% weight reduction. In drone design, every kilogram of weight reduction can reduce launch costs by tens of thousands of dollars and improve fuel efficiency.

Heat Dissipation Performance

The thermal conductivity of aluminum substrates reaches 20-50W/m·K, over 10 times that of FR-4 (0.2-0.3W/m·K). When the drone’s motor driver board is operating at full load, the aluminum substrate can keep the surface temperature difference within 5°C, preventing performance degradation caused by local overheating and extending component life.

Mechanical Strength

Aluminum substrates utilize 6061 aluminum alloy (tensile strength 310 MPa), which is 80% lighter than steel substrates but strong enough to withstand the 30G overload experienced during spacecraft launches.

Cost and Environmental Protection

Aluminum substrate processing costs are lower than steel substrates and are RoHS compliant. Their recyclability (recycling consumes only 5% of the energy consumed in primary aluminum production) supports sustainable development.

What factors affect aluminum substrate cost?

The cost of aluminum substrates is primarily influenced by the following factors:

Raw Material Cost

Aluminum Ingot Price: This constitutes the majority of the aluminum substrate cost and is subject to fluctuations in international market prices.

Other Auxiliary Materials: These include alumina, carbon anodes, and fluoride salts, whose price fluctuations directly impact production costs.

Processing and Labor Costs

Production Process: Complex processes (such as multi-layer design and precision machining) increase costs.

Labor and Depreciation: Labor costs per ton of aluminum are approximately 500-800 yuan, with equipment depreciation accounting for 8%-12%.

Market and Economic Factors

Demand Fluctuations: Changes in demand in industries like construction and electronics directly impact prices.

International Trade: Tariff adjustments and exchange rate fluctuations may affect the cost of imported raw materials.

How are aluminum substrates chosen for drones?

When selecting an aluminum PCB for drones, factors such as heat dissipation, structural strength, weight, and process costs must be comprehensively considered.

Heat Dissipation Performance

The thermal conductivity of aluminum PCBs can be over 10 times that of FR-4, enabling rapid heat transfer from high-power components like motor driver boards, reducing surface temperature differences to within 5°C and preventing localized overheating.

Structural Strength and Weight

Thickness: Drones typically use 1.2-1.6mm thick PCBs, balancing structural strength and weight.

Density: Aluminum PCBs have a density only one-third that of traditional FR-4 (0.6g/cm³ vs. 1.8g/cm³), resulting in a 66% weight reduction for the same surface area.

Vibration Resistance: 100 hours of continuous vibration at 10-2000Hz and 20G acceleration without deformation of the aluminum core, and a solder joint loss rate of <0.1%.

Process and Cost

Exposure Process: Suitable for high-precision requirements of line width/line spacing ≤ 0.1/0.1mm, with neat and smooth pad edges, suitable for high-end drone circuits.

Mixed Dielectric Solution: Optimizing the stackup design can reduce costs by 10%-20%, for example, by using high-TG FR4 material to reduce weight while maintaining mechanical strength.

Electromagnetic Shielding and Reliability

Aluminum substrates can replace ceramic substrates, reducing the number of components such as heat sinks, and improving product heat resistance and physical properties.

Oxidation Resistance Test: No discoloration after 10-15 minutes of sweat dripping, indicating good oxidation resistance.

Why are aluminum drones better than other UAV materials?

Aluminum drones are superior to other materials due to their combination of lightweight, high strength, and cost-effectiveness:

Lightweight Advantages

Aluminum’s density is only one-third that of steel, making it lighter for the same volume, significantly reducing the overall weight of a drone. Using aluminum alloy for a drone’s fuselage frame increases its flight range by approximately 30%.

Strength and Stiffness

Aluminum alloys (such as 6061 alloy) have a tensile strength of 310 MPa and can withstand 30G overload shocks, meeting the structural requirements of drones operating at high speeds and in complex environments. Carbon fiber composites have a specific strength five times that of aluminum alloys, but are more expensive and are primarily used in high-end drones.

Processing and Maintenance

Aluminum alloy processing techniques are mature (extrusion, forging, etc.), making them suitable for mass production and recyclable, aligning with environmental trends. In contrast, carbon fiber composites have higher maintenance costs and require specialized equipment.

Heat Dissipation and Electrical Conductivity

Aluminum substrates have a thermal conductivity of 20-50 W/m·K. In drone motor driver boards, this can reduce chip temperature by 15°C and extend life by three times. Aluminum also has excellent electrical conductivity, making it suitable for components such as motor stators.

Cost and Applicability

Aluminum alloys cost only one-third to one-half of carbon fiber, making them suitable for large-scale civilian drone production. Carbon fiber composites, while offering superior performance, are expensive and are primarily used in military or high-end consumer products.

How are aluminum substrate costs reduced?

Optimize material selection: While meeting performance requirements, rationally select aluminum purity and insulation layer materials. For example, for non-critical heat dissipation scenarios, choose aluminum with an appropriate purity to avoid the cost increase of excessively high purity. Prioritize mature, mass-produced insulation materials to reduce the premium of custom materials.

Simplify design and standardize dimensions: Reduce circuit design complexity, such as optimizing circuit density and eliminating unnecessary layers or high-precision vias, to ease production difficulties. Use standard dimensions to reduce losses and customization costs associated with special cutting, thereby improving production efficiency.

Scaled procurement and production: Increase order batches and reduce per-ton procurement costs through large-scale raw material procurement. Mass production can spread fixed costs such as equipment commissioning and mold development.

Optimize process solutions: While performance requirements are met, select the most cost-effective process. For example, in common scenarios, use tin spraying instead of immersion gold.

What are the benefits of aluminum drones?

The benefits go beyond cost savings or raw performance numbers. Aluminum drones feel more responsive in flight and hold up better in demanding environments.

Better flight stability: Stronger structures reduce vibration and keep sensors accurate.

Higher payload capacity: Strong yet light materials allow carrying more equipment.

Improved safety: Less chance of component failure due to overheating.

Consistent quality: Aluminum substrates maintain performance over repeated flights.

Aluminum drones, with their core advantages of strength, heat dissipation, load-bearing capacity, and environmental resistance, demonstrate reliable practicality in scenarios such as industrial operations, outdoor adventures, and long-duration missions.

How does aluminum thickness impact UAVs?

Thickness plays a critical role in both performance and cost. Too thin, and the board may flex or overheat. Too thick, and you add unnecessary weight, reducing flight time.

Thin substrates are ideal for racing drones or small UAVs that need every gram saved. They still offer adequate heat dissipation for lighter electronics.

Thicker substrates excel in industrial drones, agricultural UAVs, or long-endurance drones. They handle higher currents, stronger vibration, and heavier payloads without losing shape.

What are the best deals on drone aluminum substrates?

Price alone doesn’t guarantee value. The ideal supplier offers bulk discounts, free samples, fast lead times, and clear technical documentation.

Look for suppliers who:

Offer bulk discounts for larger orders.

Provide free samples so you can test before committing.

Have short lead times to avoid production delays.

Share technical data sheets for full transparency.

This is exactly where Best Technology stands out. With over 19 years in PCB and substrate manufacturing, we provide high-grade aluminum substrates tailored for UAVs, competitive bulk pricing, and a commitment to 7-day delivery for most orders. Every order comes with full technical data sheets and ROHS/REACH compliance, plus expert guidance to help you choose the perfect thickness, material grade, and finish.

If you have any needs for Drone aluminum substrate, please contact us: sales@bestpcbs.com

Tags:aluminium drone, aluminum drone
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What Is PCB Copper Weight? PCB Copper Weight vs Thickness

Tuesday, August 5th, 2025

What is PCB copper weight? Let’s explores definitions, thickness conversion, current capacity, and selection criteria for PCB copper weight.

Are you troubled with these problems?

