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PCB Directory Types: FR4, FPC, Ceramic & Metal Core PCB

Would you like to know what types of PCB directory are? Let’s explore FR4, Flexible, ceramic and metal core PCB directories through this blog together.

At Best Technology, we can provide you service:

  • Competitive Price & Premium Quality– Maximize your budget with cost-effective PCBs that meet stringent quality standards.
  • 24 Hours Rapid Prototyping– Accelerates product development cycles.
  • Free ‌DFM (Design for Manufacturability‌) Support -Prevents manufacturing errors before production.
  • Full Turnkey Solution-handle PCB fabrication to assembly, saving vendor coordination time cost and production cost.

Feel free to contact us if you have any inquiry for FR4 PCB, FPC PCB, ceramic PCB and MCPCB: sales@bestpcbs.com.

What Is PCB Directory?

PCB Directory is a professional online service platform dedicated to the global printed circuit board (PCB) industry. It aggregates resources from manufacturers, assembly providers, and design service firms, facilitating efficient supplier matching through parameter-based categorization (e.g., material type, layer count, thickness) and geographic filters. The platform supports specialized requirements such as flexible PCB and ceramic PCB, streamlining supply chain collaboration in electronics manufacturing and serving as a critical industry information hub.

What Is PCB Directory?

What Are Types of PCB Directory?

Base Material Categories

1. FR4 PCB Directory

  • Core Material: Fiberglass-reinforced epoxy composite.
  • Parameters: Tg 130-180℃, DK 4.2-4.8.
  • Applications: Consumer electronics mainboards, industrial control systems.

2. Flexible PCB (FPC) Directory

  • Core Material: Polyimide (PI) or polyester film.
  • Technical Features: Bend radius ≤1mm, >100,000 flex cycles.
  • Applications: Foldable smartphones, medical endoscopy devices.

3. Ceramic PCB Directory

  • Material Systems: Al₂O₃ (96%), AlN, BeO.
  • Thermal Performance: AlN 170-230W/m·K > Al₂O₃ 24-28W/m·K.
  • Applications: High-power LED modules, aerospace radar systems.

4. Metal Core PCB(MCPCB) Directory

  • Structural Types: Aluminum-backed (MCPCB), Copper-backed (IMS).
  • Thermal Management: Thermal resistance as low as 0.5℃/W.
  • Applications: Automotive headlamp drivers, photovoltaic inverters.

FR4 PCB Directory

  • Single Layer PCB
  • 2 Layers PCB
  • Multi-Layer PCB
  • Heavy Copper PCB
  • Bus Bar PCB
  • Extra Thin PCB
  • High Tg PCB
  • HDI PCB
  • RF Board

Our FR4 PCB capabilities:

ItemCapabilities
Layer Count1 – 32 Layers
Max Board Dimension2424″ (610610mm)
Min Board Thickness0.15mm
Max Board Thickness6.0mm – 8.0mm
Copper ThicknessOuter Layer: 1oz~30oz, Inner Layer: 0.5oz~30oz
Min Line Width/Line SpaceNormal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm)
Min Hole DiameterNormal: 8mil (0.20mm); HDI: 4mil (0.10mm)
Min Punch Hole Diameter0.1″ (2.5mm)
Min Hole Spacing12mil (0.3mm)
Min PAD Ring(Single)3mil (0.075mm)
PTH Wall ThicknessNormal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD DiameterNormal: 14mil (0.35mm); HDI: 10mil (0.25mm)
Min Solder mask BridgeNormal: 8mil (0.2mm); HDI: 6mil (0.15mm)
Min BAG PAD Margin5mil (0.125mm)
PTH/NPTH Diameter TolerancePTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation±2mil (0.05mm)
Outline ToleranceCNC: ±6mil (0.15mm); Die Punch: ±4mil (0.1mm); Precision Die: ±2mil (0.05mm)
Impedance ControlledValue>50ohm: ±10%; Value≤50ohm: ±5ohm
Max Aspect Ratio0.334027778
Surface TreatmentENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating, ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Immersion, Tin Immersion
Solder mask ColorGreen/White/Black/Yellow/Blue/Red

FPC PCB Directory

  • Single Sided Flexible Circuits
  • Double Sided Flexible Circuits
  • Multilayer Flexible Circuits
  • ‌FFC(Flat Flexible Cable‌)
  • Dual Access Flexible Circuits
  • Rigid-Flex Circuits

Our FPC PCB capabilities:

