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Insulated Metal Substrate vs PCB: What are Differences?
Thursday, September 4th, 2025

Are you always curious these questions about insulated metal substrate PCB:

What is insulated metal substrate? Does it the same as metal core PCB (MCPCB)?

What are the key differences between insulated metal substrate and standard PCB?

Can I use insulated metal substrate in my project? What’s its performance?

As a experienced PCB manufacturer, we can confident to say the insulated metal substrate (IMS) PCB is the same as mcpcb, there is no differences between them. But it is big differ from standard PCB. Actually, IMS PCB offer numerous benefits in high power or heat sensitive projects. In this blog we will introduce what is it, its performance and the differeces with FR4 PCB.

What is an Insulated Metal Substrate (IMS)?

An insulated metal substrate (IMS) is a type of metal core PCB designed for heat-intensive applications. Unlike traditional FR4 boards, IMS uses a metal base layer—usually aluminum or copper—covered with a thin dielectric insulation and a copper circuit layer on top.

The purpose of this design is simple: dissipate heat quickly while keeping the circuit stable. Aluminum IMS boards are most common, offering a balance of cost, strength, and thermal conductivity. Copper IMS is used where performance is critical, especially in high-current applications.

Key characteristics of IMS PCBs include:

  • High thermal conductivity to transfer heat away from components.
  • Strong mechanical stability compared to FR4.
  • Reliable performance in harsh environments.

For industries like LED lighting, automotive electronics, and power supplies, IMS PCBs have become a preferred choice.

Insulated Metal Substrate vs PCB: What are Differences?

What is IMS material for PCB?

The performance and cost of an insulated metal substrate PCB depend heavily on the choice of the base material. Different metals give different levels of thermal conductivity, mechanical strength, and pricing.

1. Copper IMS PCB

Copper has the best thermal conductivity among IMS options. It spreads heat rapidly and is highly stable under load. However, copper is expensive, so it is often reserved for high-power applications such as industrial converters or advanced automotive modules.

2. Aluminum IMS PCB

Aluminum is the most common choice for IMS PCBs. It strikes a balance between cost, weight, and thermal performance. With good heat dissipation and lower price than copper, it has become the preferred material in LED lighting and consumer automotive systems.

3. Iron IMS PCB

Iron-based substrates are rarely used. While they are strong, their lower thermal performance and processing challenges make them less attractive. In most cases, aluminum and copper dominate the IMS market.

What is a Traditional PCB?

A traditional PCB typically refers to a board made with FR4 substrate. FR-4 is a code for a fire-resistant material grade. It represents a material specification where the resin material must be able to extinguish itself when exposed to a burning condition. It is not a material name but a material grade. Most consumer electronics use FR4 PCBs because they are affordable and easy to manufacture.

The construction includes:

  • Fiberglass base (FR4) for insulation and strength.
  • Copper foil laminated on one or both sides.
  • Solder mask and silkscreen for protection and labeling.

FR4 PCBs work well in devices that do not generate extreme heat. They are versatile and suitable for phones, laptops, IoT devices, wearables, and household appliances.

What is a Traditional PCB?

What is the Difference Between Insulated Metal Substrate and PCB?

The key differences between ims pcb and traditional PCB is the base material, IMS pcb uses metal core as the base substrate while traditional PCB uses fiberglass epoxy. Due to the differences base materials used, their performance, price and applications are different accordingly. Here we listing a detailed table for your reference:

FeatureTraditional PCB (FR4)Insulated Metal Substrate (IMS)
Base MaterialFiberglass epoxy (FR4)Metal base (aluminum or copper)
Thermal ConductivityLow (~0.3 W/mK)High (2–10 W/mK dielectric + metal base can reach up to 400 W/mk)
Heat ManagementNeeds extra cooling (heat sinks, fans)Built-in heat spreading through metal layer
Mechanical StrengthRigid but less durable under vibrationStrong, resists shock and vibration
FlexibilityCan be rigid, flex, or rigid-flexMostly rigid only
ApplicationsConsumer electronics, IoT, computersLED lighting, automotive, power modules
CostLow, highly economical for mass productionHigher, due to materials and processing

Why is IMS Better for Heat Dissipation Compared to PCB?

As we all know, heat is the biggest enemy of electronic components. If heat builds up, components degrade, solder joints crack, and lifespan shortens. Standard FR4 struggles to move heat away, leading to performance issues in high-power systems.

An IMS PCB solves this by using a metal base that acts like a built-in heat sink. The dielectric layer transfers heat from components directly to the metal, which spreads it out quickly. This keeps the board and devices cooler and improves the overall reliability.

This is why IMS PCBs are widely used in LED lighting, where heat directly impacts brightness and lifespan. Similarly, automotive systems like motor controllers and power converters use IMS to handle constant high currents.

Which Applications Do We Use IMS vs Standard PCB?

Each type of board has its own application areas.

IMS PCB applications

  • LED lighting systems
  • Automotive electronics (engine control units, sensors, chargers)
  • Power modules and converters
  • Industrial motor drives
  • Telecom base stations

FR4 PCB applications

  • Consumer electronics (phones, tablets, laptops)
  • IoT devices and smart wearables
  • Household appliances
  • Audio and multimedia systems
  • Office electronics

The decision depends on the heat level, power density, and cost balance.

Which Applications Do We Use IMS vs Standard PCB?

Cost Differences Between IMS and PCB

IMS PCBs are more expensive than standard FR-4 boards due to their raw materials and processing steps. Aluminum-based IMS typically costs $0.12–$0.25 per cm², while FR-4 falls around $0.05–$0.10 per cm². Extra copper thickness, dielectric layers, and specialized drilling add further expense.

Yet, the higher upfront cost can translate into system savings. In LED lighting, automotive, and power modules, IMS often reduces the need for heat sinks or cooling parts. Studies show a 15–20% drop in overall system cost when FR-4 is replaced with IMS, thanks to better thermal control and longer product life.

Design Consideration of Insulated Metal Substrate PCB

Designing an Insulated Metal Substrate (IMS) PCB is more than just replacing FR4 with a metal base. The entire design strategy changes because thermal performance becomes the top priority. Several aspects need careful thought:

1. Dielectric Layer Thickness and Thermal Conductivity

The dielectric is the heart of an IMS PCB. Its job is to provide electrical insulation while transferring heat from the copper layer to the metal base.

  • Typical FR4 dielectric has thermal conductivity of 0.3–0.5 W/mK.
  • IMS dielectrics range from 2 to 10 W/mK, depending on material choice.
  • Thickness is usually 50–150 μm. Thinner layers transfer heat better but risk breakdown if not well controlled.

For normal LED boards, a 75 μm dielectric with 1-2 W/mK conductivity is often a balance between cost and reliability.

2. Copper Thickness and Trace Design

Current capacity is vital. Wider traces reduce resistance and heat buildup.

  • Standard FR4 PCBs often use 1 oz (35 μm) copper.
  • IMS boards commonly use 2–3 oz (70–105 μm) copper to carry higher currents.

IPC-2221 guidelines suggest that a 2 oz copper trace at 10 mm width can handle around 20–25 A continuously, which fits the demands of power devices.

3. Component Placement and Thermal Management

Hot components, such as MOSFETs, LEDs, or regulators, should be placed directly over areas where heat can spread into the metal base efficiently. Grouping high-power parts together without proper spacing often leads to localized hot spots.

Simulation tools (like ANSYS or thermal CAD software) are often used to map temperature rise. Data shows that placing components 5 mm apart can reduce local heat rise by 8–12°C compared to tightly packed layouts.

4. Board Thickness and Mechanical Strength

IMS boards are stiffer than FR4 due to the metal layer.

  • Common thickness: 0.8–3.2 mm.
  • For automotive PCBs exposed to vibration, a 1.6 mm aluminum base is typical for balancing rigidity and weight.

Designers should consider mounting holes and mechanical supports early to avoid stress cracking during assembly.

5. Surface Finishes and Soldering

Surface finishes like ENIG, ENEPIG, OSP or HASL are commonly applied. However, IMS boards undergo more thermal cycling during soldering, so ENIG is often preferred for reliability.

Factors Affect the Failure of Insulated Metal Substrate PCB

Even with proper design, IMS PCBs can fail if certain risks are not controlled. Failures usually stem from thermal, mechanical, or environmental stresses. Let’s examine the main causes, with supporting data:

1. Thermal Stress and Cycling

IMS PCBs are exposed to wide temperature swings, especially in LED lighting (-40°C to +120°C) or automotive control units (-55°C to +150°C). In additional, a thinner dielectric layer (<75 μm) is more likely to fail under repeated expansion and contraction. So, using high Tg dielectrics (Tg ≥ 170°C) and flexible solder materials reduces the chance of cracks.

2. Dielectric Breakdown

The dielectric layer separates copper circuitry from the conductive metal base. If the insulation fails, short circuits occur.

  • Standard IMS dielectric breakdown voltage: 2–6 kV/mm.
  • If the dielectric is too thin or contaminated during manufacturing, breakdown may occur earlier, especially in high-voltage power supplies.

3. Corrosion and Moisture Ingress

If the protective coating or solder mask is not properly applied, moisture, chemicals, or salts can corrode the copper traces or the aluminum base. There is no doubt that unprotected copper can corrode in under 72 hours in a salt spray environment (5% NaCl). Therefore, applying ENIG or OSP surface finishes greatly reduces corrosion risk.

4. Mechanical Stress and Vibration

IMS boards are less flexible than FR4, which means they can crack under excessive bending or vibration.

  • In automotive vibration testing (10–2,000 Hz sweep, 20 g), poor mounting caused delamination in 5–10% of samples after 50 hours.
  • Proper mechanical design (screw supports, standoffs, thicker bases) minimizes this risk.

5. Manufacturing Defects

Poor drilling, lamination errors, or uneven dielectric spreading can lead to early failures. For example:

  • Misaligned lamination can create voids, which increase heat resistance and raise local temperatures by 10–15°C.
  • Improper drilling of vias in IMS can leave burrs or microcracks, leading to premature electrical failure.

Best Technology has more than 19 years in IMS PCB manufacturing. It cannot be denied that we had ever faced such problems and solved them finally, then we have much experiences to solve them and mature skills to avoid such defectives.

Insulated Metal Substrates Market

The insulated metal substrates market has grown rapidly with the demand for efficient heat management in electronics. Several sectors drive this expansion:

  • LED Lighting: As LEDs move into general lighting, street lamps, and automotive headlights, IMS boards remain essential for heat control.
  • Electric Vehicles (EVs): Motor controllers, inverters, and battery systems require durable IMS boards to handle high currents.
  • Industrial Power Systems: Power converters, motor drives, and renewable energy inverters are major adopters.
  • Telecom: Base stations and 5G equipment rely on IMS to stabilize performance under heavy workloads.

Market reports suggest steady growth in IMS adoption worldwide, especially in Asia-Pacific regions like China and South Korea, where LED and EV industries are booming. Aluminum IMS PCBs dominate due to cost efficiency, but copper IMS is growing in high-performance niches.

How to Choose Between IMS PCB and FR4 PCB?

The choice between IMS PCB and FR-4 PCB depends on performance demands, cost expectations, and application environment. If your design handles high power density or generates significant heat—such as in LED lighting, power converters, or automotive control units—IMS PCB is usually the better option. Its aluminum or copper base provides strong thermal conductivity, keeping component temperatures 20–30% lower than FR-4 under the same load.

FR-4 PCB, on the other hand, is more suitable for general-purpose electronics where heat generation is moderate. Devices like consumer gadgets, IoT sensors, and low-power communication modules often prioritize affordability and flexibility in design over extreme thermal performance. FR-4 also supports higher multilayer counts more easily than IMS, which is beneficial for complex circuits with dense routing.

So, in a word:

  • Choose FR4 PCB if your device is low-power, cost-sensitive, and not heat-intensive.
  • Choose IMS PCB if your design generates high heat, requires high reliability, or operates in harsh environments.