Why does my high-density PCB design keep experiencing signal interference?
How do I balance PCB cost and reliability? Low-cost solutions are always unstable!
Small-batch orders have long lead times. How can I quickly verify my design and prototype?

Best Technology can provide services:

Signal Integrity Optimization: Use simulation tools to predict interference and ensure first-pass EMC testing.
Cost-Performance Balance: Tiered copper thickness selection (1oz/2oz) saves 20% in material costs.
48-Hour Fast Prototyping: Dedicated small-batch production lines prioritize urgent orders.

Welcome to contact us if you have any request for heavy copper PCB: sales@bestpcbs.com.

What Is PCB Copper Weight?

PCB Copper Weight refers to the mass of copper per square foot on a printed circuit board, measured in ounces (1 oz = 28.35g). It directly impacts current capacity, heat dissipation, and manufacturing costs, higher oz values (e.g., 2oz, 3oz) mean thicker copper layers for power-heavy designs, while lighter weights (1oz) are common in standard electronics. Engineers choose oz values based on current requirements, thermal needs, and budget constraints, as thicker copper increases cost but improves durability and performance.

What Is PCB Copper Thickness?

PCB Copper Thickness is the physical depth of the copper layer on a circuit board, measured in microns (μm) or mils (1 mil = 0.0254 mm). It defines how much current the trace can carry, its resistance, and thermal performance. Common thicknesses range from 0.5 oz (17.5 μm) for high-frequency designs to 4 oz (140 μm) for high-power applications. Thicker copper improves durability and heat dissipation but increases cost and etching complexity.

Differences Between PCB Copper Weight vs Thickness

Attributes	Copper Weight	Thickness
Definition	Copper mass per unit area (oz/ft² or g/m²)	Vertical height of copper layer (mils or μm)
Units	Ounces/square foot (oz/ft²) or grams/square meter (g/m²)	Miles (mils) or microns (μm)
Direct Relationship	Increased copper weight→ increased thickness (directly proportional)	Increased thickness → increased copper weight (directly proportional)
Conversion Formula	1 oz/ft² ≈ 34.8 μm (1.378 mils)	Thickness (μm) = Copper Weight (g/m²) / (8.96 × 0.001)
Current Capacity Impact	Higher copper weight → higher current carrying capacity	Thicker thickness → higher current carrying capacity
Manufacturing Impact	Requires matched laminate thickness and etching precision	Requires controlled etching uniformity to avoid overcut/residue
Typical Applications	0.5 oz/ft² (17.5 μm) → High-density SMT/BGA	35 μm (1 oz/ft²) → General signal layers
Typical Applications	2 oz/ft² (70 μm) → Power planes/high-current	105 μm (3 oz/ft²) → Industrial control/RF boards

Copper Weight to Thickness Calculator

‌Copper Weight to Thickness Conversion‌

1 oz/ft² = 1.37 mils (34.8 μm)

‌Calculator Formula‌:

Thickness (mils) = Copper Weight (oz/ft²) × 1.37
Thickness (μm) = Copper Weight (oz/ft²) × 34.8

Standard Reference Table

Copper Weight (oz/ft²)	Thickness (μm)	Thickness (mils)
0.5	17.4	0.685
1	34.8	1.37
2	69.6	2.74
3	104.4	4.11
4	139.2	5.48

How to Choose PCB Copper Weight for High Power Applications?

Current Capacity Analysis

Calculate required trace width based on max current using IPC-2221 formulas or online calculators.
Select copper weight (1oz=35µm, 2oz=70µm) to match trace width without exceeding temperature rise limits.

Thermal Management Needs

Use thicker copper (2oz+) for high-power components (e.g., power converters, LED drivers) to enhance heat dissipation.
Add copper pours or thermal vias under hot components for additional cooling.

Signal Integrity Considerations

Prioritize thinner copper (0.5oz-1oz) for high-frequency/RF circuits to minimize skin effect losses.
Avoid excessive copper thickness in impedance-controlled traces.

Cost-Performance Balance

1oz copper is standard for most consumer electronics (low cost, adequate for low/mid-power).
Reserve 2oz+ for industrial/automotive applications requiring robustness.

Manufacturing Constraints

Confirm PCB fab capabilities: Thicker copper may require specialized processes (e.g., plating, etching).
Multi-layer boards with heavy copper may increase lead time and cost.

Mechanical Durability

Use heavier copper for flex/rigid-flex PCBs to improve bend reliability.
Thicker copper reduces risk of trace fracture under vibration or thermal cycling.

Component Compatibility

Match pad sizes to copper thickness (e.g., SMT components need consistent solder joints).
Heavy copper may require larger vias/pads for proper solder wetting.

Environmental Factors

Choose heavier copper for outdoor/high-humidity environments to resist corrosion.
Consider ENIG/ENEPIG finishes for heavy copper to enhance solderability.

How to Choose PCB Copper Weight for High Power Applications?

Relationships Between PCB Copper Weight vs Current

Copper Weight vs. Current Capacity

Copper weight (oz/ft²) directly determines current-carrying capacity. Thicker copper (e.g., 2 oz/ft² or 3 oz/ft²) supports higher currents due to lower resistance and reduced heat generation.
Rule of Thumb: 1 oz/ft² copper ≈ 1 A/mm line width (adjust for temperature rise and layer type).

Trace Width Impact

Wider traces reduce resistance and heat, enabling higher current. For example:

1 oz/ft² copper, 0.25 mm width ≈ 1.5 A
2 oz/ft² copper, 0.25 mm width ≈ 2.5 A
Use IPC-2221 or IPC-2152 standards for precise calculations.

Temperature Rise Constraints

Maximum allowable temperature rise (e.g., 10°C or 20°C) dictates copper weight and trace width. Thicker copper mitigates heat buildup in high-current applications.

Application-Specific Recommendations

Low Current (<1 A): Use 0.5–1 oz/ft² copper with minimal trace width. High Current (>3 A): Opt for 2–6 oz/ft² copper and wider traces (e.g., ≥1 mm).
Power Distribution: Thick copper (>2 oz/ft²) paired with thermal vias for heat dissipation.

Layer Considerations

External layers dissipate heat better than internal layers. For internal traces, reduce current capacity by 10–20% or use thicker copper.

Industry Standards & Tools

IPC-2152: Primary standard for current capacity, accounting for layer type, copper weight, and temperature.
Saturn PCB Toolkit: Free software for calculating trace/via current capacity based on IPC-2152.

Why Choose Best Technology as PCB Manufacturer?

19 Years of PCB Manufacturing Experience: Flexibly handle various problems encountered in PCB production and largely reduce maintenance costs.
ISO 14001/ISO 13485, ROHS/REACH Certification: medical/automotive customers are exempt from secondary testing, and compliance costs are reduced by 30%
Strict Quality Inspection: 100% quality inspection for bulk orders to reduce field failures.
Fast Turnaround (24 hours Rapid Prototyping, 5-7 days Bulk Production): Accelerated timelines without quality compromise.
Cost-Effective Solutions: Bulk discounts and material optimization reduce PCB costs.
Free DFM Analysis: Avoid costly redesigns, reduce prototype iterations.
Competitive Price: Save 15–25% on PCB costs without compromising quality.
Turnkey Solutions: Full-service PCB manufacturing from design to delivery, accelerating your product’s time-to-market.

Contact Best Technology to unlock cost savings, accelerated timelines, and flawless execution. Whether you need rapid prototypes or high volume production, our team ensures your PCBs meet standards. Get a quote now: sales@bestpcbs.com.

Tags:PCB copper thickness, PCB Copper Weight, PCB Copper Weight vs Thickness
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Standard Copper Thickness PCB Manufacturer丨Best Technology

Tuesday, August 5th, 2025

Why choose standard copper thickness PCB? Let’s explore definition, benefits, application, thickness chart, manufacturing processes for standard copper thickness PCB.

