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Copper Based PCB for Projector丨Best Technology
Friday, August 8th, 2025

Why choose copper based PCB for projector? Let’s explore definition, benefits, design guide and manufacturing process, case study for copper based PCB.

Are you still troubled by these issues?

  • Why do traditional PCBs flicker at high brightness?
  • Why are cooling fans becoming increasingly noisy?
  • Why are repair costs so high?

Best Technology offers copper substrate solutions:

  • Services: Custom copper-based PCB thermal conductive layers, with thermal conductivity reaching up to 398W/m·K.
  • (The copper layer directly connects to the bottom of the LED driver chip, dissipating 90% of heat in 0.3 seconds and improving image stability by 65%).
  • Services: Embedded copper block + micro-hole array design.
  • (A 2oz thickened copper layer combined with a 0.4mm heat dissipation hole array reduces thermal resistance to 0.4°C/W and reduces fan speed by 40%).
  • Services: Anti-oxidation surface treatment for copper substrates.
  • (Nickel-gold plating on the copper layer, salt spray resistance exceeding 500 hours, extending device life to 50,000 hours).

Welcome to contact us if you have any request for copper based PCB: sales@bestpcbs.com.

What Is Copper Based PCB?

Copper based PCB (also called copper substrate PCB) is a printed circuit board with a copper core layer designed for superior thermal conductivity. It efficiently dissipates heat from high-power components in applications like LEDs, power supplies, and projectors, outperforming traditional FR4 boards. The copper core (typically 0.5-3.0mm thick) ensures reliable performance in thermally demanding environments.

What Is Copper Based PCB?

Why Choose Copper Based PCB for Projector?

  • Superior Heat Dissipation‌: Copper core (300-400 W/m·K) efficiently transfers heat away from high-power LEDs/Laser diodes, preventing thermal throttling and extending projector lifespan.
  • Compact & Lightweight‌: Enables thinner projector designs (0.5-3.0mm thick) without sacrificing cooling performance, ideal for portable and home theater systems.
  • Reliable Performance‌: Stable operation under continuous high-power loads (50W+), reducing flickering risks and maintaining consistent brightness.
  • Cost-Effective Longevity‌: Lower maintenance costs due to reduced thermal stress on components, minimizing failures and warranty claims.
  • Industry Standard for High-Brightness Models‌: Trusted by top projector brands for 4K/ultra-short-throw models demanding rigorous thermal management.

How to Design a Projector Copper Based PCB?

1. Requirements Analysis and Planning

  • Defining Parameters: Determine projector power (e.g., 300W LED light source), size (e.g., compact size ≤ 200mm²), heat dissipation requirements (temperature rise ≤ 85°C), and EMC standards (e.g., CISPR 32).
  • Material Selection: Select the copper substrate type (single-sided/double-sided/multi-layer) and thickness (1.0-3.0mm). Use high-thermal-conductivity PP material (0.1-0.3mm thickness) for the insulation layer.

2. Schematic Diagram and Layout Design

  • Modular Layout: Divide modules by function (e.g., light source driver, signal processing). Heat-generating components (LEDs, laser diodes) are concentrated at the board edges, utilizing the copper substrate edges for heat dissipation.
  • Core Component Positioning: Prioritize placement of the DMD chip and laser light source, ensuring precise alignment with the optical components (error ≤ 0.1mm).

3. Thermal Design and Simulation

  • Copper Thickness Step Design: Use a 3-4oz copper layer in the core heat-generating area, tapering to 2oz at the periphery. A teardrop-shaped transition (angle ≤ 45°) is used to reduce thermal stress.
  • Via Array Optimization: Arrange 0.3mm diameter heat dissipation vias (density ≥ 4 vias/cm²), combined with heat pipes (diameter 1.5mm) or phase change materials to enhance local heat dissipation.
  • Simulation Verification: Use ANSYS Icepak to simulate heat distribution, ensuring hotspot temperature rise ≤ 15°C, and adjust via placement and copper thickness.

4. Signal and Power Design

  • High-Speed Signal Routing: HDMI/VGA signal lines should be short and straight, avoiding 90-degree corners. Use serpentine routing to compensate for delays (differential line length error ≤ 5 mil).
  • Power Distribution: Separate power and ground planes, with ground trace widths ≥ power lines (e.g., 10A power trace width ≥ 2mm). Critical signals (such as clocks) should be ground-wrapped, and return vias should be added when switching differential signal layers.