In practice, many manufacturers use both types in their product lines. Consumer electronics stay with FR4, while lighting and automotive turn to IMS.

FAQs

1. What materials are used in insulated metal substrates?

IMS PCBs usually use aluminum or copper as the base, with a dielectric insulation layer and copper foil.

2. Is IMS PCB more reliable than FR4 PCB?

Yes, especially in high-power or high-heat applications, IMS offers better thermal management and durability.

3. Can IMS replace all standard PCBs?

No, IMS is designed for specific heat-demanding uses. FR4 remains more cost-effective for everyday electronics.

4. Why are IMS PCBs used in LED lighting?

They transfer heat away quickly, improving brightness, efficiency, and lifespan of LEDs.

5. How expensive are IMS PCBs compared to normal PCBs?

IMS PCBs cost more due to metal materials and manufacturing, but they often save costs by reducing cooling needs.

About Best Technology – Your Trust Insulated Metal Substrate PCB Supplier

Best Technology is a turnkey PCB & PCBA manufacturer in China, we specialize in the design and manufacturing of high-quality PCBs, and we are confident that we can provide a tailored solution for your project. With our expertise and a broad range of materials, including SY, Rogers, Isola, KB, ceramic, metal core pcb, flex circuit and busbar copper pcb, etc, we offer flexibility and reliability for all your PCB designs.

We’ve made many PCBs for our customers, whether you need high-speed, high-frequency, or multi-layer PCBs, our experienced engineering team ensures reliable, cost-effective designs with excellent manufacturability. We’ve worked in this industry over 19 years, so we deeply know what our customers want, and make them into reality.

Our services include:

  • Customized PCB design based on your schematic and specifications
  • Free Design for manufacturability (DFM) to reduce production issues
  • Optimization for signal integrity, thermal management, and reliability
  • PCB layout and PCB design full turnkey service

Industry certifications we have:

  • ISO9001 (quality management system)
  • IATF16949 (for automotive device)
  • ISO13485 (for medical instrument)
  • AS9100D (aerospace applications)

In addition to our advanced PCB manufacturing capabilities, we also have a fully equipped SMT factory both in China & Vietnam. This facility is dedicated to providing our customers with professional PCB assembly services, including SMD soldering, component placement, and testing. This allows us to offer a complete solution, from PCB fabrication to final assembly, all under one roof. If you have PCB or IMS PCB manufacturing demands, welcome to contact us at sales@bestpcbs.com

PCB Directory Types: FR4, FPC, Ceramic & Metal Core PCB
Tuesday, September 2nd, 2025

Would you like to know what types of PCB directory are? Let’s explore FR4, Flexible, ceramic and metal core PCB directories through this blog together.

At Best Technology, we can provide you service:

  • Competitive Price & Premium Quality– Maximize your budget with cost-effective PCBs that meet stringent quality standards.
  • 24 Hours Rapid Prototyping– Accelerates product development cycles.
  • Free ‌DFM (Design for Manufacturability‌) Support -Prevents manufacturing errors before production.
  • Full Turnkey Solution-handle PCB fabrication to assembly, saving vendor coordination time cost and production cost.

Feel free to contact us if you have any inquiry for FR4 PCB, FPC PCB, ceramic PCB and MCPCB: sales@bestpcbs.com.

What Is PCB Directory?

PCB Directory is a professional online service platform dedicated to the global printed circuit board (PCB) industry. It aggregates resources from manufacturers, assembly providers, and design service firms, facilitating efficient supplier matching through parameter-based categorization (e.g., material type, layer count, thickness) and geographic filters. The platform supports specialized requirements such as flexible PCB and ceramic PCB, streamlining supply chain collaboration in electronics manufacturing and serving as a critical industry information hub.

What Is PCB Directory?

What Are Types of PCB Directory?

Base Material Categories

1. FR4 PCB Directory

  • Core Material: Fiberglass-reinforced epoxy composite.
  • Parameters: Tg 130-180℃, DK 4.2-4.8.
  • Applications: Consumer electronics mainboards, industrial control systems.

2. Flexible PCB (FPC) Directory

  • Core Material: Polyimide (PI) or polyester film.
  • Technical Features: Bend radius ≤1mm, >100,000 flex cycles.
  • Applications: Foldable smartphones, medical endoscopy devices.

3. Ceramic PCB Directory

  • Material Systems: Alâ‚‚O₃ (96%), AlN, BeO.
  • Thermal Performance: AlN 170-230W/m·K > Alâ‚‚O₃ 24-28W/m·K.
  • Applications: High-power LED modules, aerospace radar systems.

4. Metal Core PCB(MCPCB) Directory

  • Structural Types: Aluminum-backed (MCPCB), Copper-backed (IMS).
  • Thermal Management: Thermal resistance as low as 0.5℃/W.
  • Applications: Automotive headlamp drivers, photovoltaic inverters.

FR4 PCB Directory

  • Single Layer PCB
  • 2 Layers PCB
  • Multi-Layer PCB
  • Heavy Copper PCB
  • Bus Bar PCB
  • Extra Thin PCB
  • High Tg PCB
  • HDI PCB
  • RF Board

Our FR4 PCB capabilities:

ItemCapabilities
Layer Count1 – 32 Layers
Max Board Dimension2424″ (610610mm)
Min Board Thickness0.15mm
Max Board Thickness6.0mm – 8.0mm
Copper ThicknessOuter Layer: 1oz~30oz, Inner Layer: 0.5oz~30oz
Min Line Width/Line SpaceNormal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm)
Min Hole DiameterNormal: 8mil (0.20mm); HDI: 4mil (0.10mm)
Min Punch Hole Diameter0.1″ (2.5mm)
Min Hole Spacing12mil (0.3mm)
Min PAD Ring(Single)3mil (0.075mm)
PTH Wall ThicknessNormal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD DiameterNormal: 14mil (0.35mm); HDI: 10mil (0.25mm)
Min Solder mask BridgeNormal: 8mil (0.2mm); HDI: 6mil (0.15mm)
Min BAG PAD Margin5mil (0.125mm)
PTH/NPTH Diameter TolerancePTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation±2mil (0.05mm)
Outline ToleranceCNC: ±6mil (0.15mm); Die Punch: ±4mil (0.1mm); Precision Die: ±2mil (0.05mm)
Impedance ControlledValue>50ohm: ±10%; Value≤50ohm: ±5ohm
Max Aspect Ratio0.334027778
Surface TreatmentENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating, ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Immersion, Tin Immersion
Solder mask ColorGreen/White/Black/Yellow/Blue/Red

FPC PCB Directory

  • Single Sided Flexible Circuits
  • Double Sided Flexible Circuits
  • Multilayer Flexible Circuits
  • ‌FFC(Flat Flexible Cable‌)
  • Dual Access Flexible Circuits
  • Rigid-Flex Circuits

Our FPC PCB capabilities:

ItemCapabilities
Layers Count1-10L
Max Board Dimension1L:500*2000mm; 2L:250*1380mm
Conductor Thickness1/3 OZ (12 um) – 4OZ (140um)
Min Line Width/Line Space2/2mil
Min Hole SpacingNPTH:16mil; PTH:20mil
Hole Position Deviation±4mil (0.10mm)
Outline ToleranceLaser: +0.15mm/-0.05mm;
Die Punch: +0.10/-0.20 mm
Surface TreatmentENIG(Au 4u”), Hard Gold Plating (Au 50u”), Immersion Silver, Immersion Tin, OSP, ENEPIG
FPC PCB Directory

Our rigid-flex circuits capabilities:

ItemCapabilities
Layers Count2-50L
Max Board Dimension500 × 500mm
Conductor Thickness0.5oz (18μm) – 2oz (70μm)
Board Thickness0.3mm – 4.0mm
Min Line Width/Line Space4/4mil
Min Hole SpacingNPTH: 16mil; PTH: 20mil
Min Solder Mask Bridge8mil
Impedance Controlled±10% (>50Ω); ±5Ω (≤50Ω)
Rigid-Flex Circuits

Ceramic PCB Directory

  • Thick Film Ceramic PCB
  • Thin Film Ceramic PCB
  • DBC Ceramic PCB
  • DPC Ceramic PCB
  • AMB Ceramic PCB
  • LTCC PCB
  • HTCC PCB

Our ceramic PCB capabilities:

ItemCapabilities
Layer Count    1-6L (Thick Film)
1-2L (DBC/DPC/AMB)
4-64L (LTCC/HTCC)
Substrate MaterialAl₂O₃, AlN, BeO, ZrO₂, Si₃N₄
Conductor ThicknessCopper: 0.035-0.30mm
AgPd: 10-20μm
Au: 6-10μm
Working Temperature-50℃ to 800℃
Bonded Resistors±0.5% Tolerance
PTH Diameter Tolerance±4mil (0.1mm)
NPTH Diameter Tolerance±2mil (0.05mm)
Outline ToleranceLaser: +0.20/-0.05mm
Max Board SizeThick Film: 200×200mm
DBC/DCB: 138×178mm
DPC: 138×190mm AMB: 114×114mm
Min Board Thickness0.25mm-0.40mm
Min Hole SpacingNPTH: 16mil (0.30mm)
PTH: 20mil (0.5mm)
Hole Vias Tolerance±4mil (0.1mm)
Cutting ToleranceLaser: +0.2/-0.05mm
Mold+0.25/-0.20mm
Line Width/Space Tolerance±5mil (0.125mm), ±1mil (0.025mm)
Surface TreatmentAgPd, AuPd, Mn/Ni (Thick Film), OSP, Nickel Plating, ENIG, ENEPIG
Ceramic PCB Directory

Metal Core PCB Directory

  • Aluminum Base PCB
  • Copper Base PCB
  • COB PCB
  • SinkPAD PCB

Our MCPCB capabilities:

ItemCapabilities
Layer Count1-10L
Max Board Dimension610×1625mm
Conductor Thickness0.5oz – 10oz
Min Line Width/Line Space4/4mil
Wall Copper ThicknessNormal: 0.59mil; HDI: 0.48mil
Special Hole TypesCounterbore hole, Countersunk hole, Blind, Buried, Vias
Max Aspect Ratio10:1
Min Board Thickness0.8mm
Max Board Thickness5.0mm
Min Hole Diameter0.8mm
Min Hole Spacing1mm
Min Solder mask Bridge0.15mm
Metal Core PCB Directory

Our Prototyping Lead Time

Lead time for FR4 PCB prototyping

LayersNormal ServiceFastest Service
17 Days24 H
28 Days24 H
410 Days48 H
610 Days72 H
812 Days72 H
≥10TBDTBD

Lead time for MCPCB prototyping

LayersNormal ServiceFastest Service
14 Days24 H
214 Days168 H
421 DaysTBD

Lead time for FPC, Rigid- Flex & Ceramic PCB Prototyping

ItemsNormal ServiceFastest Service
FPC48-72 H24 H
Rigid- Flex2 Weeks for 4L1.5 Weeks for 4L
>4L: TBD>4L: TBD
Ceramic3 Weeks2 Weeks

Our Quality Certifications

  • ISO9001:2015
  • ISO13485:2016
  • REACH
  • RoHS
  • IATF16949

Attaches is our FR4 PCB prototype video for your reference:

Welcome to contact us if you need any help for FR4 PCB, FPC PCB, ceramic PCB and MCPCB : sales@bestpcbs.com.

Quick Thermally Conductive PCB From Prototypes
Thursday, August 28th, 2025

A thermally conductive PCB is at the heart of heat control in modern electronics. In this blog, we primarily discuss about the definition, material, applications of thermally conductive PCB, and where to get quick thermally conductive PCB from prototypes.

Have you suffered from these bad headaches?

  • Have you experienced terrible thermal management problems?
  • Have you faced complexity in material selection and process?
  • Have you struggled with balancing quick prototyping and mass production?
  • Have you worried about the deficiency of the thermal management solution?

