In the realm of advanced electronic design, Semi-flex PCBs stand out as pioneering solutions. Leveraging specialized FR-4 materials and employing a distinctive manufacturing method, they ingeniously combine the flexibility of a flexible circuit with the convenience of easy installation.
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Do you know what’s Semi-flex PCB?
A Semi-Flexible PCB (Printed Circuit Board) is a type of PCB that offers a compromise between rigid and flexible circuit boards. It incorporates elements of both rigid and flexible PCBs, allowing it to bend to some extent while still maintaining a degree of stiffness. This innovative flex-to-install design not only ensures cost-effectiveness but also opens up a realm of possibilities for diverse applications, making Semi-flex PCBs a versatile and economical solution in the ever-evolving landscape of electronic design. Embracing cutting-edge technology and adaptability, these boards exemplify the ongoing commitment to pushing the boundaries of innovation in electronic engineering.
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Vital Features of Semi-flexible PCBs
In our more than 17 years of experience in the PCB manufacturing field, we take pride in delivering Semi-Flexible PCBs that meet the highest standards of quality and performance. we are happy to share some the key features of our Semi-Flexible PCBs we made:
Flexibility and Bending Capability: The semi-flexible nature of these PCBs allows for bending and shaping, making them suitable for applications with space constraints or those requiring unique form factors.
Reliability: Despite their flexibility, our Semi-Flexible PCBs maintain high levels of reliability and performance. They are designed to withstand bending without compromising the integrity of the circuit.
Space Optimization: The ability to conform to three-dimensional shapes enables better use of available space, making these PCBs ideal for compact electronic devices and innovative product designs.
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As we move forward, we invite you to explore the possibilities that Semi-Flexible PCBs offer and to partner with us in shaping the future of electronic engineering. Together, let us continue to embrace the spirit of innovation and unlock new horizons in the dynamic and rapidly advancing field of technology. Trust Best Technology, we are the BEST!
ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold. This type of metal coating on the PCB pad surface consists of three layersânickel, palladium, and gold. Apart from protecting the copper surface from corrosion and oxidation, the ENEPIG surface treatment is also suitable for high-density SMT (Surface Mount Technology) designs.
For its manufacturing process, manufacturers begin by activating the copper surface, followed by depositing a layer of electroless nickel, then a layer of electroless palladium, and finally, a layer of immersion gold. The process is somewhat similar to the one they follow in the ENIG process, but adding a palladium layer to the ENIG technology. The palladium layer not only improves the surface protection of the PCB, but also prevents nickel from deteriorating and inhibits interactions with the gold layer.
Pros of ENEPIG Surface Treatment
Reduce the black pad issues
Excellent solderability and high reflow soldering performance
Provide high-reliable wire bonding capability
High-density design available
Meet the miniaturization standards
Suitable for extra thin PCBs
Cons of ENEPIG Surface Treatment
Expensive than ENIG process
Thicker palladium layer will decrease the effective of SMT soldering
Longer wettability time
What are the Differences Between ENIG and ENEPIG?
The main difference between ENIG and ENEPIG is the palladium layer. This is the extra layer that added in ENEPIG process, which provides high oxidation resistance, enhance the electrical performance of the surface cleanliness and improve the abrasion resistance of the PCB surface. However, the palladium layer also increases the cost of manufacturing.
Additionally, the inconsistent surface cleanliness of ENIG, resulting from low solder joint reliability, particularly in gold wire bonding, is a concern. Extra procedures are also required to prevent nickel corrosion in ENIG. When considering it into manufacturing, the ENIG is well-suited for lower-end electronic products.
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The Considerations of Selecting ENIG or ENEPIG Surface Finishing
Though both two surface treatments offer excellent electrical performance and heat dissipation properties, there are still some conditions that need to consider when choose them.
Budget
Cost is an important factor when choose a suitable surface treatment. As we explain above, ENEPIG is expensive than ENIG, if you are trying to find a relative cost-effective coating, then ENIG is the best choice.
End-applications
The end-applications or finished products also determined the selection of surface finishing. For example, if your PCB will be used in high temperature applications, ENIG would be the better one since it can withstand high temperature.
Flatness
Many traditional surface finishes have poor flatness and smoothness, this brings the big challenge of small-size components mounted. Especially for those fine-pitch components like BGA, an uneven surface can result many problems. However, both ENIG and ENEPIG offer highly smooth surface finishes, forming thin and uniform layers on the solder pads.
Bonding demand
ENEPIG provides the optimal choice for wire bonding due to its highly smooth surface finish, which enhances wire bonding capabilities.