Are you troubled with these problems?

Why does my high-speed design always fail signal integrity tests?
How do I reduce costs without sacrificing reliability?
Why are my prototype lead times so long?

Best Technology can provide service:

First-Pass Prototyping Success – Advanced impedance control & pre-layout simulation to eliminate SI issues.
Cost-Effective Reliability – Smart copper weight selection (1oz/2oz) balancing performance and BOM costs.
48-Hour Rapid Prototyping – Dedicated small-batch line for urgent verification needs.

Welcome to contact Best Technology if you have any request for heavy copper PCB: sales@bestpcbs.com.

What Is Standard Copper Thickness PCB?

Standard Copper Thickness PCB typically refers to 1 oz (ounce) per square foot (≈35 µm) for outer layers and 0.5 oz (≈17.5 µm) for inner layers. This balance optimizes cost, manufacturability, and performance for most consumer electronics, signal traces, and low-power applications. Thicker copper (e.g., 2 oz–6 oz) is used for high-current, power, or thermal management needs. Standard thickness ensures reliability while minimizing material and processing costs.

IPC Standard PCB Copper Thickness Chart

Copper Weight (oz/ft²)	Thickness (μm)	IPC-2152 Current Rating (1mm trace, 10°C rise)	Typical Application
0.5 oz	~17.5 μm	~1.5A	Low-power circuits
1 oz	~35 μm	~3A	Consumer electronics
2 oz	~70 μm	~5A	Power supplies
3 oz	~105 μm	~7A	Automotive, industrial
4 oz	~140 μm	~10A+	High-current systems

Why Choose Standard Copper Thickness PCB?

Advantages of standard copper thickness PCB:

Cost Optimization: Standard thickness (1 oz/ft² / 35 µm) reduces material and fabrication costs by 20–50% compared to heavy copper (≥2 oz).
Universal Compatibility: Works with 90%+ PCB designs, including low-current signals, controlled impedance traces, and mixed-signal boards.
Proven Reliability: Tested for decades in consumer/industrial electronics, meeting IPC-6012 Class 2 standards for electrical and thermal performance.
Simplified Manufacturing: Avoids specialized etching or laminate requirements, ensuring faster lead times and fewer production risks.
Design Flexibility: Enables 4–6 mil traces for high-density SMT/BGA and simplifies impedance control (e.g., 50Ω microstrip).
Supply Chain Efficiency: Standard copper foils (ED/RA) are readily available, minimizing delays versus custom heavy copper orders.
Thermal Performance Balance: Adequate for most applications (ΔT ≤10°C at 5A). Pair with thermal vias/copper pours for higher currents without thickening copper.
Risk Mitigation: Avoids over-engineering risks like plating unevenness or delamination from unverified fab capabilities.

Why Choose Standard Copper Thickness PCB?

When to Use Standard Copper Thickness PCB?

Consumer Electronics – Smartphones, tablets, and IoT devices with currents <5A. Standard copper (1 oz/ft²) balances cost and performance.
Low-Current Signal Transmission – Sensor interfaces, microcontroller I/O, and digital communication lines (e.g., I²C, SPI) where currents <1A.
Controlled Impedance Traces – High-speed designs (e.g., USB, HDMI, Ethernet) needing 50Ω/100Ω microstrip/stripline with predictable trace geometry.
General Industrial Control – PLCs, relays, and low-power motor drivers (currents <10A) where thermal performance is adequate with standard copper.
Lightweight Applications – Drones, wearables, or aerospace systems prioritizing reduced board weight over extreme current handling.
Standard Communication Devices -Routers, modems, and Wi-Fi modules with power rails ≤12V and currents <5A.

How to Choose PCB Copper Layer Thickness?

‌Current Requirements‌: Thicker copper (e.g., 2 oz) handles higher currents; thinner (e.g., 0.5 oz) suffices for low-power circuits.
Signal Integrity‌: Thinner copper reduces skin effect for high-frequency signals; thicker copper minimizes resistance for power traces.
Thermal Management‌: Thicker copper dissipates heat more effectively in high-power designs.
Manufacturing Constraints‌: Standard thicknesses (0.5 oz–6 oz) are easier to fabricate; exotic thicknesses increase cost.
‌Impedance Control‌: Thinner copper is preferred for controlled impedance traces in high-speed PCBs.
Cost‌: Thicker copper raises material and production costs; optimize based on performance needs.
‌Layer Stackup‌: Match thickness with dielectric layers to maintain consistent impedance and manufacturability.
Via and PTH Handling‌: Thicker copper requires larger vias/pads to ensure reliable plating.
Industry Standards‌: Follow IPC-2221 or design guidelines for typical applications (e.g., 1 oz for consumer electronics).

How to Make A Standard Copper Thickness PCB?

Design PCB Layout: Use CAD software to create circuit patterns, ensuring trace widths and spacing meet standard copper thickness requirements.
Select Copper Foil Thickness: Choose copper foil with standard thickness (e.g., 1 oz/35 µm or 2 oz/70 µm) for inner and outer layers.
Prepare Substrate Material: Use FR-4 or similar laminate core with pre-bonded copper foil of desired thickness.
Image Transfer (Inner Layers): Apply photoresist, expose to UV light using artwork film, and develop to transfer circuit patterns.
Etch Inner Layers: Use chemical etching (e.g., ammonium persulfate) to remove excess copper, leaving desired traces.
Layer Stackup: Align etched inner layers with prepreg sheets and outer copper foil, then press under heat/pressure to laminate.
Drill Holes: Use CNC drilling to create via holes and component mounting holes.
Electroless Copper Deposition: Apply chemical bath to deposit a thin conductive layer on hole walls.
Electrolytic Plating: Pass current through holes to build up copper thickness (e.g., 1-2 oz) on traces and vias.
Outer Layer Imaging: Repeat photoresist, exposure, and development steps for outer layer circuit patterns.
Final Etching: Remove excess copper from outer layers using controlled etching to retain standard thickness.
Solder Mask Application: Coat PCB with epoxy-based solder mask to protect copper traces.
Surface Finish: Apply finishes like HASL, ENIG, or OSP to prevent oxidation and ensure solderability.
Quality Inspection: Use AOI, X-ray, or microsectioning to verify copper thickness uniformity and circuit integrity.

Standard Copper Thickness PCB Manufacturer – Best Technology

Certified & Compliant Standards: ISO 9001, ISO 13485, IATF 16949 Certified, and UL, REACH, RoHS Compliant
Precision Thickness Control – Strict adherence to 1oz/ft² (35μm) standard with ±5% tolerance for consistent performance.
Competitive Pricing – Bulk-order discounts & transparent cost structure (20% lower than industry average).
Strict Quality Inspection– 100% full inspection in mass production.
Fast Turnaround – 24-hour expedited service available with standard 5-7 day lead time.
Free DFM Expertise – Free design review to optimize trace widths/spacing for 1oz copper.
Multilayer Capability – Supports up to 20-layer boards with standard copper lamination.
Global Logistics – DHL/FedEx partnerships for door-to-door delivery in 3-5 days.
24/7 Support – Dedicated account managers for real-time order tracking.

