


{"id":38519,"date":"2026-11-06T18:42:53","date_gmt":"2026-11-06T10:42:53","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/"},"modified":"2026-11-06T18:42:53","modified_gmt":"2026-11-06T10:42:53","slug":"microvia-target-pad-landing-margin","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/","title":{"rendered":"Microvia Target Pad: Check the Hidden Landing Margin"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_89 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#What_the_Target_Pad_Does\" >What the Target Pad Does<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Why_Top_and_Bottom_Can_Tell_Different_Stories\" >Why Top and Bottom Can Tell Different Stories<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Detailed_Parameters_for_a_Landing_Check\" >Detailed Parameters for a Landing Check<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Capture_Pad_vs_Target_Pad\" >Capture Pad vs Target Pad<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Worked_Example_Budget_the_Remaining_Margin\" >Worked Example: Budget the Remaining Margin<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Use_Compatible_Worst-Case_Inputs\" >Use Compatible Worst-Case Inputs<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Do_Not_Reuse_the_Circular_Formula_for_Every_Pad\" >Do Not Reuse the Circular Formula for Every Pad<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Separate_Misregistration_From_Interface_Damage\" >Separate Misregistration From Interface Damage<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Ask_What_the_Cross-Section_Represents\" >Ask What the Cross-Section Represents<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Treat_Stacked_Structures_Individually\" >Treat Stacked Structures Individually<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Connect_the_Margin_to_the_Routing_Trade-Off\" >Connect the Margin to the Routing Trade-Off<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Put_the_Review_on_the_Release_Drawing\" >Put the Review on the Release Drawing<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#Request_an_HDI_Review\" >Request an HDI Review<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/11\/microvia-target-pad-landing-margin\/#FAQ\" >FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div><p>A laser microvia can look centred at its entry while its bottom opening is too close to the edge of the buried target pad. Check the entry and landing separately. A top-side image cannot show the hidden margin or establish that the finished interface is sound.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"What_the_Target_Pad_Does\"><\/span>What the Target Pad Does<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>The target pad is the copper feature at the bottom of the microvia. It provides the intended landing on the destination layer. An <a href=\"https:\/\/www.ipc.org\/system\/files\/technical_resource\/E12%26S06_01.pdf\">IPC-hosted paper on microvia failure modes<\/a> distinguishes misalignment at the capture and target pads.<\/p>\n<figure><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/11\/hdi-via-escape.jpg\" width=\"1120\" height=\"630\" style=\"max-width:100%;height:auto\" alt=\"Illustrative HDI routing with a loose BGA package showing its solder-ball side\"><figcaption>AI-generated cutaway concept; the package is not shown installed and the geometry is not to scale.<\/figcaption><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Why_Top_and_Bottom_Can_Tell_Different_Stories\"><\/span>Why Top and Bottom Can Tell Different Stories<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>The entry relates to the outer pad. The bottom relates to another layer and the effective hole geometry at that depth. A centred entry alone does not locate the buried copper relative to the hole bottom.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Detailed_Parameters_for_a_Landing_Check\"><\/span>Detailed Parameters for a Landing Check<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<figure class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Parameter<\/strong><\/td>\n<td><strong>Unit or record<\/strong><\/td>\n<td><strong>Purpose<\/strong><\/td>\n<\/tr>\n<tr>\n<td>&#8212;<\/td>\n<td>&#8212;<\/td>\n<td>&#8212;<\/td>\n<\/tr>\n<tr>\n<td>Finished target diameter<\/td>\n<td>\u00b5m<\/td>\n<td>Defines the circular example pad<\/td>\n<\/tr>\n<tr>\n<td>Bottom opening diameter<\/td>\n<td>\u00b5m<\/td>\n<td>Defines the footprint at the landing<\/td>\n<\/tr>\n<tr>\n<td>Relative centre offset<\/td>\n<td>\u00b5m<\/td>\n<td>Describes target registration<\/td>\n<\/tr>\n<tr>\n<td>Required remaining margin<\/td>\n<td>\u00b5m<\/td>\n<td>Sets the acceptance boundary<\/td>\n<\/tr>\n<tr>\n<td>Layer pair and via type<\/td>\n<td>Drawing IDs<\/td>\n<td>Identifies which construction is being checked<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Capture_Pad_vs_Target_Pad\"><\/span>Capture Pad vs Target Pad<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<figure class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Question<\/strong><\/td>\n<td><strong>Capture pad<\/strong><\/td>\n<td><strong>Target pad<\/strong><\/td>\n<\/tr>\n<tr>\n<td>&#8212;<\/td>\n<td>&#8212;<\/td>\n<td>&#8212;<\/td>\n<\/tr>\n<tr>\n<td>Where is it?<\/td>\n<td>At the via entry<\/td>\n<td>On the destination layer<\/td>\n<\/tr>\n<tr>\n<td>Which diameter applies?<\/td>\n<td>Entry opening<\/td>\n<td>Bottom opening<\/td>\n<\/tr>\n<tr>\n<td>What should be verified?<\/td>\n<td>Registration to outer land<\/td>\n<td>Landing overlap and interface<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Worked_Example_Budget_the_Remaining_Margin\"><\/span>Worked Example: Budget the Remaining Margin<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>For hypothetical round features, use half the difference between target diameter and bottom opening, minus the offset magnitude. With a 180 \u00b5m target, 90 \u00b5m bottom opening and 25 \u00b5m offset, the remaining margin is 20 \u00b5m. If the agreed limit were 25 \u00b5m, this example would fail. The values are not a supplier capability.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Use_Compatible_Worst-Case_Inputs\"><\/span>Use Compatible Worst-Case Inputs<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>For a conservative circular estimate, use the minimum target diameter and maximum relevant bottom opening and offset under the agreed model. Do not count a tolerance twice. If the fabricator uses a different statistical or geometric approach, document it separately.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Do_Not_Reuse_the_Circular_Formula_for_Every_Pad\"><\/span>Do Not Reuse the Circular Formula for Every Pad<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A shaped pad, neighbouring cutout or noncircular opening can put the closest edge in a different direction. Check the real shapes and the approved datum. Use the simple calculation only where its assumptions describe the feature.