{"id":36951,"date":"2026-10-06T14:31:54","date_gmt":"2026-10-06T06:31:54","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=36951"},"modified":"2026-10-06T14:31:54","modified_gmt":"2026-10-06T06:31:54","slug":"bga-void","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/","title":{"rendered":"What Is a BGA Void? Causes, Risks, and Prevention"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#What_Is_a_BGA_Void\" >What Is a BGA Void?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#What_Causes_BGA_Voids_to_Form\" >What Causes BGA Voids to Form?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#Are_BGA_Voids_Always_a_Reliability_Problem\" >Are BGA Voids Always a Reliability Problem?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#Which_BGA_Voids_Are_More_Likely_to_Affect_Reliability\" >Which BGA Voids Are More Likely to Affect Reliability?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Are_BGA_Voids_Detected_and_Measured\" >How Are BGA Voids Detected and Measured?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#What_BGA_Void_Percentage_Is_Acceptable\" >What BGA Void Percentage Is Acceptable?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Do_Solder_Paste_and_Stencil_Printing_Affect_BGA_Voids\" >How Do Solder Paste and Stencil Printing Affect BGA Voids?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Does_the_Reflow_Profile_Affect_BGA_Voiding\" >How Does the Reflow Profile Affect BGA Voiding?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Do_PCB_Pad_and_Via_Designs_Contribute_to_BGA_Voids\" >How Do PCB Pad and Via Designs Contribute to BGA Voids?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Can_You_Find_the_Root_Cause_of_BGA_Voids\" >How Can You Find the Root Cause of BGA Voids?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#How_Can_You_Reduce_and_Prevent_BGA_Voids\" >How Can You Reduce and Prevent BGA Voids?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#FAQs_About_BGA_Voids\" >FAQs About BGA Voids<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/#Conclusion\" >Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div><style>.post-36951 h1,.post-36951 h2{word-break:normal!important;overflow-wrap:break-word!important}@media(max-width:600px){.post-36951 figure.diagnostic-table{overflow:visible}.post-36951 .diagnostic-table table,.post-36951 .diagnostic-table tbody,.post-36951 .diagnostic-table tr,.post-36951 .diagnostic-table td{display:block;width:100%!important;box-sizing:border-box}.post-36951 .diagnostic-table tr:first-child{display:none}.post-36951 .diagnostic-table tr{margin:0 0 1rem;border:1px solid #d9d9d9}.post-36951 .diagnostic-table td{border:0!important;padding:.55rem .7rem}.post-36951 .diagnostic-table td::before{content:attr(data-label);display:block;margin-bottom:.2rem;font-weight:700}}<\/style>\n<p>Finding a <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/\">BGA void<\/a> does not automatically mean the solder joint will fail, and it does not automatically justify rework. <strong>The decision depends on how much of the joint is affected, where the void sits, whether the pattern repeats, and which acceptance requirement governs the build.<\/strong><\/p>\n<p>A single percentage cannot answer all four questions. The useful path is to read the full X-ray pattern, separate measurement from acceptance, and then connect the result to paste deposition, reflow, moisture exposure, or PCB pad and via design. That turns an image into a decision instead of a reason to change several process variables at once.<\/p>\n<figure class=\"article-image\">\n    <img src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/10\/bga-void-x-ray-inspection-a548759269.jpg\" alt=\"BGA void, BGA package and X-ray inspection monitor showing hidden solder joint indications\" width=\"600\" height=\"400\" fetchpriority=\"high\" class=\"aligncenter size-full\" loading=\"eager\" decoding=\"async\" style=\"display:block;width:100%;max-width:600px;height:auto;margin:0 auto;\"><br \/>\n  <\/figure>\n<section>\n<h2 id=\"what-is-a-bga-void\"><span class=\"ez-toc-section\" id=\"What_Is_a_BGA_Void\"><\/span>What Is a BGA Void?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>A <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/\">BGA void<\/a> is an unfilled cavity trapped inside a BGA solder joint after reflow.<\/strong> It can originate in the package solder ball, the printed solder paste, or the combined joint formed when the ball and paste coalesce during <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/06\/bga-soldering\/\">BGA soldering<\/a>. Because the package hides the array, internal voids are normally assessed with X-ray inspection.<\/p>\n<p>A void is not the same as a bridge, missing ball, nonwet open, or head-in-pillow condition. Those defects form differently and may require other views or tests. <strong>Confirm the defect type before calculating a void percentage or changing the assembly process.<\/strong> Record the indication first; make the acceptance decision only after its context is known.<\/p>\n<\/section>\n<section>\n<h2 id=\"what-causes-bga-voids-to-form\"><span class=\"ez-toc-section\" id=\"What_Causes_BGA_Voids_to_Form\"><\/span>What Causes BGA Voids to Form?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>BGA voids form when gas, flux volatiles, or trapped air cannot escape before molten solder solidifies.