There are some optimal ways of dealing with the above issues.

  • Applying MCPCB thermal management solutions, which conduct heat from the circuit boards to the heat sinks.
  • Using thermally conductive dielectric materials to improve the thermal management capability of PCBs.
  • Optimizing quick prototype and fabrication. Employing a rapid prototype development process to shorten development cycles, reduce design changes, and manufacturing complexity via modular design.
  • Improving thermal management design. For example, using a thermal analysis tool to do thermal management design, and follow thermal management design rules to improve thermal management efficiency ultimately.

Best Technology is one of the best PCB manufacturers in China, providing thermally conductive PCB, IMS PCB, aluminium core PCB, busbar PCB, heavy copper PCB, HDI PCB, ceramic PCB, and more. If you want to inquire about any PCB or PCBA, just write an email to us at sales@bestpcbs.com.

Quick Thermally Conductive PCB From Prototypes

What does thermally conductive PCB mean?

The design aim of thermally conductive PCB is conducting heat from components to keep stable circuit. Thermally conductive PCB is different from common PCB. It uses high thermal conductivity rate PCB material or metal core. Heat is conducted away through copper layers, thermally conductive vias, or the metal substrate. This design if of benefit to reduce temperature of chips and extend the lifespan of devices.

What does thermally conductive PCB mean?

Is FR4 thermal conductivity?

FR4 thermal conductivity is low. Generally, it is only around 0.3 W/m·K. For low power device, FR4 is a good choice. However, in high power LED, automobile module or RF circuit, FR4 is not able to dissipate heat effectively. That is why designers move toward metal core boards, ceramics, or other high thermal conductivity PCB material. Many customers will meet some issues since they still use FR4 even in high heat loading situation. Best Technology helps by suggesting better materials during the early design stage.

What’s the most high thermal conductivity PCB material?

Among all options, copper thermal conductivity is the highest at nearly 400 W/m·K. However, copper PCBs are heavy and costly. Aluminum is more cost efficient, and features good thermal conductivity, lighter weight. Ceramics such as aluminum nitride are also popular for their stability and high thermal conductivity PCB material values. It is good to know that engineers will select suitable materials based on costs, weights, and the applications.

What does thermally conductive tape do for metal core PCB manufacturer?

Thermally conductive tape is widely used with metal core PCB manufacturer solutions. It is able to bond components or heat sinks to the boards’ surface. This brings benefits of improving contact and reducing heat resistance. This small process gives boards the benefit of passing heat dissipation testing, and with the benefit of cost efficiency. It is crucial to note that many customers have delayed projects since their heat dissipation testing is failed. Best Technology makes use well of thermally conductive tape, and you will enjoy benefits of short lead time and improved stability.

What is the relation: thermally conductive PCB, PCB thermal resistance?

The link between thermally conductive PCB and PCB thermal resistance is direct. PCB thermal resistance refers to the transferring efficiency of heat between layers. The lower PCB thermal resistance, the sooner heat dissipation. Thermally conductive PCB can reduce hot spots, which promotes the benefits of stability, and the higher power density. Hence, during prototyping, PCB thermal resistance parameter is key element that customers pay highly attention to.

How to use a PCB thermal conductivity calculator when selecting thermal conductivity PCB material?

A PCB thermal conductivity calculator helps predict how heat flows through materials. Input thickness, copper area, material types and other parameters by engineers, then the tools will present the result. In this way, the mistakes will be reduced. However, it is common to know that customers don’t have time to do the double checking. By using calculators, Best Technology’s engineers help save time and reduce risk by providing guidance early.

Why is a thermally conductive gap filler important for high thermal conductivity PCB material?

Thermally conductive gap filler bridges air gaps between parts and board. Air will isolate the heat transferring. But gap filler is able to conduct heat efficiently. For high thermal conductivity PCB material, the gap filler keeps the surface contact smooth and efficient. Otherwise, even the copper or ceramic boards, the effect will be largely lessened. This is significant for power electronics and LEDs particularly.

What are the applications of thermally conductive PCB?

The applications include LED lighting, electrical automobile, 5G equipment, satellite modules and the industrial drives. In these applications, heat is the most terrible enemy of performance. Thermally conductive PCB manages heat in the circumstance that it does not increase large heat sinks. Since it reduces the weight, which is useful and essential to the aerospace and automobile. And customers hope to get prototypes quickly in general. Best Technology can meet this kind of demands via flexible prototyping service.

Where to get quick thermally conductive PCB from prototypes?

It is a bottleneck problem for finding a suitable supplier. Since various company has the issue of seriously delayed delivery time or the hopeless quality control. Best Technology provides a faster path. We promise the traceability via applying MES system. Besides, we offer a full quality guarantee. Our factory is fully compatible with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. Our company is to fully dedicate ourselves to do DFM analysis, review the thermal design problem during prototyping, so that customers get not only our rapid prototypes but also our professional and workable solutions. In this way, we can accelerate the market entry time and reduce the rework costs in the meanwhile.

Where to get quick thermally conductive PCB from prototypes?

In a nutshell, for the electronic products, heat dissipation is indispensable. Every process decides the final performance, from material selection to the prototype delivery. We know some customers often suffers the headaches for the overheating or long delivery time. Best Technology solves customers’ headaches through quick thermally conductive PCB prototyping, professional technical support, and strict quality management. For those seeking a trusted thermally conductive PCB partner, Best Technology is ready to help. A warm welcome to contact us via sales@bestpcbs.com for our highly professional supports.

What is PCB copper core? Copper metal core PCB
Monday, August 25th, 2025

PCB copper core stands out among other PCB types due to its high thermal and power capabilities. These boards are designed to operate in harsh environments, offering exceptional durability and reliability.

What is PCB copper core? Copper metal core PCB

Maybe you have these worries and concerns:

  • Can the copper thickness and thermal conductivity of copper core PCBs be precisely tailored to meet specific requirements?
  • How can I avoid delamination and oxidation of the copper core? How can I resolve issues if they arise?
  • Can I guarantee sample or batch delivery?
  • Are there any industry examples? Can I receive a 24-hour response to after-sales technical questions?

BEST Technology can solve your problem:

  • We support custom copper thicknesses from 0.5-10 ounces, and precisely match power requirements through zoned thermal design.
  • We utilize vacuum lamination and an anti-oxidation coating (such as OSP or immersion gold) to ensure interlayer bonding strength ≥1.8N/mm² and pass 1000 cycles of -40°C to 125°C temperature cycling testing without delamination. We offer free rework or replacement for delamination and oxidation issues within the warranty period, with a 48-hour response and solution.
  • Single- and double-sided boards: 24-48 hours, multi-layer boards: 3-5 days. Batch delivery: Regular orders: 7-10 days, expedited orders: within 3 days.
  • This material has been widely used in new energy vehicle BMS systems (10oz copper thickness), industrial inverters (8oz multilayer boards), and 5G base station power modules (6oz copper core). We provide 24-hour remote support to ensure rapid resolution of technical issues.

What is a copper core PCB?

Copper core PCB is a type of printed circuit board with a solid copper layer at its core. Unlike traditional PCBs, where copper is only part of the circuit paths, the core itself is copper. This provides superior thermal conductivity, allowing heat to be efficiently managed in high-power applications.

The copper core acts as a heat spreader. It moves heat away from sensitive components. This prevents overheating and maintains long-term performance. These boards are widely used in LED lighting, automotive electronics, industrial equipment, and power electronics.

Using a copper core also improves the mechanical stability of the board. Components remain securely in place even under heat stress. The copper’s high conductivity ensures that both electrical performance and heat dissipation are optimal.

Why Use a Copper Core PCB?

Modern electronics often produce significant heat, which can reduce efficiency and shorten the life of components. Copper core PCBs solve this problem efficiently.

Here’s why they are used:

  • High thermal conductivity: Copper efficiently transfers heat away from components, keeping devices cooler.
  • Durability: They withstand thermal cycling better than standard FR4 boards.
  • Compact design: Designers can place components closer together without worrying about overheating.
  • Energy efficiency: Reduced heat buildup enhances performance and reduces energy loss.

In short, using a copper core PCB increases reliability, extends device life, and supports high-power applications where traditional PCBs would fail.

How is a Copper Metal Core PCB Made?

The manufacturing of a copper metal core PCB differs from standard PCB production. It requires precision and advanced techniques.

What is PCB copper core? Copper metal core PCB

Step-by-step process:

  • Copper sheet selection: High-purity copper sheets are chosen for the core. Purity ensures consistent thermal conductivity.
  • Insulation layer application: An insulating dielectric layer is added to separate the copper core from the circuit traces.
  • Copper layering: Copper foil is laminated on both sides of the dielectric layer. This creates the circuit paths.
  • Etching: The unwanted copper is chemically removed to form the desired circuit design.
  • Surface finish: Methods like HASL, ENIG, or immersion silver are applied to protect the copper and improve solderability.
  • Testing and inspection: Each board is rigorously tested for electrical continuity, thermal performance, and mechanical stability.

This process ensures that copper core PCBs perform well under high thermal and electrical stress.

Do PCBs Have Copper?

Yes, copper is a standard material in all PCBs. It forms the conductive pathways that carry electricity. Standard FR4 PCBs use copper only in traces and pads.

Copper core PCBs are different. The copper is in the core, not just the circuit layers. This gives them superior heat conduction. Components stay cooler, even under heavy loads.

Copper’s excellent electrical and thermal conductivity ensures stable performance. Devices work reliably for years without overheating.

What Type of Copper is Used in PCB?

The type of copper affects both thermal and electrical performance. In copper core PCBs, BEST Technology typically use:

  • High-purity electrolytic copper: Provides consistent conductivity and low resistance.
  • Oxygen-free copper (OFC): Reduces oxidation and ensures long-term stability.
  • Rolled annealed copper: Offers flexibility and mechanical strength for assembly.
What is PCB copper core? Copper metal core PCB

Choosing the right copper type ensures high thermal conductivity, strong mechanical support, and stable electrical performance. This is especially important in LEDs, automotive electronics, and industrial equipment.

The Types of Copper-Based PCB

Copper-based PCBs can vary depending on the application. The main types include:

  • Single-layer copper core PCB: Features one conductive layer. Often used in simple LED modules or low-power devices.
  • Double-layer copper core PCB: Has copper on both sides. This design supports more complex routing while maintaining heat management.
  • Multilayer copper core PCB: Includes multiple circuit layers with a central copper core. Ideal for high-power, dense electronics.
  • Flexible copper core PCB: Thin copper sheets with flexible substrates allow heat dissipation and adaptable design.

Each type is tailored for specific needs. LEDs often use single or double-layer boards. Industrial and automotive applications prefer multilayer copper core PCBs.

Is Copper Core or Aluminum Core Better?

Both copper and aluminum core PCBs are designed to manage heat efficiently. However, copper offers several advantages.

Advantages of copper core:

  • Higher thermal conductivity.
  • Better electrical performance.
  • Greater long-term reliability.

Advantages of aluminum core:

  • Lower cost.
  • Lightweight construction.
  • Suitable for moderate heat applications.

While aluminum cores are cost-effective, copper core PCBs outperform them in thermal management, reliability, and longevity. This makes copper the preferred choice for high-power and high-reliability electronics.

Copper Core vs Aluminum Core – Thermal Conductivity

Thermal conductivity determines how efficiently a material transfers heat. This is critical in electronics design.

  • Copper core PCB: Typically 300–400 W/m·K.
  • Aluminum core PCB: Typically 1-30 W/m·K.
What is PCB copper core? Copper metal core PCB

Copper conducts heat several times faster than aluminum. This keeps components cooler and prevents hotspots. Electronics run efficiently and last longer when heat is managed properly.