Our Quality Inspection & Testing

Visual Inspection (IPC-A-600): Mandatory for surface defects (scratches, pinholes) and solder mask alignment. Ensures compliance with Class 2/3 acceptability criteria.
Automatic Optical Inspection (AOI): Critical for detecting trace/space violations (>4 mil) and solder mask defects. Post-etch inspection prevents short circuits.
X-Ray Inspection (IPC-6012): Required for hidden features (blind/buried vias, BGA solder joints). Validates via integrity and void percentages (<5%).
Electrical Continuity Test (Flying Probe/ICT): Ensures all nets are connected. Flying probe used for prototypes; ICT for high-volume production.
Impedance Control Verification (TDR): Mandatory for high-speed designs (e.g., 50Ω traces). Tolerance must stay within ±10% (IPC-2221).
Thermal Shock Test (IPC-TM-650): -55°C to 125°C cycling for 100 cycles. Pass criteria: no delamination or cracks.
Humidity Resistance Test (85°C/85% RH):168-hour exposure. Insulation resistance must remain >100MΩ (IPC-TM-650).
Solderability Test (IPC-TM-650): HASL/ENIG pads dipped in 245°C solder. Minimum 95% coverage required to ensure solder joint reliability.
Peel Strength Test (IPC-TM-650): Copper-substrate adhesion: ≥1.4 lb/in (inner layers), ≥2.8 lb/in (outer layers). Prevents trace lifting.
Microsection Analysis: Slicing through PTHs to verify copper thickness (±20%) and via wall plating. Ensures annular rings meet IPC-6012.

How to Get a Quote For Your PCB Project?

Required Materials Checklist:

Gerber Files

Include all layers (copper, solder mask, silkscreen) in RS-274X format.
Verify file accuracy with a Gerber viewer.

Bill of Materials (BOM)

List components with part numbers, quantities, and footprints.
Specify brand preferences for critical parts (e.g., capacitors, ICs).

Technical Specifications

Board dimensions, layer count (e.g., 4L, 6L), and copper thickness (1 oz/2 oz).
Surface finish (HASL, ENIG, OSP) and impedance requirements.

Fabrication Notes

Via types (through-hole, blind/buried) and minimum trace/space (e.g., 4 mil).
Special requirements (e.g., controlled impedance, thermal vias).

Assembly Details (If Applicable)

SMT/PTH component placement files (Centroid/Pick-and-Place).
Test requirements (e.g., ICT, functional testing).

Submit your requirements to us for a quote: sales@bestpcbs.com.

Tags:copper thickness pcb, Standard copper thickness pcb
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What is Exposed Copper on PCB? PCB Exposed Copper Edge

Friday, August 1st, 2025

When looking at a printed circuit board (PCB), you may notice shiny areas of metal that aren’t covered by the usual green or colored solder mask. These are areas of exposed copper on PCB, and they serve important roles in how the board functions. Exposed copper can be found on pads, traces, or even along the edges of the board. But why is the copper left uncovered? And how do you design a PCB to safely include exposed copper?

In this article, we’ll explore the meaning, purpose, types, and design considerations for exposed copper on PCB, including how to manage its risks and where it’s commonly used.

What is Exposed Copper on PCB? PCB Exposed Copper Edge

What Does Exposed Copper on PCB Mean?

In a PCB, exposed copper refers to areas where the copper layer is intentionally left uncovered by solder mask or surface finish. Normally, copper traces and pads are coated with a protective layer to prevent oxidation and corrosion. However, in certain parts of the board, copper is left exposed for electrical or mechanical reasons.

You’ll typically see exposed copper in places where components need to be soldered or where the board makes direct contact with another surface, such as in connectors or test points. These areas must have direct electrical contact, and that means the copper needs to remain accessible.

Where Is Copper Usually Exposed?

Component pads: These areas must be exposed for soldering.
Test points: Used for measuring signals during testing.
Thermal reliefs: Copper areas used to help dissipate heat.
Edge connectors: Known as pcb exposed copper edge, these are found on plug-in boards.
Copper pours: Large copper areas, sometimes left exposed to improve thermal or grounding performance.

Purpose of Designing Exposed Copper on PCB

Designing with exposed copper is a common and often necessary practice. Below are some of the most common reasons designers choose to expose copper on a PCB.

1. Electrical Contact

Soldering requires exposed copper. All component pads, whether for surface mount or through-hole components, need to be bare so solder can properly adhere and form a good electrical connection.

In addition to pads, test points are exposed copper areas used during assembly and troubleshooting. Probes can be placed on these spots to measure voltages or signals.

2. Thermal Management

Copper is an excellent conductor of heat. In high-power applications, such as LED lighting, motor drivers, or power supplies, leaving copper exposed can help manage heat by allowing it to dissipate more efficiently. Large exposed copper plates can act like heat sinks.

3. Grounding and Shielding

In many designs, especially in radio frequency (RF) or high-speed digital circuits, exposed copper design PCB layouts include areas for grounding or electromagnetic interference (EMI) shielding. A pcb exposed copper edge can also be connected to ground and used as part of the shielding structure to protect signal integrity.

4. Cost Considerations

Leaving copper exposed in non-critical areas can reduce costs. Surface finishes like ENIG or HASL add expense, so in low-cost or temporary boards, some copper may be left bare to save on manufacturing steps.

Types of Exposed Copper PCB Designs

There are several ways exposed copper is used in PCB layouts, each serving a specific function depending on the design goals. Below are the most common types you’ll find, along with their applications and things to watch out for.

1. Exposed Copper Pads

Exposed copper pads are the most widely used type of exposed copper in any PCB. These are the metal areas where components are soldered onto the board. By design, they must remain uncovered to allow solder to create a solid electrical and mechanical connection between the component leads and the PCB’s copper layers.

In addition to component soldering, some exposed pads are used for mechanical support or to connect heat-generating parts to large copper pours for better heat dissipation. Proper surface finish on these pads—such as HASL or ENIG—helps prevent oxidation and improves solderability.

2. Exposed Copper Traces

In some designs, traces (the thin copper lines connecting different components) are intentionally left exposed. This is less common than exposed pads, but it’s done in specific cases where designers need direct access to the trace for testing or where the trace carries high current and benefits from better heat dissipation.

One common use for exposed copper traces is creating test points. By leaving a section of trace uncovered, engineers can place probes directly on the trace during testing or troubleshooting.

3. PCB Exposed Copper Edge

A pcb exposed copper edge refers to copper that runs right to the edge of the PCB and remains exposed for functional use. This is typically found in boards that need to connect to sockets or other boards via edge connectors. In these cases, the copper along the edge acts as contact points and must remain exposed for reliable electrical connection.

This type of exposed copper is also used for grounding purposes. For example, in RF circuits or high-speed digital designs, the board edge may have exposed copper connected to ground to reduce electromagnetic interference (EMI). Some designs use edge plating, where the copper is plated along the entire edge of the board to create a continuous conductive path.

What Is the Clearance of Copper to Edge of PCB?

When designing PCBs, copper-to-edge clearance is critical. Copper should not be placed too close to the edge unless it is meant to be exposed. If copper unintentionally gets too close to the edge, it can cause manufacturing problems or failures in the field.

Industry Guidelines

Standard practice, according to IPC standards, recommends at least 0.25mm (10 mils) clearance between copper and the board edge. This clearance prevents copper from being damaged or exposed during board cutting.

Edge Copper Design

If you’re designing a pcb exposed copper edge, such as for a connector or grounding point, you can extend copper to the edge, but it must be plated and processed correctly. Special instructions are needed for the manufacturer to plate the edges and prevent delamination.

How to Design a PCB with an Exposed Copper Plate?

Designing exposed copper areas requires planning and proper use of your PCB design software.

Step 1: Define Copper Areas

Use copper pours, pads, or large planes for the areas you want exposed. Ensure they are connected to the correct net, whether ground, power, or signal.

Step 2: Disable Solder Mask

In your PCB layout tool, disable the solder mask over these areas. This is done by creating a solder mask opening in the relevant layer.

Step 3: Edge Exposure

For pcb exposed copper edge designs, extend the copper to the edge of the board. Indicate this clearly in your mechanical drawings. Some manufacturers require a note to plate the edge.

