RO3003 is widely used across RF and microwave PCB because it offers stable electrical behavior, low loss, and smooth processing on modern PCB lines. Engineers often choose this laminate when they need predictable impedance, steady phase response, and strong thermal performance at high frequencies. Below is a comprehensive, fabrication-level RO3003 datasheet, covering electrical, mechanical, thermal, chemical, processing, and reliability properties.
Rogers RO3003 Laminate Datasheet
Rogers RO3003™ Electrical Properties
Parameter
Condition
Typical Value
Notes
Dielectric Constant (Dk)
10 GHz (IPC-TM-650 2.5.5.5)
3.00 ± 0.04
Very stable across temperature and frequency
Dielectric Constant (Dk)
2.5 GHz
3.01
Suitable for wideband RF
Dissipation Factor (Df)
10 GHz
0.0010
Extremely low loss
Dissipation Factor (Df)
2.5 GHz
0.0009
Excellent for mmWave
Volume Resistivity
23°C / 50% RH
1.7 × 10¹⁰ MΩ·cm
High electrical insulation
Surface Resistivity
23°C / 50% RH
5.7 × 10⁹ MΩ
Stable in damp conditions
Electric Strength
0.5 mm thickness
35 kV/mm
Strong dielectric barrier
Impedance Stability
-40°C to +85°C
±1.3%
Very stable for antenna structures
Dk Temperature Coefficient (TCDk)
-40 to +85°C
-3 ppm/°C
Very low drift
RO3003 is chosen often for 77 GHz radar, 24 GHz radar, and mmWave antennas because of these stable dielectric properties.
RO3003™ Material Thermal Properties
Parameter
Typical Value
Notes
Thermal Conductivity
0.5 W/m·K
Higher than FR4
Usable Temperature Range
-55°C to +150°C
Suitable for automotive radar
Dimensional Stability (X/Y)
0.2–0.3%
Strong laminate stability
Coefficient of Thermal Expansion (CTE) – X
17 ppm/°C
Matches copper closely
CTE – Y
17 ppm/°C
Helps reduce expansion stress
CTE – Z
24 ppm/°C
Critical for microvias
Thermal Decomposition Temp (Td)
> 400°C
Much higher than FR4
Thermal Stress
288°C / 10 sec
No delamination
Specific Heat
1.0 J/g-K
Supports stable power handling
The matched X/Y CTE and moderate Z-axis CTE improve reliability in multi-layer RF boards, QFN modules, and BGA transitions.
RO3003™ Mechanical Properties
Parameter
Condition
Typical Value
Tensile Modulus (MD)
23°C
18,000 MPa
Tensile Modulus (CD)
23°C
17,500 MPa
Flexural Strength
23°C
340 MPa
Peel Strength
1 oz Cu, after thermal aging
8.0 lb/in
Density
—
2.1 g/cm³
Hardness (Shore D)
—
74
Moisture Absorption
48h @ 50°C water
0.02%
Low moisture absorption is one of the main reasons designers choose Ro3003 laminate for outdoor and long-range radio systems.
RO3003™ Chemical & Environmental Properties
Property
Typical Value
Flammability
UL 94 V-0
Fungus Resistance
Pass
Copper Corrosion Test
Pass
Water Absorption
0.02%
RoHS
Compliant
Lead-Free Assembly
Fully supported
The laminate performs well in harsh environments such as marine radar, industrial sensors, and automotive radar systems.
RO3003™ Thickness Availability
Standard Thickness
Inches
Mil
Notes
0.127 mm
0.0050″
5 mil
Very common for antennas
0.203 mm
0.0080″
8 mil
Good for compact RF paths
0.254 mm
0.0100″
10 mil
LNA/PA front-end boards
0.508 mm
0.0200″
20 mil
Many GPS modules
0.762 mm
0.0300″
30 mil
Lower insertion loss
1.524 mm
0.0600″
60 mil
Large antennas or radar
Copper foil options include:
Copper Type
Standard Weight
Notes
ED Copper
½ oz, 1 oz
Best for general RF
Reverse-Treat Copper (RTF)
½ oz, 1 oz
Better for low-loss designs
Rolled Copper
Limited
Used for bending applications
RO3003™ Available Panel Sizes
Panel Size
Notes
12″ × 18″
Most common
18″ × 24″
Higher utilization
24″ × 36″
For mass production
Custom Cuts
By manufacturer
Panel selection strongly affects Rogers 3003 price because utilization changes final cost.
RO3003™ Impedance Control Data
Line Type
Result on 10 mil RO3003
Notes
50 Ω Microstrip
~23 mil width
Typical, depends on copper
75 Ω Microstrip
~12 mil width
Used in satellite links
100 Ω Differential Pair
8–10 mil / 8–10 mil spacing
Depends on copper thickness
90 Ω Diff Pair
10–12 mil
Common in RF front ends
For mmWave (60–86 GHz), designers often use:
Feature
Typical Value
Via Stub Target
< 6 mil
CPWG Gap
6–8 mil
Bends
Avoid sharp angles
RO3003™ Reliability Properties
Test
Result
Thermal Cycling
Excellent stability
IST Test
Low via fatigue
PTH Reliability
Stable with standard processes
Solder Float
No blistering
High-Temp Exposure
No resin cracking
Multi-Reflow Test
Stable after 3× lead-free reflow
RO3003 is widely used in 77 GHz automotive radar because it withstands large temperature swings without drift.
RO3003™ Comparison Against Other Rogers Materials
Parameter
RO3003
RO4003C
RO4350B
Dk
3.00
3.38
3.48
Df
0.0010
0.0027
0.0037
Moisture Absorption
0.02%
0.04%
0.06%
Thermal Conductivity
0.5 W/m·K
0.3 W/m·K
0.6 W/m·K
Dimensional Stability
High
Medium
High
Fabrication Difficulty
Low
Very low
Low
Cost
Highest
Lowest
Medium
Best For
Radar, mmWave
General RF
Telecom, WiFi, RF modules
RO3003™ Material Stack-Up Examples
1- Layer RF Antenna Stack-Up
Layer
Material
Top Copper
18 μm RTF
Dielectric
RO3003 10 mil
Ground Copper
18 μm RTF
2-Layer Balanced RF Module
Layer
Material
Signal Layer
½ oz copper
RO3003 Core
20 mil
Ground Layer
1 oz copper
Hybrid RF + Digital Stack-Up
Layer
Material
Top Copper
RF traces
RO3003
10 mil
Adhesive Layer
—
FR4 Prepreg
Standard
FR4 Core
Digital circuits
Bottom Copper
Ground / digital signals
If your next RF project involves RO3003 or other high-frequency laminates, our engineering team is ready to assist with simulations, stack-up proposals, prototype runs, and volume builds. You are welcome to contact Best Technology for professional guidance and fast support as you move from concept to production.
Our teams support RF designers from the early stack-up stage through final production with careful engineering review, material guidance, and precise process control. Every PCB moves through certified systems, including ISO9001, ISO13485, IATF16949, and AS9100D, which gives customers confidence in long-term reliability.
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