Conclusion:

PCB copper core ensures excellent thermal conductivity. Components stay cool, even under high power or prolonged use. Copper core PCBs are durable, reliable, and suitable for compact designs. Compared to aluminum, they provide higher conductivity, better performance, and longer lifespan.

These boards are widely used in LED lighting, automotive electronics, industrial equipment, and power modules. Choosing a copper core PCB improves efficiency, safety, and product reliability.

For more information or inquiries, contact sales@bestpcbs.com

Reliable Quality BYD Automotive LED Aluminum Substrate
Friday, August 22nd, 2025

BYD automotive LED aluminum substrate is a specially designed metal-core printed circuit board used in automotive LED lighting, providing excellent heat dissipation, mechanical stability, and reliable electrical performance. In this blog, you will find some significant information about the definition, features, types, materials, functions, working principle, manufacturing process, main applications, and cases about BYD automotive LED aluminum substrate.

Have you ever complained about these headaches before?

  • Troublesome thermal dissipation problem?
  • Worrying about deficits of manufacturing and design?
  • Bothersome material and process problem?
  • Difficult reliability and lifespan problem?

Here are the efficient solutions Best Technology provides to solve the above issues for your reference.

  • Adjust heat dissipation design: Best Technology makes use of the high conductivity rate of the aluminum substrate and applies heat dissipation structure, such as heat sinks, to boost efficiency.
  • Employ strict manufacturing and quality control: We adopt cutting-edge manufacturing processes to ensure the stable performance of the products. Besides, we strictly control material selection and process parameters to ensure every PCB is fully compatible with the standards.
  • Enhance inspection and verification: We exploit innovative inspection equipment and methods to ensure the stable PCB performance.
  • Boost the customer support and cooperation: We present quick prototype design, small batch manufacturing, turnkey assembly, quick delivery and other services to meet customers’ requirements.

Best Technology has precious experience to provide sensible, tailored solutions of BYD automotive LED aluminum substrate. Our metal core PCBs and services include prototype to PCBA. If you need high quality and reliable aluminum LED board substrate, a warm welcome to contact us at sales@bestpcbs.com.

What is BYD Automotive LED Aluminum Substrate?

In short, it is a metal-based printed circuit board used in BYD vehicle lighting. It adopts an aluminum substrate to boost heat dissipation and mechanical strength. And the copper layer is isolated via the insulated layer, to ensure the LED current is well distributed. The structure supports high lumen density, meanwhile, keeps junction temperature low, ensuring the long-term stability of the brightness and colors.

In comparison with traditional FR4, the aluminum substrate conducts heat faster, which allows LEDs to be placed in high density for a compact space. Besides, the metal base improves rigidity and vibration tolerance. It adapts to the heat shock of the vehicle and the vibration of roads during driving.

What are the features of BYD Automotive LED Aluminum Substrate?

  • Excellent thermal dissipation: Low heat resistance keeps low LED junction temperature, stable lumen and color, and long lifespan.
  • Safe electricity: A highly insulated layer ensures electrical pressure loading capability, and the single-sided layouts meet the distance and the creepage requirements.
  • Mechanical strength: aluminum substrate features of warp resistance and shock resistance, which are beneficial for mounting of lenses and brackets.
  • Stable manufacturing: Clean copper layer, good solder paste, and finally, the low rework rate.
  • Cost efficiency: It reduces layers and processes for single-layer layouts, and the tools are simple; finally, the yield rate is high.

What are the Types of BYD Automotive LED Aluminum Substrate?

Here are the types of BYD automotive LED aluminum substrates.

  • Single-sided aluminum substrate: The most common choice for lamps and DRL strips.  
  • Boosted insulated IMS: The Insulated layer thickness or the breakdown pressure will be higher.
  • High-thermal IMS: Dielectric engineered for lower thermal resistance, which is good for compact spaces and high flux.
  • Hybrid boards: The LED area uses aluminum, and the control circuit area uses FR4.
  • Rigid-flex circuit boards: Adopt an aluminum substrate for segments, connected with Flex cables, suitable for bended lighting strips.

What materials are used in an LED single-sided aluminum substrate?

  • First, the aluminum base in 1.0–2.0 mm thickness with 5052 or 1060 grades is often used.
  • Second, the thermal conductivity insulated layer is 75–150µm.
  • Third, copper foil in 35–105 µm.
  • The solder paste protective layer and white surface coating will improve the optical gain.
  • Finally, it is worth mentioning that the surface treatments are OSP or ENIG.

It is helpful to note that it needs to consider the thermal conductivity, insulation, and cost when doing the material selection.

What are the functions of aluminum substrate backed single layers boards for the LED lighting industry?

The main functions include thermal dissipation, electrical conductivity, and the mechanical structure support (which includes lenses and the bracket).

  • Thermal dissipation: It is through the aluminum base and aluminum layer to realize fast thermal transmission.
  • Electricity conductivity: The copper foil circuit is used in current transmission.
  • Mechanical support: It provides a rigid structure to LED modules, lenses, and the heat sinks, particularly for automobile applications.

In an automobile, these functions take center stage. Single-layer boards are a practical foundation in applications.

How does an aluminum LED board substrate work in BYD automotive lighting?

It is important to understand the core mechanism that enhances thermal dissipation efficiency and operational stability.

First, there is the separated structure design, which is an aluminum core, an insulated layer, and a copper foil circuit layer.

  • Aluminum core, such as 6061 aluminum alloy, offers mechanical support, which high thermal conductivity is up to 200–235W/m·K. It is beneficial to conduct heat away where LED chips are generated.
  • Besides, it is through an insulation layer to ensure the electrical isolation, meanwhile to keep the heat conductivity, with a heat conductivity coefficient of 1–3W/m·K.
  • Finally, the copper foil circuit layer is through etching to form the circuit, which connects the LED chips and the drive circuit.

Optimizing the thermal dissipation route is essential.

  • Heat passes layer by layer: LED chips → insulation layer → aluminum substrate → heat sinks.
  • Compared to traditional FR4, heat resistance is reduced by over 50%.

Automobile-grade strengthened designs are also notable.

  • The structure resists corrosion in moisture and salt spray environments and withstands vibration, with the aluminum core providing a 1.0 mm rigid layer.

Finally, it is worthy to note of the integration benefits.

  • The single-layer deisgn simplifies the assembly, and reduce the material of the heat sinks and interface, reducing weight and costs.

This design helps to maintain the lifespan over 50,000 hours even if in high temperature, high moisture situations.

What is the manufacturing process of BYD Automotive LED Aluminum Substrate?

1.  Data review: It is significant to check the stackup and IPC standards.

2. Material prep: Aluminum base cutting and deburring. Copper-laminate and dielectric selection based on thermal and voltage targets.

3. The dry film explosion: Transferring copper circuit pattern.

4. Etching: Controlling the line width precision.

5. Drilling: Including mounting holes and optical alignment holes.

6. Surface treatment: OSP or ENIG.

7. Coating: Proceed Solder paste and white coating

8. V-cut/route: Panels prepared for smooth depaneling at the SMT line.

9. Reliability inspection: pressure resistance, heat shock, solderability, and the smooth level.

10. QA: Finalize the QA and packing

What are the main applications of aluminum LED board substrate in BYD LED lighting?

The core applications are as follows:

  • Headlamps and DRLs: High flux LED arrays with precise optics. It avoids the lumen depreciation since the high heat conductivity of the aluminum substrate conducts the LED chips’ heat quickly.
  • Fog lamps: Compact housings with strong heat paths. Good for wet and cold cycles.
  • Power and control modules: For example, the electrical adjust device or controlling device is for power transferring, such as a DC / AC inverter. Aluminum has a high current loading capability up to 4500V pressure resistance, and has low heat resistance, which largely improves the reliability.
  • The Taillights/Interior lighting: It meets the thinner and lighter-weight needs via the high density assembly of the SMT process.

It is important to note that the heat conductivity rate of the aluminum substrate boards is of over 6.7 times that of the FR4. Hence, it will be a good fit for high-power LED lighting.

Case about BYD Automotive LED Aluminum Substrate

Here is a condensed case from a recent platform lamp refresh for our customer.

We proposed a single-sided aluminum substrate with a high-thermal dielectric. A thin thermal pad bridged the back to the cast housing. Junction temperature dropped by 16–22 °C in the worst case.

It has the key wins that it has less heat at the LED. Cleaner color over life. Higher yield at SMT. And no tooling changes. That is one of the true solutions of a well-built aluminum LED board. Here are some of our parameters and corresponding PCB pictures for your reference.

  • Layer: 2 Layer (Single Sided Aluminum PCB)
  • Material: FR-4+AL  base pressed, 1.6 mm, 2 oz/2 oz, 100 μm insulated layer, 3 W/(m·K)
  • Solder Mask: White
  • Silk Screen: None
  • Surface Treatment: OSP (Organic Solderability Preservative)
  • Workmanship: FR-4+AL base pressed, CNC routing, aluminum back groove
  • Application: Automotive LED lighting, industrial control
Case about BYD Automotive LED Aluminum Substrate
Case about BYD Automotive LED Aluminum Substrate

Why choose Best Technology for aluminum substrate LED manufacturing?

 Best Technology focuses on the high quality aluminum substrate LED manufacturing and the assembly service to a highly competitive market.

  • Quick Quote: Our engineers reply the inquiry with 4 hours. We will confirm the stackup and process, and will give the rational solution with the specific quote.
  • Quick delivery time: We will evaluate the delivery time in advance and will update the manufacturing schedule. We promise 2 – 3 weeks delivery time no matter how complicated the boards are.
  • Optimized design: Our engineers will improve insulation, aluminum material, and the thermal dissipation design.
  • Comprehensive quality system: Our factory is full compatible with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. We will meet your requirements of automobile, medical, and aerospace grade requirement. You can enjoy our full technical support.

In conclusion, BYD automotive LED aluminum substrate features reliable heat dissipation and optical stability, which could meet the stable lighting and the lasting brightness requirement of BYD automobile. If you would like to find a reliable manufacturer to tackle the pain points of material procurement, engineering, lead time, or LED PCB performance, just feel free to get in touch with us at sales@bestpcbs.com, and we will ensure your project runs smoothly.

Aluminum PCB Etching, Aluminum Base PCB Manufacturer
Friday, August 22nd, 2025

What is aluminum PCB etching? Let’s explore its principle, application, etching process, technical parameter, common problems and solutions, differences between copper PCB etching.

Are you troubled with these problems?

  • Why does aluminum PCB etching yield stay stuck at 80%?
  • How to eliminate copper burrs after etching?
  • Is there a permanent fix for thin aluminum warping?

Best Technology can provide service and solution:

  • Molecular Reconstruction Etchant‌: 95%+ yield stability.
  • Micro-Etch + Polish Hybrid Process‌: Ra≤0.8μm surface finish.
  • Low-Temp Tension-Control Etching‌: <0.5% warpage in 0.2mm plates.

Welcome to contact us if you have any inquiry for aluminum PCB etching: sales@bestpcbs.com.

What is Aluminum PCB Etching?

Aluminum PCB etching is a manufacturing process that removes excess copper foil from aluminum based circuit boards using chemical solutions (e.g., acidic copper chloride), forming desired conductive traces while maintaining structural integrity. Unlike traditional FR4 etching, aluminum substrate etching requires strict control of temperature, pressure, and etch rate to minimize side erosion (≤15%) and ensure line width/space accuracy (≥0.2mm), especially for high-power applications like motor control boards.

What is Aluminum PCB Etching?

Principle of Aluminum PCB Etching

Chemical Dissolution Mechanism

  • Acidic copper chloride solution selectively attacks exposed copper foil (unmasked areas) while leaving patterned traces intact.
  • Aluminum substrate acts as a rigid base, requiring etchant compatibility to prevent substrate corrosion.

Parameter Precision Control

  • Temperature: Maintained at 50-60℃ (±2℃ tolerance) to balance reaction speed and side erosion.
  • Pressure: 1.5-2.5kg/cm² spray pressure ensures uniform solution contact without over-agitation.

