MCPCB & PCB Production Capability

We are continued to improve our MCPCB, FR4 PCB & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves. Currently our monthy productivity is 260,000 square feet (28,900 square meter), more than 100 different boards will be completed. We calso provide fast service, and urgent boards can be shipped out within 24 hours! For more information , please click here for lead time...

Follows are basic PCB production cabability, but we are not limited by that. If you would like some specail material, tighter tolerance or other requirements, you can Contact our stuff directly, we are going to answer any questions of MCPCB, FR4 PCB & Ceramic PCB at anytime.

Items
FR4 PCB
MCPCB
Ceramic PCB
Max Layer Count 32 Layer 10 Layers Thick Film: 10L; DCB: 2L
Min Board Thickness 5.5 mil (0.13mm) (2 L) 12 mil (0.3mm) Thick Film: 10 mil (0.25mm)
DCB: 12mil (0.30mm)
6.7 mil (0.17mm) (2 L) 24 mil (0.6mm) Thick Film: 11mil (0.28mm)
DCB: 16mil (0.40mm)
16 mil (0.4mm) (4 L) 40 mil (1.0mm) 13.5 mil (0.34mm)
24 mil (0.6mm) (6 L) 48 mil (1.2mm) 28 mil (0.46mm)
32 mil (0.8mm) (8 L) 62 mil (1.6mm) 32 mil (0.81mm)
40 mil (1.2mm) (10 L) 79 mil (2.0mm) 60 mil (1.50mm)
Max Board Thickness 2L: 236mil (6mm)
≥4L: 315mil (8mm)
157 mil (4.0mm) Thick Film: 1.5mm
DCB: 1L: 1.3mm; 2L 1.6mm
Max Board Dimension 24*24" (610*610mm) 4*51"(100*1,300mm) 24*64"(610*1,625mm) Thick Film: 200*200mm
DCB: 138*178mm
Max Conductor Thickness 20 OZ (27.56mm) 10 OZ (14mil) Thick Film: 13um (0.51mil)
DCB: 8.6OZ (12mil)
Min Conductor Thickness 1/2 OZ (0.7 mil) Thick Film: 10um (0.39mil)
DCB:3.9 OZ (4mil)
Min Trace Width/Space Normal: 4/4 mi
HDI: 2/2 mil
4/4mil (0.1/0.10mm) Thick Film: 6/8mil (0.15/0.2mm)
DCB: 12/12mil (0.3/0.30mm)
Min Hole Diameter Normal: 8 mil (0.2mm) ;
HDI: 4mil (0.1mm)
12 mil (0.3mm) 4mil (0.1mm)
Min Punch Hole Dia 0.1" (2.5mm) 0.12" (3.0mm) N/M
Min Hole Spacing 12 mil (0.3mm) 16 mil (0.4mm) NPTH: 16mil (0.30mm)
PTH: 20mil (0.5mm)
Max Aspect Ratio 8:1 12:1 8:1
Min Solder PAD Dia HDI: 10 mil (0.25mm)
Normal: 14mil (0.35mm)
14mil (0.35mm) 10mil (0.25mm)
Min PAD Ring(Single) 3mil (0.075mm)
PTH Wall Thickness 0.48mil (12 um) for HDI;
0.59mil (15um) for normal
Thick Film: 10um
DCB: Not Available
PTH Dia Tolerance ± 3 mil (0.075mm) ± 4 mil (0.1mm)
NPTH Dia Tolerance ±2 mil (0.05mm) ± 2 mil (0.05mm) ± 2 mil (0.05mm)
Hole Position ±2 mil (0.05mm) ±3 mil (0.075mm) ±4 mil (0.1mm)
Outline Tolerance CNC: ± 6 mil (0.15mm) CNC: ± 6 mil (015mm) Laser: +0.2/0.05mm
Die Punch: ± 4 mil (0.1mm) Die Punch: ± 6 mil (0.15mm) Die Punch: +0.25/0.20mm
Min Soldermask Bridge HDI: 6 mil (0.15mm);
Normal: 8mil (0.2mm)
8 mil (0.20mm) 2 mil (0.3mm)
Min BAG PAD Margin 5 mil (0.125mm)

12 mil (0.3mm)

Impedance Controlled Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm

N/M

Thermal Conductivity
(W/m.K, or W/m.C)
0.30-0.45 Normal: 0.8~1.0, 1.5
High: 2.0, 3.0
Al2O3: >= 24 W/C-K
AIN: >=170 W/C-K
Dielectric Strength > 1.3 KV /mm >1.5 Kv (L/S >1.5mm);
>3.0 Kv (L/S >3.0mm)
>15 KV/mm
Wrap & Twist ≤ 0.75% ≤ 3%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating,ENEPIG, ENIPIG;
HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Thick Film: AgPd, AuPd, Mn/Ni
DCB: Ni plating, ENIG