Step 4: Selective Surface Finish

Decide whether the copper will remain bare or have a finish like HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold). These finishes prevent oxidation and improve durability.

Risks and Challenges with Exposed Copper PCB

While exposed copper on PCB serves many useful purposes, it comes with challenges.

Oxidation and Corrosion

Copper oxidizes quickly in air, forming a dull brown or green layer. This can reduce conductivity and make soldering difficult. Moist environments accelerate this process.

Short Circuits

Exposed copper is more likely to cause shorts if it touches other metal objects. Extra care is needed in design and assembly to avoid accidental contact.

Handling Risks

Bare copper areas can be scratched or contaminated during handling. Fingerprints, dust, or moisture can affect performance. Protective packaging and careful assembly help reduce these risks.

Exposed Copper Design Guidelines in PCB Layout

Here are some helpful tips for designing exposed copper areas safely:

Maintain clearance from high-voltage areas unless insulation is provided.
Use protective coatings like conformal coating if the board will be exposed to harsh environments.
Clearly indicate exposed copper areas in your Gerber files and fabrication notes.
For pcb exposed copper edge, work with your manufacturer to ensure proper plating and durability.
Use thicker copper (e.g., 2 oz) for large exposed areas meant for heat dissipation or high current.

FAQs

1. How to remove copper from PCB board?

Copper can be removed through chemical etching using ferric chloride or similar solutions. It can also be scraped off mechanically or milled with CNC tools.

2. What happens to exposed copper?

Exposed copper oxidizes when exposed to air and moisture. This can affect electrical performance, so protective finishes or coatings are often applied.

3. Can exposed copper PCB be used outdoors?

Not directly. Outdoor use requires additional protection, like conformal coating, to prevent corrosion. Without protection, copper will degrade quickly.

4. How do I prevent oxidation on exposed copper areas?

Apply coatings such as OSP (Organic Solderability Preservative), clear lacquer, or conformal coating. Using surface finishes like ENIG or HASL also helps.

5. What surface finish is best if I want partial copper exposed?

ENIG and HASL can be applied selectively. Masking during the finishing process allows partial copper exposure where needed.

6. Is exposed copper safe for high-voltage applications?

Not unless proper spacing and insulation are used. High voltage requires strict clearance and protection to avoid arcing or shorts.

7. What’s the difference between exposed copper and plated finish?

Exposed copper has no added layer, while plated finishes like ENIG or HASL add protection and improve performance.

Tags:exposed copper design pcb, Exposed Copper on PCB, pcb exposed copper edge
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Extreme Copper PCB Supplier, One Stop Solution

Tuesday, July 29th, 2025

Looking for extreme copper PCB solutions? This guide covers specs, benefits, applications and design guidelines for extreme copper PCB.

Are you troubled with these problems?

Frequent PCB failures in high-current scenarios?
Is the cost of cooling solutions out of control?
Half the lifespan in harsh environments?

Best Technology can provide solutions:

4-20oz stepped copper layer: Minimum trace width of 0.8mm achieves 600A continuous current.
3D heat dissipation topology: 0.5mm microvia clusters + copper pillar soldering, reducing thermal resistance by 40%.
Environmentally adaptable coating: Passed 72-hour dual 85 test, IP67 protection level.

Welcome to contact us if you have any request for heavy copper PCB: sales@bestpcbs.com.

What Is Extreme Copper PCB?

An extreme copper PCB is a special type of printed circuit board that uses extra-thick copper layers, typically starting from 5 oz/ft² (about 175 microns) and going up to 20 oz/ft² or even higher. These thick copper layers are far greater than the standard 1 oz or 2 oz copper found in most PCBs. The goal of using extreme copper is to handle very high current, manage intense heat, and ensure mechanical durability in harsh environments.

Unlike standard copper PCB boards, extreme copper PCBs can safely conduct large currents without overheating, thanks to the increased cross-sectional area of the copper traces. In addition, the thick copper enhances the board’s thermal conductivity and mechanical strength, making it highly reliable for long-term use in demanding applications.

Extreme Copper PCB Specification

Parameter	Specification
Copper Thickness	5 oz/ft² to 20 oz/ft² (175 µm to 700 µm)
Base Material	High TG FR4, Polyimide, Metal Core (Aluminum or Copper), Ceramic
Board Thickness	1.6 mm to 6.0 mm (customizable)
Minimum Trace Width/Spacing	0.5 mm / 0.5 mm (may vary based on copper thickness and design)
Maximum Current Capacity	Up to 100 Amps or more, depending on trace width and copper weight
Thermal Conductivity	High, due to thick copper and thermal vias (1.0–3.0 W/m·K for standard FR4)
Surface Finish Options	ENIG (Immersion Gold), HASL, OSP, Immersion Silver, Hard Gold
Drill Hole Size	Minimum 0.3 mm (12 mil), larger holes recommended for thick boards
Layer Count	1 to 6 layers (commonly 1–2 layers for extreme copper)
Impedance Control	Possible with careful design; may be challenging due to thick copper
Solder Mask	High-temperature resistant (e.g., green, black, white, custom colors)
Plating Type	Heavy copper plating for traces, pads, and through-holes
Thermal Via Support	Yes – often required for heat dissipation in multilayer or dense designs
Standards Compliance	IPC-6012 Class 2/3, RoHS, UL94-V0 flame retardant rating

What Are Benefits of Extreme Copper PCB?

Breaking Current-Carrying Limits

A single 4oz (140μm) copper layer can carry 50A, four times the current of a conventional 1oz PCB.
Multi-layer stacking solutions (such as a 2oz + 4oz combination) support high-current transmission exceeding 1000A.

Reduced System Temperature Rise Risk

Tests show that under the same load, the temperature rise of a 4oz copper plate is 40% lower than that of a 1oz copper plate.
Reduced heat sink size enables device miniaturization.

Extended Product Lifecycle

The fatigue strength of the copper layer is increased by 60%, preventing circuit cracking caused by high-frequency vibration.
Salt spray testing shows corrosion resistance is three times that of conventional PCBs.

Simplified System Design Complexity

Multiple low-voltage circuit boards can be combined into a single board, reducing connectors and wiring harnesses.
Supports integrated power/signal design, reducing EMI interference.

Lifecycle Cost Advantages

Although the initial cost increases by 20%, the failure rate decreases by 70%.
A five-year TCO (Total Cost of Ownership) calculation shows a 35% reduction in maintenance costs.

What Are Benefits of Extreme Copper PCB?

What Are Applications of Extreme Copper PCB?

Applications of Extreme Copper PCB

Power Electronics– Used in power supplies, converters, and inverters to handle high current and heat.
Automotive Systems– Ideal for electric vehicle chargers, battery management systems, and motor controllers.
Industrial Equipment– Applied in welding machines, heavy machinery, and high-power control systems.
Military and Aerospace– Used in radar systems, communication devices, and rugged electronics for harsh conditions.
Renewable Energy– Found in solar inverters and wind power controllers that require high reliability and heat resistance.
Railway and Transportation– Used in power control units and signaling systems that demand strong and durable PCBs.
Medical Devices– Suitable for high-power medical equipment requiring stable and safe operation.

Extreme Heavy Copper PCB Design Guide

1. Material Selection

Base Material: Use high-Tg (≥180°C) FR4 or ceramic-filled PTFE for thermal stability.
Copper Foil: Specify 6-10 oz (210-350µm) rolled annealed copper for flexibility and adhesion.
Metal Core: Integrate aluminum/copper substrates (e.g., 2mm thickness) for direct heat dissipation.

2. Layer Stackup Strategy

Outer Layers: 6-10 oz copper for power/ground paths.
Inner Layers: 2-4 oz copper for signals; add isolated power planes for high-current rails.
Thermal Vias: Place 0.8-1.2mm diameter vias (≥3 oz plating) under hot components to connect outer/inner layers.