Side Erosion Mitigation

  • Etchant flow direction and mask alignment minimize lateral copper dissolution (≤15% side etch rate).
  • Critical for 0.2mm+ trace/space accuracy in high-current designs (e.g., motor control PCBs).

Material-Specific Adaptation

  • Unlike FR4, aluminum substrates demand slower etch rates (3-5μm/min) to avoid thermal stress-induced warping.
  • Post-etch neutralization prevents aluminum-copper galvanic corrosion.

Quality Verification

  • Line width/space measured via optical microscopy (±0.02mm tolerance).
  • Cross-section analysis confirms trace profile integrity (90° sidewalls).

When to Use Aluminum PCB Etching?

  • High-Power Electronics: Motor controllers, inverters, power supplies (>50A current).
  • LED Lighting Systems: High-brightness LED modules, automotive headlights.
  • Automotive ECU/Powertrain: Engine control units, battery management systems.
  • RF & High-Frequency Applications: 5G base station amplifiers, RF power modules.
  • Industrial Control Equipment: PLC modules, servo drive systems.
When to Use Aluminum PCB Etching?

What is Process of Aluminum PCB Etching?

1. Surface Preparation

  • Clean aluminum substrate using alkaline solution to remove oil/oxides.
  • Apply micro-etching (e.g., sulfuric acid) to roughen surface for better photoresist adhesion.

2. Photoresist Coating

  • Dry-film or liquid photoresist applied via roller coating or spray.
  • Thickness controlled at 20-30μm to withstand etching without undercutting.

3. Exposure & Development

  • UV exposure through circuit pattern mask (e.g., 365nm wavelength).
  • Alkaline developer (e.g., 0.8-1.2% Na2CO3) dissolves unexposed photoresist, revealing copper areas to be etched.

4. Etching Stage

  • Acidic copper chloride (CuClâ‚‚ + HCl) solution sprayed at 50-60℃.
  • Parameters: 1.5-2.5kg/cm² pressure, 3-5μm/min etch rate.

5. Photoresist Stripping

  • Alkaline stripper (e.g., 3-5% NaOH) removes residual photoresist at 40-50℃.
  • Ultrasonic cleaning ensures no organic residues remain.

6. Post-Etch Processing

  • Acid neutralization (e.g., 5% Hâ‚‚SOâ‚„) to prevent aluminum-copper galvanic corrosion.
  • Dry baking (120-150℃) removes moisture and improves trace adhesion.

7. Quality Inspection

  • Optical microscopy checks line width/space (±0.02mm tolerance).
  • Cross-section analysis verifies 90° trace sidewalls and zero substrate undercut.
What is Process of Aluminum PCB Etching?

Aluminum PCB Etching Technical Parameter

Parameter CategorySpecification
Etching Rate1.2-1.8 μm/min (alkaline etching)
0.8-1.5 μm/min (acidic etching)
Temperature Control45±2°C (alkaline)
30±2°C (acidic)
Solution Concentration   NaOH: 15-25% (alkaline) CuSOâ‚„: 180-220 g/L (acidic)
Spray Pressure        1.5-2.5 bar (uniform distribution)
Conveyor Speed1.5-3.0 m/min (adjustable per thickness)
Copper Thickness Range0.5-3.0 oz (17-105 μm)
Line Width Tolerance±10% (design vs. actual)
Waste TreatmentNeutralization (pH 6-8)
Heavy metal precipitation (Cu <0.5 ppm post-treatment)
Safety RequirementsEmergency showers
Ventilation (≥12 ACH)PPE: Acid-resistant gloves/goggles

Common Problems & Solutions in Aluminum PCB Etching Processes

Excessive Side Etching (Jagged Edges/Impedance Instability)

Symptoms: Copper trace sidewalls show burrs, line width deviation >0.03mm.

Solutions:

  • Add 5-10% glycerol additive to enhance vertical dissolution.
  • Adjust spray pressure to 1.8-2.2kg/cm² (reduce turbulent flow impact)
  • Implement pulsating etching: 3-second spray / 0.5-second pause cycles.

Aluminum Surface Corrosion (White Spots/Pitting)

Symptoms: Aluminum substrate shows >0.1mm deep etch pits.

Solutions:

  • Maintain real-time pH control at 8.5±0.3
  • Use dual-layer liquid photoresist (5μm epoxy base layer)
  • Post-etching citric acid neutralization (3% concentration, 45s immersion)

Fine Line Breakage (<0.2mm Trace Fractures)

Symptoms: Micro-trace discontinuities in high-frequency circuits

Solutions:

  • Use 18μm ultra-low profile copper foil (RTF copper).
  • Optimize pre-bake: 110℃×30min stress relief.
  • Slow etching to 2μm/min precision control.

Uneven Etching (Copper Thickness Variation)

Symptoms: >10% copper thickness variation across panel

Solutions:

  • Install rotating rack (2-3rpm continuous rotation).
  • Optimize nozzle layout with honeycomb matrix (50mm spacing).
  • Real-time beta-ray thickness monitoring (3 points per panel).

Residual Copper Slag (Micro-Short Risks)

Symptoms: <50μm copper particles between traces

Solutions:

  • Add ultrasonic cleaning (40kHz, 60℃ deionized water).
  • High-pressure water jet rinse (8MPa, 45° angle).
  • Add 0.5g/L EDTA disodium salt chelating agent.
Common Problems & Solutions in Aluminum PCB Etching Processes

Differences between Aluminum PCB vs Copper PCB Etching

Comparison DimensionAluminum PCB EtchingCopper PCB Etching  
Material PropertiesGood thermal conductivity but soft; requires corrosion protection.Excellent conductivity/thermal performance; prone to oxidation.
Etchant CompositionAcidic mixed solution (prevents over-etching)Acidic copper chloride solution.
Temperature ControlLow temperature (50-60℃ to prevent deformation)Medium temperature (50-55℃ for uniformity)
Spray Pressure        Low pressure (1.5-2.5kg/cm² to reduce side etching)Medium pressure (2-3bar for coverage)
Side Etch ControlRequires additives + pulsating etchingAdjustable via process parameters
ApplicationsHigh-power/high-heat scenarios (LED, automotive electronics)Consumer electronics/communication devices

Why Choose Best Technology as Aluminum Base PCB Manufacturer?

Reasons why choose us as aluminum base PCB manufacturer:

  • 19 Years of Aluminum Substrate R&D Expertise: Specialized in high-power aluminum PCB development since 2006, with over 500 global client projects delivered across industrial lighting, automotive electronics, and communication equipment.
  • Dual-Certification Quality System: ISO 9001/IATF 16949 dual certification, compliant with medical (ISO 13485) and automotive standards. 100% AOI inspection ensures zero tolerance for solder bridges, misalignment, or copper residues.
  • Industry-Leading Etching Precision: Utilizes pulsating etching process (3-second spray / 0.5-second pause) with 5-10% glycerol additive, achieving ≤15% side etch rate and ±0.02mm line width accuracy, supporting 0.15mm ultra-fine circuit processing.
  • Thermal Management Innovation: Proprietary heat dissipation design reduces device operating temperature by 30%, paired with 3W/m·K high-thermal-conductivity aluminum substrates for stable performance in high-temperature environments.
  • 24-Hour Rapid Prototyping: Direct import of Altium/PADS design files, coupled with in-house etching lines, enables 24-hour prototype delivery and 48-hour shipment, accelerating time-to-market.
  • Free DFM Design Optimization: Engineering team pre-reviews thermal via layouts and trace spacing, proactively mitigating etching defects and reducing rework costs by over 40%, especially for complex multilayer designs.
  • Eco-Friendly & Cost-Effective Solutions: Lead-free etching processes and 25% recycled aluminum content meet RoHS/REACH standards while offering budget-friendly options for mass production, balancing performance and affordability.

Welcome to contact us if you have any inquiry for aluminum base PCB: sales@bestpcbs.com.

LED double-sided aluminum substrate, LED substrates
Friday, August 22nd, 2025

LED double-sided aluminum substrate is a high thermal conductivity circuit board with copper wiring on both sides of the aluminum substrate. LEDs are soldered on one side and drive or control circuits are carried on the other side. The aluminum core in the middle dissipates heat quickly, allowing high-power lamp beads to operate stably in a smaller space. It has been widely used in automotive headlights, street lights and high-density backlight modules.

LED double-sided aluminum substrate, LED substrates

Are you curious about Best Technology’s LED double-sided aluminum substrate?

  • Will double-sided wiring lead to short circuits or signal distortion due to inaccurate interconnections?
  • Is heat dissipation balanced on both sides, preventing localized overheating that could affect the life of the lamp?
  • Will the copper foil easily peel off after repeated soldering?
  • Does the cost of double-sided processing justify the performance improvement?

Best Technology’s LED double-sided aluminum substrate can answer these questions.

  • Using high-precision drilling and alignment processes, interconnect holes are precisely positioned, providing reliable insulation and preventing short circuits or signal issues.
  • The double-sided aluminum base design, with its symmetrical heat dissipation path, ensures even heat conduction, reduces localized overheating, and extends the life of the lamp.
  • The copper foil and aluminum base are tightly bonded through a high-temperature pressing process, resistant to soldering heat shock and maintaining stable adhesion after repeated soldering.
  • The double-sided design increases circuit density and heat dissipation efficiency. Process costs are optimized through large-scale production, and the performance improvements far outweigh the cost increases.

What is double sided aluminum PCB?

Double-sided aluminum PCB is a printed circuit board with aluminum as its base material, featuring copper layers on both sides. It includes an insulating dielectric layer between the copper and aluminum base. This design enables routing on both sides, unlike single-sided boards that only allow traces on one side.

Because aluminum offers excellent heat dissipation, these boards are widely used in high-power LED lighting. They prevent overheating, which can damage LEDs or reduce their lifespan.

With two conductive layers, double-sided boards also allow more complex circuits, making them ideal for advanced LED assemblies.

Types of double-sided aluminum PCB

Double-sided aluminum PCBs come in different forms, depending on application needs. The most common types include:

  • Standard Double-Sided Aluminum PCB: These have two copper layers and a dielectric layer between the aluminum base. They are simple yet effective for medium-power applications.
  • Hybrid Double-Sided PCB: This type of substrate combines the benefits of two different materials, such as aluminum and ceramic, to provide improved thermal conductivity and electrical performance.
  • Flexible Double-Sided PCB: This type of substrate is made of a flexible material and has a layer of aluminum on both sides. It is commonly used in applications where flexibility is required, such as in wearable electronics.
  • High-frequency double-sided aluminum PCB: This type of substrate is designed for high-frequency applications and has a low dielectric constant, which helps to reduce signal loss.

Each type serves a specific purpose. Choosing the right one depends on thermal requirements, circuit complexity, and mechanical needs.

How does a double-sided aluminum PCB differ from a single-sided one?

Single-sided aluminum PCB has one copper layer for circuit routing, limiting its complexity. A double-sided board, on the other hand, has two copper layers, allowing for denser component placement and more advanced designs.

Another major difference is thermal management. Both provide excellent heat dissipation thanks to the aluminum base, but double-sided boards handle higher power loads better. This is crucial for high-brightness LED systems where heat can build up quickly.

LED double-sided aluminum substrate, LED substrates

Lastly, cost and assembly differ. Double-sided boards may cost slightly more.

What materials are used in LED double-sided aluminum substrates?

LED double-sided aluminum substrate typically consists of:

  • Aluminum Base Layer: Provides structural strength and excellent thermal conductivity.
  • Dielectric Layer: Acts as an insulator between the aluminum base and copper layer while offering high thermal performance.
  • Copper Foil: Present on both sides for circuit routing. Thickness varies depending on current requirements.
  • Solder Mask: Protects the copper from oxidation and prevents short circuits.
  • Silkscreen Layer: Used for labeling components and guiding assembly.