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Separate_Misregistration_From_Interface_Damage\"><\/span>Separate Misregistration From Interface Damage<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A sufficient geometric margin does not show that the interface is clean, continuous or properly plated. The <a href=\"https:\/\/www.ipc.org\/system\/files\/technical_resource\/E8%26S22_01.pdf\">IPC-hosted drilling paper<\/a> describes difficulties that can occur when the laser misses its intended landing. Check geometry and interface condition as separate observations.<\/p>\n<figure><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/11\/hdi-landing-section.jpg\" width=\"1120\" height=\"571\" style=\"max-width:100%;height:auto\" alt=\"HDI coupon at a metallography station\"><figcaption>AI-generated illustration of inspection context, not a qualified section.<\/figcaption><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Ask_What_the_Cross-Section_Represents\"><\/span>Ask What the Cross-Section Represents<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A section can expose the hidden interface, but its cut plane limits what it shows. A section aligned with one direction may miss a displacement in another direction. Agree on a representative inspection plan rather than using one attractive image as proof of the worst case.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Treat_Stacked_Structures_Individually\"><\/span>Treat Stacked Structures Individually<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>In a stack, the landing for one step is not automatically the landing for the next. Check the layer pair, process sequence and relevant interfaces. Do not assume a result on a single blind via covers a different stacked construction.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Connect_the_Margin_to_the_Routing_Trade-Off\"><\/span>Connect the Margin to the Routing Trade-Off<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Increasing the target pad can consume escape-routing space or change clearance. Before changing it, compare the proposed opening, stackup and registration with the fabricator. The <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/pcb-via-types\/\">BestPCBs via types guide<\/a> covers the wider interconnect choices.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Put_the_Review_on_the_Release_Drawing\"><\/span>Put the Review on the Release Drawing<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Record layer pairs, the intended landing geometry, accepted criteria and inspection evidence. Keep the drawing and coupon identifiers linked. When the proposed build differs from the approved geometry, resolve the discrepancy before relying on the calculation.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Request_an_HDI_Review\"><\/span>Request an HDI Review<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Share the stackup and via geometry with <a href=\"mailto:sales@bestpcbs.com\">Best Technology<\/a>.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"FAQ\"><\/span>FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<h3>Are capture pad and target pad the same thing?<\/h3>\n<p>They refer to different positions in this article: the entry pad and the destination pad. Terminology can vary, so name the exact layer and show the geometry in the drawing. That makes the requested check clear even when a supplier uses different naming.<\/p>\n<h3>Can the entry diameter be used for the bottom calculation?<\/h3>\n<p>Only if it actually represents the specified bottom opening, which cannot be assumed for a tapered via. Use the geometry at the target interface for the landing check. Keep the entry calculation separate and confirm how the fabricator defines and measures each opening.<\/p>\n<h3>Does a centred top view prove adequate landing?<\/h3>\n<p>No. It shows the relationship visible at the surface and does not identify the buried target location. The bottom opening and the target pad belong to another check. Ask for suitable design and inspection evidence if the hidden margin is important for approval.<\/p>\n<h3>Can I fix the issue by increasing every target pad?<\/h3>\n<p>A larger pad can improve the nominal geometric margin but may reduce routing space or clearance. Review the actual offset and manufacturing proposal first. Change the specific geometry that needs it and confirm that the revised construction still meets electrical and layout constraints.<\/p>\n<h3>Is positive margin enough for acceptance?<\/h3>\n<p>Not necessarily. The drawing can require more than simple overlap, and the result depends on how the dimensions were defined. Compare the calculated or measured margin with the actual requirement and verify the interface condition separately before treating the via as accepted.<\/p>\n<h3>What if the section is cut at the wrong angle?<\/h3>\n<p>The observed geometry may not show the true offset direction or the narrowest remaining margin. Document the cut and ask how the sample was prepared. If the result controls disposition, use the inspection plan to determine whether another view or suitable evidence is needed.<\/p>\n<h3>Does electrical continuity catch every landing problem?<\/h3>\n<p>Continuity shows a path exists under the test conditions. It does not measure the remaining target margin or rule out all structural weaknesses. Use electrical and physical evidence for their intended purposes, and apply the acceptance rules for the specific HDI build.<\/p>\n<h3>What should the fabricator review before ordering?<\/h3>\n<p>Send the layer pair, target and entry pads, expected opening geometry and clearance requirements. Ask how registration is budgeted and what evidence represents the actual production structure. Keep the approved interpretation tied to the released stackup and artwork so later changes can be assessed.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Check microvia target-pad margin separately from the visible top opening, and learn which measurements support an HDI registration review.<\/p>\n","protected":false},"author":32827,"featured_media":38517,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[174],"tags":[9147,9145,9146,9144],"class_list":["post-38519","post","type-post","status-publish","format-standard","hentry","category-bestpcb","tag-capture-pad","tag-hdi-registration","tag-laser-via","tag-microvia-target-pad"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 5.0.4 - aioseo.com -->\n\t<meta name=\"description\" content=\"Check microvia target-pad margin separately from the visible top 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