Environment-friendly
Some traditional surface treatments contain hazardous substances, making them non-compliant with RoHS requirements. Both ENIG and ENEPIG made by Best Technology are fully RoHS compliant and lead-free, so you are donât worry about the environment unfriendly.
At the end, the choice between ENIG and ENEPIG surface treatments in PCB manufacturing involves a careful consideration of various factors. While both options offer excellent electrical performance, heat dissipation properties, and compliance with environmental standards like RoHS, specific project requirements and priorities will guide the decision-making process. If you are still confuse about the selection of surface treatment, welcome to contact with us, Best Team will give you a best solution that can meet your specific demands and save money for you.
In the aluminum PCB design, people always mention the thermal conductivity value. Do you know what about thermal conductivity and you know what is the role of this layer in the aluminum core circuit board? Welcome to keep reading if you are interested in it.
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What is thermal conductivity?
Thermal conductivity is a physical value signifies the capacity of a material to allow heat flow per unit area through it in a unit of time. A higher thermal conductivity indicates better heat conduction for the material. In the field of heat generation and thermal management products, thermal conductivity is a crucial parameter as it relates to the product’s heat dissipation capability and stability. In the structure of aluminum, the thermal conductivity layer is always stand between the copper circuit layer and base material, so that the heat generated by product can be transfer quickly to outside.
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Significance of Thermal Conductivity in Aluminum PCBs
Aluminum substrates are commonly used materials in heat dissipation and thermal management products. Their thermal conductivity is a vital element evaluated heat dissipation properties typically in W/m¡K. It can be understood as the material’s heat transfer rate, i.e., the amount of heat conducted per unit time. Specifically, assuming the same amount of heat is conducted in aluminum substrates and other materials, the conduction rate of aluminum substrate will be faster over a certain period. This implies that aluminum substrates can transfer heat more quickly from the heat source to the external environment, achieving efficient heat dissipation.
Impact of Thermal Conductivity on Heat Dissipation Products
The primary function of thermal management products is to dissipate heat. How does thermal conductivity specifically affect them? Let us dive into from below aspects:
1. Thermal Conductivity Value
A higher thermal conductivity leads to better heat dissipation capability, as it can achieve faster transfer of heat from the heat source to the environment. Therefore, thermal conductivity of aluminum substrates plays a crucial role in the heat dissipation products, such as the LED lights, industrial power devices, automotives. At Best Technology, the thermal conductivity we used for aluminum PCB always is range from 1.0 to 3.0W (thickness=75-200um). Different thermal conductivity value has its own thickness.
2. Product Stability
The stability of a product also depends on its thermal conductivity. According to our 17+ manufacturing experience, insufficient thermal conductivity in heat dissipation products may result in overheating during prolonged operation, potentially shortening the product’s lifespan. Let me take a simple example, assume your mobile phone is under long time playing games, then it will generate many heats, finally causing the overheating phenomenon. And this will shorten its lifecycle if you always do like that.
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When it comes to thermal conductivity selection, there is a big misunderstanding is that some may believe that higher thermal conductivity in aluminum substrates is always better. However, this is not entirely accurate. While higher thermal conductivity is generally favorable, it does not mean that aluminum substrates with the highest thermal conductivity are suitable for all heat dissipation applications. In specific use cases, it is essential to choose the appropriate thermal conductivity for aluminum substrates based on actual requirements to achieve the optimal heat dissipation effect.
By the way, if you want to choose higher thermal conductivity value, ceramic PCB is a better choice, which can achieve 24W or more. It mainly depends on its ceramic substrate material, like the Al2O3 thermal conductivity value is around 24W~28W/m-K, while AlN enable to reach 150W~240W/m-K.
Conclusion
All in all, to ensure optimal heat dissipation effects and stability, it is crucial to choose the right thermal conductivity for aluminum substrates based on actual needs. The careful consideration of thermal conductivity values in aluminum PCBs is integral to the longevity and performance of heat dissipation products, emphasizing the importance of informed selection in the pursuit of effective thermal management.
Best Technology is an expert in metal core PCB manufacturing, we have strong R&D team and full-experienced employs that can provide with you the best metal core PCB solution. Welcome to contact us at sales@bestpcbs.com if you want to know more.
Surface treatment also called surface finishing, it is a protective layer that through coating a layer of metal organic material on the surface of printing circuit boards (PCBs). Apply a layer of surface treatment enable to protect pads from scratches and oxidation, as well as improve the solderability of components mounting. ENIG and ENEPIG are the two common high-reliable surface finishing types in the circuit board manufacturing, they are not only for FR4-PCB, but also available in ceramic PCB, flex circuits and rigid-flex PCB. Today, Best Team would like to sharing information about ENIG and ENEPIG, and explore the differences between them.