Some boards may also include surface finishes like ENIG (Electroless Nickel Immersion Gold) for better solderability and corrosion resistance.

What are the advantages of using double-sided LED substrates over FR4?

Compared to FR4 boards, double-sided aluminum substrates have multiple advantages:

  • Superior Heat Dissipation: Aluminum conducts heat away from LEDs quickly, reducing thermal stress.
  • Enhanced Durability: Aluminum-based boards are more resistant to mechanical stress than FR4.
  • Better Power Handling: Perfect for high-power LED applications where FR4 cannot manage heat efficiently.
  • Longer LED Lifespan: Lower operating temperatures mean LEDs last longer, reducing replacement costs.
  • Compact Design: Double-sided routing allows smaller, more efficient layouts.

While FR4 is common in electronics, it cannot match aluminum substrates for thermal and structural performance in LED systems.

What thickness options are available for double-sided LED aluminum boards?

Thickness plays a vital role in thermal performance and strength. Typical options include:

  • Aluminum Base Thickness: 1.0 mm, 1.2 mm, 1.5 mm, and 2.0 mm.
  • Copper Thickness: Usually 1 oz (35 μm), 2 oz (70 μm), or even higher for high-current applications.
  • Dielectric Layer: Often between 75 μm and 150 μm, depending on thermal needs.
LED double-sided aluminum substrate, LED substrates

Choosing the right thickness ensures proper heat dissipation without adding unnecessary weight.

Where is the double-sided aluminum substrate used?

Double-sided aluminum substrates are versatile. Common applications include:

  • LED Lighting Systems: Indoor, outdoor, and industrial lighting where thermal management is critical.
  • Automotive Lighting: Headlights, tail lamps, and dashboard lighting.
  • Consumer Electronics: Devices that require compact yet heat-resistant boards.
  • Medical Devices: Surgical lights and diagnostic equipment that must stay cool for safety.
  • Power Electronics: High-power converters and power supplies where heat is a major concern.

The ability to handle high power and maintain stability under heat makes these substrates essential for advanced applications.

How is a double-sided aluminum PCB manufactured?

The manufacturing process involves several precise steps:

  • Aluminum Base Preparation: The base is cleaned and treated to improve adhesion.
  • Dielectric Layer Application: A thermally conductive but electrically insulating layer is added.
  • Copper Foil Lamination: Copper is laminated on both sides under heat and pressure.
  • Circuit Patterning: Copper layers are etched to create circuit paths.
  • Drilling and Plating: Holes are drilled and plated to connect layers.
  • Surface Finish: ENIG, HASL, or other finishes are applied for better solderability.
  • Solder Mask and Silkscreen: Applied for protection and labeling.
  • Testing: Each board undergoes electrical and thermal testing to ensure quality.

Precision is key to achieving tight tolerances and long-lasting performance.

What are the applications of double-sided aluminum PCB?

These boards power a wide range of industries:

  • LED Lighting: Streetlights, floodlights, and smart lighting solutions.
  • Displays and Signage: High-brightness displays that run for long hours.
  • Telecommunication Equipment: Devices where heat control is essential for reliability.
  • Aerospace and Defense: Applications requiring extreme durability and stability.
  • Renewable Energy: Solar inverters and power control systems that demand high thermal performance.
LED double-sided aluminum substrate, LED substrates

Wherever heat and reliability matter, double-sided aluminum PCBs are the go-to solution.

Conclusion:

Double-sided aluminum substrates for LEDs are able to handle high power, dissipate heat efficiently, and support compact designs without compromising performance. Their advantages over FR4 make them the best choice for demanding applications.

If you need custom LED aluminum substrates for your projects, Best Technology is here to help. We provide premium-quality aluminum PCBs, strict quality control, and fast delivery. Contact us today at sales@bestpcbs.com

6oz Aluminum PCB for Electronic Control Board
Friday, August 22nd, 2025

Why choose 6oz aluminum PCB for electronic control board? Let’s explore benefits, applications, technical spec, thermal management, production processes for 6oz aluminum PCB.

Are you troubled with these problems?

  • Overheating causing frequent failures and high repair costs?
  • Poor PCB thermal performance limiting product upgrades?
  • Small-batch orders struggling with slow delivery and inventory risks?

Best Technology can provide services and solutions:

  • High-Efficiency Thermal Management: Significantly extending device lifespan.
  • Rapid Prototyping: 48 hours rapid prototyping and flexible support for small-batch orders.
  • Cost Optimization: Integrated thermal design reduces overall system costs by 25%.

Welcome to contact us if you have any inquiry for aluminum PCB: sales@bestpcbs.com.

Why Choose 6oz Aluminum PCB for Electronic Control Board?

Reasons why choose 6oz aluminum PCB for electronic control board:

  • Heat Dissipation Powerhouse: Thermal conductivity >2.0W/m·K. Reduces component temperatures by 40% vs. FR4.
  • High Current Performance: 6oz copper (0.17mm) handles high power loads. Minimizes voltage drop in motor drives/power modules.
  • Lightweight & Durable: Aluminum alloy (6063/5052) balances strength and weight. Withstands vibration/industrial environments.
  • EMI Shielding: Reduces high-frequency noise in RF/5G circuits. Improves signal integrity with grounding design.
  • Cost-Efficient Design: Eliminates heatsinks/fans. Enables compact layouts for space-constrained boards.
  • Rugged Reliability: Passes extreme thermal cycling (-40°C~125°C). Surface finishes (ENIG) resist corrosion.
  • Scalable Production: Consistent copper thickness for high yields. Customizable layers for diverse control board needs.
Why Choose 6oz Aluminum PCB for Electronic Control Board?

Applications of 6oz Aluminum PCB for EV Electronic Control Board

  • Motor Controller (MCU) Power Module‌
  • On-Board Charger (OBC) DC-DC Conversion Circuit‌
  • Battery Management System (BMS) Main Board‌
  • Inverter Power Unit‌
  • PDU (Power Distribution Unit) Busbar‌
  • VCU (Vehicle Control Unit) Power Module‌
  • Thermal-Sensitive Sensor Interface Board‌
  • Fast Charger Power Module‌

6oz Aluminum PCB for Electronic Control Board Design Specification

Parameter CategorySpecifications/Details
Substrate Material6063/5052 Aluminum Alloy (High Thermal Conductivity, Corrosion-Resistant)
Copper Thickness6oz (≈0.17mm, ±10% Tolerance)
Thermal Conductivity≥2.0W/m·K (Aluminum Substrate Layer)
Thermal ResistanceSoldering Temperature: 260°C/10s No Delamination; Thermal Cycling: 3 Cycles (-40°C~125°C) No Cracks
Mechanical PropertiesTensile Strength ≥200MPa; Bend Radius ≥1.5×Board Thickness (Non-Plated Side)
Surface FinishENIG (Au Thickness 0.05~0.1μm), OSP (Antioxidant)
Insulation LayerEpoxy/Polyimide (Thickness 50~150μm, Dielectric Strength ≥500V)
Min Trace Width/Space0.15mm/0.15mm (Requires Electroplating Process)

6oz Aluminum PCB for Electronic Control Board Thermal Management

1. Material Selection Criteria

  • Base Material: 6oz (170μm) copper-clad aluminum PCB with thermal conductivity ≥3W/m·K.
  • Dielectric Layer: Thermal resistance ≤1.2°C·cm²/W, withstand voltage ≥500V.
  • Surface Treatment: Anodized finish ≥5μm, surface roughness Ra0.8-1.6μm.

2. Thermal Source Layout

  • Maintain ≥30% copper coverage in high-power zones.
  • Keep ≥5mm spacing between MOSFET/IGBT components.
  • Position temperature-sensitive parts (capacitors) ≥10mm from heat sources.

3. Thermal Path Design

  • Thermal via arrays under critical components (0.5mm diameter, 1mm pitch).
  • Via filling with thermal conductive paste (≥5W/m·K).
  • Direct contact pressure ≥20N/cm² between PCB and housing.

4. Cooling System Configuration

Passive Cooling:

  • Fin thickness ≥1.5mm, height ≥20mm.
  • Thermal grease thickness 0.1-0.3mm at interface.

Active Cooling:

  • Add axial fan when power density >5W/cm²
  • Airflow ≥3CFM/W, noise <35dB(A)

5. Process Control

  • Soldering: Peak temperature 245±5°C, reflow time ≤90s.
  • Assembly: M3 stainless screws (1.2-1.5N·m torque), spring washers ≥0.8mm.

6. Performance Verification

  • Thermal resistance (junction-to-ambient) ≤5°C/W.
  • Temperature rise ≤45°C under full load.
  • Pass 1000 hours 85°C/85% RH aging test.

7. Achieved Results

  • 40%+ improvement in heat dissipation efficiency.
  • 25-35°C reduction in component operating temperatures.
  • System MTBF ≥50,000 hours.
  • Compliance with IEC 60068-2-78 damp heat standard.
  • 30%+ space reduction compared to traditional designs.
6oz Aluminum PCB for Electronic Control Board Thermal Management

6oz Electronic Control Aluminum PCB Manufacturing Processes

1. Raw Material Preparation

  • Procure high-purity electrolytic copper foil (6oz, 210μm thickness).
  • Select 5052 or 6061 series aluminum alloy substrate.
  • Prepare high-thermal-conductivity insulating dielectric layer (≥8W/mK).

2. Aluminum Substrate Pretreatment

  • Mechanically polish substrate surface to surface roughness Ra ≤ 0.2μm.
  • Chemically clean to remove surface oxide layers and oil contamination.
  • Anodize to enhance surface insulation properties.

3. Insulating Layer Coating

  • Apply thermal conductive adhesive uniformly using high-precision coating equipment.
  • Curing conditions: 150 ±5℃ for 30 minutes.
  • Thickness tolerance controlled within ±10μm.

4. Copper Foil Lamination

  • Hot-press composite 6oz copper foil with insulating layer.
  • Process parameters: pressure 15–20kg/cm², temperature 180–200℃.
  • Ensure no bubbles or delamination defects.

5. Pattern Transfer

  • Use LDI (Laser Direct Imaging) technology.
  • Special etching compensation design required for 6oz thick copper.
  • Minimum line width/spacing: 0.2mm/0.2mm.

6. Etching Process

  • Adopt acidic copper chloride etching solution.
  • Strictly control side etching rate ≤15%.
  • Post-etching copper thickness deviation within ±10%.

7. Drilling

  • Use tungsten carbide drills or laser drilling.
  • Hole diameter tolerance ±0.05mm.
  • Hole wall roughness ≤25μm.

8. Surface Finish

  • Optional processes: immersion gold/OSP/HASL.
  • Immersion gold thickness: 0.05–0.1μm.
  • Nickel layer thickness: 3–5μm.

9. Solder Mask Printing

  • Apply high-thermal-conductivity solder mask ink.
  • Thickness: 20–30μm.
  • Post-curing temperature resistance up to 150℃.

10. Contour Machining

  • CNC milling with contour tolerance ±0.1mm.
  • V-cut depth controlled at 1/3 of board thickness.
  • Chamfering to eliminate burrs.

11. Electrical Testing

  • 100% flying probe testing.
  • Insulation resistance ≥1000MΩ.
  • Withstand voltage test ≥3kV/60s.

12. Final Inspection

  • Visual inspection under 10x magnification.
  • Full dimensional inspection via CMM.
  • Thermal resistance test ≤0.5℃/W.

13. Packaging & Shipping

  • Vacuum moisture-proof packaging.
  • Anti-scratch spacing between each piece.
  • Storage conditions: temperature 15–30℃, humidity ≤60%.

How to Balance Cost and Quality of Electronic Control Aluminum PCB?

1. Material Tiering Optimization

  • Critical Zones: Use 6oz copper foil + 6061 aluminum alloy (thermal conductivity ≥200W/m·K) for high-heat components (e.g., IGBTs).
  • Non-Critical Zones: Deploy 4oz copper foil + 5052 aluminum alloy, reducing material costs by 15-20% while validating thermal distribution via simulation.

