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The ceramic PCB is widely applied to various industries, such as automotive electronics, communications, aerospace and so on. It possesses the characteristics of high temperature resistance and high insulation performance. The thick film technology can improve the insulation performance and resistance accuracy of the circuit. Meanwhile, it also reduce the influence of external temperature and humidity. Therefore, the thick film circuit has stronger external environment adaptability than independent soldering circuit. Since the thick film ceramic PCB possesses many benefits, then how to make it? Here are some steps about the fabrication of thick film ceramic PCB.

1、Raw material

The size of the common ceramic substrate is 114*114mm. The specifications need to check the manufacturing capability of Best Technology. The picture below is the raw material before cutting:

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raw-material

2、Substrate drilling and outline cutting

Now both the drilling technology and the outline cutting are using laser machine. But the laser energy is different, such as cold light source (UV light), carbon dioxide (CO2), fiber cutting and so on,

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drilling

3、Blackening spot removing after laser drilling

After drilling, the protective material on the surface should be removed so that it can go to next step of copper spurring or conductive film printing, also the residue in the holes should be cleaned completely.

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ceramic-substrate-after-scribing

4、Make stencil for the trace according to the circuit drawing

In fact, the process of laser drilling/scribing and stencil making can be done at the same time, as they’re belonging to different production workshop.

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make-stencil

5、Conductive ink preparation

Different conductive ink has different storage temperature. Base on the different storage temperature a certain thawing and warming time are needed.

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conductive-ink

6.Sample making

At sample making, it can be followed the procedures like this: Fixing the ceramic substrate on the base, Align the locations of the stencil and the substrate, Putting the ink on the stencil,

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Sample making

7、Spreading, drying and over the firing oven , so that ink can be combined with ceramic substrate.

The detail steps after printing as below. If you still have questions about the Sample making, please click here to read more: 6.Sample making

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raw-material

8、Printing resistance ink and laser resistor trimming

The resistance ink can be printed after the conductor circuit was made. According to the different resistivity, only use the same value ink will be printed at a time.

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raw-material

9、Printing glass glaze to protect the circuit

Because the manufacturing process is the same as printing conductive ink, here the details will not be shown again. The process is also printing, drying, high-temperature firing,

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raw-material

10、Finished product testing, packing and shipment