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How to Select the Right Surface Treatment for Your PCB?
With the rapid development of electronics, there are various of PCB types that can be used in electronic devices, and at the same time, there are also increasingly more surface treatment technics available for selection. Until now, the common surface treatments are OSP, HASL, Immersion Silver, Gold Plating, ENIG and ENEPIG. Each of these surface treatments has its own advantages and disadvantages, so it is necessary to choose the most suitable one for a particular application. The selection of surface finish needs to take into account factors such as cost, application environment, fine-pitch components, the use of leaded or lead-free solder, operating frequency, shelf life, drop and impact resistance, volume and throughput, as well as thermal resistance.
With PCBs trending towards micro-vias and finer traces, and the drawbacks of HASL and OSP, such as flatness and flux elimination issues, becoming more pronounced, the demand for surface treatments like ENIG continues to grow. In addition, black pad is a major weakness of ENIG while ENEPIG enable to solve it very well, making it a preferred choice for those PCBs need to wire bonding.
What is the ENIG Surface Treatment?
ENIG, its full name is Electroless Nickel Immersion Gold, is also known as chemical gold or immersion gold in the electronics industry. This type of surface treatment provides two metal layersâgold and nickelâthat manufacturers deposit them on the surface of PCB pads sequentially. This surface finish is a selective surface finish, meaning that certain specific pads may have ENIG surface finish, while others may have different types, such as OSP, HASL, or immersion tin. Here are the main processes of the ENIG coating:
Copper activation
In this step, manufacturers will active the copper layer through cleaning process, this way can help to remove the dust and oxides residual on the surface, but also remove any gases or air trapped in the perforations (holes) of the PCB by wetting the surface. Next, micro-etching the PCB surface using substances like hydrogen peroxide or sulfuric acid.
Electroless nickel
This process is to coat a layer of nickel on the active copper layer by electroplating. The nickel layer serves as a protective layer or inhibitor, which prevent the copper reactive with other elements.
Immersion gold
Immersion gold is the last step of whole ENIG process, immersing the PCB into a mixture, oxidizing the nickel surface, generating nickel ions, and then reducing gold from the mixture. The reduced gold forms a metallic coating to protect the nickel surface. This is the whole process of coating ENIG surface treatment.
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Advantages of ENIG
Surface flatness â good for fine-pitch and small size components like BGA.
Suitable for press-fit components since it provides a reliable connection for electrical testing.
Suitable for wire bonding and gold-fingers connectors.
Cost-effective compared with ENEPIG
Disadvantages of ENIG
Black pad issues.
Varied coating thickness because of the uncontrolled nickel plated and immersion gold.
Poor wettability during PCB assembly.
All in all, ENIG is a good option if you want to mount fine-pitch components on the PCB surface or if you are considering its use in plug-and-pull devices such as WIFI interfaces. In our next blog, we will introduce ENEPIG surface treatment, including its pros & cons and the differences between ENIG and ENEPIG. Pay attention to our news or contact us directly if you want to know more.
A circuit board is an independent part of modern electronic devices, equipped with various components that play different roles and functions on the board such as connecting, signal transmission, power distribution, and signal conversion. Theoretically speaking, electronic components are the fundamental units in the devices, and printed circuit board (PCB) serves as a carrier for mounting components, connecting them to completing the functions of electronic systems. Here, we will introduce some common circuit board components and their functions.
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What Are Electronic Components?
Electronic components are fundamental building blocks used in the construction of electronic circuits and systems. These components manipulate electrical signals to perform specific functions in electronic devices. Based on their purpose and functionality, electronic components can be categorized into two major types: passive components and active components.
Passive electronic components mainly include resistors, capacitors, inductors, power filters, and so on. They do not have active operational functions such as amplification or signal control. Instead, passive components can only consume or store electrical energy. In electronic systems, their main roles include signal transmission, distribution, filtering, isolation, and other similar functions.
Active electronic components, on the other hand, include transistors, field-effect transistors (FETs), integrated circuits (ICs). Unlike passive components, active components have the ability to actively amplify, control, and manipulate signals related to current, voltage, frequency, and more. They play a crucial role in electronic systems, enabling active operations and functionalities.
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What Is the Functionality of Common Components on PCB?
On an assembled circuit board (PCBA), we can see various of components on its surface. Different components play its unique role and have different function. Here we will introduce the function of common components.
Resistor
A resistor is a component used to restrict the flow of electric current. Its purpose is to control the magnitude of current by adjusting its resistance value, ensuring appropriate current adjustment within the circuit.