3. Trace Design Rules

Calculate width using IPC-2221 (e.g., 10 oz copper = ~150A for 20mm trace at 10°C rise).
Use 45° bends; avoid right angles to reduce impedance spikes.
Thicken traces near connectors (e.g., 2x nominal width) to handle surge currents.

4. Thermal Management

Fill unused areas with copper pours (≥70% coverage) tied to ground/power planes.
Use embedded heat sinks (e.g., copper coins) under MOSFETs/IGBTs.
For metal-core boards, bond components directly to the substrate with thermal epoxy.

5. Power Distribution

Split power planes by voltage (e.g., 48V, 12V) to minimize noise.
Place decoupling capacitors (e.g., 10µF ceramic) within 2mm of IC power pins.
Widen battery-to-load paths (e.g., 50mm+ traces) to minimize IR drop.

6. Signal Integrity

Keep high-speed traces (>100MHz) away from power zones (≥5mm gap).
Adjust trace spacing to maintain 75-100Ω impedance despite thick copper.
Use guard traces (grounded copper) around sensitive signals.

7. Manufacturing Compliance

Specify “extreme heavy copper” and “metal-core” in design notes.
Confirm minimum trace/space (≥10mil) and via drill sizes (≥0.5mm).
Request differential etching and X-ray inspection for via plating quality.

8. Assembly Considerations

Use high-temperature solder (e.g., SAC305) rated for 260°C reflow.
Add soldermask dams between thick traces to prevent solder wicking.
Test prototypes with 2x nominal current to validate thermal performance.

9. Validation & Testing

Perform thermal imaging under max load to identify overheating zones.
Use a microsection analysis to verify copper thickness and via plating integrity.
Conduct HALT (Highly Accelerated Life Test) for thermal cycling (-40°C to +125°C).

Why Choose Best Technology as Extreme Copper PCB Supplier?

Reasons why choose us as extreme copper PCB supplier:

Certified Compliance (ISO 9001, UL, RoHS) – Mitigates regulatory risks and ensures products meet global standards for safety and environmental compliance.
19 Years of Heavy Copper PCB Manufacturing Experience – Quickly and flexibly handle the production of thick copper plates, speeding up production cycles。
24-Hour Rapid Prototyping Delivery – Accelerates product development cycles, enabling faster time-to-market and competitive edge in high-demand industries.
Stringent Quality Control with 100% Inspection – Eliminates hidden defects, reduces rework costs, and ensures reliability in high-current/thermal applications.
Transparent Pricing with No Hidden Fees – Predictable budgeting and cost savings through upfront pricing models tailored to thick copper PCB specifications.
Free DFM (Design for Manufacturability) Analysis – Optimizes PCB layouts to reduce material waste, lower production costs, and avoid late-stage design revisions.
One-Stop Solution from Design to Delivery – Streamlines project management by consolidating prototyping, fabrication, and assembly under one roof.

Why Choose Best Technology as Extreme Copper PCB Supplier?

Our Heavy Copper PCB Capabilities

Base material	FR4/Aluminum
Copper thickness:	4 OZ~10 OZ
Extreme Heavy Copper:	20~200 OZ
Outline:	Routing, punching, V-Cut
Soldermask:	White/Black/Blue/Green/Red Oil
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	580480mm(22.8″18.9″)

How to Get A Quote For Extreme Copper PCB Project?

Basic structural parameters

Number of layers required (single-sided/double-sided/4-20 layers)
Finished product dimensions (length x width ± tolerance) and panelization plan
Panel type (FR4 Tg 170°/aluminum substrate/ceramic substrate
Target board thickness (0.8-6.0mm range)

Copper foil process specifications

Copper thickness distribution (e.g., outer layer 4oz/inner layer 2oz)
Special requirements (locally thickened copper block/embedded copper heat sink)
Minimum trace width/spacing (e.g., 6oz copper thickness requires ≥5.0mil)

Electrical performance requirements

Current carrying capacity (e.g., continuous current ≥200A @ 25°C)
Impedance control requirements (differential pair impedance value and tolerance)
Insulation withstand voltage rating (power frequency/DC withstand voltage)

Surface finish options

Choose one of: ENIG/immersion tin/OSP
Solder mask color (default green, other colors +20% fee)
Silkscreen requirements (character height ≥0.8mm)

Special process instructions

Thick copper etching compensation solution (design documents required)
Thermal via design (aperture diameter/pitch/filler material)
Acceptance criteria (IPC-6012D) Class 2/3)

Required Documents

Gerber (RS-274X format) + drill file.
Stackup diagram (with copper thickness distribution).
Impedance calculation table (if high-speed signals are involved).

Why choose Best Technology?

19 Years of Thick Copper Expertise: Delivered over 50 million 4oz+ PCBs since 2006, a strategic supplier to Tesla and Huawei.
Pricing Transparency: Vertically integrated supply chain, prices 30-40% lower than those of European and American manufacturers for comparable processes.
Extreme Response: 24-hour emergency proofing, 72-hour first-part delivery (industry average: 7 days).
Full Inspection Commitment: 100% AOI + Flying Probe Testing, CPK ≥ 1.67, Failure Rate < 50 PPM.
One-Stop Service: From design review to conformal coating to assembly and testing, complete management.

Welcome to contact us if you have any request for copper PCB: sales@bestpcbs.com.

Tags:Extreme Copper PCB, Extreme Copper PCB Supplier
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4 oz Copper PCB Board Design & Manufacturer, Fast Delivery

Tuesday, July 29th, 2025

Why choose 4 oz copper PCB? This guide discover its thickness, application, design guide and spec, as well as supplier selection methods.

Are you troubled with these problems?

How to avoid copper foil melting in high current scenarios?
How to balance the cost and reliability of thick copper plates?
How to efficiently achieve complex heat dissipation requirements?

Best Technology can provide services and solutions:

Copper thickness optimization algorithm + customized design: Based on 19 years of data accumulation, provide accurate copper thickness and line width matching solutions to ensure stability under 5A/mm² current.
Step-by-step cost control solution: Through innovations such as local thickening and gold immersion process replacement, reduce overall costs by 15%-30% without sacrificing performance.
Three-dimensional heat dissipation structure design: The use of embedded copper blocks and microchannel etching technology increases heat dissipation efficiency by 40%, without the need for additional heat sinks.

Welcome to contact us if you have any request for heavy copper PCB: sales@bestpcbs.com.

What Is 4 oz Copper PCB?

A 4 oz copper PCB refers to a printed circuit board with copper layers weighing 4 ounces per square foot, roughly 140 microns thick. This thicker copper coating allows the board to handle higher electrical currents and heat dissipation compared to standard 1 oz or 2 oz PCBs. It’s commonly used in power electronics, motor controls, automotive systems, and industrial devices where robustness and efficiency matter. Manufacturing such PCBs requires specialized techniques to ensure even copper distribution and structural integrity, making them slightly more expensive but ideal for demanding applications.

How Thick Is 4 oz of Copper PCB?

The thickness of a 4 oz copper PCB refers to the weight of copper per square foot, which translates to approximately 0.14 millimeters (mm) or 5.6 mils in physical thickness. This measurement is commonly used in printed circuit board (PCB) manufacturing to indicate the copper layer’s density, with 4 oz being a standard choice for high-current applications due to its durability and conductivity.

Why Choose 4 oz Copper PCB?