5. Manufacturing and Assembly Considerations

  • Drilling Specifications: Hole diameters should meet the board thickness ratio (≤ 10:1) to avoid drill contamination, and depth-to-aperture ratios ≤ 0.8:1.
  • Surface Treatment: Use immersion gold (Immersion Gold) (Ni thickness 3-5μm, Au 0.05-0.1μm) to prevent deformation of the copper substrate caused by tin spraying.
  • Machining: Milling is used for copper substrate cutting, with edge chamfers of 0.8-1mm and a ≥2mm keep-out zone around the screw holes.

6. Verification and Testing

  • DRC Check: Ensure there are no shorts or opens, and that line widths and spacing meet manufacturing capabilities (e.g., minimum line width 0.1mm).
  • Prototype Testing: Test thermal performance (temperature rise ≤ 85°C), signal integrity (eye diagram test), and mechanical strength (vibration test).
How to Design a Projector Copper Based PCB?

How to Make a Projector Copper Based PCB?

1. Cutting and Pretreatment

  • Substrate Cutting: The raw copper substrate (double-sided or single-sided) is cut into production panels according to the designed dimensions, with a typical thickness of 1.0-3.0mm.
  • Edge Treatment: The board edges are processed using an automatic edge grinder and corner filleter to remove burrs and chamfer the edges by 0.8-1mm.
  • Cleaning and Baking: The board surface is cleaned to remove oxide layers and contaminants, and then baked at a high temperature (120-150°C) to relieve stress.

2. Inner Layer Circuit Fabrication

  • Pretreatment: Chemical cleaning of the copper surface is performed to increase roughness and improve dry film adhesion.
  • Dry Film Lamination: A photosensitive dry film (15-25μm thick) is applied by hot pressing to cover the copper surface.
  • Exposure and Development: UV exposure is used to transfer the circuit pattern, and a developer (1% Naâ‚‚CO₃) is used to remove the uncured dry film.
  • Etching: An acidic copper chloride solution is used to etch the exposed copper areas, forming the inner layer circuits. The line width tolerance is ≤±10%.
  • Film Stripping and Inspection: A strong alkaline solution is used to remove the protective dry film, and AOI is used to inspect for circuit defects (shorts, opens).

3. Lamination and Heat Dissipation Enhancement

  • Brown Treatment: Chemically roughens the copper surface of the inner layer to enhance interlayer bonding.
  • Lamination and Lamination: The layers are stacked in the order of “copper foil – prepreg (PP) – inner layer – PP – copper foil” and pressed using a vacuum laminator (temperature 180-200°C, pressure 30-50 kg/cm²).
  • Heat Dissipation Vias: Laser drilled (hole diameter 0.3mm, density ≥ 4 holes/cm²), electroplated with copper (20-25μm) on the hole walls, and filled with thermally conductive silicone.
  • Copper Block Embedding: T-shaped copper blocks (2.5mm thick) are embedded in the high-heat zone, ensuring 100% contact with the light source module.

4. Outer Layer Circuitry and Plating

  • Outer Layer Dry Film: Repeat the inner layer process, attach the dry film, and expose and develop, leaving the areas to be plated.
  • Electroplating Thickening: The copper layer is thickened to the designed thickness (e.g., 2oz in the HDMI signal area), and tin is simultaneously plated to protect the pads.
  • Etching and Tin Stripping: Etching removes unprotected copper, and then using a tin stripping solution to remove the tin layer, exposing the complete outer layer circuitry.

5. Solder Mask and Surface Treatment

  • Solder Mask Printing: Screen-print solder mask ink (primarily green) to cover non-solderable areas.
  • Curing: UV exposure cures to retain the solder mask layer, followed by high-temperature baking (150°C) for hardening.
  • Surface Treatment: Immersion Gold (5μm Ni, 0.1μm Au), with key pads locally thickened to 0.2μm.

