5G Will Drive the Development of PCB

As the basic material of the digital products, PCB possesses a vast market. It can be applied to a variety of industries, including communications, computers, digital products and automobiles. Communications and computers account for the largest part.

5G era is around the corner, and China plans to achieve official commercialization of 5G network by 2020. The development of 5G puts higher requirements on the performance of PCB substrate, especially reflected in the followings:

1.      Low loss, high reliability

2.      High frequency

3.      High frequency PCB structure

4.      Low cost

HDI PCB

It is reported that 5G RF (radio frequency) will introduce Massive MIMO technology that requires communication with a wider spectrum and wider bandwidth in the millimeter wave band. Compared with the number of million-level base stations in the 4G era, the development of millimeter waves will promote the scale of base stations to exceed tens of millions in the 5G era.

It can be predicted that the full commercialization of 5G will push the construction and upgrading of the communication base stations. As a result, there will be a huge demand for high-frequency and high-speed PCB, and the PCB will meet the needs of a new round of upgrading and replacement.

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