MCPCB Technical FAQ’s
1. Can you tell me the minimum specs for smoothly manufacturing 2 layer Metal Core PCBs at your facility? +
Minimum hole diameter: 0.5mm; Minimum spacing between hole edge and hole edge: 1.5mm; Minimum circuit width and spacing: 1OZ(0.2mm) / 2OZ(0.25mm); Minimum final board thickness: 0.8mm
2. Are you UL certified manufacturer? +
Yes, we are UL certified manufacturer, our UL is E475635.
3. Can the aluminum be made as the base of sinkpad? +
Actually, the sinkpad can only use copper as the base. Aluminum cannot react with etching acid directly, which makes the process complex and increases scrap rate.
4. Would you have white papers explaining technical comparisons between FR4 and MCPCB? +
MCPCB has better thermal conductivity, generally 3-4 times more expensive than FR4. It efficiently dissipates heat via a thermal dielectric layer, while FR4 retains heat.
5. Is the backside of the PCB coated or exposed copper? +
Normally, the copper is exposed. ENEPIG coating is available but more expensive.
6. How thick is the ENEPIG metal layer finish? +
3u” for wire bonding.
7. How thick is the dielectric interlayer between top copper and substrate? +
75-100um
8. Is it possible to request a thicker dielectric layer? +
Yes, 150um is available.
9. Which dielectric do you recommend for 90+W LED products? +
3W/m·k or 2W/m·k is better than 1W/m·k.
10. Can you do bevel and chamfer features in metal core technology? +
Yes. Routing: ±0.15~0.2mm tolerance, rough surface; Carving: ±0.1mm tolerance, higher cost.
11. What is the standard dielectric thickness for aluminum MCPCB? +
75um or 100um.
12. Can the dielectric thickness be adjusted? +
Yes. Too thin may cause breakdown.
13. Is 2.0 W/(m·K) the highest thermal conductivity available? +
No, we offer 3.0 W/(m·K).
14. Can 1-layer SinkPAD use lead-free HASL? +
Not recommended. Risk of delamination and chemical reaction. OSP is preferred.
