Archive for the ‘Metal Core PCB’ Category

Reliable Quality BYD Automotive LED Aluminum Substrate

Friday, August 22nd, 2025

BYD automotive LED aluminum substrate is a specially designed metal-core printed circuit board used in automotive LED lighting, providing excellent heat dissipation, mechanical stability, and reliable electrical performance. In this blog, you will find some significant information about the definition, features, types, materials, functions, working principle, manufacturing process, main applications, and cases about BYD automotive LED aluminum substrate.

Have you ever complained about these headaches before?

Troublesome thermal dissipation problem?
Worrying about deficits of manufacturing and design?
Bothersome material and process problem?
Difficult reliability and lifespan problem?

Here are the efficient solutions Best Technology provides to solve the above issues for your reference.

Adjust heat dissipation design: Best Technology makes use of the high conductivity rate of the aluminum substrate and applies heat dissipation structure, such as heat sinks, to boost efficiency.

Employ strict manufacturing and quality control: We adopt cutting-edge manufacturing processes to ensure the stable performance of the products. Besides, we strictly control material selection and process parameters to ensure every PCB is fully compatible with the standards.

Enhance inspection and verification: We exploit innovative inspection equipment and methods to ensure the stable PCB performance.

Boost the customer support and cooperation: We present quick prototype design, small batch manufacturing, turnkey assembly, quick delivery and other services to meet customers’ requirements.

Best Technology has precious experience to provide sensible, tailored solutions of BYD automotive LED aluminum substrate. Our metal core PCBs and services include prototype to PCBA. If you need high quality and reliable aluminum LED board substrate, a warm welcome to contact us at sales@bestpcbs.com.

What is BYD Automotive LED Aluminum Substrate?

In short, it is a metal-based printed circuit board used in BYD vehicle lighting. It adopts an aluminum substrate to boost heat dissipation and mechanical strength. And the copper layer is isolated via the insulated layer, to ensure the LED current is well distributed. The structure supports high lumen density, meanwhile, keeps junction temperature low, ensuring the long-term stability of the brightness and colors.

In comparison with traditional FR4, the aluminum substrate conducts heat faster, which allows LEDs to be placed in high density for a compact space. Besides, the metal base improves rigidity and vibration tolerance. It adapts to the heat shock of the vehicle and the vibration of roads during driving.

What are the features of BYD Automotive LED Aluminum Substrate?

Excellent thermal dissipation: Low heat resistance keeps low LED junction temperature, stable lumen and color, and long lifespan.

Safe electricity: A highly insulated layer ensures electrical pressure loading capability, and the single-sided layouts meet the distance and the creepage requirements.

Mechanical strength: aluminum substrate features of warp resistance and shock resistance, which are beneficial for mounting of lenses and brackets.

Stable manufacturing: Clean copper layer, good solder paste, and finally, the low rework rate.

Cost efficiency: It reduces layers and processes for single-layer layouts, and the tools are simple; finally, the yield rate is high.

What are the Types of BYD Automotive LED Aluminum Substrate?

Here are the types of BYD automotive LED aluminum substrates.

Single-sided aluminum substrate: The most common choice for lamps and DRL strips.
Boosted insulated IMS: The Insulated layer thickness or the breakdown pressure will be higher.
High-thermal IMS: Dielectric engineered for lower thermal resistance, which is good for compact spaces and high flux.
Hybrid boards: The LED area uses aluminum, and the control circuit area uses FR4.
Rigid-flex circuit boards: Adopt an aluminum substrate for segments, connected with Flex cables, suitable for bended lighting strips.

What materials are used in an LED single-sided aluminum substrate?

First, the aluminum base in 1.0–2.0 mm thickness with 5052 or 1060 grades is often used.

Second, the thermal conductivity insulated layer is 75–150µm.

Third, copper foil in 35–105 µm.

The solder paste protective layer and white surface coating will improve the optical gain.

Finally, it is worth mentioning that the surface treatments are OSP or ENIG.

It is helpful to note that it needs to consider the thermal conductivity, insulation, and cost when doing the material selection.

What are the functions of aluminum substrate backed single layers boards for the LED lighting industry?

The main functions include thermal dissipation, electrical conductivity, and the mechanical structure support (which includes lenses and the bracket).

Thermal dissipation: It is through the aluminum base and aluminum layer to realize fast thermal transmission.

Electricity conductivity: The copper foil circuit is used in current transmission.

Mechanical support: It provides a rigid structure to LED modules, lenses, and the heat sinks, particularly for automobile applications.

In an automobile, these functions take center stage. Single-layer boards are a practical foundation in applications.

How does an aluminum LED board substrate work in BYD automotive lighting?

It is important to understand the core mechanism that enhances thermal dissipation efficiency and operational stability.

First, there is the separated structure design, which is an aluminum core, an insulated layer, and a copper foil circuit layer.

Aluminum core, such as 6061 aluminum alloy, offers mechanical support, which high thermal conductivity is up to 200–235W/m·K. It is beneficial to conduct heat away where LED chips are generated.
Besides, it is through an insulation layer to ensure the electrical isolation, meanwhile to keep the heat conductivity, with a heat conductivity coefficient of 1–3W/m·K.
Finally, the copper foil circuit layer is through etching to form the circuit, which connects the LED chips and the drive circuit.

Optimizing the thermal dissipation route is essential.

Heat passes layer by layer: LED chips → insulation layer → aluminum substrate → heat sinks.

Compared to traditional FR4, heat resistance is reduced by over 50%.

Automobile-grade strengthened designs are also notable.

The structure resists corrosion in moisture and salt spray environments and withstands vibration, with the aluminum core providing a 1.0 mm rigid layer.

Finally, it is worthy to note of the integration benefits.

The single-layer deisgn simplifies the assembly, and reduce the material of the heat sinks and interface, reducing weight and costs.

This design helps to maintain the lifespan over 50,000 hours even if in high temperature, high moisture situations.

What is the manufacturing process of BYD Automotive LED Aluminum Substrate?

1. Data review: It is significant to check the stackup and IPC standards.

2. Material prep: Aluminum base cutting and deburring. Copper-laminate and dielectric selection based on thermal and voltage targets.

3. The dry film explosion: Transferring copper circuit pattern.

4. Etching: Controlling the line width precision.

5. Drilling: Including mounting holes and optical alignment holes.

6. Surface treatment: OSP or ENIG.

7. Coating: Proceed Solder paste and white coating

8. V-cut/route: Panels prepared for smooth depaneling at the SMT line.

9. Reliability inspection: pressure resistance, heat shock, solderability, and the smooth level.

10. QA: Finalize the QA and packing

What are the main applications of aluminum LED board substrate in BYD LED lighting?

The core applications are as follows:

Headlamps and DRLs: High flux LED arrays with precise optics. It avoids the lumen depreciation since the high heat conductivity of the aluminum substrate conducts the LED chips’ heat quickly.

Fog lamps: Compact housings with strong heat paths. Good for wet and cold cycles.

Power and control modules: For example, the electrical adjust device or controlling device is for power transferring, such as a DC / AC inverter. Aluminum has a high current loading capability up to 4500V pressure resistance, and has low heat resistance, which largely improves the reliability.

The Taillights/Interior lighting: It meets the thinner and lighter-weight needs via the high density assembly of the SMT process.

It is important to note that the heat conductivity rate of the aluminum substrate boards is of over 6.7 times that of the FR4. Hence, it will be a good fit for high-power LED lighting.

Case about BYD Automotive LED Aluminum Substrate

Here is a condensed case from a recent platform lamp refresh for our customer.

We proposed a single-sided aluminum substrate with a high-thermal dielectric. A thin thermal pad bridged the back to the cast housing. Junction temperature dropped by 16–22 °C in the worst case.

It has the key wins that it has less heat at the LED. Cleaner color over life. Higher yield at SMT. And no tooling changes. That is one of the true solutions of a well-built aluminum LED board. Here are some of our parameters and corresponding PCB pictures for your reference.

Layer: 2 Layer (Single Sided Aluminum PCB)
Material: FR-4+AL base pressed, 1.6 mm, 2 oz/2 oz, 100 μm insulated layer, 3 W/(m·K)
Solder Mask: White
Silk Screen: None
Surface Treatment: OSP (Organic Solderability Preservative)
Workmanship: FR-4+AL base pressed, CNC routing, aluminum back groove
Application: Automotive LED lighting, industrial control

Case about BYD Automotive LED Aluminum Substrate

Why choose Best Technology for aluminum substrate LED manufacturing?

Best Technology focuses on the high quality aluminum substrate LED manufacturing and the assembly service to a highly competitive market.

Quick Quote: Our engineers reply the inquiry with 4 hours. We will confirm the stackup and process, and will give the rational solution with the specific quote.

Quick delivery time: We will evaluate the delivery time in advance and will update the manufacturing schedule. We promise 2 – 3 weeks delivery time no matter how complicated the boards are.

Optimized design: Our engineers will improve insulation, aluminum material, and the thermal dissipation design.

Comprehensive quality system: Our factory is full compatible with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. We will meet your requirements of automobile, medical, and aerospace grade requirement. You can enjoy our full technical support.

In conclusion, BYD automotive LED aluminum substrate features reliable heat dissipation and optical stability, which could meet the stable lighting and the lasting brightness requirement of BYD automobile. If you would like to find a reliable manufacturer to tackle the pain points of material procurement, engineering, lead time, or LED PCB performance, just feel free to get in touch with us at sales@bestpcbs.com, and we will ensure your project runs smoothly.

Tags:BYD Automotive LED Aluminum Substrate
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Aluminum PCB Etching, Aluminum Base PCB Manufacturer

Friday, August 22nd, 2025

What is aluminum PCB etching? Let’s explore its principle, application, etching process, technical parameter, common problems and solutions, differences between copper PCB etching.

Are you troubled with these problems?

Why does aluminum PCB etching yield stay stuck at 80%?
How to eliminate copper burrs after etching?
Is there a permanent fix for thin aluminum warping?

Best Technology can provide service and solution:

Molecular Reconstruction Etchant‌: 95%+ yield stability.
Micro-Etch + Polish Hybrid Process‌: Ra≤0.8μm surface finish.
Low-Temp Tension-Control Etching‌: <0.5% warpage in 0.2mm plates.

Welcome to contact us if you have any inquiry for aluminum PCB etching: sales@bestpcbs.com.

What is Aluminum PCB Etching?

Aluminum PCB etching is a manufacturing process that removes excess copper foil from aluminum based circuit boards using chemical solutions (e.g., acidic copper chloride), forming desired conductive traces while maintaining structural integrity. Unlike traditional FR4 etching, aluminum substrate etching requires strict control of temperature, pressure, and etch rate to minimize side erosion (≤15%) and ensure line width/space accuracy (≥0.2mm), especially for high-power applications like motor control boards.

Principle of Aluminum PCB Etching

Chemical Dissolution Mechanism

Acidic copper chloride solution selectively attacks exposed copper foil (unmasked areas) while leaving patterned traces intact.
Aluminum substrate acts as a rigid base, requiring etchant compatibility to prevent substrate corrosion.

Parameter Precision Control

Temperature: Maintained at 50-60℃ (±2℃ tolerance) to balance reaction speed and side erosion.
Pressure: 1.5-2.5kg/cm² spray pressure ensures uniform solution contact without over-agitation.

Side Erosion Mitigation

Etchant flow direction and mask alignment minimize lateral copper dissolution (≤15% side etch rate).
Critical for 0.2mm+ trace/space accuracy in high-current designs (e.g., motor control PCBs).

Material-Specific Adaptation

Unlike FR4, aluminum substrates demand slower etch rates (3-5μm/min) to avoid thermal stress-induced warping.
Post-etch neutralization prevents aluminum-copper galvanic corrosion.

Quality Verification

Line width/space measured via optical microscopy (±0.02mm tolerance).
Cross-section analysis confirms trace profile integrity (90° sidewalls).

When to Use Aluminum PCB Etching?

High-Power Electronics: Motor controllers, inverters, power supplies (>50A current).
LED Lighting Systems: High-brightness LED modules, automotive headlights.
Automotive ECU/Powertrain: Engine control units, battery management systems.
RF & High-Frequency Applications: 5G base station amplifiers, RF power modules.
Industrial Control Equipment: PLC modules, servo drive systems.

What is Process of Aluminum PCB Etching?