Capacitor
The capacitor has the ability to store charge and release it when needed. Its function is to smooth power supply voltage, stabilize current, and in some cases, perform signal filtering to accomplish signal conditioning. Resistors and capacitors are two common types of electronic components.
Diode
Diode is a type of component with unidirectional conductivity. The uses of diode enable to allow current to flow in one direction while blocking reverse current. It is commonly used in power supplies, rectifiers, and other circuits.
Transistor
A transistor functions in amplification and switching in a printed circuit board. Its role is to amplify electronic signals, control the flow of current, and it is widely used in circuits such as amplifiers and logic gates.
Integrated Circuit (IC)
Integrated circuit is a very important components in those small size circuits, because it can integrate multiple functional circuits onto a single chip. That means it can save space if your design has limited space, enhance system performance and reliability of devices. Integrated circuits find widespread applications in areas such as computers, communication systems, and embedded systems.
Inductor
The working principle of inductor is similar to a capacitor, but the different is an inductor has the ability to store and release energy while capacitor is to store and release charge. Its main function is to accomplish energy conversion and distribution in a circuit. Inductors are commonly used in circuits for filtering, power supplies, and more.
Variable Resistor
A variable resistor allows for the adjustment of resistance and it always used for modifying circuit characteristics by changing the resistance value. Variable resistors are commonly used in circuits for functions like volume control, light intensity adjustment and some other devices that need to adjust the resistance.
Light Emitting Diode (LED)
LED chips is a component that we can see everywhere need to light up. It converts electrical energy into light energy. Its function includes emitting light for indicators, illumination, and it is widely used in circuits such as display screens and indicator lights.
Power Module
Power module is always designed to provide the electrical energy required by a circuit. Using power to stabilize output voltage and current, protecting the circuit from external power fluctuations.
Sensor
A sensor can perceive physical quantities or signals in the surrounding environment and convert them into electrical signals. Its function is to enable interaction between the circuit and the external environment. Sensors find wide applications in areas such as automatic control, the Internet of Things (IoT), and more.
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In summary, the various components on a circuit board have their specific roles, work in conjunction with each other, and collectively achieve the functionality and objectives of the circuit. Understanding the functions of these components allows for a better grasp of the working principles of circuit boards, providing reference and guidance for the design and maintenance of electronic products.
However, for some reasons, inspect the components before PCB assembly is the main method that ensures the reliability of a PCBA. In our next post, we will share how to make the incoming inspection for electronic components, leave your messages if you are interested in it.
We often receive this question from customerâ what is a E-Tester?â andâ how to do E-Test for FR4 PCB?â Hereby I would like to share with you how to use E-Tester to test PCB.
Best Technology in FR4 PCB circuit manufacturing filed since year 2006, we have more than 17 years experiences in PCB fabrication process. We can provide from the design to turn key service for our customer.
Let us come to todayâs topic, now what is a E-Tester?
What is a E-tester?
E-Tester is tooling for test PCB during volume production. E-Tester was used to detect the electrical performance of PCB. It is the essential process to test the PCB by this tester before shipment.
As you may know that during PCB process flow, it might be caused some defects by external factors and this is unavoidable.
So, in order to reduce the loss before PCB goes to the next stage when it is assembled with components, Therefore, the E-Test plays important role in PCB quality control to segregate PCBs with defects from shipment to customers and thatâs why most of customers require their PCB manufactures to do 100% E test before shipment.
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The E tester mainly checks the open/short circuit for FR4 PCB.
How to do E-test?
Firstly, set up the E-tester on the testing machine and up test datasheet on the computer. Put the board to the E-tester to test the open/short circuit for board and dielectric strength.
Shorts Test: Check to make sure that NO current flows between separate nets by measuring the amount resistance between them.
Opens Test: Check to make sure there is current flow from one ânodeâ to the next for every net on the board.
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During the testing, test whether there is short circuit between different network routes of PCB; test whether the PCB network is open to each PAD, and whether the hole is open; Finally, Insulation strength test and the Impedance test.
If the trace open is found on the bare board, the failure location could be repaired or the bare board has to be scrapped. On the other hand, the cost will be increased when PCB goes to the next stage when it is assembled with components, mainly are the sorting cost, component cost and the assembly cost. The compensation ratio is 10 times or even more than the PCB cost and this damages PCB manufacturerâs profit. The worse case is when PCBA is installed onto the end product, the loss caused by defected PCB could be very painful, say up to thousand times of PCB cost. Therefore, the E-Test plays important role in PCB industry to segregate PCBs with defects from shipment to customers and thatâs why most of customers require their PCB suppliers to do 100% E test before shipment.
