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What is a Copper Clad PCB? Copper Clad Laminate (CCL)
Thursday, August 21st, 2025

Copper clad PCB are a core material for printed circuit boards (PCBs). Composed of an insulating substrate and copper foil, these materials are heat-pressed to form a composite. They both support components and provide conductive circuits. Depending on the substrate, these materials can be categorized as paper, fiberglass, composite, or metal. They are widely used in consumer electronics, communications, automotive, and industrial control applications.

What is a Copper Clad PCB? Copper Clad Laminate (CCL)

Are you curious about Best Technology’s copper clad PCBs?

  • Does the insulation performance meet circuit insulation requirements?
  • Can the material strength withstand the processing and usage environment?
  • Is the performance and cost balance balanced?
  • Does BEST Technology provide customization and after-sales support?

Best Technology’s copper clad PCB can answer these questions.

  • Compatible. Supports standard sizes and customized specifications (thickness, shape), adapting to different PCB design requirements, and enabling fast response for small batches.
  • Performance. The base material is highly resistant to bending and impact, and can withstand cutting, drilling, and other processing processes, preventing cracking or deformation after long-term use.
  • Achieve. Performance meets industry standards, with over 100 board options for cost optimization, balancing reliability and affordability.
  • Provide. Supports customization of materials, specifications, and processes. After-sales service includes rapid response and warranty services, and expedited orders ship within 24 hours.

What is copper clad in PCB?

Copper clad PCB refers to a board where a thin layer of copper foil is bonded to one or both sides of a substrate, usually fiberglass or other insulating material. This copper layer forms the conductive surface where circuit patterns are later etched.

Without this copper cladding, a PCB would just be an insulator with no ability to carry signals. By laminating copper onto the substrate, the board gains electrical conductivity and becomes the foundation for electronic circuits.

The copper clad board is then processed through techniques like imaging, etching, and drilling to create pathways that allow electricity to flow between components.

In short, a copper clad PCB board is the starting point for almost every PCB. It bridges the gap between insulating materials and conductive pathways.

How thick is PCB copper clad?

Copper thickness is one of the most critical specifications in any copper clad PCB sheet. It directly affects current-carrying capacity, heat dissipation, and durability.

The thickness of copper in PCBs is usually measured in ounces per square foot (oz/ft²). Here’s what it typically looks like:

  • 0.5 oz/ft² copper → about 18 microns thick
  • 1 oz/ft² copper → about 35 microns thick
  • 2 oz/ft² copper → about 70 microns thick
  • 3 oz/ft² and above → heavy copper, often used for power electronics
What is a Copper Clad PCB? Copper Clad Laminate (CCL)

Standard consumer electronics often use 1 oz copper. High-power applications may need 2 oz or more to handle higher currents without overheating.

So, when choosing a PCB copper clad board, thickness depends on your circuit’s power requirements and performance needs.

What are the materials of copper clad laminate (CCL)?

The copper clad laminate (CCL) is not just copper. It’s a composite material made of multiple layers. Each one has a specific role.

Here are the primary materials used:

1. Copper Foil

  • Conductive layer
  • Provides the pathways for current flow
  • Usually treated to improve adhesion

2. Resin System

  • Often epoxy or modified epoxy
  • Acts as a binder
  • Provides mechanical strength

3. Reinforcement Material

  • Fiberglass cloth is the most common
  • Ensures dimensional stability
  • Improves heat resistance

4. Additives

  • Flame retardants
  • Fillers for mechanical stability
  • Special compounds for high-frequency applications

The combination of these elements gives the copper clad laminate PCB its strong insulation, mechanical toughness, and long-term reliability.

What is a PCB with copper clad on only one side called?

PCB with copper laminated on only one side is known as a single-sided copper clad board. It’s the simplest form of PCB copper clad laminate.

These are widely used in low-cost and less complex electronic devices. For example:

  • Calculators
  • Power supplies
  • LED lighting modules
  • Consumer gadgets

On the other hand, a double sided copper clad PCB board has copper foil on both sides. This allows more complex designs and higher component density.

Therefore, depending on the complexity of the circuit, a single-sided or double-sided option can be chosen.

What are the types of copper clad laminate (CCL)?

Copper clad laminates are available in different types to suit varied applications. Here are the main categories:

What is a Copper Clad PCB? Copper Clad Laminate (CCL)

Based on Substrate

  • Paper-based (phenolic resin) → Affordable, good for household appliances
  • Glass fabric (epoxy resin) → More durable, widely used in general electronics
  • Composite CCL → A mix of paper and fiberglass

Based on Copper Foil

  • Electrolytic copper foil → Smooth surface, ideal for precision circuits
  • Rolled annealed copper foil → Excellent ductility, used in flexible PCBs

Based on Application

  • General-purpose CCL → Cost-effective and widely used
  • High-frequency CCL → Designed for RF and microwave devices
  • High-speed CCL → Used in data communication systems
  • Thermal conductive CCL → Great for LED and power devices

Each type of copper clad laminate PCB material is designed to handle unique performance demands.