1. Surface Preparation

Clean aluminum substrate using alkaline solution to remove oil/oxides.
Apply micro-etching (e.g., sulfuric acid) to roughen surface for better photoresist adhesion.

2. Photoresist Coating

Dry-film or liquid photoresist applied via roller coating or spray.
Thickness controlled at 20-30μm to withstand etching without undercutting.

3. Exposure & Development

UV exposure through circuit pattern mask (e.g., 365nm wavelength).
Alkaline developer (e.g., 0.8-1.2% Na2CO3) dissolves unexposed photoresist, revealing copper areas to be etched.

4. Etching Stage

Acidic copper chloride (CuCl₂ + HCl) solution sprayed at 50-60℃.
Parameters: 1.5-2.5kg/cm² pressure, 3-5μm/min etch rate.

5. Photoresist Stripping

Alkaline stripper (e.g., 3-5% NaOH) removes residual photoresist at 40-50℃.
Ultrasonic cleaning ensures no organic residues remain.

6. Post-Etch Processing

Acid neutralization (e.g., 5% H₂SO₄) to prevent aluminum-copper galvanic corrosion.
Dry baking (120-150℃) removes moisture and improves trace adhesion.

7. Quality Inspection

Optical microscopy checks line width/space (±0.02mm tolerance).
Cross-section analysis verifies 90° trace sidewalls and zero substrate undercut.

What is Process of Aluminum PCB Etching?

Aluminum PCB Etching Technical Parameter

Parameter Category	Specification
Etching Rate	1.2-1.8 μm/min (alkaline etching)
Etching Rate	0.8-1.5 μm/min (acidic etching)
Temperature Control	45±2°C (alkaline)
Temperature Control	30±2°C (acidic)
Solution Concentration	NaOH: 15-25% (alkaline) CuSO₄: 180-220 g/L (acidic)
Spray Pressure	1.5-2.5 bar (uniform distribution)
Conveyor Speed	1.5-3.0 m/min (adjustable per thickness)
Copper Thickness Range	0.5-3.0 oz (17-105 μm)
Line Width Tolerance	±10% (design vs. actual)
Waste Treatment	Neutralization (pH 6-8)
Waste Treatment	Heavy metal precipitation (Cu <0.5 ppm post-treatment)
Safety Requirements	Emergency showers
Ventilation (≥12 ACH)	PPE: Acid-resistant gloves/goggles

Common Problems & Solutions in Aluminum PCB Etching Processes

Excessive Side Etching (Jagged Edges/Impedance Instability)

Symptoms: Copper trace sidewalls show burrs, line width deviation >0.03mm.

Solutions:

Add 5-10% glycerol additive to enhance vertical dissolution.
Adjust spray pressure to 1.8-2.2kg/cm² (reduce turbulent flow impact)
Implement pulsating etching: 3-second spray / 0.5-second pause cycles.

Aluminum Surface Corrosion (White Spots/Pitting)

Symptoms: Aluminum substrate shows >0.1mm deep etch pits.

Solutions:

Maintain real-time pH control at 8.5±0.3
Use dual-layer liquid photoresist (5μm epoxy base layer)
Post-etching citric acid neutralization (3% concentration, 45s immersion)

Fine Line Breakage (＜0.2mm Trace Fractures)

Symptoms: Micro-trace discontinuities in high-frequency circuits

Solutions:

Use 18μm ultra-low profile copper foil (RTF copper).
Optimize pre-bake: 110℃×30min stress relief.
Slow etching to 2μm/min precision control.

Uneven Etching (Copper Thickness Variation)

Symptoms: >10% copper thickness variation across panel

Solutions:

Install rotating rack (2-3rpm continuous rotation).
Optimize nozzle layout with honeycomb matrix (50mm spacing).
Real-time beta-ray thickness monitoring (3 points per panel).

Residual Copper Slag (Micro-Short Risks)

Symptoms: <50μm copper particles between traces

Solutions:

Add ultrasonic cleaning (40kHz, 60℃ deionized water).
High-pressure water jet rinse (8MPa, 45° angle).
Add 0.5g/L EDTA disodium salt chelating agent.

Differences between Aluminum PCB vs Copper PCB Etching

Comparison Dimension	Aluminum PCB Etching	Copper PCB Etching
Material Properties	Good thermal conductivity but soft; requires corrosion protection.	Excellent conductivity/thermal performance; prone to oxidation.
Etchant Composition	Acidic mixed solution (prevents over-etching)	Acidic copper chloride solution.
Temperature Control	Low temperature (50-60℃ to prevent deformation)	Medium temperature (50-55℃ for uniformity)
Spray Pressure	Low pressure (1.5-2.5kg/cm² to reduce side etching)	Medium pressure (2-3bar for coverage)
Side Etch Control	Requires additives + pulsating etching	Adjustable via process parameters
Applications	High-power/high-heat scenarios (LED, automotive electronics)	Consumer electronics/communication devices

Why Choose Best Technology as Aluminum Base PCB Manufacturer?

Reasons why choose us as aluminum base PCB manufacturer:

19 Years of Aluminum Substrate R&D Expertise: Specialized in high-power aluminum PCB development since 2006, with over 500 global client projects delivered across industrial lighting, automotive electronics, and communication equipment.

Dual-Certification Quality System: ISO 9001/IATF 16949 dual certification, compliant with medical (ISO 13485) and automotive standards. 100% AOI inspection ensures zero tolerance for solder bridges, misalignment, or copper residues.

Industry-Leading Etching Precision: Utilizes pulsating etching process (3-second spray / 0.5-second pause) with 5-10% glycerol additive, achieving ≤15% side etch rate and ±0.02mm line width accuracy, supporting 0.15mm ultra-fine circuit processing.

Thermal Management Innovation: Proprietary heat dissipation design reduces device operating temperature by 30%, paired with 3W/m·K high-thermal-conductivity aluminum substrates for stable performance in high-temperature environments.

24-Hour Rapid Prototyping: Direct import of Altium/PADS design files, coupled with in-house etching lines, enables 24-hour prototype delivery and 48-hour shipment, accelerating time-to-market.

Free DFM Design Optimization: Engineering team pre-reviews thermal via layouts and trace spacing, proactively mitigating etching defects and reducing rework costs by over 40%, especially for complex multilayer designs.

Eco-Friendly & Cost-Effective Solutions: Lead-free etching processes and 25% recycled aluminum content meet RoHS/REACH standards while offering budget-friendly options for mass production, balancing performance and affordability.

Welcome to contact us if you have any inquiry for aluminum base PCB: sales@bestpcbs.com.

Tags:Aluminum Base PCB, aluminum PCB etching
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LED double-sided aluminum substrate, LED substrates

Friday, August 22nd, 2025

LED double-sided aluminum substrate is a high thermal conductivity circuit board with copper wiring on both sides of the aluminum substrate. LEDs are soldered on one side and drive or control circuits are carried on the other side. The aluminum core in the middle dissipates heat quickly, allowing high-power lamp beads to operate stably in a smaller space. It has been widely used in automotive headlights, street lights and high-density backlight modules.

LED double-sided aluminum substrate, LED substrates

Are you curious about Best Technology’s LED double-sided aluminum substrate?

Will double-sided wiring lead to short circuits or signal distortion due to inaccurate interconnections?

Is heat dissipation balanced on both sides, preventing localized overheating that could affect the life of the lamp?

Will the copper foil easily peel off after repeated soldering?

Does the cost of double-sided processing justify the performance improvement?

Best Technology’s LED double-sided aluminum substrate can answer these questions.

Using high-precision drilling and alignment processes, interconnect holes are precisely positioned, providing reliable insulation and preventing short circuits or signal issues.

The double-sided aluminum base design, with its symmetrical heat dissipation path, ensures even heat conduction, reduces localized overheating, and extends the life of the lamp.

The copper foil and aluminum base are tightly bonded through a high-temperature pressing process, resistant to soldering heat shock and maintaining stable adhesion after repeated soldering.

The double-sided design increases circuit density and heat dissipation efficiency. Process costs are optimized through large-scale production, and the performance improvements far outweigh the cost increases.

What is double sided aluminum PCB?

Double-sided aluminum PCB is a printed circuit board with aluminum as its base material, featuring copper layers on both sides. It includes an insulating dielectric layer between the copper and aluminum base. This design enables routing on both sides, unlike single-sided boards that only allow traces on one side.

Because aluminum offers excellent heat dissipation, these boards are widely used in high-power LED lighting. They prevent overheating, which can damage LEDs or reduce their lifespan.

With two conductive layers, double-sided boards also allow more complex circuits, making them ideal for advanced LED assemblies.

Types of double-sided aluminum PCB

Double-sided aluminum PCBs come in different forms, depending on application needs. The most common types include:

Standard Double-Sided Aluminum PCB: These have two copper layers and a dielectric layer between the aluminum base. They are simple yet effective for medium-power applications.

Hybrid Double-Sided PCB: This type of substrate combines the benefits of two different materials, such as aluminum and ceramic, to provide improved thermal conductivity and electrical performance.

Flexible Double-Sided PCB: This type of substrate is made of a flexible material and has a layer of aluminum on both sides. It is commonly used in applications where flexibility is required, such as in wearable electronics.

High-frequency double-sided aluminum PCB: This type of substrate is designed for high-frequency applications and has a low dielectric constant, which helps to reduce signal loss.

Each type serves a specific purpose. Choosing the right one depends on thermal requirements, circuit complexity, and mechanical needs.

How does a double-sided aluminum PCB differ from a single-sided one?

Single-sided aluminum PCB has one copper layer for circuit routing, limiting its complexity. A double-sided board, on the other hand, has two copper layers, allowing for denser component placement and more advanced designs.

Another major difference is thermal management. Both provide excellent heat dissipation thanks to the aluminum base, but double-sided boards handle higher power loads better. This is crucial for high-brightness LED systems where heat can build up quickly.

Lastly, cost and assembly differ. Double-sided boards may cost slightly more.

What materials are used in LED double-sided aluminum substrates?

LED double-sided aluminum substrate typically consists of:

Aluminum Base Layer: Provides structural strength and excellent thermal conductivity.

Dielectric Layer: Acts as an insulator between the aluminum base and copper layer while offering high thermal performance.

Copper Foil: Present on both sides for circuit routing. Thickness varies depending on current requirements.

Solder Mask: Protects the copper from oxidation and prevents short circuits.

Silkscreen Layer: Used for labeling components and guiding assembly.

Some boards may also include surface finishes like ENIG (Electroless Nickel Immersion Gold) for better solderability and corrosion resistance.

What are the advantages of using double-sided LED substrates over FR4?

Compared to FR4 boards, double-sided aluminum substrates have multiple advantages:

Superior Heat Dissipation: Aluminum conducts heat away from LEDs quickly, reducing thermal stress.

Enhanced Durability: Aluminum-based boards are more resistant to mechanical stress than FR4.

Better Power Handling: Perfect for high-power LED applications where FR4 cannot manage heat efficiently.

Longer LED Lifespan: Lower operating temperatures mean LEDs last longer, reducing replacement costs.

Compact Design: Double-sided routing allows smaller, more efficient layouts.

While FR4 is common in electronics, it cannot match aluminum substrates for thermal and structural performance in LED systems.

What thickness options are available for double-sided LED aluminum boards?

Thickness plays a vital role in thermal performance and strength. Typical options include:

Aluminum Base Thickness: 1.0 mm, 1.2 mm, 1.5 mm, and 2.0 mm.

Copper Thickness: Usually 1 oz (35 μm), 2 oz (70 μm), or even higher for high-current applications.

Dielectric Layer: Often between 75 μm and 150 μm, depending on thermal needs.

Choosing the right thickness ensures proper heat dissipation without adding unnecessary weight.

Where is the double-sided aluminum substrate used?

Double-sided aluminum substrates are versatile. Common applications include:

LED Lighting Systems: Indoor, outdoor, and industrial lighting where thermal management is critical.

Automotive Lighting: Headlights, tail lamps, and dashboard lighting.

Consumer Electronics: Devices that require compact yet heat-resistant boards.

Medical Devices: Surgical lights and diagnostic equipment that must stay cool for safety.

Power Electronics: High-power converters and power supplies where heat is a major concern.

The ability to handle high power and maintain stability under heat makes these substrates essential for advanced applications.

How is a double-sided aluminum PCB manufactured?