<\/strong> The sources fall into four practical groups:<\/p>\n<ul>\n<li><strong>Material-related causes:<\/strong> paste chemistry, flux activity, moisture, oxidation, or contamination can add gas or interfere with wetting.<\/li>\n<li><strong>Printing-related causes:<\/strong> the shape and consistency of the paste deposit influence trapped air, solder volume, and the route available for gas to leave.<\/li>\n<li><strong>Reflow-related causes:<\/strong> the thermal profile determines when volatiles are released, how well the solder wets, and how long gas can escape before solidification.<\/li>\n<li><strong>PCB pad and via-related causes:<\/strong> land geometry, via-in-pad construction, and local copper distribution alter solder flow, heat transfer, and solder wicking.<\/li>\n<\/ul>\n<p>Several groups can act together. The X-ray pattern narrows the search; paste records, SPI, thermal data, and PCB information identify the actual cause.<\/p>\n<\/section>\n<section>\n<h2 id=\"are-bga-voids-always-a-reliability-problem\"><span class=\"ez-toc-section\" id=\"Are_BGA_Voids_Always_a_Reliability_Problem\"><\/span>Are BGA Voids Always a Reliability Problem?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>No. A BGA void is an internal cavity, not an automatic declaration that the solder joint is defective.<\/strong> Some joints with voiding remain serviceable, while others deserve attention because of their geometry and the product&#8217;s operating conditions.<\/p>\n<p>An X-ray indication should therefore trigger an engineering evaluation rather than immediate rework. Removing a BGA adds another thermal cycle and can introduce pad, package, or alignment damage, so the rework decision should follow the applicable acceptance requirement and the actual risk to the assembly.<\/p>\n<p><strong>The lower-risk response is to document the indication, review the governing requirement, and compare the complete array before deciding whether further testing or rework is justified.<\/strong><\/p>\n<\/section>\n<section>\n<h2 id=\"which-bga-voids-are-more-likely-to-affect-reliability\"><span class=\"ez-toc-section\" id=\"Which_BGA_Voids_Are_More_Likely_to_Affect_Reliability\"><\/span>Which BGA Voids Are More Likely to Affect Reliability?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Voids are more likely to affect reliability when they remove a large part of the joint, sit near a critical interface, form a cluster, or recur at stressed ball locations.<\/strong> The same void geometry deserves more attention in assemblies exposed to strong mechanical or thermal loads.<\/p>\n<p><strong>Pay closer attention when:<\/strong><\/p>\n<ul>\n<li><strong>Large area loss:<\/strong> a single void occupies a large part of the joint.<\/li>\n<li><strong>Critical location:<\/strong> the void is close to an interface or likely crack path.<\/li>\n<li><strong>Clustered geometry:<\/strong> several nearby voids reduce the effective solder area in one region.<\/li>\n<li><strong>Repeatable coordinates:<\/strong> the same ball locations show voiding across multiple boards.<\/li>\n<li><strong>High service load:<\/strong> the assembly faces vibration, bending, drop, or repeated thermal cycling.<\/li>\n<\/ul>\n<p><strong>Do not decide from total percentage alone.<\/strong> Compare the largest void, its location, the distribution across the array, and the product&#8217;s expected loads. A higher-risk pattern calls for closer verification, not an automatic conclusion.<\/p>\n<\/section>\n<section>\n<h2 id=\"how-are-bga-voids-detected-and-measured\"><span class=\"ez-toc-section\" id=\"How_Are_BGA_Voids_Detected_and_Measured\"><\/span>How Are BGA Voids Detected and Measured?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>BGA voids are normally detected by <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/04\/x-ray-inspection-for-pcb-assembly\/\">X-ray inspection for PCB assembly<\/a>, where they appear as lighter regions inside the darker solder-joint projection.<\/strong> The first task is to confirm that the indication is inside a joint and then read it in the context of the complete array.<\/p>\n<ul>\n<li><strong>Size:<\/strong> compare the largest individual void and the total affected area rather than counting bright spots alone.<\/li>\n<li><strong>Location:<\/strong> note whether the void is central, near an interface, or aligned with a via or other PCB feature.<\/li>\n<li><strong>Pattern:<\/strong> distinguish one isolated indication from clusters, rows, corners, or a region that shares the same thermal or design influence.<\/li>\n<li><strong>Repeatability:<\/strong> compare the same ball coordinates across more than one board to separate a random event from a fixed process or PCB factor.<\/li>\n<\/ul>\n<p>Inspect the whole array before enlarging one joint. Use a consistent exposure and orientation, record the ball coordinate, and retain the original image. That makes later comparisons traceable and reduces the chance that one unusual joint is mistaken for a package-wide trend.<\/p>\n<p><strong>Projected void area ratio = total projected void area inside the joint \u00f7 projected solder-joint area \u00d7 100%<\/strong><\/p>\n<p>For example, 0.050 mm<sup>2<\/sup> of visible voiding inside a 0.503 mm<sup>2<\/sup> projected joint area gives about 9.9%. The result can change with image angle, magnification, contrast, and the selected boundary, so comparisons need the same setup and method.