ItemCapabilities
Layers Count1-10L
Max Board Dimension1L:500*2000mm; 2L:250*1380mm
Conductor Thickness1/3 OZ (12 um) – 4OZ (140um)
Min Line Width/Line Space2/2mil
Min Hole SpacingNPTH:16mil; PTH:20mil
Hole Position Deviation±4mil (0.10mm)
Outline ToleranceLaser: +0.15mm/-0.05mm;
Die Punch: +0.10/-0.20 mm
Surface TreatmentENIG(Au 4u”), Hard Gold Plating (Au 50u”), Immersion Silver, Immersion Tin, OSP, ENEPIG
FPC PCB Directory

Our rigid-flex circuits capabilities:

ItemCapabilities
Layers Count2-50L
Max Board Dimension500 × 500mm
Conductor Thickness0.5oz (18μm) – 2oz (70μm)
Board Thickness0.3mm – 4.0mm
Min Line Width/Line Space4/4mil
Min Hole SpacingNPTH: 16mil; PTH: 20mil
Min Solder Mask Bridge8mil
Impedance Controlled±10% (>50Ω); ±5Ω (≤50Ω)
Rigid-Flex Circuits

Ceramic PCB Directory

  • Thick Film Ceramic PCB
  • Thin Film Ceramic PCB
  • DBC Ceramic PCB
  • DPC Ceramic PCB
  • AMB Ceramic PCB
  • LTCC PCB
  • HTCC PCB

Our ceramic PCB capabilities:

ItemCapabilities
Layer Count    1-6L (Thick Film)
1-2L (DBC/DPC/AMB)
4-64L (LTCC/HTCC)
Substrate MaterialAl₂O₃, AlN, BeO, ZrO₂, Si₃N₄
Conductor ThicknessCopper: 0.035-0.30mm
AgPd: 10-20μm
Au: 6-10μm
Working Temperature-50℃ to 800℃
Bonded Resistors±0.5% Tolerance
PTH Diameter Tolerance±4mil (0.1mm)
NPTH Diameter Tolerance±2mil (0.05mm)
Outline ToleranceLaser: +0.20/-0.05mm
Max Board SizeThick Film: 200×200mm
DBC/DCB: 138×178mm
DPC: 138×190mm AMB: 114×114mm
Min Board Thickness0.25mm-0.40mm
Min Hole SpacingNPTH: 16mil (0.30mm)
PTH: 20mil (0.5mm)
Hole Vias Tolerance±4mil (0.1mm)
Cutting ToleranceLaser: +0.2/-0.05mm
Mold+0.25/-0.20mm
Line Width/Space Tolerance±5mil (0.125mm), ±1mil (0.025mm)
Surface TreatmentAgPd, AuPd, Mn/Ni (Thick Film), OSP, Nickel Plating, ENIG, ENEPIG
Ceramic PCB Directory

Metal Core PCB Directory

  • Aluminum Base PCB
  • Copper Base PCB
  • COB PCB
  • SinkPAD PCB

Our MCPCB capabilities:

ItemCapabilities
Layer Count1-10L
Max Board Dimension610×1625mm
Conductor Thickness0.5oz – 10oz
Min Line Width/Line Space4/4mil
Wall Copper ThicknessNormal: 0.59mil; HDI: 0.48mil
Special Hole TypesCounterbore hole, Countersunk hole, Blind, Buried, Vias
Max Aspect Ratio10:1
Min Board Thickness0.8mm
Max Board Thickness5.0mm
Min Hole Diameter0.8mm
Min Hole Spacing1mm
Min Solder mask Bridge0.15mm
Metal Core PCB Directory

Our Prototyping Lead Time

Lead time for FR4 PCB prototyping

LayersNormal ServiceFastest Service
17 Days24 H
28 Days24 H
410 Days48 H
610 Days72 H
812 Days72 H
≥10TBDTBD

Lead time for MCPCB prototyping

LayersNormal ServiceFastest Service
14 Days24 H
214 Days168 H
421 DaysTBD

Lead time for FPC, Rigid- Flex & Ceramic PCB Prototyping

ItemsNormal ServiceFastest Service
FPC48-72 H24 H
Rigid- Flex2 Weeks for 4L1.5 Weeks for 4L
>4L: TBD>4L: TBD
Ceramic3 Weeks2 Weeks

Our Quality Certifications

  • ISO9001:2015
  • ISO13485:2016
  • REACH
  • RoHS
  • IATF16949

Attaches is our FR4 PCB prototype video for your reference:

Welcome to contact us if you need any help for FR4 PCB, FPC PCB, ceramic PCB and MCPCB : sales@bestpcbs.com.

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