The manufacturing process involves several precise steps:

Aluminum Base Preparation: The base is cleaned and treated to improve adhesion.

Dielectric Layer Application: A thermally conductive but electrically insulating layer is added.

Copper Foil Lamination: Copper is laminated on both sides under heat and pressure.

Circuit Patterning: Copper layers are etched to create circuit paths.

Drilling and Plating: Holes are drilled and plated to connect layers.

Surface Finish: ENIG, HASL, or other finishes are applied for better solderability.

Solder Mask and Silkscreen: Applied for protection and labeling.

Testing: Each board undergoes electrical and thermal testing to ensure quality.

Precision is key to achieving tight tolerances and long-lasting performance.

What are the applications of double-sided aluminum PCB?

These boards power a wide range of industries:

LED Lighting: Streetlights, floodlights, and smart lighting solutions.

Displays and Signage: High-brightness displays that run for long hours.

Telecommunication Equipment: Devices where heat control is essential for reliability.

Aerospace and Defense: Applications requiring extreme durability and stability.

Renewable Energy: Solar inverters and power control systems that demand high thermal performance.

Wherever heat and reliability matter, double-sided aluminum PCBs are the go-to solution.

Conclusion:

Double-sided aluminum substrates for LEDs are able to handle high power, dissipate heat efficiently, and support compact designs without compromising performance. Their advantages over FR4 make them the best choice for demanding applications.

If you need custom LED aluminum substrates for your projects, Best Technology is here to help. We provide premium-quality aluminum PCBs, strict quality control, and fast delivery. Contact us today at sales@bestpcbs.com

Tags:double sided led strip, LED double-sided aluminum PCB, led substrates
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6oz Aluminum PCB for Electronic Control Board

Friday, August 22nd, 2025

Why choose 6oz aluminum PCB for electronic control board? Let’s explore benefits, applications, technical spec, thermal management, production processes for 6oz aluminum PCB.

Are you troubled with these problems?

Overheating causing frequent failures and high repair costs?
Poor PCB thermal performance limiting product upgrades?
Small-batch orders struggling with slow delivery and inventory risks?

Best Technology can provide services and solutions:

High-Efficiency Thermal Management: Significantly extending device lifespan.
Rapid Prototyping: 48 hours rapid prototyping and flexible support for small-batch orders.
Cost Optimization: Integrated thermal design reduces overall system costs by 25%.

Welcome to contact us if you have any inquiry for aluminum PCB: sales@bestpcbs.com.

Why Choose 6oz Aluminum PCB for Electronic Control Board?

Reasons why choose 6oz aluminum PCB for electronic control board:

Heat Dissipation Powerhouse: Thermal conductivity >2.0W/m·K. Reduces component temperatures by 40% vs. FR4.
High Current Performance: 6oz copper (0.17mm) handles high power loads. Minimizes voltage drop in motor drives/power modules.
Lightweight & Durable: Aluminum alloy (6063/5052) balances strength and weight. Withstands vibration/industrial environments.
EMI Shielding: Reduces high-frequency noise in RF/5G circuits. Improves signal integrity with grounding design.
Cost-Efficient Design: Eliminates heatsinks/fans. Enables compact layouts for space-constrained boards.
Rugged Reliability: Passes extreme thermal cycling (-40°C~125°C). Surface finishes (ENIG) resist corrosion.
Scalable Production: Consistent copper thickness for high yields. Customizable layers for diverse control board needs.

Applications of 6oz Aluminum PCB for EV Electronic Control Board

Motor Controller (MCU) Power Module‌
On-Board Charger (OBC) DC-DC Conversion Circuit‌
Battery Management System (BMS) Main Board‌
Inverter Power Unit‌
PDU (Power Distribution Unit) Busbar‌
VCU (Vehicle Control Unit) Power Module‌
Thermal-Sensitive Sensor Interface Board‌
Fast Charger Power Module‌

6oz Aluminum PCB for Electronic Control Board Design Specification

Parameter Category	Specifications/Details
Substrate Material	6063/5052 Aluminum Alloy (High Thermal Conductivity, Corrosion-Resistant)
Copper Thickness	6oz (≈0.17mm, ±10% Tolerance)
Thermal Conductivity	≥2.0W/m·K (Aluminum Substrate Layer)
Thermal Resistance	Soldering Temperature: 260°C/10s No Delamination; Thermal Cycling: 3 Cycles (-40°C~125°C) No Cracks
Mechanical Properties	Tensile Strength ≥200MPa; Bend Radius ≥1.5×Board Thickness (Non-Plated Side)
Surface Finish	ENIG (Au Thickness 0.05~0.1μm), OSP (Antioxidant)
Insulation Layer	Epoxy/Polyimide (Thickness 50~150μm, Dielectric Strength ≥500V)
Min Trace Width/Space	0.15mm/0.15mm (Requires Electroplating Process)

6oz Aluminum PCB for Electronic Control Board Thermal Management

1. Material Selection Criteria

Base Material: 6oz (170μm) copper-clad aluminum PCB with thermal conductivity ≥3W/m·K.
Dielectric Layer: Thermal resistance ≤1.2°C·cm²/W, withstand voltage ≥500V.
Surface Treatment: Anodized finish ≥5μm, surface roughness Ra0.8-1.6μm.

2. Thermal Source Layout

Maintain ≥30% copper coverage in high-power zones.
Keep ≥5mm spacing between MOSFET/IGBT components.
Position temperature-sensitive parts (capacitors) ≥10mm from heat sources.

3. Thermal Path Design

Thermal via arrays under critical components (0.5mm diameter, 1mm pitch).
Via filling with thermal conductive paste (≥5W/m·K).
Direct contact pressure ≥20N/cm² between PCB and housing.

4. Cooling System Configuration

Passive Cooling:

Fin thickness ≥1.5mm, height ≥20mm.
Thermal grease thickness 0.1-0.3mm at interface.

Active Cooling:

Add axial fan when power density >5W/cm²
Airflow ≥3CFM/W, noise <35dB(A)

5. Process Control

Soldering: Peak temperature 245±5°C, reflow time ≤90s.
Assembly: M3 stainless screws (1.2-1.5N·m torque), spring washers ≥0.8mm.

6. Performance Verification

Thermal resistance (junction-to-ambient) ≤5°C/W.
Temperature rise ≤45°C under full load.
Pass 1000 hours 85°C/85% RH aging test.

7. Achieved Results

40%+ improvement in heat dissipation efficiency.
25-35°C reduction in component operating temperatures.
System MTBF ≥50,000 hours.
Compliance with IEC 60068-2-78 damp heat standard.
30%+ space reduction compared to traditional designs.

6oz Aluminum PCB for Electronic Control Board Thermal Management

6oz Electronic Control Aluminum PCB Manufacturing Processes

1. Raw Material Preparation

Procure high-purity electrolytic copper foil (6oz, 210μm thickness).
Select 5052 or 6061 series aluminum alloy substrate.
Prepare high-thermal-conductivity insulating dielectric layer (≥8W/mK).

2. Aluminum Substrate Pretreatment

Mechanically polish substrate surface to surface roughness Ra ≤ 0.2μm.
Chemically clean to remove surface oxide layers and oil contamination.
Anodize to enhance surface insulation properties.

3. Insulating Layer Coating

Apply thermal conductive adhesive uniformly using high-precision coating equipment.
Curing conditions: 150 ±5℃ for 30 minutes.
Thickness tolerance controlled within ±10μm.

4. Copper Foil Lamination

Hot-press composite 6oz copper foil with insulating layer.
Process parameters: pressure 15–20kg/cm², temperature 180–200℃.
Ensure no bubbles or delamination defects.

5. Pattern Transfer

Use LDI (Laser Direct Imaging) technology.
Special etching compensation design required for 6oz thick copper.
Minimum line width/spacing: 0.2mm/0.2mm.

6. Etching Process

Adopt acidic copper chloride etching solution.
Strictly control side etching rate ≤15%.
Post-etching copper thickness deviation within ±10%.

7. Drilling

Use tungsten carbide drills or laser drilling.
Hole diameter tolerance ±0.05mm.
Hole wall roughness ≤25μm.

8. Surface Finish

Optional processes: immersion gold/OSP/HASL.
Immersion gold thickness: 0.05–0.1μm.
Nickel layer thickness: 3–5μm.

9. Solder Mask Printing

Apply high-thermal-conductivity solder mask ink.
Thickness: 20–30μm.
Post-curing temperature resistance up to 150℃.

10. Contour Machining

CNC milling with contour tolerance ±0.1mm.
V-cut depth controlled at 1/3 of board thickness.
Chamfering to eliminate burrs.

11. Electrical Testing

100% flying probe testing.
Insulation resistance ≥1000MΩ.
Withstand voltage test ≥3kV/60s.

12. Final Inspection

Visual inspection under 10x magnification.
Full dimensional inspection via CMM.
Thermal resistance test ≤0.5℃/W.

13. Packaging & Shipping

Vacuum moisture-proof packaging.
Anti-scratch spacing between each piece.
Storage conditions: temperature 15–30℃, humidity ≤60%.

How to Balance Cost and Quality of Electronic Control Aluminum PCB?

1. Material Tiering Optimization

Critical Zones: Use 6oz copper foil + 6061 aluminum alloy (thermal conductivity ≥200W/m·K) for high-heat components (e.g., IGBTs).
Non-Critical Zones: Deploy 4oz copper foil + 5052 aluminum alloy, reducing material costs by 15-20% while validating thermal distribution via simulation.

2. Design Standardization & Modularization

Build a library of universal circuit modules (e.g., power conversion units), cutting custom design time by 30%.
Use DFM system to auto-check thermal expansion coefficient matching, reducing rework by 67%.

3. Smart Manufacturing Upgrades

Deploy AI-powered visual inspection to monitor etching uniformity, boosting 6oz thick-copper board yield from 85% to 96%.
Adopt diamond-coated milling cutters for edge processing, reducing burr rate by 90% and improving soldering reliability.

4. Supply Chain Vertical Integration

Sign long-term agreements with raw material suppliers to lock copper foil prices; use JIT warehousing to cut inventory costs by 10-15%.
Prioritize domestic high-thermal-conductivity insulation (e.g., ceramic-filled epoxy), shortening lead times to ≤7 days.

5. Differentiated Surface Finishing

Apply low-cost OSP (Organic Solderability Preservative) for non-soldering areas and ENIG for critical pads, reducing surface treatment costs by 40% while passing 500hrs 85℃/85%RH tests.

6. Life Cycle Cost Accounting

Optimize for high-thermal-conductivity insulation (≥8W/m·K): Though 20% more expensive upfront, it reduces cooling components, cutting total life cycle costs by 8-12%.

7. Green Manufacturing & Recycling

Establish scrap recycling system (70% recycled aluminum utilization), meeting EU 2025 e-waste recycling targets (≥65%).
Replace traditional stamping with laser cutting, reducing waste rate from 22% to 8% while improving accuracy to ±0.05mm.

How to Balance Cost and Quality of Electronic Control Aluminum PCB?

Our Electronic Control Aluminum PCB Case Studies

At Best Technology, we specialize in electronic control aluminum PCB manufacturing for 19 years, providing a full service from design consultation to mass production. Our professional design team can customize designs based on your power device layout and heat dissipation requirements, ensuring your products meet stringent electrical performance and mechanical stability requirements. Here is a photo of electronic control board aluminum PCB we made before:

Why Choose Best Technology as Aluminum PCB Manufacturer?

Dual-Certification Quality Assurance

ISO 9001 (general quality) & IATF 16949 (automotive-grade) certified
Optional medical-grade ISO 13485 compliance

Thermal Management Gradient

Economy: 3W/m·K aluminum PCB for low-power devices (e.g., security sensors)
Premium: 8W/m·K aluminum nitride substrate for high-power applications (e.g., 5G base stations)

Supply Chain Efficiency

Direct sourcing reduces bulk procurement costs by 15%-20%
Flexible production scale from 50-unit prototypes to 10,000-unit mass production

24-Hour Rapid Prototyping

Aluminum substrate samples delivered within 24 hours
Free DFM (Design for Manufacturability) optimization to mitigate thermal via placement risks

Integrated One-Stop Service

PCB design, thermal simulation, and SMT assembly under one roof
Engineering support for thermal resistance calculation and temperature rise modeling

Eco-Friendly Manufacturing

RoHS/REACH compliance with 95% recycled aluminum content
Lead-free process reduces carbon emissions by 25%

High-Reliability Material System

Dielectric layer: ≥500V withstand voltage, ≤1.2°C·cm²/W thermal resistance
Anodized surface (5-8μm thickness), passes 1,000hrs 85℃/85%RH aging test

Precision Fabrication Capability

Minimum trace width/spacing: 0.1mm
Laser drilling accuracy: ±0.05mm
Layer alignment precision: ≤0.03mm

Welcome to contact us if you have any request for aluminum PCB: sales@bestpcbs.com.

