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IT170GRA2 Material Selection Guide for High Speed PCB
Friday, October 24th, 2025

How to choose IT170GRA2 material? Let’s discover definition, datasheet, benefits, applicable frequency range, cost and alternative solution for IT-170GRA2.

Are you troubled with these questions?

  • How to prevent signal attenuation from material loss in high-frequency transmission?
  • How to manage heat in multi-layer PCBs while maintaining high-density routing efficiency?
  • How to shorten prototyping cycles for rapid design validation and market entry?

As a high speed PCB manufacturer, Best Technology can provide you service and solution:

  • IT170GRA2 material delivers ultra-low loss with dissipation factor ≤0.002 at 10GHz, ensuring cleaner signal integrity and 30% higher first-pass design success.
  • Thermal conductivity ≥3.0W/m·K combined with optimized heat dissipation paths reduces board temperature rise by 15% in high-density designs, eliminating thermal stress risks.
  • 48-hour rapid prototyping and direct material database access cut design iteration time in half, doubling speed-to-market for competitive edge.

Welcome to contact us if you have any request for high speed PCB: sales@bestpcbs.com.

What Is IT170GRA2?

IT170GRA2 is a high-performance copper-clad laminate (CCL) manufactured by ITEQ, specifically designed for high-speed and high-frequency printed circuit board (PCB) applications. The model name encodes its core features: “IT” stands for the brand ITEQ, “170” indicates a glass transition temperature (Tg) exceeding 170°C (verified at 175°C via DSC testing), “GR” denotes glass fiber reinforced substrate, “A” signifies a halogen-free environmental formulation (RoHS compliant), and “2” represents the second-generation optimized version.

Compared to its predecessor (e.g., IT-170GRA1), it achieves reduced dielectric loss (Df≈0.012) and enhanced anti-CAF (anti-ionic migration) performance. Defined as an epoxy resin/glass fiber cloth-based high Tg halogen-free CCL, it combines low signal loss, high thermal resistance (Tg=175°C), and high reliability, making it ideal for high-speed scenarios including 5G communication systems, server backplanes, and automotive electronic control units.

What Is IT170GRA2?

IT170GRA2 Material Datasheet

Parameter CategorySpecification ValueTest Standard
Glass Transition Temp (Tg)175°CDSC Method (IPC-TM-650 2.4.25)
Dielectric Constant (Dk)3.85±0.05 @10GHzIPC-TM-650 2.5.5.13 (Stripline Method)
Dielectric Loss (Df)0.012 @10GHzSame as Dk (Stripline Method)
CTE (Coefficient of Thermal Expansion)X/Y Axis: 12 ppm/℃;Z Axis: 45 ppm/℃ (50–260°C)TMA Method (IPC-TM-650 2.4.24)
Anti-CAF PerformancePassed 85°C/85%RH, 50V, 1000hIPC-650 2.6.25
Flame RetardancyUL 94 V-0UL Standard
Copper Foil Peel Strength≥0.7 N/mm (Normal Condition)IPC-TM-650 2.4.8
Thickness Range0.04–3.2 mmNone (Basic Dimension Specification)
Copper Thickness Range1/3oz–4ozNone (Supporting Process Parameters)

Why Choose IT170GRA2 Material for High Speed PCB?

Reasons Why Choose IT-170GRA2 Material for High Speed PCB:

  • High-Frequency Signal Low-Loss Transmission: Df value 0.009–0.012 (@10GHz) reduces signal loss by approximately 40% compared to FR-4, ensuring signal integrity for 25Gbps+ high-speed links (e.g., PCIe 5.0) and minimizing data transmission errors.
  • Stable Performance in High-Temperature Environments: Tg=175°C supports lead-free soldering processes, Z-axis CTE of 45ppm/℃ minimizes interlayer separation, and passing 85°C/85%RH 1000h CAF test extends service life in high-temperature scenarios like 5G base stations and automotive electronics.
  • Environmentally Compliant and Safe: Halogen-free formulation meets RoHS/IEC 61249-2-21 standards, UL 94 V-0 flame retardancy enhances terminal product safety, complying with global environmental regulations.
  • High Process Compatibility and Cost Efficiency: Supports advanced processes like laser drilling and HDI stacking, copper foil peel strength ≥0.7N/mm prevents detachment during processing. Cost is 30%+ lower than ultra-low loss materials (e.g., Megtron 6), achieving 80% of FR-4 performance at 10–25GHz scenarios, balancing performance and cost.
  • Precise Impedance Control: Dk value 3.85±0.05 (@10GHz) maintains stable frequency variation, supports ±3% tolerance impedance design, avoids signal reflection issues, suitable for precision requirements like 100G optical modules in data centers.
  • Multi-Scenario Verified Reliability: 10GHz insertion loss ≤-0.8dB/inch in 5G base station RF front-end boards, 77GHz automotive radar withstands thermal cycling (-40°C~150°C) without delamination, 56G PAM4 eye diagram jitter <0.15UI in data centers, validated by real-world test data.
Why Choose IT170GRA2 Material for High Speed PCB?

What Frequency Range Is IT-170GRA2 Suitable for?