If you want to know more about testing for FR4 PCB board, welcome to visited www.bestpcbs.com or email us, we are very happy to answer your question.
The resistance and capacitance buried in multi layers PCB process is a process of burying resistors and capacitors inside the PCB board. Usually, the resistors and capacitors on the PCB are directly soldered on the board through mounting technology, while the buried resistor and capacitor process is to embed the resistors and capacitors into the internal layer of the PCB board.
This kind of printed circuit board consists of a first dielectric layer, a buried resistor, a circuit layer and a second dielectric layer in order from bottom to top. Among them, the part of the buried resistor without a circuit layer on the buried resistor is covered with a polymer isolation layer, and the surface of the polymer isolation layer is roughened, the surface roughness Rz is bigger than 0.01 Îźm, and the thickness of the polymer isolation layer at the corners is at least 0.1 Îźm.
The printed circuit board of the utility model covers a layer of polymer isolation layer on the surface of the buried resistor, thereby protecting the buried resistor from being attacked and corroded by chemical chemicals during subsequent wet processes such as browning and super-coarseness, and improving the efficiency of manufacturing buried resistors. Resistor plate process capabilities further promote the application of buried resistive plates to inner layer buried resistors.
The advantages of the buried resistor and buried capacitor process include:
1. Space saving:
Since the resistors and capacitors are embedded directly into the internal layers of the board, space on the PCB board can be saved, making the entire circuit board more compact.
2. Reduce circuit noise:
Embedding resistors and capacitors into the internal layers of the board can reduce the electromagnetic interference and noise of the circuit and improve the stability and anti-interference capabilities of the circuit.
3. Improve signal integrity:
The buried resistance and buried capacitance process can reduce the transmission delay and reflection loss of circuit signals and improve the integrity and reliability of signal transmission.
4. Reduce the thickness of the PCB:
However, the buried resistor and buried capacitor process is relatively complicated in terms of manufacturing and repair, because the resistors and capacitors cannot be directly observed and replaced. In addition, the buried resistance and buried capacitance process is usually used in high-end electronic products, and the cost is relatively high.
When it comes to high-density circuit design, PCB buried resistance and buried capacitance technology has become a very useful technology. In traditional PCB layout, resistors and capacitors are usually soldered on the PCB surface in the form of patches. However, this layout method causes the PCB board to take up more space and may cause noise and interference on the surface.
The buried resistance and buried capacitance process solves the above problems by embedding resistors and capacitors directly into the internal layer of the PCB board.
The following are the detailed steps of the PCB buried resistor and buried capacitor process:
1. Make the inner layer:
When making a PCB board, in addition to the conventional layers (such as outer layer and inner layer), it is also necessary to make a separate inner layer specifically for buried resistance and buried capacitance. These internal layers will contain areas for buried resistors and capacitors. The inner layers are usually made using the same techniques as regular PCB manufacturing, such as electroplating, etching, etc.
2. Resistor/capacitor footprint:
Resistors and capacitors are packaged in a special package in the buried resistor and capacitor process so that they can be embedded into the internal layer of the PCB. These packages are usually thinned to accommodate the thickness of the PCB board and have good thermal conductivity.
3. Buried resistor/capacitor:
In the process of making the inner layer, the buried resistor and capacitor process is completed by embedding resistors and capacitors into the inner layer of the PCB board. This can be achieved through a variety of methods, such as using special pressing techniques to embed resistors and capacitors between inner layers of material, or using laser technology to etch holes in the inner layer material and then fill them with resistors and capacitors.
4. Connection layer:
After completing the inner layer of the buried resistor and buried capacitor, connect it to other regular layers (such as the outer layer). This can be achieved through conventional PCB manufacturing techniques such as lamination, drilling, etc.
In general, the buried resistance and buried capacitance process is a highly integrated technology that embeds resistors and capacitors in the internal layer of the PCB board. It can save space, reduce noise, improve signal integrity, and make PCB boards thinner and lighter. However, due to the complexity, the buried resistor and buried capacitor process is usually used in high-end electronic products with higher performance requirements.
The electronics industry has continuously pursued smaller and faster electronic products with increased functionality. To meet these demands, the electronic packaging industry has focused on developing more advanced packaging methods, aiming to increase the density of components on a circuit board while integrating multiple functions into a densely package.