Tags:Electronic Control Board
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

LED Wall Washer Aluminum PCB Manufacturer

Thursday, August 21st, 2025

Why choose LED wall washer aluminum PCB? Let’s explore its benefits, technical parameter, thermal solution, design guide, selection guide through this blog.

Are you troubled with these problems?

Poor heat dissipation leads to rapid light decay and short product lifespan?‌
Outdoor environments cause PCB corrosion and oxidation?‌
Heavy wall washer fixtures warp during installation?‌

Best Technology can provide services and solutions:

Custom Thermal Design‌ – Optimize aluminum PCB thickness and copper layer layout for precise temperature control.
Environmental Testing‌ – Provide third-party certification for waterproofing, shock resistance, and outdoor durability.
Fast Prototyping‌ – 24-hour turnaround for aluminum PCB samples, accelerating R&D cycles.

Welcome to contact us if you have any inquiry for LED wall washer aluminum PCB: sales@bestpcbs.com.

Why Choose LED Wall Washer Aluminum PCB?

Reasons why choose LED wall washer aluminum PCB:

Efficient heat dissipation and stable operation: The aluminum base plate quickly dissipates heat, preventing LED damage from high temperatures, ensuring long-term stable operation at high power levels and significantly delaying lumen degradation.
Lower cost and high cost-effectiveness: Aluminum’s low cost and inherent heat dissipation eliminate the need for external heat sinks, significantly reducing material and assembly costs.
Lightweight and compact, saving space: High heat dissipation efficiency allows for a thinner and lighter luminaire, eliminating the need for additional heat sink components and enabling flexible installation in confined locations.
Increased lifespan and reduced maintenance: Temperature control extends LED lifespan to over 30,000 hours, reducing maintenance requirements for outdoor applications at high altitudes.
Weather-resistant and resistant to harsh environments: The aluminum base plate is impact- and vibration-resistant, and the die-cast housing achieves IP67 waterproofing, making it suitable for outdoor use in the sun and rain.
Environmentally friendly and recyclable, in line with current trends: Aluminum is non-toxic and 100% recyclable, with low energy consumption in production, meeting green manufacturing requirements.
Supporting high power density: Carrying high current density, it drives densely packed, high-brightness LEDs for uniform, powerful wall-washing lighting.

LED Wall Washer Aluminum PCB Technical Parameter

Parameter Category‌	‌Technical Specifications	Description‌
Base Material‌	Aluminum alloy (5052/6061)	Thickness: 1.0-3.2mm, with anodized surface treatment
Thermal Conductivity	Conductivity: 1.0-8.0 W/(m·K)	Standard type (1.0-2.0) for medium-low power, high-conductivity (3.0-8.0) for high-power applications
Insulation Layer‌	Thickness: 50-200μm	Epoxy resin with ceramic filler, slightly higher loss than FR-4
	Dielectric Constant: 4.5-5.0 (1GHz)
	Dielectric Strength: ≥3 kV/mm
‌Thermal Resistance	Total thermal resistance: 0.8-3.0°C/W	Depends on copper foil area and insulation layer thickness
	Interface resistance: <0.5K/W (eutectic soldering)
‌Electrical Parameters	Operating voltage: AC220V/DC24V	Suitable for outdoor environments
	IP65 protection Operating temp: -40°C to +60°C
‌Mechanical Properties	Dimensional tolerance: ±0.1mm (custom modules)	Minimal impact from anodizing
	Surface roughness: Ra 0.2-0.8μm
‌Process Standards	Copper foil thickness: 35-70μm	Compatible with SMT and reflow soldering
	Peel strength: 1.0-1.5 kgf/cm UL94 V0 flame retardancy

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

1. Superior Thermal Management for Optimal LED Operation

Heat Dissipation Efficiency: Aluminum PCBs (thermal conductivity 1-10 W/m·K) outperform FR4 (0.3 W/m·K) by 10x+, rapidly conducting 70% of LED-generated heat away from chips.
Temperature Control: Low thermal resistance (0.05–0.2 K/W) enables safe operation at >10W/chip, reducing junction temperature by 10–15°C and minimizing light decay.

2. Electrical Performance Optimization

Conductivity Advantage: Aluminum’s low impedance cuts power loss, improving system efficiency.
Light Output Boost: White-coated PCBs enhance reflection efficiency by 30%+, indirectly reducing energy consumption per lumen.

3. High-Density Design Support

Compact Integration: Aluminum substrates allow higher LED density (e.g., 500+ LEDs/m²) with uniform light distribution, ideal for large-scale illumination.
Mechanical Reliability: High bending strength prevents solder joint failures under vibration or thermal stress.

4. Cost & Lifespan Benefits

Extended Lifetime: Thermal efficiency extends LED lifespan to 50,000+ hours (2–3x longer than standard solutions).
Simplified Design: Eliminates 40% of external heat sinks, reducing material costs and assembly complexity. Aluminum recycling aligns with sustainability goals.

5. Real-World Application Advantages

High-Power Models: 48W wall washers leverage aluminum PCBs for compact IP66-rated designs, avoiding thermal failure.
Optical Optimization: Multi-layer structures (LED → phosphor → resin → reflective layer) maximize light extraction while efficiently managing internal heat.

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

Wall Wash Light Aluminum PCB Thermal Solution

Copper Layer Thermal Design Optimization

Prioritize solid plane copper layers for maximum thermal conductivity (highest cost).
For cost-sensitive designs, grid patterns offer 80-90% thermal efficiency with ~10% cost reduction.
Avoid star/custom patterns unless required for EMC compliance (70-80% efficiency, unstable cost-benefit).

Thermal Via Design Refinement

Thermal vias are critical for heat transfer from component pads to aluminum substrate. Optimize parameters (diameter, pitch, copper thickness) to minimize thermal resistance.
Parallel thermal resistance network modeling simplifies design and improves efficiency by 20-30%. Reducing via pitch and increasing quantity is effective but requires cost-balance with drilling.

System Thermal Resistance Reduction

High-thermal-conductivity substrates: Use aluminum oxide (Al₂O₃) substrates (22-24 W/mK), outperforming FR-4/ceramic alternatives.
Thin dielectric layers: Minimize thickness while meeting electrical insulation requirements (key to low thermal resistance).
Reduce non-thermal vias: Excessive standard vias increase thermal path length and resistance.

Component Layout & Routing Strategies

Placement: Avoid hotspots by dispersing high-power components (LEDs, drivers). Position major heat sources near substrate edges or directly over thermal vias. Aim for uniform distribution.
Routing: Minimize long/thin copper traces to reduce resistive heating. Widen copper traces or increase thermal via contact area in critical paths (15-20% local thermal improvement).

Integrated Thermal Enhancement Measures

Heat sinks: Most common passive solution, handling ~70% of total heat load. Cost-effective and easy to integrate into housing.
Forced air cooling: Adds ~85% efficiency in enclosed/high-power units but increases cost, noise, and complexity.
Thermal interface materials (TIMs): Thermal grease/pads fill micro-gaps, improving interfacial conductivity by ~30% at low cost.
Liquid cooling: ~95% efficiency but highly complex and costly. Reserved for extreme power densities or specialized applications.

Convection Optimization

Component orientation: Align temperature-sensitive/heat-generating components with their long axis perpendicular to airflow in natural/forced convection.
Expose aluminum substrate: Directly expose large PCB aluminum areas to airflow where structurally feasible.
Airflow management: Arrange tall components parallel to airflow to reduce turbulence and avoid downstream thermal dead zones.

Substrate Material Selection

Aluminum-based PCBs (MCPCBs): Preferred for wall washers due to excellent thermal performance, mechanical robustness, CTE matching (reduces solder joint fatigue), and recyclability. Thickness range: 0.4-6.0mm.
Alumina ceramic substrates: Suitable for high-temperature/high-reliability applications (350-1500°C resistance) with good thermal conductivity.

Thermal Simulation Utilization

Use finite element analysis (FEA) in design phase to predict temperature distribution and identify hotspots.
Simulation-driven optimization reduces post-development thermal issues by 20-30%, lowering risk and cost, especially for mass production.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

1. LED Selection & Color Parameters

Color Tolerance (SDCM): Use SDCM ≤5 LEDs to ensure batch consistency.
Color Rendering Index (CRI): Prioritize Ra ≥80 LEDs (e.g., Lumileds LUXEON) for accurate color reproduction.
Dimmable Options: Support 1900K-5700K CCT ranges with SDCM ≤5 across all settings.

2. Aluminum PCB & Thermal Design

Material: High-thermal-conductivity 6063 aluminum (≥200W/m·K) with anodized coating.
Layout: LED spacing ≥20mm (adjust per power) to prevent localized overheating.
Wiring: 45° traces (width ≥0.5mm, spacing ≥0.3mm) to minimize current interference.

3. Optical System Optimization

Mixing Distance: Short-distance lenses (≤15mm) for RGBWY uniform blending.
Lens: Optical-grade PC/PMMA (transmittance ≥92%) with recessed design (depth ≥5mm).

4. Environmental Adaptability

Protection: IP65/IP66 with silicone sealing (e.g., Dow Corning 7091).
Temperature: Operate from -20°C to +60°C without deformation.

5. Production & Quality Control

Supplier Collaboration: Verify PCB color process (UV-resistant ink, reflection ≥85%).
Inspection: Tighten tolerances (PCB size ±0.1mm, pad alignment ±0.05mm).
Soldering: Through-hole preferred; SMT requires epoxy reinforcement.

6. Control System Compatibility

Dimming: DMX512 0-100% smooth control with Δu’v’ ≤0.005.
Driver: PF >0.9, ripple ≤5% (e.g., PFC circuit design).

7. Long-Term Reliability

Testing: 50,000-hour LM-80 validation, Δu’v’ ≤0.003 post-aging.
Coating: Acrylic varnish (50-80μm) for UV/chemical resistance.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

LED Wall Washer Aluminum PCB Selection Guide

1. Thermal Performance Priority

Thermal Conductivity: 1.0-2.0 W/(m·K) for low-power (<50W) ≥3.0 W/(m·K) for high-power (>50W).
Substrate Thickness: 1.0mm (lightweight) or 2.0-3.0mm (heavy-duty cooling).
Construction: 6061 aluminum base + ceramic-filled insulation for low thermal resistance.

2. Electrical Safety Standards

Protection: IP65 dust/water resistance mandatory for outdoors.
Insulation: Dielectric strength ≥3 kV/mm, copper foil adhesion ≥1.0 kgf/cm.
Voltage: Match input (AC220V/DC24V) with driver compatibility.

3. Optical Compatibility

Beam Angle: 120° standard lens requires PCB layout alignment.
Color Quality: High CRI (Ra>90) needs low-decay LEDs.
Efficacy: ≥10 lm/W for white light; RGB requires independent control zones.

4. Mechanical & Environmental Durability

Coating: Anodized + conformal coating (humidity/mold resistance ≤Class 1).
Impact Resistance: Die-cast aluminum housing (IK10 certified).
Temperature Range: -40°C to +60°C operational certification.

5. Cost & Supply Chain

Material Efficiency: Smart panel layout reduces waste by 23%.
Packaging: SMT-compatible reel packaging recommended.
Certifications: UL94 V0 flammability rating + RoHS compliance.

LED Wall Washer Aluminum PCB Selection Guide

Why Choose Best Technology as Aluminum PCB Manufacturer?

Reasons why choose us as LED wall washer aluminum PCB manufacturer:

1. Premium Quality Assurance

Material Selection: Use 6063/6061 aluminum with thermal conductivity ≥150W/m·K (3x higher than industry average).
Certifications: UL, RoHS, and IP65 compliance guaranteed for harsh outdoor environments.

2. 19 Years of Industry Expertise

Specialized Experience: Dedicated focus on LED lighting PCBs since 2005, with 500+ wall washer projects completed.