Why use a copper clad PCB board?

Copper clad PCBs bring several advantages that make them a preferred choice:

  • Excellent Conductivity: Copper provides stable and reliable current flow.
  • Thermal Management: Thicker copper spreads heat efficiently, preventing damage.
  • Mechanical Strength: Fiberglass reinforcement adds stability.
  • Design Flexibility: Available in single, double, or multilayer forms.
  • Cost Efficiency: Paper-based and FR4 laminates reduce manufacturing costs.

These advantages have led to the widespread use of copper clad PCBs in consumer electronics, automotive systems, and medical devices.

What is copper clad used for?

Copper clad boards serve as the base for many electronic products. Some key applications include:

1. Consumer Electronics

  • Smartphones, tablets, laptops
  • Wearable devices

2. Automotive Electronics

  • Control modules
  • Safety systems
  • Infotainment units

3. LED Lighting

  • High thermal conductivity versions
  • Used in LED lighting aluminum substrates

4. Industrial Control Systems

  • Robust designs for high current
  • Suitable for harsh environments

5. Medical Devices

  • Compact and reliable circuits
  • Long-term performance stability

In short, copper clad PCBs are used anywhere reliable electronic connections are required.

How to choose a copper clad board for PCB?

Choosing the right copper clad laminate PCB requires balancing performance, cost, and application needs. Here’s how you can decide:

What is a Copper Clad PCB? Copper Clad Laminate (CCL)

1. Power Requirements

  • High current? Choose thicker copper.
  • Low power? Standard 1 oz copper is enough.

2. Frequency Performance

  • For RF or high-speed circuits, select low-loss laminates.
  • For simple circuits, FR4 is cost-effective.

3. Thermal Demands

  • LEDs and power devices benefit from thermal conductive laminates.

4. Design Complexity

  • Single-sided for simple devices.
  • Double-sided or multilayer for complex designs.

5. Budget Considerations

  • Paper-based laminates are cheaper.
  • Glass-fiber laminates offer longer life.

By considering these factors, you can select the best copper clad board PCB for your project.

At Best Technology, we specialize in PCB copper clad laminates that meet international standards and deliver long-term reliability. If you are seeking a trustworthy supplier for your copper clad PCB boards, our team is here to help. Contact us today at sales@bestpcbs.com

Copper Laminate PCB Design Guide丨MCPCB Manufacturer
Thursday, July 31st, 2025

Looking for copper laminate PCB solution? This blog discover its material, specification, benefits, applications, design guide for LED lighting, manufacturing process.

Are you worried about these problems?

  • Uneven heat dissipation leads to a dramatic reduction in component lifespan. How can we overcome thermal management challenges?
  • High-frequency signal integrity is insufficient. How can we balance electromagnetic compatibility and transmission efficiency?
  • Low-volume customization leads to long lead times. How can we balance flexibility and cost control?

Best Technology can provide solutions include:

  • Gradient heat dissipation structure design: Through optimized three-dimensional heat conduction paths, it achieves a temperature drop of over 15°C in hotspots, extending device lifespan.
  • Low-impedance electromagnetic shielding layer: Utilizing high-purity aluminum-based nano-plating technology, signal transmission loss is reduced to 0.3dB/cm.
  • Agile and flexible production lines: Prototyping within 48 hours, supporting minimum orders of 10 pieces, and reducing mass production cycle time by 30%.

Welcome to contact us if you have any request for metal core PCB: sales@bestpcbs.com.

What Is Copper Laminate PCB?

A Copper Laminate PCB is a printed circuit board base material that consists of an insulating substrate (such as FR4, CEM-1, ceramic, or metal core) that is laminated with a thin layer of copper foil on one or both sides. This copper layer is later etched to create electrical pathways or circuit traces, which connect and support electronic components.

What Is Copper Laminate PCB?

What Is Material of Copper Clad PCB?

Materials of Copper Clad Laminate (CCL) PCB

Base Substrate Materials:

  • Epoxy Resin (FR-4): Most common, combining glass fiber cloth with epoxy for rigidity and insulation.
  • Polyimide (PI): Used in flexible PCBs for high-temperature resistance and bendability.
  • Phenolic Resin: Low-cost option for paper-based CCLs, suited for simple circuits.
  • PTFE (Teflon): High-frequency applications due to ultra-low dielectric loss.

Reinforcement Materials:

  • Glass Fiber Cloth (E-glass): Primary reinforcement in rigid CCLs for strength and stability.
  • Paper/Cellulose: Used in cost-sensitive, low-performance boards.
  • Polyester/PET Film: Base for flexible CCLs in lightweight designs.