Advantages of 4 oz Copper PCB

Enhanced Current Handling – 4 oz copper PCBs can carry higher currents without overheating, making them ideal for power electronics, motor controllers, and high-voltage systems.
Improved Durability – The thicker copper layer resists thermal stress and mechanical wear, extending the lifespan of the PCB in demanding environments.
Better Thermal Management – Increased copper thickness dissipates heat more efficiently, reducing the risk of component failure due to overheating.
Reliable Signal Integrity – For high-frequency applications, the robustness of 4 oz copper minimizes signal loss and interference, ensuring stable performance.
Cost-Effective in the Long Run – While slightly pricier than thinner alternatives, their longevity and reduced maintenance needs lower total ownership costs.
Simplified Design Flexibility – Allows for wider traces and fewer layers, streamlining manufacturing while maintaining performance.

When to Use 4 oz Copper PCB Board?

Applications for 4 oz copper PCB board

High-Current Power Electronics – Used in power supplies, motor controllers, and inverters to handle heavy currents efficiently.
LED Lighting Systems – Essential for high-power LED drivers to dissipate heat and ensure stable performance.
Automotive Electronics – Suitable for battery management systems (BMS) and EV charging circuits due to durability.
RF and Microwave Devices – Provides low resistance for signal integrity in high-frequency applications.
Industrial Equipment – Ideal for welding machines and robotics where robust current handling is critical.
Solar Power Systems – Used in solar charge controllers and inverters to optimize energy conversion.

4 oz Copper PCB Design Specification

Specification	Typical Value / Range
Copper Thickness	4 oz/ft² (≈ 140 µm or 0.14 mm per layer)
Minimum Trace Width	≥ 10 mil (0.254 mm)
Minimum Trace Spacing	≥ 10 mil (0.254 mm)
Minimum Hole Diameter	0.3 mm (can vary with board thickness)
Board Thickness	1.6 mm – 3.2 mm (custom options available)
Max. PCB Size	Typically 600 mm × 600 mm (depends on fabrication)
Dielectric Material	FR4, Polyimide, or High-TG material
Thermal Conductivity	Depends on base material, FR4 ~0.3 W/mK, Metal Core ~1–3 W/mK
Surface Finish	ENIG, HASL, OSP, Immersion Silver, Immersion Tin
Layer Count	1 to 12 layers (4 oz typically used in 2–6 layers)
Solder Mask Color	Green, Blue, Black, Red, White
Tg (Glass Transition Temp.)	≥ 130°C (Standard FR4) or ≥ 170°C (High-TG)
Impedance Control	Optional – harder to achieve with thick copper
Drill Tolerance	±0.075 mm typical
Aspect Ratio (Hole:Board)	≤ 6:1 recommended for plating reliability

How to Design A 4 oz Copper PCB Board for High Power?

4 oz copper PCB board design guide for high power application:

1. Material Selection

Use high-Tg (≥170°C) FR4 or metal-core substrates (aluminum/copper) to withstand heat from high currents. Verify copper foil adhesion strength to prevent delamination under thermal stress.

2. Layer Stackup

Outer layers: 4 oz copper for power/ground traces.
Inner layers: 1-2 oz copper for signals.
Add dedicated power/ground planes near high-current areas.

3. Trace Design

Calculate trace width using IPC-2221 standards (e.g., 4 oz copper = ~70A for 10mm width at 10°C rise).
Avoid sharp angles; use 45° bends to reduce impedance mismatches.
Thicken traces near connectors/power components.

4. Thermal Management

Fill unused areas with copper pours connected to ground/power planes.
Place thermal vias (≥0.5mm diameter, ≥2 oz plating) under hot components to transfer heat to inner layers.
Use metal-core bases for direct heat dissipation.

5. Power Distribution

Split power planes for different voltage rails (e.g., 12V, 5V).
Place decoupling capacitors close to IC power pins.
Widen high-current paths (e.g., battery to motor) to minimize voltage drop.

6. Signal Integrity

Keep high-speed traces (e.g., >50MHz) away from power zones.
Adjust trace spacing to maintain 50-75Ω impedance despite thick copper.

7. Manufacturing Compliance

Specify “4 oz copper” and “metal-core” to PCB vendors.
Confirm minimum trace/space (≥8mil) and via drill sizes (≥0.3mm).
Request differential etching to avoid undercutting.

8. Testing & Validation

Perform thermal imaging under max load to identify hotspots.
Simulate current flow with tools like PSpice or LTspice.
Test prototype with 1.5x nominal current to validate reliability.

How to Design A 4 oz Copper PCB Board for High Power?

How to Choose A Reliable Heavy Copper PCB Manufacturer?

Methods about how to choose a reliable 4 oz copper PCB manufacturer:

Verify Credentials & Certifications: Prioritize manufacturers with ISO 9001, UL certification, IPC compliance, and RoHS/REACH compliance.
Assess Production Experience: Demand case studies of 4 oz copper PCB projects, especially in high-current, thermal management, or RF applications to reduces technical risks.
Inspect Quality Control Systems: Inquire about AOI (Automated Optical Inspection), X-ray layer inspection, and electrical testing capabilities. For thick copper boards, uneven plating is a common defect, robust QC processes minimize failures.
Evaluate Technical Expertise: Confirm the engineering team’s proficiency in impedance control, thick copper filling, and other specialized processes. Request technical whitepapers or examples of past design optimizations (Such as reducing thermal stress).
Clarify Lead Times & Capacity: 4 oz copper PCBs require longer production cycles. Confirm if the factory has dedicated lines for thick copper boards and emergency order handling. Ask for the past 3-month on-time delivery rate (aim for ≥95%).
Test Customer Service Responsiveness: Measure technical support reply time (ideal: ≤24 hours via email/phone). Ensure they provide DFM (Design for Manufacturability) feedback to avoid costly late-stage revisions.
Compare Price Transparency: Request itemized quotes. Beware of hidden costs (e.g., engineering fees, testing charges). For 4 oz copper boards, reasonable price differences should stay within 15%, prioritize value over lowest bid.
Focus on Long-Term Reliability: For high-stakes applications (e.g., industrial control, power modules), prioritize suppliers with proven defect-handling protocols. A slightly higher upfront cost often offsets project delays or field failures.

How to Choose A Reliable Heavy Copper PCB Manufacturer?

How to Get A Quote For Heavy Copper PCB Project?

All Materials Clients Need to Submit

1. Gerber Files & Drawings

Provide complete PCB design files (including .brd, .gbl, .gtl formats), marking copper thickness distribution areas and special process requirements (e.g., stepped copper, deep copper slots).

2. Technical Specifications

Specify:
Copper thickness (e.g., 4oz/5.6oz)
Layer count and stack-up structure
Minimum trace width/spacing (≥6mil recommended for heavy copper)
Impedance control requirements (±10% accuracy)

3. Material & Surface Finish

Define substrate (e.g., FR4, CEM-3), solder mask color, surface treatment (HASL, ENIG, OSP), and note if high-temperature/high-TG material is needed.

4. Special Process Requirements

Include buried/blind vias, back drilling, metal core (aluminum/copper substrate), immersion gold thickness (2-5μm recommended), with detailed design drawings.

5. Testing & Certification Needs

List required tests: flying probe test, impedance test, thermal stress test, and third-party certifications (e.g., UL, CE).

6. Volume & Lead Time

Provide estimated order quantity (e.g., 50pcs/500pcs) and desired delivery time, noting if split shipments are acceptable.

7. Application Description

Briefly explain product use (e.g., new energy, automotive electronics, industrial control) to help optimize process parameters (e.g., current-carrying capacity design).

8. Contact Information

Include company name, procurement contact, and details for smooth technical communication.

Act Now for Accurate Quotation!

Best Technology has 19 years of expertise in heavy copper PCB manufacturing, offering 24-hour rapid prototyping. Our engineering team provides free design optimization, ensuring copper thickness uniformity within ±8% and via filling rate ≥95%. Submit materials to sales@bestpcbs.com to get a free quote now!