3. Cost-Effective Solutions

Price Advantage: 15-20% lower than competitors via optimized production lines and bulk material procurement.
Design Optimization: Free DFM reduces material waste by up to 25% without compromising performance.

4. Fast Delivery

Lead Time: 24 hour rapid prototyping, 5-7 days for mass production (50% faster than industry standard).

5. Free DFM Support

Pre-Production Analysis: Identify thermal bottlenecks, electrical risks, and assembly issues pre-manufacturing.
Design Adjustments: Optimize LED layouts for 30% higher lumen density while maintaining thermal safety.

6. Stringent Quality Control

Thermal cycling (-40°C~+125°C, 1000 cycles).
48-hour burn-in test for all batches.
AOI/X-ray inspection for solder joint integrity.

7. Customization Capability

Flexible Design: Support ultra-thin (0.8mm) to heavy-duty (3.2mm) substrates.
Special Coatings: White solder mask for 95% reflectivity, anti-sulfur treatment for coastal areas.

Welcome to contact us if you have any request for LED wall washer aluminum PCB: sales@bestpcbs.com.

Tags:aluminum pcb, LED Wall Washer
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

COB immersion gold aluminum substrate, Gold immersion plating

Thursday, August 21st, 2025

COB immersion gold aluminum substrate is a high-power packaging solution that directly bonds the LED chip (Chip On Board) to an aluminum substrate treated with immersion gold.

The aluminum substrate quickly dissipates heat, while the immersion gold layer ensures long-term oxidation resistance of the chip pads, ensuring reliable soldering. This eliminates the need for brackets and reflow soldering, resulting in higher luminous efficacy and longer lifespan. It has become a core substrate for high-power LED modules.

COB immersion gold aluminum substrate, Gold immersion plating

Do you have any questions about COB aluminum PCBs?

Does the immersion gold coating and thermal conductivity meet COB heat dissipation requirements?

Do the dimensions and specifications match COB packaging and lighting fixture installation?

Can the immersion gold process and materials withstand long-term high-temperature use?

Do the performance and cost meet expected price/performance ratios?

BEST Technology’s COB aluminum substrates can answer your questions.

The immersion gold layer reduces contact thermal resistance, while the aluminum base and highly thermally conductive insulation layer quickly dissipate concentrated heat from the COB, ensuring efficient heat dissipation.

The COB package area size and overall shape can be customized to accommodate different power COBs and lamp mounting structures.

The immersion gold layer offers strong oxidation resistance, and the substrate has undergone high-temperature cycling testing without delamination, ensuring it can withstand the long-term high-temperature operating environment of the COB.

High heat dissipation ensures COB lifespan, while customized processing optimizes costs, resulting in a reasonable balance of performance and price.

What is COB aluminum substrate?

COB aluminum substrate is a type of PCB that directly mounts LED chips on an aluminum base. Unlike traditional PCBs that use fiberglass, aluminum substrates use metal for better heat dissipation. This structure ensures LEDs operate efficiently and last longer.

The core of a COB aluminum substrate consists of three layers:

A copper circuit layer for electrical connections.

A dielectric layer for insulation and heat transfer.

An aluminum base layer for mechanical support and thermal conduction.

This design keeps LEDs cool and improves performance. It’s the reason COB substrates are widely used in LED lighting, automotive lights, and high-power applications.

Is immersion gold the same as ENIG?

Yes and no. Immersion gold is a key step in the ENIG (Electroless Nickel Immersion Gold) process. ENIG has two layers: a nickel layer and a thin gold layer. Nickel acts as a barrier to protect the copper, and gold prevents oxidation and ensures good solderability.

Therefore, immersion gold usually refers to the gold layer applied in the ENIG process. This finish is popular because it provides excellent corrosion resistance and long shelf life.

Can you plate aluminum substrate with gold?

Yes, you can. In fact, plating aluminum substrates with gold is common in high-end electronic applications. However, the process is not as simple as plating copper. Aluminum forms an oxide layer quickly, which must be removed before plating.

To apply immersion gold on an aluminum substrate, BEST Technology first coat the aluminum with a conductive layer, usually copper. Then, they apply the ENIG finish on top. This method ensures strong adhesion and reliable performance.

What are the benefits of immersion gold on aluminum substrates?

The benefits are impressive. Here are the main reasons why immersion gold is chosen for COB aluminum substrates:

Superior Corrosion Resistance: Gold does not tarnish or oxidize, so it protects the surface even in harsh environments.

Excellent Solderability: The gold layer makes soldering easier and more reliable, especially for fine-pitch components.

Improved Electrical Performance: Gold has low contact resistance, which enhances signal integrity.

Long Shelf Life: Boards with immersion gold can be stored longer without losing quality.

High Reliability for LED Applications: COB LEDs generate heat, and gold plating helps maintain stable performance under thermal stress.

These benefits make immersion gold plating a preferred choice for high-end LED lighting, automotive electronics, and industrial controls.

How thick is gold in ENIG finish?

The gold layer in an ENIG finish is very thin, but it’s enough to provide excellent protection. Typically, the thickness ranges from 0.05 to 0.1 microns. This thin layer ensures good solderability without adding significant cost.

The nickel layer beneath the gold is thicker, usually around 3 to 6 microns. Together, these layers create a strong barrier that protects the copper from oxidation and maintains good electrical conductivity.

Is ENIG better than HASL?

For high-end applications like COB aluminum substrates, ENIG is better than HASL (Hot Air Solder Leveling). Here’s why:

Flat Surface: ENIG provides a smooth, flat surface, which is essential for small components and fine-pitch designs.

Better Corrosion Protection: Gold offers superior resistance to oxidation compared to HASL.

Higher Reliability: ENIG is more stable for thermal cycling and high-power devices.

HASL is cheaper and works well for simple boards, but for COB LEDs, ENIG is the clear winner.

What are the problems with ENIG solderability?

ENIG is reliable, but there are some challenges:

Black Pad Issue: If the plating process is not controlled, it can lead to corrosion of the nickel layer, causing poor solder joints.

Higher Cost: ENIG is more expensive than HASL or OSP finishes.

However, these issues rarely occur when working with BEST Technology, a trusted PCB manufacturer that follows strict quality controls.

What are the uses of COB aluminum substrate?

COB aluminum substrates are used in a wide range of applications:

LED Lighting: High-brightness LEDs for residential, commercial, and industrial lighting.

Automotive Lights: Headlights, tail lights, and daytime running lights.

Display Backlighting: LCD and signage displays that need uniform light.

Medical Equipment: Devices that require precise lighting and heat management.

Industrial Control Systems: Where stable performance and long life are critical.

These uses show how important COB immersion gold aluminum substrates are in modern technology.

Conclusion:

COB aluminum substrates provide excellent heat dissipation and mechanical strength for LED applications. When paired with immersion gold plating, they offer even greater reliability, corrosion resistance, and solderability. ENIG is better than HASL for high-end boards, and the gold layer, though thin, ensures long-lasting performance.

If you need high-quality COB immersion gold aluminum substrates, contact us today at sales@bestpcbs.com

Tags:COB immersion gold aluminum substrate, gold immersion plating, immersion copper plating, immersion gold on copper, silver immersion plating
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB, PCB Technology | No Comments »

Copper Multilayer PCB Manufacturer in China| Best Technology

Wednesday, August 20th, 2025

What is copper multilayer PCB? Let’s discover its material, benefits, applications, design guide for wearable device, production process through this blog.

Are you troubled with these problems?

High-frequency signal degradation killing your design?‌
Heat dissipation always a bottleneck?‌
Yield rates dropping with layer stacking?‌

Best Technology can provide service and solutions‌:

Rapid Response‌ – 24/7 engineering support, samples delivered in 48 hours.
Cost Efficiency‌ – Intelligent panelization + material reuse cuts costs by 15%.
‌Transparency‌ – Real-time production tracking with photo verification at key stages.

Welcome to contact us if you have any inquiry for copper multilayer PCB: sales@bestpcbs.com.

What is Copper Multilayer PCB?

Copper Multilayer PCB consist of alternating copper conductive layers and insulating materials (such as FR-4 or polyimide) bonded together through a lamination process. Copper’s high thermal conductivity (386W/m·K) and electrical conductivity support complex circuit designs, enabling high-density interconnection between layers through through-holes, blind vias, or buried vias.

This type of PCB is suitable for high-power applications (such as automotive electronics and 5G base stations), offering superior heat dissipation and signal stability compared to single- or double-layer PCBs. Its symmetrical structure (e.g., copper-prepreg-core-prepreg-copper) enhances mechanical strength and controls impedance. Some models also utilize thermal isolation technology to directly conduct heat.

What is Material of Multilayer Copper PCB?

1. Conductive Layer

Composition: Electrolytic copper foil (ED) or rolled copper foil (RA)
Features: Thickness 0.5–6 oz/ft² (17–210 μm), conductivity ≥58 MS/m (20°C), surface finish available: brown oxide (OSP) or nickel-gold (ENIG).

2. Insulation

FR-4: Epoxy resin + fiberglass, dielectric constant 4.2–4.8 (1 GHz), heat resistance 130°C (standard) / 170°C (high Tg).
Polyimide (PI): Dielectric constant 3.4–3.6 (1 GHz), heat resistance >250°C, short-term temperature resistance ≥300°C.

3. Prepreg (PP)

Composition: 7628/2116/1080 glass cloth impregnated with epoxy resin
Features: Thickness 0.05–0.2mm (0.1–0.4mm after lamination), resin content 52%–65%, curing conditions 180°C/60min.

4. Metal Substrate (Optional)

Aluminum Substrate: 1050/6061 alloy, thermal conductivity 180–220 W/m·K, thickness 1.0–3.2mm.
Copper Substrate: Electrolytic copper, thermal conductivity 386 W/m·K, thickness 0.5–2.0mm.

5. High-Frequency Material (Optional)

PTFE: Polytetrafluoroethylene, dielectric constant 2.2–2.5 (10 GHz), dissipation factor <0.001 (10 GHz).
Rogers RO4003C: dielectric constant 3.38 (10 GHz), dissipation factor 0.0027 (10 GHz).

6. Solder Mask

Composition: Liquid Photosensitive Solder Mask Ink (LPI)
Characteristics: Thickness 10–25μm, Temperature Resistance ≥ 150°C (short-term), Insulation Resistance ≥ 1×10⁸Ω.

What Are Advantages of Copper Multilayer PCBs?

Benefits of copper multilayer PCB:

High-density integration capabilities: By stacking multiple conductive layers (up to 32 layers), complex circuits can be integrated within a limited space, meeting the demands of miniaturized devices such as smartphone motherboards.
Excellent heat dissipation performance: Copper foil has a thermal conductivity of 400. W/m·K (nearly twice that of aluminum substrates), combined with a thick copper design (3–10 oz), allows for rapid heat conduction and reduces the junction temperature of high-power devices.
High-frequency signal integrity: Specialized high-frequency materials (such as PTFE) have a dielectric constant as low as 2.2–3.5, reducing signal loss and making them suitable for 5G base stations and radar systems.
Optimized electromagnetic compatibility: Multi-layer ground and power planes effectively shield electromagnetic interference (EMI) and reduce crosstalk risks.
Improved mechanical strength: Copper substrates offer superior deformation resistance to traditional FR-4, making them suitable for vibration environments such as automotive electronics.
Current carrying capacity: Thick copper layers (6 oz+) support high current transmission and reduce voltage drop in power modules.
Design flexibility: Supports advanced processes such as blind and buried vias and mixed dielectric layers to meet the needs of high-frequency, high-speed, and high-power hybrid designs.
Long-term reliability: Copper’s oxidation resistance and multi-layer laminate structure (using prepreg PP) extend product life, making them suitable for industrial control equipment.

What Are Advantages of Copper Multilayer PCBs?

What Are Applications of Copper Multilayer PCB?

Communications Equipment: 5G base stations, routers, mobile phone signal repeaters, fiber optic receivers
Computers and Data Centers: Server motherboards, hard drive controllers, graphics cards, storage devices
Medical Equipment: Heart monitors, CT scanners, X-ray equipment
Industrial Control and Automotive Electronics: Motor controllers, industrial automation systems, power converters, in-vehicle electronics
Aerospace: Satellite systems, space exploration equipment, radar
Consumer Electronics: Smartphones, wearable devices, game consoles
Energy and Power Systems: Power amplifiers, battery chargers, rectifiers, high-power conversion devices

How to Design a Copper Multilayer PCB for Wearable Device?