Conductive Layer

  • Electrolytic Copper Foil: Purity ≥99.8%, thickness ranges from 18μm (0.5oz) to 105μm (3oz).
  • Rolled Copper Foil: Smoother surface for high-frequency signals.

Specialty Materials

  • Metal-Core (Aluminum/Copper): For high-power LED and automotive PCBs, offering superior heat dissipation.
  • Ceramic-Based: High thermal conductivity for RF/microwave circuits.

Adhesive Systems

  • Modified Epoxy: Bonds copper foil to substrates, ensuring peel strength ≥1.0N/mm.
  • Acrylic/Polyimide Adhesives: Used in flexible CCLs for dynamic bending applications.

Copper Clad Laminate PCB Specification

ParameterStandard Values
Base MaterialMetal-Core (Cu)
Copper Foil Thickness18μm–105μm (0.5oz–3oz)
Dielectric Constant (Dk)3.8–4.5 (FR-4), 2.5–3.5 (PTFE)
Dissipation Factor (Df)0.015–0.025 (FR-4), <0.005 (PTFE)
Thermal Conductivity150–400 W/m·K (Metal-Core)
Peel Strength≥1.0 N/mm (Cu-to-substrate)
TG RatingTg 130°C–170°C (Standard/High-Tg)
Flammability RatingUL94 V-0 (Halogen-free options)

What Are Benefits of PCB Copper Clad Laminate?

  • Enhanced Signal Integrity: Lowers ground impedance, reducing noise and interference in digital circuits (e.g., pulse current paths are optimized).
  • Improved Heat Dissipation: Copper’s high thermal conductivity (≈400 W/m·K) helps distribute heat evenly, preventing hot spots.
  • Mechanical Stability: Reinforces PCB structural integrity during manufacturing, reducing warping and deformation.
  • EMI/RFI Shielding: Acts as a natural shield against electromagnetic interference, protecting sensitive components.
  • Design Flexibility: Supports high-density interconnects (HDI) and advanced techniques like blind/buried vias for compact electronics.
  • Cost-Effective Manufacturing: Simplifies processes (e.g., plating-filled vias for reliable connections) while maintaining performance.
What Are Benefits of PCB Copper Clad Laminate?

What Are Applications of Copper Laminate PCB?

  • Telecommunications: 5G base stations, RF signal processing modules.
  • Automotive: Electric vehicle (EV) battery management systems, motor control units.
  • Lighting: High-power LED drivers, automotive headlight assemblies.
  • Aerospace: Satellite communication hardware, avionics control systems.
  • Consumer Electronics: Smartphone motherboards, IoT device circuitry.
  • Medical: MRI machine power supplies, implantable medical device interfaces.
  • Industrial Automation: Robotics motor drivers, factory automation control panels.
  • Renewable Energy: Solar inverter power conversion, wind turbine energy management systems.

Copper Laminate PCB Design Guide For LED Lighting

Below are copper laminate PCB design guide for LED lighting:

1. Material Selection

  • Base Material: Use electrolytic copper foil (ED Copper) with minimum thickness 1 oz (35µm).
  • Dielectric Layer: Select UL94 V-0 certified insulation (e.g., polyimide or ceramic-filled epoxy).
  • Copper Purity: ≥99.9% purity for thermal/electrical performance. Surface roughness (Ra) ≤1.6µm.

2. Layer Stackup

  • Single-Layer: Copper substrate (bottom) + dielectric + copper trace layer (top).
  • Multi-Layer: Avoid placing signal layers directly on copper substrate. Use “copper substrate – dielectric – copper foil” for dual layers.
  • Prohibition: No signal traces on copper substrate side.

3. Trace Routing

  • Current Capacity: Follow IPC-2221. Design traces ≥3mm/A for high-current paths (e.g., LED drivers).
  • Clearance: Maintain ≥2mm spacing between traces and copper substrate edges.
  • Geometry: Use 45° miters for bends; avoid 90° angles.

4. Thermal Management

  • Thermal Vias: Place via arrays (≥0.3mm diameter, ≤1mm pitch) under high-power LEDs. Connect directly to copper substrate.
  • Solder Mask: Exclude solder mask on copper substrate areas for direct thermal dissipation.
  • Copper Coverage: Allocate ≥40% of PCB area to copper substrate for heat spreading.

5. Solder Mask

  • Thickness: Control solder mask on copper substrate to 15–25µm.
  • Clearance: Keep solder mask openings ≥0.5mm from copper substrate edges.
  • Process: Avoid LPI (Liquid Photoimageable) solder mask on copper substrate side.

6. Via Design

  • Drilling: Mechanical vias ≥0.8mm; laser vias ≥0.15mm.
  • Teardrops: Add teardrop reliefs at via-to-trace junctions.
  • Grounding: Minimum 2 vias per high-power LED for thermal/ground connectivity.

