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We are continued to improve our MCPCB, FR4 PCB & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves. Currently our monthy productivity is 10,000 square meter, more than 100 different boards will be completed. We calso provide fast service, and urgent boards can be shipped out within 24 hours! For more information , please click here for lead time...
Follows are basic PCB production cabability, but we are not limited by that. If you would like some specail material, tighter tolerance or other requirements, you can Contact our stuff directly, we are going to answer any questions of MCPCB, FR4 PCB & Ceramic PCB at anytime.
Items |
FR4 PCB |
MCPCB |
| Max Layer Count |
32 Layer |
4 Layers |
| Min Board Thickness |
16 mil (0.4mm) (4 L) |
32 mil (0.8mm) (1 L, 2 L) |
| 24 mil (0.6mm) (6 L) |
| 32 mil (0.8mm) (8 L) |
40 mil (1.0mm) (4 L) |
| 40 mil (1.0mm) (10 L) |
| Max Board Dimension |
24"*24" (610mm*610mm) |
24" *64"(610mm*1,625mm) |
| Min Trace Width/Space |
4/4 mil (3/3 mil for Prototype) |
| Min Hole Diameter |
8 mil (0.2mm) |
12 mil (0.3mm) |
| Min Punch Hole Dia |
0.1" (2.5mm) |
0.12" (3.0mm) |
| Min Hole Spacing |
12 mil (0.3mm) |
16 mil (0.4mm) |
| Max Aspect Ratio |
8:1 |
12:1 |
| Min Solder PAD Dia |
10 mil (0.25mm) |
10 mil (0.25mm) |
| Min PAD Ring |
± 4.5 mil (0.115mm) |
± 4.5 mil (0.115mm) |
| PTH Wall Thickness |
0.8 mil |
| PTH Dia Tolerance |
± 2 mil (0.05mm) |
± 2 mil (0.05mm) |
| NPTH Dia Tolerance |
±1 mil (0.025mm) |
± 2 mil (0.025mm) |
| Hole Position Deviation |
±2 mil (0.05mm) |
±3 mil (0.075mm) |
| Outline Tolerance |
CNC: ± 6 mil (0.15mm) |
CNC: ± 8 mil (0.2mm) |
| Die Punch: ± 4 mil (0.1mm) |
Die Punch: ± 6 mil (0.15mm) |
| Max Thickness of Copper |
Inner layer: 2.5 OZ |
2 OZ |
| Outlayer: 20 OZ |
2 OZ |
| Min Weld Separation Spacing |
± 8 mil (0.2mm) |
± 10 mil (0.25mm) |
| Min Weld Separation Width |
± 3 mil (0.075mm) |
± 4 mil (0.1mm) |
| Impedance Controlled |
± 10% |
N/M
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| Flammability |
94V-0 |
| Dielectric Strength |
> 1.3 KV /mm |
>1.5 Kv (L/S >1.5mm);
>3.0 Kv (L/S >3.0mm) |
| Wrap & Twist |
≤ 0.8% |
| Thermal Conductivity |
Normal: <=0.8 W/C-K |
Normal: 0.8~1.0 W/C-K
High: 2.0, 3.0 W/C-K |
| Thermal Stress |
3 x 10 Sec @ 280 ℃ |
> 60 Sec @ 280 ℃ |
| Surface Treatment |
HASL, HAL(LF), OSP, ENIG, Gold plating, Heavy Gold plating (up to 50 um), Gold finger, Selected Gold plating, Silver Imm., Tin Imm, |
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