1. Material Selection & Substrate Optimization

Substrate: Prioritize polyimide (PI) or liquid crystal polymer (LCP), thickness 0.05–0.1mm, for flexibility (bending radius <5mm) and high-temperature resistance (Tg >250℃).
Conductive Layer: Use ultra-thin rolled annealed copper foil (RA, 0.5oz/17μm) to balance flexibility and conductivity (conductivity ≥58 MS/m).
Adhesive Layer: Apply low-modulus prepreg (PP) to reduce interlayer stress and prevent cracking during bending.

2. Stackup Design & Flexibility

Layer Count: Prioritize for 4-layer boards (Signal-Ground-Power-Signal) with total thickness 0.4–0.6mm to minimize weight.
Symmetry: Distribute copper layers symmetrically (e.g., Cu-PI-Cu) to avoid warping during bending; place ground and power planes adjacent to reduce EMI.
Flexible Zones: Use coreless structures (copper foil + PI only) in bending areas (e.g., wristband connections) for unrestricted flexibility.

3. Signal Integrity Assurance

High-Speed Signals: Design Bluetooth/Wi-Fi antennas as microstrip lines with 50Ω impedance control (trace width 0.15mm, spacing 0.1mm) and avoid 90° bends.
Differential Pair Routing: Route high-speed interfaces (USB, MIPI) with equal length (tolerance ±5mil) and spacing ≥3x trace width to minimize crosstalk.
Shielding: Add copper shielding layers (width ≥2mm) around antennas, grounded via stitching to reduce external EMI.

4. Power Distribution & Low-Power Design

Layered Power: Implement split power planes (e.g., 1.8V/3.3V) with power-ground spacing 0.1mm and decoupling capacitors (10μF + 100nF).
Low-Power Components: Select ultra-low-power MCUs (e.g., STM32L series) and PMICs, paired with hardware watchdogs to prevent lockups.
Layout Optimization: Place batteries, PMICs, and MCUs close to minimize trace length and reduce static power consumption.

5. Thermal Management Strategies

Heat Dissipation: Place copper foils (1oz thickness) under heat-generating components (MCUs, power chips) and connect via thermal vias (diameter 0.2mm, pitch 0.5mm) to external thermal areas.
Thermal-Electric Separation: Isolate high-power LEDs or battery chargers with dedicated copper layers to prevent heat transfer to sensitive components.
Material Enhancement: Embed graphene thermal films (0.01mm thickness) in critical zones to improve lateral heat conduction.

6. Mechanical Reliability & Bend Resistance

Solder Mask: Use high-flexibility solder mask (e.g., Taiyo PSR-9000), thickness 10μm, rated for >100,000 bend cycles.
Surface Finish: Apply ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) to prevent copper oxidation and ensure solder reliability.
Validation: Pass dynamic bend tests (radius 3mm, 1Hz frequency, 10,000 cycles) and accelerated aging (85℃/85%RH, 168 hours).

7. Electromagnetic Compatibility (EMC) & Compliance

Grounding: Connect metal enclosures (e.g., wristband, buttons) to PCB ground via spring contacts or conductive adhesives, forming a Faraday cage to mitigate ESD.
Certification: Achieve CE (EU) or FCC (US) EMC compliance, testing across 80MHz–6GHz to ensure stable operation in complex electromagnetic environments.
Wireless Charging: Position Qi-standard coils at PCB edges, away from antennas and sensors to avoid interference.

How to Design a Copper Multilayer PCB for Wearable Device?

How was Copper Multilayer PCB Made?

1. Substrate Preparation

Select FR4 glass fiber epoxy resin laminate as substrate, with copper foil cladding (thickness 1oz/2oz).

2. Inner Layer Pattern Transfer:

Apply photosensitive dry film, transfer circuit pattern via UV exposure, and dissolve unexposed areas.
AOI (Automatic Optical Inspection) verifies line precision and marks defects.

3. Inner Layer Etching & Oxidation

Chemically etch copper not protected by dry film to form inner layer circuits.
Black oxide/brown oxide treatment on copper surfaces to enhance interlayer adhesion.

4. Lamination & Pre-Press

Stack inner layer core boards, prepreg sheets, and outer layer copper foils alternately, aligning via positioning holes.
High-temperature/high-pressure lamination (180-200℃) melts resin to fill gaps, forming a unified board.

5. Mechanical Drilling

CNC drilling machine processes through-holes/blind holes with diameter accuracy ±0.05mm.
Clean hole-wall resin residues (desmear).

6. Electroless Copper Plating

Deposit electroless copper (0.3-0.8μm) on hole walls to establish conductive base.
Electroplate to thicken copper layer (20-25μm) for reliable hole-wall conductivity.

7. Outer Layer Pattern Transfer

Repeat inner layer pattern transfer process, addressing hole alignment.
Use high-precision exposure equipment to compensate for interlayer deviation.

8. Outer Layer Etching & Stripping

Secondary etching defines outer layer circuits, with tin layer protecting desired copper areas.
Alkaline solution strips dry film, retaining circuit patterns.

9. Solder Mask & Silkscreen

Apply liquid photosensitive solder mask (green/black), expose and develop to expose pads.
Silkscreen component identifiers (white/yellow text).

10. Surface Finish

Treat pad areas with ENIG (Electroless Nickel Immersion Gold)/immersion tin/OSP to prevent oxidation and enhance solderability.
Plate gold finger areas with hard gold for wear resistance (e.g., board-edge connectors).

11. Electrical Testing

Flying probe test or bed-of-nails test verifies continuity and insulation.
AOI re-inspects for micro-shorts/opens.

12. Profiling & Packaging

CNC milling cuts board outlines; V-score or punching for separation.
Final cleaning, drying, and vacuum moisture-proof packaging.

Why Choose Best Technology as Copper Multilayer PCB Manufacturer?

Reasons why choose us as copper multilayer PCB manufacturer:

19 years of experience in copper substrate R&D: Precisely addressing interlayer heat dissipation and current carrying challenges in high-power multi-layer copper substrates, ensuring long-term stable operation of high-power devices (such as projectors/lasers).
Triple international quality certification (ISO9001/IATF16949/ISO13485): Medical and automotive-grade copper substrate production standards ensure ±1μm copper thickness uniformity in multi-layer board holes and zero deviation in electrical performance.
Customized thermal management solutions for copper substrates: Embedded copper pillars/thermoelectric separation structures reduce the thermal resistance of multi-layer boards to 0.5°C/W, extending the life of LEDs/power modules by over 30%.
Cost-optimized copper substrate design: Utilizing a gradient copper foil thickness (1oz outer layer + 2oz inner layer) to balance conductivity and heat dissipation requirements, saving 15% in material costs compared to traditional designs.
24-hour copper substrate rapid prototyping service: Laser drilling and electroless copper plating processes deliver high-complexity (20+ layers) copper substrate prototypes within 48 hours, accelerating the validation cycle for high-power products.
Free Copper Substrate Design for Material (DFM) Analysis: Preemptively identify design risks such as copper layer distribution and blind via alignment, preventing interlayer cracking caused by thermal expansion coefficient mismatch and reducing secondary re-board rework costs.
100% Automated Optical Inspection (AOI): Detects hole wall voids and copper nodules, a common feature of copper substrates, with a 0.01mm² level of defect detection, ensuring zero defective batch orders.
Full-Process Copper Substrate Solution: From thermal simulation (Flotherm) to copper layer etching and surface treatment (ENIG/HASL), we provide a one-stop service, reducing the cost of coordinating multiple suppliers.
Ultra-Thin Copper Substrate Process (0.2mm total thickness): Combining flexible PI substrate and copper foil calendering technology, we achieve a bend radius of less than 1mm for multi-layer copper substrates for wearable devices while maintaining a current density of 10A/cm².

Our Copper PCB Capabilities

Items	Technical Parameters
Product model	Copper PCB
Copper trace thickness	1OZ, 2OZ, 3OZ, 4OZ, up to 10OZ
Thermal Conductivity	1.0, 1.5, 2.0, 3.0W/m.K
Surface finishing	HAL(LF)/ Gold Immersion/ Gold plating/ OSP/ Immersion Tin/ Silver Immersion
Soldermask Color	White/Black/Green/Blue/Red/Yellow
Layers	1L, 2L, 4L, 6L, 8L, double sided, COB
Maximum dimension	1,100mm*480mm; 1,500x300mm
Minimum dimension	5mm*5mm
Minimum Line width/space	0.1mm/0.1mm
Warp and twist rate	≤0.75%(thickness:1.6mm, measurement:300mm×300mm)
Board Thickness	0.3－4.5mm
Die-Punching dimension tolerance	±0.15mm
V-cut positioning tolerance	±0.1mm
Manufacturing capability	6000m²
Wall Cu thickness	15-25um
Alignment tolerance	±0.076mm
Minimum diameter of die-punching hole	Thickness <=1.0mm: 1.0mm
	Thickness 1.2-3.0mm: 1.5mm
	Thickness 4.0mm: 2.0mm
Minimum size the square groove/slot/cutout	Thickness <=1.0mm: 0.8mm×0.8mm
	Thickness 1.2-3.0mm: 1.0×1.0mm
	Thickness 4.0mm: 1.5×1.5mm
Outline Tolerance	CNC routing：±0.1mm; Die-punching：±0.15mm
Minimum diameter of hole	0.3mm; not limit for maximum diameter of hole
Surface Finishing Thickness	gold plating：Ni 2.5-5um, Au: 0.025－0.075um
	immersion gold: Ni 3-6um, Au: 0.025-0.1um
	HAL(LF): 3-30um
V－cut Angle tolerance	±5°
V-cut Range	0.3mm-4.5mm
Smallest silkscreen height	0.15mm
Smallest PAD	0.1mm

How to Get a Quote for Copper Multilayer PCB Project?

Essential Documentation for Copper Multilayer PCB Quotation

Lamination Stackup Drawing: Specify layer materials (e.g., FR-4/Rogers 4350), copper thickness (1–6OZ), dielectric thickness (mm), and impedance control targets.
Gerber Files: Include circuit layers, drilling layers, and solder mask layers. Annotate trace width/spacing (e.g., 4/4mil), blind/buried via positions, and hole tolerance (±0.05mm).
PCB Technical Parameter Sheet: Board dimensions (L×W×T), layer count (e.g., 8L), surface finish (ENIG/OSP), and special processes (via plating/half-hole).
Impedance Control Requirements: Define differential pair impedance (e.g., 100Ω±10%), reference layers, and testing methods.
Acceptance Criteria: Specify IPC class (e.g., IPC-6012 Class 3) and testing items (flying probe/AOI/X-ray).
Quantity & Lead Time: Prototype/batch quantity (e.g., 5pcs/1k) and desired delivery timeline (e.g., 7-day expedited).
Special Requirements: High-frequency/thermal needs (e.g., PTFE hybrid), environmental certifications (RoHS/UL).

Why Partner with Best Technology?

Expertise: Handles 16+ layer thick copper (6OZ) and hybrid high-frequency boards.
Speed: Offers 48-hour quick quotes and complimentary impedance calculation.
Quality: Free DFM review to eliminate design flaws upfront.
Result: Avoid cost overruns, accelerate time-to-market, and ensure compliance for demanding applications.

Welcome to contact us if you have any request for copper multilayer PCB: sales@bestpcbs.com.

Tags:Copper Multilayer PCB, Multilayer Copper PCB
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

What is an LED lighting aluminum substrate?

Wednesday, August 20th, 2025

LED lighting aluminum substrate is a circuit board with aluminum as the base, on which the LED chip is directly soldered, which is both conductive and acts as a heat sink. Aluminum’s high thermal conductivity instantly dissipates heat, preventing LED overheating and light decay, allowing high-power LEDs to maintain a long lifespan and continuous high brightness.

What is an LED lighting aluminum substrate?

Are you curious about BEST Technology’s aluminum substrates for LED lighting?

Does the thermal conductivity meet the cooling requirements?

Do the dimensions match the fixture’s installation requirements?

Can the material and craftsmanship withstand high temperatures?

Is the performance and cost-performance ratio reasonable?

Does BEST Technology offer customization and after-sales service?

BEST Technology’s aluminum substrates for LED lighting can answer these questions.