7. Test Points

  • Placement: Locate test pads away from copper substrate areas.
  • Size: Test pad diameter ≥2mm; spacing ≥2.54mm.
  • Accessibility: Ensure test points are probe-friendly (no components nearby).

8. Manufacturing Tolerances

  • Outline: Board dimension tolerance ±0.1mm.
  • V-Cut: Depth ≤1/3 of total board thickness.
  • NPTH: Avoid non-plated through-holes (NPTH) near copper substrate.

9. Reliability Testing

  • Thermal Cycling: -40°C to +125°C, 1000 cycles.
  • Humidity: 85°C/85%RH for 500 hours.
  • Solderability: 260°C/10s reflow, 3 cycles.

10. Documentation

  • Annotations: Specify copper thickness, dielectric material, and thermal via locations.
  • Thermal Model: Provide 3D thermal simulation files (e.g., Ansys Icepak).
  • Assembly Notes: Highlight LED polarity, thermal pad alignment, and pressure requirements.
Copper Laminate PCB Design Guide For LED Lighting

Single Sided Copper Clad Laminate PCB Manufacturing Processes

Single-Sided Copper Clad Laminate PCB Manufacturing Processes

1. Material Preparation

  • Use FR-4 or CEM-1 substrate with 1 oz (35µm) electrolytic copper clad on one side.
  • Cut raw panels to working size (e.g., 400mm × 500mm) with ±1mm tolerance. Clean edges to remove debris.

2. Drilling

  • CNC drill component/mounting holes using carbide bits (0.3mm–3.2mm diameter).
  • Deburr holes with nylon brush or ultrasonic cleaner. Inspect for broken bits or residual copper.

3. Surface Cleaning

  • Alkaline wash (pH 10–12) to remove oils and fingerprints.
  • Micro-etch copper surface with sulfuric acid + hydrogen peroxide solution (Ra 1.6–3.2µm).
  • Dry at 80–100°C to prevent oxidation.

4. Circuit Formation

  • Apply dry film photosensitive laminate (35–50µm) or screen-print etch-resistant ink.
  • Expose to UV light through artwork film (1–5 seconds). Develop with sodium carbonate (0.8–1.2% concentration).

5. Etching

  • Use ferric chloride (FeCl₃) solution at 45–55°C or ammonium persulfate at 25–30°C.
  • Spray etch with 1.5–2.5 kg/cm² pressure for uniformity. Control line width (±10% tolerance) and undercut (<10% of line width).
  • Rinse with water and strip residual dry film with sodium hydroxide (2–3% solution).

6. Solder Mask Application

  • Spray or screen-print epoxy-based liquid photoimageable (LPI) solder mask (20–30µm thickness).
  • Expose to UV through solder mask film. Develop with sodium carbonate (1–2% concentration). Cure at 150°C for 60 minutes.

7. Surface Finish

  • HASL: Dip in molten Sn63/Pb37 solder (260°C) and blow hot air to remove excess.
  • OSP: Apply benzotriazole-based coating. Dry at 80°C for 10–15 minutes.

8. Profiling

  • Score board edges with V-Cut (30–60° angle) using hydraulic press. Maintain ±0.1mm dimensional tolerance.

9. Electrical Testing

  • Use flying probe tester (e.g., Takaya APT-9411) with 10–50V DC. Verify isolation resistance (>100MΩ) and continuity (<1Ω).

10. Quality Inspection

  • Visual check: No exposed copper outside solder mask, no voids/cracks, pad alignment ±0.05mm tolerance.
  • Dimensional check: Hole positions (±0.1mm), board size (±0.2mm).

11. Packaging

  • Vacuum seal boards in ESD-safe bags with desiccant. Label with lot number, date code, and RoHS compliance mark.
Single Sided Copper Clad Laminate PCB Manufacturing Processes

Why Choose Best Technology as MCPCB Manufacturer?

  • 19-Year Metal Substrate Expertise: Avoid costly design iterations with battle-tested thermal management solutions.
  • Strict Quality Control: 100% AOI/X-ray inspection ensures flawless delivery, eliminating rework risks.
  • 24-Hour Rapid Prototyping: Cut product validation time by 50% and accelerate market entry.
  • ISO 9001/14001 Certified: Global regulatory compliance simplified for seamless international sales.
  • Competitive Pricing: Achieve 20%+ cost savings through optimized production scaling.
  • Custom Thermal Management: Optimize heat dissipation for high-power applications (e.g., automotive, LED).
  • Flexible MOQ (5pcs–100K+): Reduce inventory risks with agile small-batch to mass-production transitions.
  • 24/7 Engineering Support: Solve technical challenges proactively, shorten R&D cycles by 30%.

Welcome to contact us if you have any inquiry for metal core PCB: sales@bestpcbs.com.