The increasing density of packaging and interconnection has driven the progression of assembly methods from through-hole technology (THT) to surface-mount technology (SMT). Additionally, the use of wire bonding to connect chips to substrates has become more prevalent. The adoption of smaller interconnect pitches and chip-scale packaging (CSP) has further increased component density, while multi-chip modules (MCM) and system-in-package (SiP) have enabled the integration of more functions on a single package.
This post describes the key factors affecting the reliability of interconnections, with a particular focus on the specific properties of surface-treated wire bonding, emphasizing the selection of wire bonding surface treatments.
Selection of Surface Treatment for Wire Bonding
While electroless nickel gold provides excellent performance for wire bonding, it has three main drawbacks that hinder its application in cutting-edge technologies:
1. The relatively high demand for gold layer thickness leads to lengthy process costs.
2. Thick gold layers are prone to the formation of weak tin-gold intermetallic compounds (IMC), reducing the reliability of solder joints. To enhance solder joint reliability, alternative surface treatments may be used, but this increases additional process costs.
3. The electroplating process requires the use of electroplating lines, limiting the design freedom and wiring density of the packaging substrate.
The limitations posed by electroplated nickel-gold provide an opportunity for the adoption of chemical plating. The techniques of chemical plating include Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Gold (ENEG), and Electroless Nickel Palladium Immersion Gold (ENEPIG).
Among these three options, ENIG is generally unproblematic due to its lack of high reliability in gold wire bonding properties (although it has been used in some low-end consumer products). On the other hand, ENEG shares the high production cost and presents complex challenges in terms of the manufacturing process, similar to electroplated nickel-gold.
ENEPIG was initially introduced in the late 1990s, its market acceptance was delayed until around the year 2000 due to fluctuations in palladium metal prices (which were inflated to unreasonable levels around 2000). However, ENEPIG can meet the requirements of many new packaging applications, providing reliable performance and conform to lead-free/ROHS requirements, with a recent strong surge in market demand.
In addition to the advantages in packaging reliability, the cost of ENEPIG is another benefit. With the recent rise in gold prices surpassing US$800/oz, it becomes challenging to control costs for electronic products requiring thick gold plating. The price of palladium (US$300/oz), relative to gold, is less than half, making palladium a cost-effective alternative with surface-related advantages.
Comparison of Surface Treatments
Up to now, for printed circuit boards accommodating fine-pitch QFP/BGA components, there are primarily four lead-free surface treatments:
Immersion Tin (IT)
Immersion Silver (IAg)
Organic Solderability Preservatives (OSP)
Electroless Nickel Immersion Gold (ENIG)
The table below compares these four surface treatments with ENEPIG. Among these surface treatments, none can simultaneously meet all the requirements of lead-free assembly processes, especially when considering multiple reflow experiences, pre-assembly shelf life, and gold wire bonding experiences. In contrast, ENEPIG offers good shelf life, solder joint reliability, gold wire bonding capability, and can serve as a touch button surface, providing surface-related advantages. Moreover, in the final gold replacement deposition reaction, the chemical palladium layer in ENEPIG works to protect the nickel layer, avoiding excessive corrosion during gold replacement.
ENEPIG has several crucial advantages, demonstrating reliable solderability and gold wire bonding concurrently. The key benefits are outlined as follows:
Prevention of “Black Nickel Problem” – The absence of gold replacement attacking nickel on the surface prevents interfacial corrosion.
The chemical palladium layer acts as a barrier, preventing copper from diffusing to the surface, ensuring satisfactory solderability.
Palladium layer enable to completely dissolves in the solder, preventing the exposure of a high-phosphorus layer at the alloy interface. After the dissolution of the chemical palladium layer, the chemical nickel layer is revealed, forming a satisfactory nickel-tin alloy.
Capability to Withstand Multiple Lead-Free Reflow Cycles
Excellent Gold Wire Bonding Properties
These advantages make ENEPIG a preferred choice in various applications, ensuring reliable performance in both soldering and wire bonding processes while offering cost efficiency. As a one-stop PCB supplier in Asia, Best Technology possesses advanced technology and high-tech manufacturing equipment that can meet the âmulti-variety, small volume, high quality, strong capability, short deliveryâ requirements. Welcome to contact us if you are going to find a reliable circuit board manufacturer.
At our latest blog, may the readers have understood the factors that will affect the PCB price, or maybe one of your have put it into practice that get a price lower than your budget. However, people are always not satisfied by the existing situation. If this is bother you as well, keep reading since this time we are going to sharing some useful tips that enable to optimize your PCB price until to the best.
Reduce board complexity
It can be said that try to simplest your design/layout and make it easy to fabricate is the simplest way to reduce your PCB cost. The more complex and irregular the forms, the higher the cost. Just remember: for every circuit board, no need to maintain a fancy diagram to demonstrate its excellence, perform functionality correctly is enough.