2. Design Standardization & Modularization

  • Build a library of universal circuit modules (e.g., power conversion units), cutting custom design time by 30%.
  • Use DFM system to auto-check thermal expansion coefficient matching, reducing rework by 67%.

3. Smart Manufacturing Upgrades

  • Deploy AI-powered visual inspection to monitor etching uniformity, boosting 6oz thick-copper board yield from 85% to 96%.
  • Adopt diamond-coated milling cutters for edge processing, reducing burr rate by 90% and improving soldering reliability.

4. Supply Chain Vertical Integration

  • Sign long-term agreements with raw material suppliers to lock copper foil prices; use JIT warehousing to cut inventory costs by 10-15%.
  • Prioritize domestic high-thermal-conductivity insulation (e.g., ceramic-filled epoxy), shortening lead times to ≤7 days.

5. Differentiated Surface Finishing

  • Apply low-cost OSP (Organic Solderability Preservative) for non-soldering areas and ENIG for critical pads, reducing surface treatment costs by 40% while passing 500hrs 85℃/85%RH tests.

6. Life Cycle Cost Accounting

  • Optimize for high-thermal-conductivity insulation (≥8W/m·K): Though 20% more expensive upfront, it reduces cooling components, cutting total life cycle costs by 8-12%.

7. Green Manufacturing & Recycling

  • Establish scrap recycling system (70% recycled aluminum utilization), meeting EU 2025 e-waste recycling targets (≥65%).
  • Replace traditional stamping with laser cutting, reducing waste rate from 22% to 8% while improving accuracy to ±0.05mm.
How to Balance Cost and Quality of Electronic Control Aluminum PCB?

Our Electronic Control Aluminum PCB Case Studies

At Best Technology, we specialize in electronic control aluminum PCB manufacturing for 19 years, providing a full service from design consultation to mass production. Our professional design team can customize designs based on your power device layout and heat dissipation requirements, ensuring your products meet stringent electrical performance and mechanical stability requirements. Here is a photo of electronic control board aluminum PCB we made before:

Our Electronic Control Aluminum PCB Case Studies

Why Choose Best Technology as Aluminum PCB Manufacturer?

Dual-Certification Quality Assurance

  • ISO 9001 (general quality) & IATF 16949 (automotive-grade) certified
  • Optional medical-grade ISO 13485 compliance

Thermal Management Gradient

  • Economy: 3W/m·K aluminum PCB for low-power devices (e.g., security sensors)
  • Premium: 8W/m·K aluminum nitride substrate for high-power applications (e.g., 5G base stations)

Supply Chain Efficiency

  • Direct sourcing reduces bulk procurement costs by 15%-20%
  • Flexible production scale from 50-unit prototypes to 10,000-unit mass production

24-Hour Rapid Prototyping

  • Aluminum substrate samples delivered within 24 hours
  • Free DFM (Design for Manufacturability) optimization to mitigate thermal via placement risks

Integrated One-Stop Service

  • PCB design, thermal simulation, and SMT assembly under one roof
  • Engineering support for thermal resistance calculation and temperature rise modeling

Eco-Friendly Manufacturing

  • RoHS/REACH compliance with 95% recycled aluminum content
  • Lead-free process reduces carbon emissions by 25%

High-Reliability Material System

  • Dielectric layer: ≥500V withstand voltage, ≤1.2°C·cm²/W thermal resistance
  • Anodized surface (5-8μm thickness), passes 1,000hrs 85℃/85%RH aging test

Precision Fabrication Capability

  • Minimum trace width/spacing: 0.1mm
  • Laser drilling accuracy: ±0.05mm
  • Layer alignment precision: ≤0.03mm

    Welcome to contact us if you have any request for aluminum PCB: sales@bestpcbs.com.

    LED Wall Washer​ Aluminum PCB Manufacturer
    Thursday, August 21st, 2025

    Why choose LED wall washer aluminum PCB? Let’s explore its benefits, technical parameter, thermal solution, design guide, selection guide through this blog.

    Are you troubled with these problems?

    • Poor heat dissipation leads to rapid light decay and short product lifespan?‌
    • Outdoor environments cause PCB corrosion and oxidation?‌
    • Heavy wall washer fixtures warp during installation?‌

    Best Technology can provide services and solutions:

    • Custom Thermal Design‌ – Optimize aluminum PCB thickness and copper layer layout for precise temperature control.
    • Environmental Testing‌ – Provide third-party certification for waterproofing, shock resistance, and outdoor durability.
    • Fast Prototyping‌ – 24-hour turnaround for aluminum PCB samples, accelerating R&D cycles.

    Welcome to contact us if you have any inquiry for LED wall washer aluminum PCB: sales@bestpcbs.com.

    Why Choose LED Wall Washer Aluminum PCB?

    Reasons why choose LED wall washer aluminum PCB:

    • Efficient heat dissipation and stable operation: The aluminum base plate quickly dissipates heat, preventing LED damage from high temperatures, ensuring long-term stable operation at high power levels and significantly delaying lumen degradation.
    • Lower cost and high cost-effectiveness: Aluminum’s low cost and inherent heat dissipation eliminate the need for external heat sinks, significantly reducing material and assembly costs.
    • Lightweight and compact, saving space: High heat dissipation efficiency allows for a thinner and lighter luminaire, eliminating the need for additional heat sink components and enabling flexible installation in confined locations.
    • Increased lifespan and reduced maintenance: Temperature control extends LED lifespan to over 30,000 hours, reducing maintenance requirements for outdoor applications at high altitudes.
    • Weather-resistant and resistant to harsh environments: The aluminum base plate is impact- and vibration-resistant, and the die-cast housing achieves IP67 waterproofing, making it suitable for outdoor use in the sun and rain.
    • Environmentally friendly and recyclable, in line with current trends: Aluminum is non-toxic and 100% recyclable, with low energy consumption in production, meeting green manufacturing requirements.
    • Supporting high power density: Carrying high current density, it drives densely packed, high-brightness LEDs for uniform, powerful wall-washing lighting.
    Why Choose LED Wall Washer Aluminum PCB?

    LED Wall Washer Aluminum PCB Technical Parameter

    Parameter Category‌‌Technical SpecificationsDescription‌
    Base Material‌Aluminum alloy (5052/6061)Thickness: 1.0-3.2mm, with anodized surface treatment  
    Thermal ConductivityConductivity: 1.0-8.0 W/(m·K)Standard type (1.0-2.0) for medium-low power, high-conductivity (3.0-8.0) for high-power applications
    Insulation Layer‌Thickness: 50-200μmEpoxy resin with ceramic filler, slightly higher loss than FR-4
    Dielectric Constant: 4.5-5.0 (1GHz)
    Dielectric Strength: ≥3 kV/mm
    ‌Thermal ResistanceTotal thermal resistance: 0.8-3.0°C/WDepends on copper foil area and insulation layer thickness
    Interface resistance: <0.5K/W (eutectic soldering)
    ‌Electrical ParametersOperating voltage: AC220V/DC24VSuitable for outdoor environments
    IP65 protection Operating temp: -40°C to +60°C
    ‌Mechanical PropertiesDimensional tolerance: ±0.1mm (custom modules)Minimal impact from anodizing
    Surface roughness: Ra 0.2-0.8μm
    ‌Process StandardsCopper foil thickness: 35-70μm  Compatible with SMT and reflow soldering
    Peel strength: 1.0-1.5 kgf/cm UL94 V0 flame retardancy

    How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

    1. Superior Thermal Management for Optimal LED Operation

    • Heat Dissipation Efficiency: Aluminum PCBs (thermal conductivity 1-10 W/m·K) outperform FR4 (0.3 W/m·K) by 10x+, rapidly conducting 70% of LED-generated heat away from chips.
    • Temperature Control: Low thermal resistance (0.05–0.2 K/W) enables safe operation at >10W/chip, reducing junction temperature by 10–15°C and minimizing light decay.

    2. Electrical Performance Optimization

    • Conductivity Advantage: Aluminum’s low impedance cuts power loss, improving system efficiency.
    • Light Output Boost: White-coated PCBs enhance reflection efficiency by 30%+, indirectly reducing energy consumption per lumen.

    3. High-Density Design Support

    • Compact Integration: Aluminum substrates allow higher LED density (e.g., 500+ LEDs/m²) with uniform light distribution, ideal for large-scale illumination.
    • Mechanical Reliability: High bending strength prevents solder joint failures under vibration or thermal stress.

    4. Cost & Lifespan Benefits

    • Extended Lifetime: Thermal efficiency extends LED lifespan to 50,000+ hours (2–3x longer than standard solutions).
    • Simplified Design: Eliminates 40% of external heat sinks, reducing material costs and assembly complexity. Aluminum recycling aligns with sustainability goals.

    5. Real-World Application Advantages

    • High-Power Models: 48W wall washers leverage aluminum PCBs for compact IP66-rated designs, avoiding thermal failure.
    • Optical Optimization: Multi-layer structures (LED → phosphor → resin → reflective layer) maximize light extraction while efficiently managing internal heat.
    How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

    Wall Wash Light Aluminum PCB Thermal Solution

    Copper Layer Thermal Design Optimization

    • Prioritize solid plane copper layers for maximum thermal conductivity (highest cost).
    • For cost-sensitive designs, grid patterns offer 80-90% thermal efficiency with ~10% cost reduction.
    • Avoid star/custom patterns unless required for EMC compliance (70-80% efficiency, unstable cost-benefit).

    Thermal Via Design Refinement

    • Thermal vias are critical for heat transfer from component pads to aluminum substrate. Optimize parameters (diameter, pitch, copper thickness) to minimize thermal resistance.
    • Parallel thermal resistance network modeling simplifies design and improves efficiency by 20-30%. Reducing via pitch and increasing quantity is effective but requires cost-balance with drilling.

    System Thermal Resistance Reduction

    • High-thermal-conductivity substrates: Use aluminum oxide (Alâ‚‚O₃) substrates (22-24 W/mK), outperforming FR-4/ceramic alternatives.
    • Thin dielectric layers: Minimize thickness while meeting electrical insulation requirements (key to low thermal resistance).
    • Reduce non-thermal vias: Excessive standard vias increase thermal path length and resistance.

    Component Layout & Routing Strategies

    • Placement: Avoid hotspots by dispersing high-power components (LEDs, drivers). Position major heat sources near substrate edges or directly over thermal vias. Aim for uniform distribution.
    • Routing: Minimize long/thin copper traces to reduce resistive heating. Widen copper traces or increase thermal via contact area in critical paths (15-20% local thermal improvement).

    Integrated Thermal Enhancement Measures

    • Heat sinks: Most common passive solution, handling ~70% of total heat load. Cost-effective and easy to integrate into housing.
    • Forced air cooling: Adds ~85% efficiency in enclosed/high-power units but increases cost, noise, and complexity.
    • Thermal interface materials (TIMs): Thermal grease/pads fill micro-gaps, improving interfacial conductivity by ~30% at low cost.
    • Liquid cooling: ~95% efficiency but highly complex and costly. Reserved for extreme power densities or specialized applications.

    Convection Optimization

    • Component orientation: Align temperature-sensitive/heat-generating components with their long axis perpendicular to airflow in natural/forced convection.
    • Expose aluminum substrate: Directly expose large PCB aluminum areas to airflow where structurally feasible.
    • Airflow management: Arrange tall components parallel to airflow to reduce turbulence and avoid downstream thermal dead zones.

    Substrate Material Selection

    • Aluminum-based PCBs (MCPCBs): Preferred for wall washers due to excellent thermal performance, mechanical robustness, CTE matching (reduces solder joint fatigue), and recyclability. Thickness range: 0.4-6.0mm.
    • Alumina ceramic substrates: Suitable for high-temperature/high-reliability applications (350-1500°C resistance) with good thermal conductivity.