6. Forming and Inspection

  • Outer Fabrication: PCB contours are cut using a CNC milling machine, and panels are separated using a V-cut assembly.
  • Electrical Testing: Flying probe testing is used to check connectivity and insulation resistance.
  • Final Inspection: Visual inspection or AOI inspection is performed to check appearance (e.g., ink misalignment, board warping), ensuring compliance with IPC-A-600 standards.

7. Packaging and Shipping

  • Vacuum Packaging: Vacuum-sealed in anti-static bags to prevent oxidation.
  • Test Report: Includes thermal distribution diagrams, signal integrity data, and reliability test results (such as a 500-hour burn-in test).

Our Projector Copper Based PCB Case Studies

At Best Technology, we have accumulated 19 years expertise in manufacturing projector copper-based PCBs, having successfully delivered multiple high-end projects for global clients. With a focus on thermal management, mechanical precision, and signal integrity, our solutions have resolved critical challenges such as high-power LED/laser heat dissipation, PCB deformation control, and ultra-high-definition signal transmission (e.g., 4K/8K HDMI 2.1). Each case applies customized copper-layer thickness zoning, embedded thermal structures, and advanced surface finishes, ensuring devices meet rigorous performance and reliability standards. This is a projector copper base PCB case we made before for your reference:

Our Projector Copper Based PCB Case Studies

Attached is specification for this case:

ParameterSpecification
Substrate TypeDouble-Sided Copper
Copper Foil Thickness (Light Source Area)3oz (105μm)
Copper Foil Thickness (Signal Area)1oz (35μm)
Insulation MaterialHigh-Performance Polypropylene (Thermal Conductivity: 3.0W/m·K)
Insulation Thickness0.2mm
Substrate Thickness2.0mm
Heat Dissipation Vias0.3mm Diameter, 6 Holes/cm², Filled with Thermally Conductive Silicone
Embedded Copper BlockT-Shaped Copper Block (2.5mm Thickness), 100% Contact Area
Surface FinishImmersion Gold (Ni: 5μm, Au: 0.1μm)
Key Pad ThickeningLocalized 0.2μm Au Layer
Machining2mm Screw Hole Keepout Area, 1mm Edge Chamfer

Why Choose Best Technology as Copper Based PCB Supplier?

Reasons why choose us as copper based PCB supplier:

  • 19+ Years Industry Experience: Leverages proven expertise to navigate high power projector. Stringent Quality Certifications (ISO9001, ISO13485, and IATF16949): Ensures product consistency and compliance with global standards.
  • Custom Thermal Management Solutions: Optimize Thermal Management and extending projector lifespan and reliability.
  • Competitive Pricing: Affordable pricing without compromising quality, ideal for cost-sensitive projects.
  • 24 Hours Rapid Prototyping: Accelerates time-to-market, meeting urgent production demands.
  • Free DFM (Design for Manufacturability) Service: Identifies design flaws early, reducing rework costs and delays.
  • Strict Quality Control – 100% automated optical inspection (AOI) for bulk orders.
  • Reliable Supply Chain – Stable material sourcing to avoid delays and ensure consistency.
  • Full Turnkey Solution –Providing one-stop services from design to delivery, integrating materials, processes and thermal management technologies to ensure high heat dissipation performance and reliability while significantly reducing supply chain complexity and project risks.
Why Choose Best Technology as Copper Based PCB Supplier?