Compatible. The aluminum base and ceramic-filled insulation layer design offers far superior thermal conductivity compared to traditional substrates, rapidly dissipating heat from the LED and ensuring stable operation.

Compatible. Standard sizes and full customization (non-standard shapes and thicknesses) are available. Small batches and samples can be delivered quickly, and the product is compatible with diverse lamp structures.

Performance. The insulation layer has undergone high and low temperature cycling tests to ensure no delamination, and its long-term operating temperature reaches 150°C. The thermal expansion coefficient is optimized for the LED chip, providing strong resistance to thermal stress.

Reasonable. The zoned heat dissipation design saves costs, improves thermal conductivity by hundreds of times, and is priced lower than international brands, balancing longevity and affordability.

Support. Full customization is provided (design, materials, and craftsmanship). After-sales service includes a 48-hour response time, free repairs during the warranty period, and 24-hour delivery for expedited orders.

What is the substrate of LED lights?

In simple terms, the substrate is the base material that supports the LED chip. It provides structure, stability, and heat management. Think of it as the “backbone” of the LED light.

LED chips generate light when electricity passes through them. But they also produce heat at the same time. If the heat isn’t managed, it can shorten the life of the LED and lower its performance. That’s where the substrate plays a critical role.

Among many options, aluminum substrates stand out as the preferred choice for LED lighting. They are designed not only to hold the LED components but also to transfer heat away quickly, ensuring the light stays cool and lasts longer.

Why use aluminum substrates for LED lighting?

LEDs are sensitive to high temperatures. Excessive heat can cause them to fade, fail early, or lose brightness. Aluminum substrates prevent this problem.

Aluminum is an excellent conductor of heat. When used as a substrate, it helps channel heat away from the LED chip to the surroundings. This ensures consistent performance and protects the LEDs from damage.

Besides thermal benefits, aluminum substrates also offer strong mechanical support. They are lightweight yet durable, making them perfect for modern LED designs. Whether used in a slim LED panel or a high-power street light, aluminum substrates ensure efficiency and reliability.

What materials are LED lights made of?

LED lights are more than just chips and covers. Several layers and materials come together to create the final product:

LED chip: The tiny semiconductor that produces light.

Substrate: The base material, often aluminum, that supports and cools the chip.

Circuit layer: Usually made of copper, it carries the electrical signals.

Dielectric layer: Provides insulation while allowing heat to pass through.

Lens or cover: Shapes the light and protects the chip.

Among these, the LED lighting aluminum substrate is one of the most critical parts. It combines electrical insulation with thermal conduction, two qualities rarely found together.

Can LED lights go on metal?

Yes, LEDs can be mounted on metal, and aluminum is the most common choice. In fact, many LED assemblies are designed specifically for metal bases.

When LEDs are mounted on aluminum, they gain improved heat dissipation. This is essential for applications like automotive lighting, industrial lamps, and high-brightness panels where heat is a big concern.

Unlike bulky cooling systems, aluminum substrates provide natural thermal management.

How does LED aluminum improve heat dissipation?

Heat dissipation is the most important function of aluminum substrates. Without it, LEDs would overheat and fail quickly.

Aluminum has high thermal conductivity. It pulls heat away from the LED chip and spreads it across the substrate. From there, the heat is released into the air.

Compared to traditional substrates, aluminum is far superior in thermal management. For example, FR4 (a common PCB material) cannot handle high heat as well.

In short, LED aluminum substrates work as natural heat spreaders. They extend the lifespan of LEDs, maintain brightness, and allow lights to perform at their best even in challenging conditions.

Why are aluminum substrates better than FR4 for LEDs?

FR4 is a widely used PCB material made of glass fiber and epoxy resin. While it works for many electronic devices, it struggles when used in LED lighting.

Here’s why aluminum substrates are superior:

Better heat conduction: Aluminum conducts heat up to 10 times faster than FR4.

Higher durability: Aluminum substrates can handle higher temperatures without damage.

Stronger support: They provide a stable base for high-power LED chips.

Longer lifespan: LEDs last longer when mounted on aluminum compared to FR4.

Because of these advantages, aluminum substrates are the first choice for most LED lighting products. FR4 may still be used in low-power LED designs, but for serious performance, aluminum is the winner.

What makes LED aluminum durable and reliable?

Reliability is everything in lighting. Aluminum is naturally strong and resistant to cracking. It also handles environmental stress well, such as vibration, impact, and moisture. This makes it ideal for outdoor and industrial LED applications.

The dielectric layer used in aluminum substrates also ensures electrical insulation. It prevents short circuits while allowing heat transfer.

In addition, LED lighting aluminum substrates resist thermal aging. They maintain their properties over time, even under constant heat. This means consistent performance, longer lifespans, and fewer replacements.

Where are LED lighting aluminum substrates applied?

The use of aluminum substrates in LED lighting is nearly endless. From household lights to industrial equipment, they are everywhere. Some common applications include:

Street lights: High-power LEDs need aluminum substrates to stay cool.

Automotive lighting: Headlights, brake lights, and interior lights benefit from aluminum’s durability.

Consumer electronics: Backlighting in TVs, displays, and smartphones.

Industrial lamps: Used in warehouses and factories where reliability is key.

Medical devices: Precision lights where stable output is essential.

Architectural lighting: Decorative LEDs that need consistent brightness.

Wherever LEDs are used, aluminum substrates play a key role in making them efficient and reliable.

Why are LED lighting aluminum extrusions important?

In addition to substrates, LED lighting aluminum extrusions are often used for housing and thermal management. These extrusions are aluminum profiles designed to protect LEDs and spread heat.

When combined with aluminum substrates, extrusions create a complete thermal solution. They not only manage heat but also improve the appearance and durability of LED products.

Conclusion:

The LED lighting aluminum substrate is the foundation of reliable LED technology. It supports the chip, improves thermal management, and ensures durability. Compared to FR4, aluminum is far superior in heat conduction and reliability. That’s why it’s the top choice for everything from street lights to smartphones.

In short, aluminum substrates make LEDs brighter, cooler, and longer-lasting. If you are looking for high-quality LED lighting aluminum substrates, reach out to us at sales@bestpcbs.com

Tags:aluminum substrates, LED lighting aluminum substrate, led substrates
Posted in FAQ, mcpcb, Metal Core PCB, PCB Technology | No Comments »

EV Motor Controller Aluminum PCB | Best Technology

Friday, August 15th, 2025

Why choose aluminum PCB for EV motor controller? Let’s explore design spec and guide, production processes, future trends for EV motor controller aluminum PCB.

Are you worried about these problems?

Frequent high temperature alarms: How can motor controllers operate calmly?
(The aluminum substrate has a thermal conductivity of 180W/m·K, three times that of standard FR4, allowing heat to be dissipated instantly from the metal casing.)
Vehicle vibration can cause cracking in solder joints. How can we prevent them from cracking?
(The aluminum substrate and metal casing have a perfect CTE match, eliminating thermal stress and passing 2000 hours of mechanical shock testing.)
Electromagnetic interference distorts signals. How can we restore good signal?
(The aluminum substrate’s single-point grounding design improves EMC performance by 40%, achieving CISPR 25 certification in one go.)

Best Technology can provide solution and service:

Thermal design outsourcing service—A thermal simulation report is issued within 72 hours, allowing temperature reduction solutions to be directly implemented in PCB layout.
Vibration compensation technology—Exclusive micro-dimpled copper foil technology extends solder joint fatigue life by five times.
EMC Express Repair Channel—Provide impedance adjustment samples within 48 hours, ensuring interference issues are resolved overnight.

Welcome to contact us if you have any request for aluminum PCB: sales@bestpcb.com.

Why Choose Aluminum PCB for EV Motor Controller?

Reasons why choose aluminum PCB for EV motor controller:

Excellent Heat Dissipation, Ensuring Stability: Thermal conductivity is 5–10 times that of FR-4, rapidly dissipating heat from the IGBT (>100W/m·K) and preventing thermal runaway.
High Reliability and Durability: Corrosion-resistant and boasting a wide operating temperature range (-55°C to 125°C), it extends lifespan (MTBF increased by 20%).
Light weighting and Space Optimization: With a density of only 2.7g/cm³, it is 60% lighter than traditional materials, improving energy efficiency.
Electrical Safety and Efficiency: The aluminum substrate provides natural EMI shielding, protecting control signals.
System Cost Advantages: Reduces reliance on heat sinks, lowering hardware costs.

Thermal Dissipation Challenges in EV Motor Controller Aluminum PCB

Heat Accumulation at High Power Density

Challenge: Localized heat generation in power modules exceeds 100W/cm², easily leading to device overheating.
Solution: Use a high-thermal-conductivity aluminum substrate (such as an aluminum nitride ceramic substrate with a thermal conductivity ≥170W/m·K) and optimize the layout of thermal vias to improve heat dissipation efficiency.

Performance Bottlenecks in Thermal Conductive Materials

Challenge: Traditional thermal adhesives have low thermal conductivity, limiting heat dissipation effectiveness.
Solution: Use nano-ceramic-filled thermal adhesives (with a thermal conductivity ≥5W/m·K) or direct bond copper (DBC) technology to reduce thermal resistance.

Non-Uniform Thermal Stress

Challenge: Differences in thermal expansion coefficients between the device and substrate lead to solder layer fatigue.
Solution: Use flexible solder materials (such as silver sintering) to buffer thermal stress and extend service life.

Design Complexity of Liquid Cooling Systems

Challenge: Improper flow channel layout leads to uneven cooling and reduced heat dissipation efficiency.
Solution: Optimize flow channel design through CFD simulation to ensure uniform coolant flow (≥1 m/s) and reduce pressure drop.

Impact of ambient temperature fluctuations

Challenge: Heat dissipation capacity degrades in high-temperature environments, impacting stability.
Solution: Integrate an intelligent temperature control system to dynamically adjust cooling strategies (such as increasing air cooling or reducing load).

Insufficient long-term reliability verification

Challenge: Lack of data on heat dissipation performance degradation after long-term use.
Solution: Accelerated aging tests (such as high-temperature and high-humidity cycling) are used to develop a lifespan prediction model to ensure long-term reliability.

Design Specification for EV Motor Controller Aluminum PCB

Design Dimension	Specification Requirements
Minimum Trace Width/Spacing	Power traces: ≥2.0mm
	Signal traces: ≥0.3mm
	Ground trace spacing: ≤5mm
Insulation Layer Thickness	50-100μm (standard), up to 150μm for high-voltage areas
Copper Foil Thickness	Outer layers: 70-140μm (standard) Inner layers: 105μm (for multilayer boards)
Hole Diameter Tolerance	±0.05mm (mechanical holes), ±0.03mm (laser holes)
Thermal Design	Heatsink contact surface flatness: ≤0.05mm/m
Thermal grease thickness	0.1-0.2mm
Surface Finish	OSP: 0.2-0.5μm ENIG: 0.05-0.1μm gold thickness
EMC Design	Metal layer grounding impedance: ≤0.1Ω
High-frequency signal grounding	trace spacing ≤3mm

EV Motor Controller Aluminum PCB Design Guide

1. Material Selection

Substrate: Use 6061-T6 or 5052-H34 aluminum alloy (thermal conductivity ≥2.0W/m·K). Insulation layer thickness: 50–150µm (thicker for high-voltage areas).
Copper Foil: 3oz (105µm) rolled copper for power circuits; 1oz (35µm) copper for signal layers.
Surface Finish: ENIG (gold thickness 0.05–0.1µm) for high-frequency areas; OSP (0.2–0.5µm) for low-voltage regions.

2. Thermal Management

Power Plane: Embed 3oz copper (covering ≥70% area) in inner layers, connected via 0.4mm via arrays.
Metal Embedding: Place 0.6mm copper blocks under high-power components, with 0.3mm buffer slots.
Liquid Cooling: Integrate 3×3mm² cooling channels filled with gallium-indium alloy (thermal resistance 0.3℃/W).

3. Electrical Layout

High-Voltage Isolation: 8mm clearance for 300V systems; 12mm for 500V systems. Add 2mm safety slots for creepage compensation.
Signal Integrity: Use 45° arcs for high-frequency traces (>100MHz); impedance tolerance ≤±5%.
Power Distribution: Dedicate Layer 6 (for 10-layer boards) as a thermal layer, connected via blind/buried vias.