    Thermal Simulation Utilization

    • Use finite element analysis (FEA) in design phase to predict temperature distribution and identify hotspots.
    • Simulation-driven optimization reduces post-development thermal issues by 20-30%, lowering risk and cost, especially for mass production.

    LED Wall Washer Aluminum PCB Color Consistency Design Guide

    1. LED Selection & Color Parameters

    • Color Tolerance (SDCM): Use SDCM ≤5 LEDs to ensure batch consistency.
    • Color Rendering Index (CRI): Prioritize Ra ≥80 LEDs (e.g., Lumileds LUXEON) for accurate color reproduction.
    • Dimmable Options: Support 1900K-5700K CCT ranges with SDCM ≤5 across all settings.

    2. Aluminum PCB & Thermal Design

    • Material: High-thermal-conductivity 6063 aluminum (≥200W/m·K) with anodized coating.
    • Layout: LED spacing ≥20mm (adjust per power) to prevent localized overheating.
    • Wiring: 45° traces (width ≥0.5mm, spacing ≥0.3mm) to minimize current interference.

    3. Optical System Optimization

    • Mixing Distance: Short-distance lenses (≤15mm) for RGBWY uniform blending.
    • Lens: Optical-grade PC/PMMA (transmittance ≥92%) with recessed design (depth ≥5mm).

    4. Environmental Adaptability

    • Protection: IP65/IP66 with silicone sealing (e.g., Dow Corning 7091).
    • Temperature: Operate from -20°C to +60°C without deformation.

    5. Production & Quality Control

    • Supplier Collaboration: Verify PCB color process (UV-resistant ink, reflection ≥85%).
    • Inspection: Tighten tolerances (PCB size ±0.1mm, pad alignment ±0.05mm).
    • Soldering: Through-hole preferred; SMT requires epoxy reinforcement.

    6. Control System Compatibility

    • Dimming: DMX512 0-100% smooth control with Δu’v’ ≤0.005.
    • Driver: PF >0.9, ripple ≤5% (e.g., PFC circuit design).

    7. Long-Term Reliability

    • Testing: 50,000-hour LM-80 validation, Δu’v’ ≤0.003 post-aging.
    • Coating: Acrylic varnish (50-80μm) for UV/chemical resistance.
    LED Wall Washer Aluminum PCB Color Consistency Design Guide

    LED Wall Washer Aluminum PCB Selection Guide

    1. Thermal Performance Priority

    • Thermal Conductivity: 1.0-2.0 W/(m·K) for low-power (<50W) ≥3.0 W/(m·K) for high-power (>50W).
    • Substrate Thickness: 1.0mm (lightweight) or 2.0-3.0mm (heavy-duty cooling).
    • Construction: 6061 aluminum base + ceramic-filled insulation for low thermal resistance.

    2. Electrical Safety Standards

    • Protection: IP65 dust/water resistance mandatory for outdoors.
    • Insulation: Dielectric strength ≥3 kV/mm, copper foil adhesion ≥1.0 kgf/cm.
    • Voltage: Match input (AC220V/DC24V) with driver compatibility.

    3. Optical Compatibility

    • Beam Angle: 120° standard lens requires PCB layout alignment.
    • Color Quality: High CRI (Ra>90) needs low-decay LEDs.
    • Efficacy: ≥10 lm/W for white light; RGB requires independent control zones.

    4. Mechanical & Environmental Durability

    • Coating: Anodized + conformal coating (humidity/mold resistance ≤Class 1).
    • Impact Resistance: Die-cast aluminum housing (IK10 certified).
    • Temperature Range: -40°C to +60°C operational certification.

    5. Cost & Supply Chain

    • Material Efficiency: Smart panel layout reduces waste by 23%.
    • Packaging: SMT-compatible reel packaging recommended.
    • Certifications: UL94 V0 flammability rating + RoHS compliance.
    LED Wall Washer Aluminum PCB Selection Guide

    Why Choose Best Technology as Aluminum PCB Manufacturer?

    Reasons why choose us as LED wall washer aluminum PCB manufacturer:

    1. Premium Quality Assurance

    • Material Selection: Use 6063/6061 aluminum with thermal conductivity ≥150W/m·K (3x higher than industry average).
    • Certifications: UL, RoHS, and IP65 compliance guaranteed for harsh outdoor environments.

    2. 19 Years of Industry Expertise

      • Specialized Experience: Dedicated focus on LED lighting PCBs since 2005, with 500+ wall washer projects completed.

      3. Cost-Effective Solutions

      • Price Advantage: 15-20% lower than competitors via optimized production lines and bulk material procurement.
      • Design Optimization: Free DFM reduces material waste by up to 25% without compromising performance.

      4. Fast Delivery

      • Lead Time: 24 hour rapid prototyping, 5-7 days for mass production (50% faster than industry standard).

      5. Free DFM Support

      • Pre-Production Analysis: Identify thermal bottlenecks, electrical risks, and assembly issues pre-manufacturing.
      • Design Adjustments: Optimize LED layouts for 30% higher lumen density while maintaining thermal safety.

      6. Stringent Quality Control

      • Thermal cycling (-40°C~+125°C, 1000 cycles).
      • 48-hour burn-in test for all batches.
      • AOI/X-ray inspection for solder joint integrity.

      7. Customization Capability

      • Flexible Design: Support ultra-thin (0.8mm) to heavy-duty (3.2mm) substrates.
      • Special Coatings: White solder mask for 95% reflectivity, anti-sulfur treatment for coastal areas.

        Welcome to contact us if you have any request for LED wall washer aluminum PCB: sales@bestpcbs.com.

        COB immersion gold aluminum substrate, Gold immersion plating
        Thursday, August 21st, 2025

        COB immersion gold aluminum substrate is a high-power packaging solution that directly bonds the LED chip (Chip On Board) to an aluminum substrate treated with immersion gold.

        The aluminum substrate quickly dissipates heat, while the immersion gold layer ensures long-term oxidation resistance of the chip pads, ensuring reliable soldering. This eliminates the need for brackets and reflow soldering, resulting in higher luminous efficacy and longer lifespan. It has become a core substrate for high-power LED modules.

        COB immersion gold aluminum substrate, Gold immersion plating

        Do you have any questions about COB aluminum PCBs?

        • Does the immersion gold coating and thermal conductivity meet COB heat dissipation requirements?
        • Do the dimensions and specifications match COB packaging and lighting fixture installation?
        • Can the immersion gold process and materials withstand long-term high-temperature use?
        • Do the performance and cost meet expected price/performance ratios?

        BEST Technology’s COB aluminum substrates can answer your questions.

        • The immersion gold layer reduces contact thermal resistance, while the aluminum base and highly thermally conductive insulation layer quickly dissipate concentrated heat from the COB, ensuring efficient heat dissipation.
        • The COB package area size and overall shape can be customized to accommodate different power COBs and lamp mounting structures.
        • The immersion gold layer offers strong oxidation resistance, and the substrate has undergone high-temperature cycling testing without delamination, ensuring it can withstand the long-term high-temperature operating environment of the COB.
        • High heat dissipation ensures COB lifespan, while customized processing optimizes costs, resulting in a reasonable balance of performance and price.

        What is COB aluminum substrate?

        COB aluminum substrate is a type of PCB that directly mounts LED chips on an aluminum base. Unlike traditional PCBs that use fiberglass, aluminum substrates use metal for better heat dissipation. This structure ensures LEDs operate efficiently and last longer.

        The core of a COB aluminum substrate consists of three layers:

        • A copper circuit layer for electrical connections.
        • A dielectric layer for insulation and heat transfer.
        • An aluminum base layer for mechanical support and thermal conduction.

        This design keeps LEDs cool and improves performance. It’s the reason COB substrates are widely used in LED lighting, automotive lights, and high-power applications.

        Is immersion gold the same as ENIG?

        Yes and no. Immersion gold is a key step in the ENIG (Electroless Nickel Immersion Gold) process. ENIG has two layers: a nickel layer and a thin gold layer. Nickel acts as a barrier to protect the copper, and gold prevents oxidation and ensures good solderability.

        COB immersion gold aluminum substrate, Gold immersion plating

        Therefore, immersion gold usually refers to the gold layer applied in the ENIG process. This finish is popular because it provides excellent corrosion resistance and long shelf life.

        Can you plate aluminum substrate with gold?

        Yes, you can. In fact, plating aluminum substrates with gold is common in high-end electronic applications. However, the process is not as simple as plating copper. Aluminum forms an oxide layer quickly, which must be removed before plating.

        To apply immersion gold on an aluminum substrate, BEST Technology first coat the aluminum with a conductive layer, usually copper. Then, they apply the ENIG finish on top. This method ensures strong adhesion and reliable performance.

        What are the benefits of immersion gold on aluminum substrates?

        The benefits are impressive. Here are the main reasons why immersion gold is chosen for COB aluminum substrates:

        • Superior Corrosion Resistance: Gold does not tarnish or oxidize, so it protects the surface even in harsh environments.
        • Excellent Solderability: The gold layer makes soldering easier and more reliable, especially for fine-pitch components.
        • Improved Electrical Performance: Gold has low contact resistance, which enhances signal integrity.
        • Long Shelf Life: Boards with immersion gold can be stored longer without losing quality.
        • High Reliability for LED Applications: COB LEDs generate heat, and gold plating helps maintain stable performance under thermal stress.
        COB immersion gold aluminum substrate, Gold immersion plating

        These benefits make immersion gold plating a preferred choice for high-end LED lighting, automotive electronics, and industrial controls.

        How thick is gold in ENIG finish?

        The gold layer in an ENIG finish is very thin, but it’s enough to provide excellent protection. Typically, the thickness ranges from 0.05 to 0.1 microns. This thin layer ensures good solderability without adding significant cost.

        The nickel layer beneath the gold is thicker, usually around 3 to 6 microns. Together, these layers create a strong barrier that protects the copper from oxidation and maintains good electrical conductivity.

        Is ENIG better than HASL?

        For high-end applications like COB aluminum substrates, ENIG is better than HASL (Hot Air Solder Leveling). Here’s why:

        • Flat Surface: ENIG provides a smooth, flat surface, which is essential for small components and fine-pitch designs.
        • Better Corrosion Protection: Gold offers superior resistance to oxidation compared to HASL.
        • Higher Reliability: ENIG is more stable for thermal cycling and high-power devices.

        HASL is cheaper and works well for simple boards, but for COB LEDs, ENIG is the clear winner.

        What are the problems with ENIG solderability?

        ENIG is reliable, but there are some challenges:

        • Black Pad Issue: If the plating process is not controlled, it can lead to corrosion of the nickel layer, causing poor solder joints.
        • Higher Cost: ENIG is more expensive than HASL or OSP finishes.

        However, these issues rarely occur when working with BEST Technology, a trusted PCB manufacturer that follows strict quality controls.

        What are the uses of COB aluminum substrate?

        COB aluminum substrates are used in a wide range of applications:

        • LED Lighting: High-brightness LEDs for residential, commercial, and industrial lighting.
        • Automotive Lights: Headlights, tail lights, and daytime running lights.
        • Display Backlighting: LCD and signage displays that need uniform light.
        • Medical Equipment: Devices that require precise lighting and heat management.
        • Industrial Control Systems: Where stable performance and long life are critical.
        COB immersion gold aluminum substrate, Gold immersion plating

        These uses show how important COB immersion gold aluminum substrates are in modern technology.

        Conclusion:

        COB aluminum substrates provide excellent heat dissipation and mechanical strength for LED applications. When paired with immersion gold plating, they offer even greater reliability, corrosion resistance, and solderability. ENIG is better than HASL for high-end boards, and the gold layer, though thin, ensures long-lasting performance.

        If you need high-quality COB immersion gold aluminum substrates, contact us today at sales@bestpcbs.com