Our Copper Substrate PCB Capabilities

ItemsTechnical Parameters
Product modelCopper Based
Copper trace thickness1OZ, 2OZ, 3OZ, 4OZ, up to 10OZ
Thermal Conductivity1.0, 1.5, 2.0, 3.0W/m.K
Surface finishingHAL(LF)/ Gold Immersion/ Gold plating/ OSP/ Immersion Tin/ Silver Immersion
Soldermask ColorWhite/Black/Green/Blue/Red/Yellow
Layers1L, 2L, 4L, 6L, 8L, double sided, COB
Maximum dimension1,100mm*480mm; 1,500x300mm
Minimum dimension5mm*5mm
Minimum Line width/space0.1mm/0.1mm
Warp and twist rate≤0.75%(thickness:1.6mm, measurement:300mm×300mm)
Board Thickness0.3ï¼4.5mm
Die-Punching dimension tolerance±0.15mm
V-cut positioning tolerance±0.1mm
Manufacturing capability6000m2
Wall Cu thickness15-25um
Alignment tolerance±0.076mm
Minimum diameter of die-punching holeThickness <=1.0mm:   1.0mm
Thickness 1.2-3.0mm: 1.5mm
Thickness 4.0mm: 2.0mm
Minimum size the square groove/slot/cutoutThickness <=1.0mm:  0.8mm×0.8mm
Thickness 1.2-3.0mm:  1.0×1.0mm
Thickness 4.0mm:  1.5×1.5mm
Outline ToleranceCNC routing:±0.1mm; Die-punching:±0.15mm
Minimum diameter of hole0.3mm; not limit for maximum diameter of hole
Surface Finishing Thicknessgold plating:Ni 2.5-5um,  Au: 0.025ï¼0.075um
immersion gold: Ni 3-6um, Au: 0.025-0.1um
HAL(LF): 3-30um
Vï¼cut Angle tolerance±5°
V-cut Range0.3mm-4.5mm
Smallest silkscreen height0.15mm
Smallest PAD0.1mm

How to Get a Quote for Your Copper Based PCB?

Materials to be submitted:

  • Design Documents: Gerber files, BOM, 3D structural drawings (with mechanical dimensions).
  • Technical Parameters: Copper foil thickness zoning (e.g., 3oz for the light source area), insulation layer thermal conductivity (≥3.0W/m·K), surface treatment requirements.
  • Special Requirements: Thermal via density, copper block size, high-speed signal impedance control (±10%).
  • Order Information: Quantity (batch/sample), delivery time.

Contact Best Technology now and submit your material list to get a quote: sales@bestpcbs.com.

Copper Substrate PCB Design & Supplier, Fast Delivery
Thursday, July 31st, 2025

Looking for copper substrate PCB solution? Let’s discover benefits, applications, design specifications and guide for copper substrate PCB.

Are you troubled with these issues?

  • Why does your 5G base station PCB frequently drop connections at high temperatures?
  • Why do LED car headlights always lose light so quickly?
  • Why is signal loss in high-frequency communication modules so high?

Best Technology can provide solutions

  • 72-hour express delivery system: Equipped with a fully automated laser drilling line, mass production orders ship within 3 days (including special insulation layer curing).
  • Cost optimization expert system: Unique copper thickness gradient design reduces raw material costs by 12% while ensuring performance.
  • Full-process thermal management solution: Provides a complete cooling solution from thermal simulation to mass production, reducing measured temperature rise by 28°C.

Welcome to contact us if you have any request for metal core PCB: sales@bestpcbs.com.

What Is the Definition of Copper Substrate PCB?

A Copper Substrate PCB is a type of printed circuit board that uses copper as the base material instead of traditional substrates like FR4 (fiberglass) or ceramic. In this type of PCB, a thick copper layer (usually much thicker than standard copper foil used in conventional PCBs) serves as the core or foundation for building the circuit. The copper substrate provides excellent thermal conductivity, electrical performance, and mechanical stability, making it ideal for high-power and high-heat applications such as power electronics, LED lighting, and automotive systems.

What Is the Definition of Copper Substrate PCB?

What Are Benefits of Copper Substrate PCB?

Advantages of copper substrate PCB:

Superior Thermal Management

  • Conducts heat 8x faster than standard FR4 PCBs (398W/mK vs. 0.3W/mK).
  • Reduces junction temperature by 15-30%, extending component lifespan.

Enhanced Electrical Performance

  • Lower impedance & better signal integrity for high-frequency applications (5G, RF).
  • Stable dielectric properties (Dk≤3.5) minimize signal loss.

Mechanical Durability

  • Withstands 3x higher mechanical stress than aluminum substrates.
  • Ultra-low thermal expansion (16.5ppm/℃) prevents warping at high temperatures.

Cost-Effective Longevity

  • 50% smaller heat sink requirements cut system cooling costs.
  • 30% longer operational life reduces replacement frequency.

Design Flexibility

  • Supports fine-line etching (0.1mm traces) for compact high-power designs.
  • Compatible with multi-layer stacking for complex circuits.
What Are Benefits of Copper Substrate PCB?

What Are Applications of Copper Based PCB?

