PCB Layout
1. What impedance control capabilities do you support for PCB designs? +
We support full impedance control for PCB designs, including single-ended impedance (typically 50Ω, 75Ω) and differential impedance (typically 90Ω, 100Ω, 120Ω), with an impedance control tolerance of ±10% for standard designs and ±5% for high-precision high-speed designs.
2. What design for manufacturability (DFM) services do you provide? +
Our engineering team provides free comprehensive DFM review for every PCB design, including:
- Line width/spacing and annular ring compliance check
- Drill hole size and spacing feasibility check
- Impedance control stack-up design and verification
- Solder mask and silk screen design optimization
- Thermal management design recommendations for high-power designs
3. What is the minimum line width and spacing you can manufacture for standard PCBs? +
For standard 1oz finished copper PCBs, the minimum manufacturable line width and spacing is 3/3mil (0.075/0.075mm). For heavier copper designs, the minimum line width and spacing increases proportionally with copper thickness.
4. What is the minimum annular ring width required for PCB vias? +
The minimum required annular ring width is 0.15mm for 1oz copper PCBs, increasing by 0.05mm for every additional 1oz of copper thickness, to ensure reliable electrical connectivity and structural stability.
5. What is the minimum solder mask bridge width required for PCB designs? +
The minimum required solder mask bridge width is 0.1mm for 1oz copper PCBs, increasing by 0.02mm for every additional 1oz of copper thickness, to prevent solder bridging between adjacent pads during assembly.
6. What are the minimum size requirements for silk screen (legend) design? +
- Minimum silk screen line width: 0.15mm
- Minimum silk screen character height: 0.8mm
- Minimum silk screen character width: 0.5mm
- Minimum spacing between silk screen and copper pad: 0.2mm
- Minimum spacing between silk screen and via hole: 0.15mm
7. What is the maximum aspect ratio supported for via holes in PCB design? +
Our manufacturing process supports a maximum via hole aspect ratio of 10:1 (board thickness : via hole diameter), ensuring reliable metallization and electrical connectivity for deep vias in high-layer-count designs.
8. What are the minimum spacing requirements between PCB design elements and the board edge? +
- Minimum spacing between copper trace and board edge: 0.2mm
- Minimum spacing between copper pad and board edge: 0.3mm
- Minimum spacing between via hole and board edge: 0.3mm
- Minimum spacing between drill hole and board edge: 0.3mm
- Minimum spacing between silk screen and board edge: 0.2mm