Design it in right size and thickness
Design your board in right size doesnât means make it smaller as possible. You must know, if your design is complex and layouts are density, that means maker need to spend more time to assemble them. Highly compact sizes are always expensive, donât skimp when it counts. Otherwise, more money will be spent to afford what you saved.
And in theory, the more layers and thickness the board, the more cost that manufacturer spend. Numerous layers in the PCB will have an influence for holes and diameters. It is recommended that if thinner thickness is enough, then just do it.
Shapes, holes and rings should be regularly
Normally, keep the PCB as square or rectangular shapes is cheaper than irregular shapes like pentagon. And large holes and rings enable to smooth the production run and easy to create. For smaller holes and rings means the driller must be smaller and delicate control.
Consider volume and choose manufacturer
In our last blog, we emphasize manufacturers will set a minimum order quantity (MOQ), it is common in this industry. So, consider your volume and check multiple quantities before ordering can help to recognize which one is the most cost-effective.
During the evaluation period, talk to your suppliers as soon as possible, knowing more about the material specifications, technical and PCB tolerances. A wrong choice will lead to much time waste and some unnecessary cost. This is we call âtrial and error costâ. Try to make all things are clear and correct before production.
Pick the best vias
There are totally three types of vias in PCB: though-hole, blind, buried. The through hole can be passed through the whole board, while blind vias is created from top or bottom side to the middle of the board without through to bottom or top side. Buried vias, just as its names, it is buried inside the boards and we canât see it by naked eyes.
Obviously, through hole is cost performance than other two vias, try to use more instead of blind or buried vias enable to decrease your cost. In additionally, blind and buried vias are always necessary in HDI PCB and RF board, otherwise, you donât usually use them.
Make sure all SMT components on the one side
Trying to make all the surface mounted (SMT) components on the one side of circuit board if possible. In this way, assembler can finish the SMT process in one-time, so that can save much manufacturing time and cost. But if the components are distributed on both sides, it is needed to assemble two times, that is top side first â bottom side second (or sometimes bottom first).
Select easily replaceable component parts
It is assumed that one of part on your circuit becomes obsolete, then you must search for replaceable part or update your design if you would like to continuedly use this board. As an extensive experienced PCB manufacturer, we strongly recommend that select components that has standard dimension, so that it is easy to match alternative one.
In addition, visit some manufacturerâs website carefully to see if any components are marked as “obsolete” or “not recommended for new designs” before finishing your design. This enables to avoid secondary update.
Follow manufacturerâs PCB fabricate standards
Understand and follow manufacturerâs fabricate standards can keep your unit PCB price in a relative lower cost. When designing a new project, please make sure to following below tips.
Use standard stack-up with standard materials.
Design 2-4 layers PCB if possible.
Keep your minimum line width and spacing within the standard spacing.
Avoid adding extra special requirements as much as possible.
Use SMT components as possible
Choose surface mounted (SMT) components instead of through hole (THT) component whenever possible. SMT and THT are almost treated as separated manufacturing processes. Hence, if all the THT components can be replaced by mounted parts, the THT process will be eliminated completely. It is not only decreasing the manufacturing cost, but also reducing delivery time. Of course, it is not always possible, but itâs worth trying.
Whatever decisions you make, the best solution is to consult and discuss with your suppliers. They be always to give you the best one that can save your money and meet your requirements as well. Meanwhile, if you donât believe the suppliers, you are welcome to reach us. We promise that we can give you a most favorable price and high-quality product.
For each development engineer or purchaser, how to keep the cost within the budget is a most irksome and irritating assignment while the PCB has the good quality and enable to perform desired function. They need to understand the computation rule and calculate the developing cost. So, it is worth to knowing the factors that affect the printed circuit board price, and it is a must learn course for every engineers. Herein, Best Technology is going to dissect the factors affect the cost of PCB, letâs move on!
What affects the cost of a PCB?
Drives the cost of PCBs are numerous, we can see from the PCB itself, for example, circuit board substrate materials, the external factors such as the manufacturing difficulties, the whole order quantities and some other special requirements that from designers.
Here, we listing some basic parameter factors which drives the whole cost of a PCB.
PCB substrate material
The substrate of PCB board refers to the material used in the non-conductor part of the circuit board, mainly FR4, glass fiber, epoxy resin, polyimide, copper, aluminum and so on. In the PCB manufacturing, glass fiber is widely used in the manufacture of double-sided circuit board and multi-layer board, while epoxy resin and polyimide are used in the manufacture of high-density multi-layer board. Among them, copper substrate is most expensive material. No matter what kind of materials, all of them shall be calculated according to the real-time international price.