  • High-Power LED Lighting – Superior heat dissipation (398W/mK thermal conductivity) ensures stable performance in LED arrays and automotive headlights
  • Power Electronics – Used in server power supplies, inverters, and motor drivers, handling currents up to 200A with 6oz copper foil
  • Automotive Systems – Critical for EV charging (OBC/BMS) and engine control units (ECUs), withstanding high temperatures (150℃+) and vibrations
  • Telecommunication Base Stations – Supports 5G RF components due to low signal loss and EMI shielding
  • Industrial Equipment – Welding machines, laser drivers, and UPS systems leverage its high current capacity (30A/mm²)
  • Aerospace & Defense – Radar systems and high-energy lasers rely on its thermal stability and reliability (MTBF >100k hours)
  • Medical Devices – Ensures precision in imaging equipment and surgical tools with minimal thermal expansion

Copper Based PCB Design Specification

ParameterTechnical SpecificationNote
Copper Thickness1oz (35μm)/2oz (70μm)/3oz (105μm)For high-current applications, ≥2oz is preferred; 1oz for cost reduction
‌Base MaterialOxygen-free copper (purity ≥99.5%)High conductivity (58MS/m) minimizes signal loss
Thermal PerformanceThermal conductivity ≥398W/mKEnsures ≤30℃ temperature rise for power devices
‌Insulation Voltage≥3000VACEnhances safety and meets UL certification
Trace Width/SpacingMinimum 0.1mm (4mil)Supports high-density routing with laser drilling
‌Current Capacity1oz: 1A/mm², 2oz: 2A/mm²Reduces thermal risks in high-current designs
Surface FinishENIG/HASL/OSPENIG for reliability, HASL for cost sensitivity

Copper Substrate PCB Design Guide

1. Substrate Material

    • Prioritize high-thermal-conductivity copper substrates (e.g., aluminum, copper, or iron substrates) with thermal conductivity ≥1 W/(m·K).
    • Select copper foil thickness (typically 35μm–210μm) based on current-carrying requirements.
    • Insulation layers must be high-temperature-resistant and highly insulating (e.g., polyimide or modified epoxy resin).

    2 Layer Stack-Up

    • Single-layer copper substrates: Suitable for simple thermal management (e.g., LED lighting).
    • Multi-layer copper substrates: Use prepreg for interlayer insulation to prevent delamination due to thermal stress.

    3. Routing Optimization

      • Use wide traces (≥0.5 mm for 1 oz copper) for high-current paths to minimize heating.
      • Separate signal and power traces to avoid electromagnetic interference (EMI).
      • Avoid sharp 90° bends; use 45° chamfers or arc transitions.

      4. Thermal Design

        • Place thermal copper pads beneath critical components (e.g., MOSFETs, ICs) and connect them to the copper substrate via thermal vias.
        • Thermal vias: Diameter ≥0.3 mm, spacing ≤1.5 mm, filled with thermally conductive material (e.g., silver paste).

        5. Lamination & Etching

          • Lamination temperature: 180–200°C, pressure ≥30 kg/cm² to ensure adhesion between copper and insulation layers.
          • Use alkaline etching solutions to avoid undercutting and maintain trace width accuracy.

          6. Surface Finish

            • Recommend ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) for oxidation resistance and soldering reliability.
            • Apply anti-oxidation treatment (e.g., nickel or tin plating) to copper substrate surfaces.

            7. Thermal Performance Testing

              • Conduct thermal cycling tests (-40°C to 125°C, ≥100 cycles) to verify material compatibility of thermal expansion coefficients.
              • Use infrared thermal imagers to detect hotspots; ensure temperature rise ≤30°C under full load.

              8. Electrical Performance Verification

                • Impedance control: Adjust trace width/spacing based on signal speed, with tolerance ≤10%.
                • High-voltage testing: Insulation layer withstand voltage ≥500 V AC, leakage current ≤1 mA.

                9. Cost Control

                  • Simplify layer count; prioritize single- or double-layer designs.
                  • Use standardized substrate sizes (e.g., 100 mm × 100 mm) for mass production.

                  10. Gerber File Requirements

                    • Clearly mark copper substrate areas (e.g., .GTO layer) to distinguish signal and thermal layers.
                    • Provide 3D assembly drawings with component height and thermal structure clearance annotations.