Tags:4 oz Copper PCB, 4 oz Copper PCB Board
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What is Thick Copper PCB? PCB Copper Thickness vs Current

Tuesday, July 29th, 2025

A thick copper PCB refers to a printed circuit board that uses a higher amount of copper than a standard PCB. Typically, standard PCBs have copper thickness ranging from 0.5 oz to 2 oz per square foot. However, when the copper thickness is 3 oz or more per square foot, it is classified as a thick copper PCB.

These boards are built for handling high current, enhanced heat dissipation, and strong mechanical performance. You’ll find them in power electronics, electric vehicles, solar inverters, and industrial machinery—wherever reliability and power handling are critical.

At Best Technology, we specialize in custom thick copper PCB manufacturing. Whether you need 3 oz or 20 oz copper, our engineering team supports your design with precision, reliability, and fast delivery. We also provide full traceability and strict quality control, making sure each board meets your performance needs.

What is Thick Copper PCB? PCB Copper Thickness vs Current

Advantages of Thick Copper PCB

1. High Current Carrying Capacity

Thicker copper allows your PCB to carry more current through its traces without causing excess heat. This helps prevent overheating and damage to components. In other words, thick copper gives your board the power capacity it needs to run safely and efficiently.

2. Excellent Thermal Management

Heavy copper spreads heat more evenly across the board and away from sensitive components. This reduces hot spots and helps maintain stable operation. It’s especially useful in environments where heat buildup can be a problem, such as power supplies or LED lighting systems.

3. Increased Mechanical Strength

Thick copper PCBs are more durable. They are less likely to bend, crack, or delaminate during assembly or use. This added strength makes them ideal for heavy machinery, vehicles, and military equipment.

4. Improved Reliability and Product Life

Better current and heat handling reduce stress on the board and components. This leads to longer lifespan and fewer failures, which saves both time and cost in maintenance.

5. Compact and Efficient Designs

You can use narrower traces with thick copper while still meeting your current requirements. This allows for smaller board sizes and space-saving layouts, especially valuable in compact devices.

All of these advantages make thick copper PCBs a smart choice when performance and reliability truly matter.

Standard PCB Copper Thickness Chart

Copper thickness is usually measured in ounces per square foot (oz/ft²) or microns (µm). For every 1 oz of copper per square foot, the actual thickness of the copper layer is about 35 microns, or 1.4 mils. To help you understand how thick copper compares to standard copper, here’s a simple PCB Copper Thickness Chart with typical values.

Copper Weight (oz/ft²)	Thickness (microns)	Thickness (mils)	Common Usage
0.5 oz	~17 µm	~0.7 mil	Signal layers, low-power circuits
1 oz	~35 µm	~1.4 mil	Most standard PCBs
2 oz	~70 µm	~2.8 mil	Power circuits, motor drivers
3 oz	~105 µm	~4.2 mil	Start of thick copper PCB range
4 oz	~140 µm	~5.6 mil	High-power, heat-intensive applications
6 oz	~210 µm	~8.4 mil	Industrial power systems, battery packs
10 oz	~350 µm	~14 mil	Heavy-duty, high-current applications

Whether you are working on a standard 1 oz board or a 10 oz thick copper PCB, the thickness affects everything from electrical performance to thermal control. If you are unsure which thickness suits your project, Best Technology offers expert guidance and custom PCB solutions. We help you choose the right copper weight to match your current load, heat needs, and budget.

PCB Copper Thickness vs Current

One of the biggest reasons to use thick copper is current capacity. As copper thickness increases, it can carry more current without excessive heating. Here’s how it works:

1 oz copper can carry around 1.2A on an inner layer for a 10°C temperature rise.
3 oz copper can carry about 3.6A under the same conditions.
Higher copper weights (like 10 oz) can handle much more, depending on trace width.

This relationship is essential for designing safe and efficient circuits. Using IPC-2221 standards as a guide, engineers can determine how much copper is needed for any given load.

If you’re unsure, tools like the PCB copper thickness calculator can help you find the right copper weight based on your current and design needs.

How to Choose PCB Copper Thickness?

Knowing how to choose PCB copper thickness is essential when designing a board that performs reliably under electrical and thermal stress. The right copper thickness affects current flow, heat management, durability, and even the size of your board. Choosing wisely can improve performance and reduce long-term costs.

1. Understand Your Current Requirements

Start by determining how much current your traces need to carry. Higher current demands thicker copper or wider traces. If your circuit handles heavy loads—like in power supplies or electric vehicles—you’ll likely need thick copper, starting from 3 oz or more.

2. Evaluate Space and Trace Width

Sometimes, there’s limited space on your PCB. If you cannot increase trace width to carry higher current, you can increase copper thickness instead. Thicker copper allows for narrower traces to handle the same current safely, helping you keep your design compact without sacrificing performance.

3. Check for Voltage Drop

Resistance in copper causes voltage drop across traces. Thicker copper has lower resistance, which means less voltage loss. If maintaining consistent voltage is important for your application—like in precision circuits or power regulation—opt for thicker copper to minimize drops.

4. Consider Cost and Board Size

While thicker copper improves performance, it also adds cost and weight. Choose copper thickness that meets your technical needs without over-engineering. For most consumer electronics, 1 oz or 2 oz is enough. For power devices, 3 oz to 10 oz may be needed.

Thick Copper PCB Applications

Power supplies
Converters
Inverters
Battery systems
Motor drives, and charging circuits efficiently
Solar Power Systems
Inverters and control circuits
Military and Aerospace
Industrial Control

Anywhere power, heat, or strength is a concern, thick copper PCBs provide dependable performance.

How to Avoid Thick Copper PCB Delamination?

The delamination of thick copper circuit boards refers to a phenomenon that occurs during PCB manufacturing. Due to insufficient adhesion between the copper foil and the substrate or excessive internal stress, the copper foil and the substrate (such as FR-4 fiberglass board) separate from each other.

While it’s not common, thick copper PCBs can be more prone to this issue if not manufactured properly. Here are some ways to avoid it:

1. Use High-TG Materials

High-TG (glass transition temperature) materials like FR4-TG170 or ceramic can better resist heat and stress.

2. Reliable Lamination Process

Proper lamination ensures strong bonding between copper and substrate. At Best Technology, we use high-pressure lamination and strict process control to prevent delamination.

3. Controlled Soldering Heat

Excessive heat during soldering can damage the board. Controlled soldering ensures minimal thermal stress.

4. Avoid Design Stress Points

Sharp corners and very narrow traces can concentrate stress. A smooth, balanced design reduces risk.

5. Quality Assurance

Choose manufacturers with strong quality systems that include thorough inspection and testing.

Best Thick Copper PCB Manufacturer – Best Technology

Looking for a trusted thick copper PCB manufacturer? Here’s why Best Technology is your best choice:

We specialize in 3 oz to 20 oz thick copper PCBs.
Certified with ISO9001, IATF16949, and UL.
Advanced plating and lamination techniques ensure strength and reliability.
Fast prototyping and mass production services.
Competitive pricing and on-time global delivery.
Engineering support for design, layout, and material choice.
Full traceability with our MES system and strict quality control.

Need help with your next project? Contact Best Technology today for a custom quote and expert support.

FAQs

1. What copper thickness qualifies as thick copper PCB?

Anything 3 oz per square foot or more is considered thick copper PCB.

2. How do I calculate required copper thickness?

Use a PCB copper thickness calculator based on your current, trace width, and temperature rise.

3. Can thick copper PCBs be multi-layered?

Yes, we manufacture single, double, and multi-layer thick copper PCBs.

4. Do thick copper PCBs cost more?

Yes, but they offer better performance and longer life, which offsets the cost.

5. How do I get a quote from Best Technology?

Just contact us with your design files, and we’ll provide a competitive, customized quote.

Tags:how to choose pcb copper thickness, PCB copper thickness chart, pcb copper thickness vs current, Thick copper pcb price
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