4. Mechanical Design

Heat Dissipation Posts: Use inverted T-shaped aluminum posts (diameter 8mm) with insulating sleeves.
Clearance Control: Maintain ≥1mm gap between posts and PCB to prevent thermal deformation.
Heatsink Interface: Ensure contact surface flatness ≤50µm; apply nano-thermal paste (thermal resistance 0.1℃·cm²/W).

5. Reliability Verification

Thermal Testing: Infrared inspection under full load (max single-point temperature ≤85℃; delta ≤15℃).
Thermal Cycling: -40℃ to 125℃ for 1000 cycles; via resistance change <10%.
EMC Testing: Grounding impedance ≤0.1Ω; high-frequency signal shielding spacing ≤3mm.

EV Motor Controller Aluminum PCB Design Guide

EV Motor Controller Aluminum PCB Manufacturing Processes

1. Cutting‌

Cut large-sized aluminum PCB raw materials into production dimensions. Special attention should be paid to protecting the aluminum and copper surfaces to avoid scratches. Check for delamination or burrs at the edges.

2. Drilling‌

Perform positioning drilling on the board to provide auxiliary support for subsequent processes and customer assembly. Verify the quantity and diameter of holes to avoid scratching and check positional deviation.

3. Dry/Wet Film Imaging‌

Through grinding, lamination, exposure, and development, create the required circuit patterns on the board. Check for open circuits after development, alignment deviations, and prevent dry film residue.

4. Acid/Alkaline Etching‌

Etch away unwanted copper parts after imaging, leaving only the required circuits. Monitor for incomplete or excessive etching, and verify line width and spacing.

5. Solder Mask & Legend Printing‌

Apply solder mask and legends via screen printing, pre-baking, exposure, and development. Inspect for contaminants, clean stencils, and ensure uniform thickness.

6. V-Cut & Routing‌

Separate individual PCBs from the panel using V-Cut and routing. Check V-groove dimensions, edge defects, and burrs while avoiding surface scratches.

7. Testing & Surface Treatment

Conduct electrical and voltage resistance tests, then apply OSP (Organic Solderability Preservative) for better solderability. Distinguish between good and defective units without damaging traces.

8. FQC & FQA

Perform full inspection (FQC) and sampling inspection (FQA), then package and ship. Confirm packaging quantities to prevent mix-ups, errors, or damage.

EV Motor Controller Aluminum PCB Manufacturing Processes

Future Trends of EV Motor Controller Aluminum PCB

Continuously Upgraded Thermal Management Performance

Aluminum substrates will utilize composite materials with higher thermal conductivity (such as ceramic-filled aluminum substrates), significantly improving the heat dissipation efficiency of motor controllers under high-current conditions, preventing overheating and failure of power devices, and extending vehicle life. This reduces system cooling costs, enhances controller reliability, and reduces after-sales maintenance requirements.

Automated Production Drives Cost Optimization

Through AI-driven automated production lines (such as intelligent optical inspection and precision etching), aluminum substrate manufacturing yields will increase by over 15%. 48-hour rapid prototyping services are also supported, accelerating customer product iteration.

Modular Design Enhances Compatibility

Aluminum substrates will support standardized interfaces and customized functional area divisions (such as power and signal area wiring), enabling customers to flexibly adapt to motor controller platforms of varying power levels and achieve “one board, multiple models” development.

High-Density Integration and Light weighting Breakthroughs

Utilizing 3D stacking and microvia technology (HDI process), aluminum substrate wiring density is increased by 40%, while ultra-thin aluminum layers (≤0.8mm) achieve a 30% weight reduction, meeting the requirements of compact motor compartment layouts.

Enhanced adaptability to extreme environments

Through surface nano-coating and alloy substrate optimization, the aluminum substrate can withstand temperature shocks of -40°C to 150°C and 1000 hours of salt spray corrosion, adapting to all climate conditions of electric vehicles.

Our EV Motor Controller Aluminum PCB Case Studies

At Best Technology, we are deeply engaged in the field of aluminum substrates for electric vehicle motor controllers, successfully delivering hundreds of high-reliability projects, covering the full range of scenarios from 48V mild hybrid to 800V high-voltage platforms. Leveraging sophisticated thermal management design, stringent process control (such as nano-coating insulation and integrated micro-channel liquid cooling), and ISO/TS 16949-certified intelligent manufacturing capabilities, we provide customized solutions with high power density and long lifecycles to customers worldwide. Here is a photo of EV motor controller aluminum PCB we made before:

Item‌ ‌	Specification‌
‌Product Name	High-Thermal-Conductivity Aluminum PCB for EV Motor Controllers
‌‌Base Material‌	Aluminum Substrate: 6061-T6 High-Thermal Aluminum (Thermal Conductivity ≥180W/m·K)
Insulation Layer	Nano-Ceramic-Filled Epoxy Resin (Withstand Voltage ≥4kV)
Thickness‌	Total Thickness: 1.5mm/2.0mm/3.0mm (Copper Layer Thickness: 35μm/70μm)
‌Solder Mask‌	Green Solder Mask, Thickness 25±5μm, Heat Resistance ≥260℃
Legend Marking‌	White/Yellow Characters, Alcohol-Resistant, Line Width ≥0.2mm
‌Surface Finish	OSP (Organic Solderability Preservative), Thickness 0.2-0.5μm, Meets IPC-6012
‌Key Processes‌	Etched Line Width Tolerance ±10%
Application‌	EV Motor Controllers

Why Choose Best Technology as Aluminum PCB Manufacturer?

Dual Quality Certification: IATF 16949 (automotive) + optional ISO 13485 (medical) compliance.
Premium Material Innovation: 8W/m·K aluminum nitride substrates, 4kV ceramic-filled insulation for high-power safety.
Cost-Optimized Supply Chain: 15-20% cost reduction via direct sourcing; tiered discounts (5% for 500+ units).
24-Hour Rapid Prototyping: Laser-cut prototypes with free DFM checks, reducing rework by 40%.
Turnkey Solution: Provide EV motor controller PCB one stop service, including prototyping, design, bulk production, assembly.
Full-Stack Engineering Support: ANSYS thermal simulation + EMC pre-scan (CISPR 25/DO-160 standards).
Extreme Environment Resilience: -40°C to +125°C operation; 20G vibration resistance; 1,000-hour damp heat testing.
Precision Manufacturing: ±3μm laser microvias; 2oz (70μm) copper for 200A+ current paths.
24/7 Technical Escort: 4-hour response for thermal runaway; 72-hour root-cause analysis.

Welcome to contact us if you have any inquiry for aluminum PCB: sales@bestpcbs.com.

Tags:aluminum pcb, EV motor controller
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

What is Double-sided copper substrate? Metal Core PCB

Friday, August 15th, 2025

If you need a double-sided copper PCB, are you curious?

What are the core advantages of a double-sided copper PCB?
How much better is the heat dissipation performance of a double-sided copper PCB than a single-sided one?
What complex designs can a double-sided copper PCB support?
What applications are double-sided copper PCBs suitable for?

BEST Technology, a professional copper PCB manufacturer, can answer your questions:

Double-sided wiring + dual copper surfaces for heat dissipation improves space utilization and doubles heat dissipation efficiency.
Dual copper layers for conduction + a highly conductive base material with a thermal resistance of ≤0.6°C/W improve heat dissipation efficiency by over 40% compared to single-sided PCBs.
Double-sided fine lines (line width/line spacing ≥3 mils) support via interconnects and locally thickened copper.
High-power LEDs, power modules, automotive electronics, and other applications require high-density wiring and strong heat dissipation.

What is a double sided copper substrate?

Double-sided copper substrate is a type of metal core PCB that has copper layers on both sides of a central core. The core is usually made from aluminum or copper, which provides strength and excellent thermal conductivity. This structure allows components to be mounted and circuits to be routed on both the top and bottom, giving more design flexibility and improving performance.

Because the core can spread heat quickly, it helps keep components cool even under heavy loads. This makes it suitable for demanding applications such as LED lighting, power modules, automotive systems, and industrial controls.

The ability to work on both sides allows for more compact designs, reducing the size of devices without compromising functionality.

What is the difference between single and double sided copper substrate?

The most obvious difference is the number of copper layers and how the circuits are arranged.

Single-sided copper substrate: Copper is applied to only one side of the core. It is simpler, less expensive, and ideal for straightforward designs with low component density.

Double-sided copper substrate: Copper is applied to both sides, and plated through-holes connect circuits between them. This design supports more complex routing, higher power handling, and better thermal management.

The choice between them depends on the product’s complexity, size constraints, and performance requirements. If you need to pack more functionality into a smaller space while keeping components cool, the double-sided option is the better choice.

What is the standard copper thickness for copper substrate?

Copper thickness is one of the most important specifications for any substrate. Common standards include:

1 oz/ft² (about 35 μm): widely used for general electronics.

2 oz/ft² (about 70 μm): for higher current and thermal demands.

3 oz or more: for heavy-duty power applications.

What is Double-sided copper substrate? Metal Core PCB

Thicker copper improves current capacity and heat dissipation but can increase cost and weight. Thinner copper is lighter and cheaper but less capable of carrying high currents. The choice must be made based on application requirements, balancing performance and cost-effectiveness.

How thick is a Double-sided copper substrate?

The total thickness depends on several layers:

Metal core: Usually 1.0 mm to 3.2 mm.

Copper layers: Typically 35 μm to 105 μm each.

Dielectric layer: 75 μm to 150 μm, thermally conductive but electrically insulating.

Combined, a double-sided copper substrate is often between 1.5 mm and 4.5 mm thick. Thinner boards are ideal for compact devices, while thicker ones offer more strength and better heat management.

What are the advantages of single-side copper substrates?

Although double-sided boards are more advanced, single-sided copper substrates still have clear benefits:

Lower production costs due to simpler manufacturing.

Faster fabrication timelines.

Easier inspection and repair since all traces are on one side.

Good durability in low-demand environments.

Perfect for applications where complexity and heat output are low.

For basic products, this can be the smarter and more economical choice.

What are the disadvantages of double-sided copper substrate?

Double-sided boards offer many strengths, but there are some limitations.

They cost more to produce due to the extra copper layer, drilling, and plating processes. Manufacturing time is also longer. Repairs can be challenging because components are placed on both sides, making rework more complex.

However, for high-performance products, these disadvantages are often outweighed by better circuit density, improved thermal performance, and extended lifespan. By choosing BEST Technology, these challenges can be effectively addressed.

How to do double-sided copper substrate?

Manufacturing involves precise steps to ensure quality:

Core preparation: Clean and treat the metal surface for adhesion.

Dielectric lamination: Apply thermally conductive, electrically insulating layers to both sides.

Copper foil bonding: Laminate copper sheets to each dielectric under heat and pressure.

Drilling: Create holes where circuits need connection between sides.

Plating: Coat hole interiors with copper to form conductive vias.

Circuit patterning: Use photolithography to define circuit traces.

Etching: Remove excess copper, leaving only the designed paths.

Solder mask application: Protect copper from oxidation and short circuits.

Surface finishing: Apply HASL, ENIG, or other finishes for solderability.

Each step requires accuracy, especially in drilling and plating, to guarantee electrical reliability.

How are double-sided copper substrates soldered?

Soldering methods vary depending on component type:

Reflow soldering is common for SMD components. Solder paste is applied, parts are placed, and the board is heated to melt the solder.

Wave soldering is often used for through-hole components, passing the board over molten solder.

Selective soldering is used for boards combining surface-mount and through-hole parts, targeting specific joints without affecting sensitive areas.

In all cases, heat control is critical to prevent damage to dielectric layers or plated through-holes.

What connects the metallic parts on the double-sided board of copper substrates?

The top and bottom copper layers are linked by plated through-holes (PTHs). These are drilled holes lined with copper to form a continuous electrical path.

PTHs carry signals, supply power, and provide grounding between sides. In thermal designs, thermal vias transfer heat from components to the metal core for dissipation. High-quality plating and precise drilling ensure these connections remain reliable throughout the board’s life.

Conclusion:

Double-sided copper substrate combines the strength of a metal core with the versatility of two copper layers. It delivers superior heat dissipation, higher circuit density, and better reliability for demanding applications. While more complex to produce than single-sided boards, its benefits make it an excellent choice for advanced electronics.

Contact: sales@bestpcbs.com for expert manufacturing support.

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