PCB size (panel and single pcs)
PCB size will determine the price of PCBs, this is for sure. Generally speaking, with a same number of PCB layers, the smaller the PCB size, the cheaper the cost. Because during calculating cost, vendors will consider the utilization rate of raw materials. Make sure the highest utilization, the cost for both purchaser and vender will be best. The raw material of PCBs is commonly 1200mm*1200mm, or 1220mm for special specifications, when the utilization achieves 90% or above, this is the best.
So, how to improve the utilization of raw materials? Normally, manufacturers will optimize the working files (WF) from single size to panel size, and then material will be cut according to the panel files. But if the panel size is not suitable, then there will be a lot of waste edges of raw material in the cutting process, and generally this will be added into your PCB price. So that the unit PCB price will be more expensive. In another word, if you PCB size is well-suited, then it is good for PCB manufacturer and yourself. And at this time, the utilization will be the highest and your PCB cost is the cheapest as well.
Line width/spacing
To a certain extent, as long as you are following the PCB design rules, the PCB price will not too high. However, if your design is complex and the line width is extreme thin, then the price will increase since it is difficult to control during manufacturing.
PCB layers
According to the IPC standard, PCBs can be classified to single-layer PCB, double sided PCB and multilayer PCB. For layer count over than 2 layers, we called it as Multilayer PCBs, such as 4 layers PCB, 6 layers PCB. For FR4 PCB, we can make up to 32layers.
Due to the manufacturing process and some unpredictable assembling cycles, the more the layers, the more expensive it is. (The price of single side PCB is the similar to double sided PCBs.)
Solder mask ink color
In the past, it is no doubt that you will spend more if you want every color expect green. But now things are changeable. Most colors are available at no or very little extra cost, which usually only occurs for unique requests such as matte tones.
PCB copper foil thickness
The weight of copper foil depends on the successful utilization of the material. Thicker copper is more expensive and comes with additional manufacturing difficulties and expenses. You may also have to fill the holes with copper foil to connect layers. In addition, heavier copper means you need to spend more cost in shipping. Letâs take a simple example, for aluminum core PCB and copper core PCB, in the same volume and quantities, copper core PCB stands out for expensive shipping cost since it has thicker copper and heavier weight.
PCB surface treatment
Surface treatment is a method that using for protecting the surface from corrosion and improve the solderability. Usually, in consideration of environmental friendliness, vendors can use a couple of gold or silver to achieve further safety for use in some applications.
The commonly used surface treatment methods include OSP, IMMERSION SILVER, ENIG, ENEPIG and HASL (LF). Among them, the price is ENEPIG>ENIG>IMMERSION SILVER>OSP>HASL. You can calculate the PCB board price according to the surface treatment method and gold thickness.
Quantity and lead time
When developing a new project, almost of companies would like to make prototypes first and ask for a sample quotation. However, some PCB manufacturers will set the minimum order quantity, the smaller the quantity, the higher cost the PCB board. Please make sure to check the price for different amount before placing an official order.
Meanwhile, the delivery time request also will affect the whole price in a certain. And certainly, the price of quick turn order and expedited service will higher than normal order.
Other special requirements (impedance, IPC standard)
To ensure the stable transmission of circuit board signals and improve the quality of signal transmission, designers and engineers will ask for impedance control for the traces. This can be seen as special requirements, so it will add a few extra prices. And the required IPC Criteria is a factor as well. Normally, if customer does not have other request, we will default use IPC class II. III level will more expensive.
Above all are the mainly factors that affect the price composition for a printed circuit board. When evaluating your PCB cost, making them in your consideration is best.
PCB and PCBA supplier that can save cost for you â Best Technology
When you are seeking for a reliable PCB and PCBA supplier, I would like to recommend Best Technology to you. Best Tech offers one-stop service including raw material purchasing, PCB making, components searching, assembly, box building and package out of warehouse. What we can provide is not limited to PCB, but also metal core PCB, ceramic PCB, flexible PCB, rigid flex PCB, special PCB like HDI PCB, heavy copper PCB, extra thin PCB and so on. During the 17 years, the Best Technology company has served include medical industry, consumer electronics, new energy, automotive electronics, aerospace, military and others.
Could it be said that you are searching for a PCB supplier that can provide favorable price that lower than market? If this is true, please go ahead and reach us today, letâs talk about more PCB information right now and start our business trip together. We promise, when you decide to take the first step, and we’ll take the remaining 99 steps.
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