                    11. DFM (Design for Manufacturability) Check

                      • Minimum trace width/spacing ≥0.2 mm, via diameter ≥0.3 mm.
                      • Avoid placing critical components within 5 mm of substrate edges.
                      Copper Substrate PCB Design Guide

                      Why Choose Best Technology as Copper Substrate PCB Supplier?

                      Reasons why choose Best Technology as copper substrate PCB supplier:

                      • 24-Hour Rapid Prototyping: Accelerate product validation by 5x, beat competitors to market.
                      • A Week Mass Production Turnaround: Eliminate supply chain bottlenecks during peak seasons.
                      • Thermal Performance Optimization: Reduce power module temperatures by 25%, extend product lifespan.
                      • Cost-Efficient Material Solutions: Achieve 15% higher profitability for LED/5G products.
                      • High-Density Routing Expertise: Miniaturize IoT devices without sacrificing performance.
                      • Global ISO/RoHS/REACH/UL Compliance: One-step certification for EU/US markets.
                      • Smart DFM Support: Avoid costly redesigns with first-pass success guarantee.
                      • Flexible Order Capacity: 100-100,000+ panel batch production capability.
                      Why Choose Best Technology as Copper Substrate PCB Supplier?

                      Our Copper Substrate PCB Capabilities

                      Base material:Copper
                      Thermal Conductivity (dielectric layer):0.8, 1.0, 1.5, 2.0, 3.0 W/m.K.
                      Board Thickness:0.5mm~3.0mm(0.02″~0.12″)
                      Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ
                      Outline:Routing, punching, V-Cut
                      Soldermask:White/Black/Blue/Green/Red Oil
                      Legend/Silkscreen Color:Black/White
                      Surface finishing:Immersion Gold, HASL, OSP
                      Max Panel size:600*500mm (23.62″*19.68″)
                      Packing:Vacuum/Plastic bag
                      Samples L/T:4~6 Days
                      MP L/T:5~7 Days

                      Our Quality Inspection & Certification

                      • Certified & Compliant Standards: ISO 9001, ISO 13485, IATF 16949 Certified, and UL, REACH, RoHS Compliant.
                      • AOI (Automated Optical Inspection): Detects surface defects like open/short circuits, missing components, and soldering issues.
                      • X-Ray Inspection (Internal Defect Screening): Checks solder joint voids, cracks, and BGA/QFN hidden defects.
                      • Peel Strength Test (Adhesion Assessment): Quantifies copper-clad laminate bonding force (ASTM D903).
                      • Aging Test (Environmental Stress Screening): Includes thermal cycling (-40℃~85℃) and humidity exposure to validate long-term reliability.
                      • Dimensional Verification (CMM/Profilometer): Measures thickness (±0.1mm), flatness, and hole alignment accuracy.

                      How to Get A Quote For MCPCB Project?

                      To ensure an accurate and fast quotation, please provide the following details:

                      ‌1. Required Technical Specifications‌

                      • Layer Count‌ (1L/2L/Multilayer)
                      • ‌Base Material‌ (Aluminum/Copper/Ceramic) & Thickness
                      • ‌Copper Weight‌ (1oz/2oz/3oz)
                      • ‌Board Dimensions‌ (Length × Width ± Tolerance)
                      • ‌Special Requirements‌ (Impedance control, blind/buried vias, etc.)

                      2. Files to Submit‌

                      • Gerber Files‌ (RS-274X format preferred)
                      • ‌Drill Files‌ (Excellon format)
                      • ‌Stackup Diagram‌ (If multilayer)
                      • ‌Schematic & BOM‌ (For assembly projects)

                      3. Additional Information‌

                      • Quantity‌ (Prototype/Bulk order)
                      • ‌Preferred Lead Time‌ (Standard/Expedited)
                      • ‌Surface Finish‌ (ENIG/HASL/OSP, etc.)

                      Why Choose Best Technology?‌

                      • ‌24H Rapid Prototyping‌ – Fast-track your product launch.
                      • ‌Cost-Effective Solutions‌ – Optimized designs save 10–15% on material costs.
                      • ‌Reliability‌ – 99.8% first-pass yield for high-power applications.

                      Get Your Quote Today!‌ Contact us at sales@bestpcbs.com with your project details.