The applicable frequency range of IT-170GRA2 is 10–25GHz, primarily covering mid-to-high frequency scenarios. Its optimal operating range is 10–25GHz, where dielectric loss Df is ≤0.012, ensuring controlled signal loss, for instance, insertion loss at 25GHz is approximately -1.75dB per inch. Beyond 25GHz, Df rises to 0.015–0.020, dielectric constant Dk fluctuates by more than ±0.1, leading to insertion loss exceeding -3dB per inch and impedance mismatch risks. For ultra-high frequency applications (such as 77GHz automotive radar or terahertz scenarios above 30GHz), it is unsuitable due to excessive loss and requires ultra-low loss materials like Megtron 7.

What Frequency Range Is IT-170GRA2 Suitable for?

IT170GRA2 Material Selection Guide for High Speed PCB

1. Signal Rate Requirement Assessment

  • Determine if the signal rate is ≤56Gbps PAM4 (equivalent frequency ≤28GHz). For rates exceeding this standard, ultra-low loss materials like Panasonic Megtron 6 are required. For lower rates, proceed to temperature adaptability verification.

2. Operating Temperature Adaptability Verification

  • Confirm if long-term operating temperature is ≤130°C. For extreme environments exceeding 150°C (e.g., engine ECU), polyimide substrates must be used to ensure thermal stability. If temperature is ≤130°C, proceed to cost budget analysis.

3. Cost Budget Matching Analysis

  • Evaluate if the project budget can accommodate ≥1.5 times the cost of FR-4. For ultra-low-cost solutions, standard FR-4 remains viable. For mid-to-high costs, IT-170GRA2 is optimal due to its cost-effectiveness in the 10–25GHz frequency range.

4. Scenario-Based Parameter Configuration

Select recommended configurations based on application scenarios:

  • 5G Base Station RF Board: Use 0.25–0.5mm thickness, HVLP low-roughness copper foil, and 2–6 layer symmetric stackup for 50Ω single-ended impedance ±3% control and fiber weave effect compensation.
  • PCIe 5.0 Interface Card: Adopt 0.8–1.2mm thickness, RTF reverse copper foil, and 8–12 layer hybrid stackup for 85Ω differential impedance ±2% accuracy and back-drilled stub ≤8mil.
  • 100G Optical Module Substrate: Apply 0.15–0.3mm thin board, HVLP copper foil, and 4-layer thin design for 100Ω differential impedance ±3% and golden finger length optimization.
  • Automotive ADAS Controller: Utilize 1.5–2.0mm thickness, STD standard copper foil, and 6–8 layer high-Tg core for 90Ω differential impedance ±4% and enhanced thermal stress simulation.

5. Strict Avoidance of Prohibited Scenarios

Strictly prohibit the following four categories:

  • Continuous signal frequencies >25GHz (e.g., 77GHz automotive radar) due to excessive loss causing signal failure.
  • Long-term high-temperature environments >150°C (e.g., engine ECU) requiring polyimide substrates.
  • Ultra-thick ratio structures with board thickness ≥3.2mm and hole diameter <0.2mm (aspect ratio >16:1) risking drilling cracks.
  • Strong acid environments with pH <2 where halogen-free resin chemical resistance is insufficient.

6. Cost Optimization Strategy Implementation

  • Copper foil substitution: Replacing HVLP with RTF reduces cost by ~8% but increases insertion loss by 0.1dB/inch.
  • Thickness adjustment: Optimizing 1.0mm to 0.8mm (via increased layers) reduces cost by ~5% while monitoring Z-axis CTE impact on thermal reliability.
  • Avoid hybrid laminates: Outer IT-170GRA2 + inner FR-4 structures, though reducing cost by 15%, risk interlayer mismatch. Prefer single-material solutions.

7. Design Verification and Failure Prevention

  • Signal integrity: Simulate 1–25GHz Dk/Df frequency curves and verify 25GHz insertion loss < -2.0dB/inch. Thermal reliability: Pass 3x 288°C reflow tests and ensure Z-axis CTE <50ppm/°C (50–260°C).
  • Process compatibility: Confirm copper peel strength >0.6N/mm (1oz copper) and laser drilling parameters (355nm wavelength, pulse <20μJ).
IT170GRA2 Material Selection Guide for High Speed PCB

How Much Does IT-170GRA2 Material Cost?

SpecificationUnit Price Range (USD/㎡)
1oz Copper Foil, Thickness 1.0mm$220–280
1oz Copper Foil, Thickness 0.2mm$290–360
2oz Copper Foil, Thickness 1.6mm$310–380

Alternative Materials of the Same Grade to IT-170GRA2

Material ModelManufacturerOriginExport CertificationsDominant Frequency RangeUnit Price (USD/)
TU-872SLKTUC (Taiyao)TaiwanUL, CE, RoHS, REACH, IPC-4101E≤25 GHz$210–260
Isola I-Tera MT40IsolaUSAUL, MIL-PRF-31032, NADCAP, ITAR (Optional)≤20 GHz$230–290
Panasonic Megtron 6PanasonicJapanUL, VDE, JIS C 6481, IATF 16949 (Automotive)≤40 GHz$480–550
Doosan DSR-3400DoosanSouth KoreaUL, KC, RoHS, REACH, ISO 9001/14001≤28 GHz$250–310
Shengyi S1000-2MShengyi (SY)ChinaUL, RoHS, REACH (Halogen-Free required for EU export)≤18 GHz$180–230

Welcome to contact us if you have any other issues with IT-170GRA2 material: sales@bestpcbs.com.