<\/p>\n<figure class=\"article-image\">\n      <img src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/10\/bga-void-detection-measurement-8dccd7db49.jpg\" alt=\"BGA void, X-ray view of a BGA array with an enlarged solder joint showing projected void area\" width=\"600\" height=\"400\" loading=\"lazy\" class=\"aligncenter size-full\" decoding=\"async\" style=\"display:block;width:100%;max-width:600px;height:auto;margin:0 auto;\"><br \/>\n    <\/figure>\n<p><strong>The measurement is not an automatic pass or fail.<\/strong> X-ray describes projected geometry; acceptance still depends on the governing requirement, the void&#8217;s position and distribution, and the product risk.<\/p>\n<\/section>\n<section>\n<h2 id=\"what-bga-void-percentage-is-acceptable\"><span class=\"ez-toc-section\" id=\"What_BGA_Void_Percentage_Is_Acceptable\"><\/span>What BGA Void Percentage Is Acceptable?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>There is no single BGA void percentage that can serve as a universal pass\/fail limit.<\/strong> Acceptance follows the document and revision specified for the project, together with the measurement method and the joint condition shown by the X-ray.<\/p>\n<p><strong>A practical decision follows this order:<\/strong><\/p>\n<ol>\n<li><strong>Identify the governing requirement.<\/strong> The customer specification, drawing, contract, or applicable IPC document establishes the acceptance basis for that build.<\/li>\n<li><strong>Confirm the measurement method.<\/strong> The reported ratio should be traceable to a defined X-ray view, threshold, and projected joint boundary.<\/li>\n<li><strong>Review the largest individual void.<\/strong> This distinguishes one dominant cavity from the same total area spread across smaller voids.<\/li>\n<li><strong>Consider location and distribution.<\/strong> Interface-adjacent, clustered, or repeated voids may justify further review even when the total percentage is unchanged.<\/li>\n<li><strong>Compare the array and production lot.<\/strong> A stable isolated result and a worsening repeated pattern should not receive the same process response.<\/li>\n<\/ol>\n<p>Figures such as <strong>10%, 20%, or 25% are not universal BGA acceptance limits<\/strong>. A value quoted online may come from another document revision, product class, package type, or measurement convention. Use a numerical limit only when the project requirement makes it applicable. If the build documents do not specify one, settle the acceptance basis and review authority before production rather than inventing a threshold after inspection.<\/p>\n<\/section>\n<section>\n<h2 id=\"how-do-solder-paste-and-stencil-printing-affect-bga-voids\"><span class=\"ez-toc-section\" id=\"How_Do_Solder_Paste_and_Stencil_Printing_Affect_BGA_Voids\"><\/span>How Do Solder Paste and Stencil Printing Affect BGA Voids?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Solder paste controls volatile release and wetting, while stencil printing determines the volume and shape of each deposit.<\/strong> Paste that is beyond its storage, conditioning, or floor-life limits can behave differently; moisture exposure or contamination can add gas or disrupt wetting. Printing variation can then change both solder volume and the escape path.<\/p>\n<p>Irregular results from ball to ball often justify checking SPI volume, alignment, aperture release, stencil cleanliness, and paste handling before changing the oven. A consistent footprint-wide pattern points more strongly toward paste chemistry, aperture design, or a stable print setup. <strong>Confirm the correction when SPI stability and the next X-ray pattern improve together.<\/strong><\/p>\n<\/section>\n<section>\n<h2 id=\"how-does-the-reflow-profile-affect-bga-voiding\"><span class=\"ez-toc-section\" id=\"How_Does_the_Reflow_Profile_Affect_BGA_Voiding\"><\/span>How Does the Reflow Profile Affect BGA Voiding?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>The reflow profile affects BGA voiding by controlling when volatiles are released, when solder coalesces, and how long gas can escape.<\/strong> Aggressive heating can trap gas after coalescence begins; insufficient time above liquidus can limit wetting; excessive heat can exhaust the flux or increase oxidation and warpage risk.<\/p>\n<p>Widespread voiding may reflect a profile that does not suit the paste and board mass, while one row or corner may expose a temperature difference across the package. Measure the real ramp, soak, time above liquidus, peak, and temperature spread with thermocouples at representative locations. <strong>Adjust within material and component limits, then compare the next build using the same X-ray method.<\/strong><\/p>\n<\/section>\n<section>\n<h2 id=\"how-do-pcb-pad-and-via-designs-contribute-to-bga-voids\"><span class=\"ez-toc-section\" id=\"How_Do_PCB_Pad_and_Via_Designs_Contribute_to_BGA_Voids\"><\/span>How Do PCB Pad and Via Designs Contribute to BGA Voids?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>PCB pad and via designs contribute to BGA voiding when they change solder volume, wetting, heat flow, or the path into which molten solder can wick.<\/strong> Open or incompletely filled <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/via-in-pad-plated-over\/\">via-in-pad structures<\/a> can pull solder away from the joint and leave an indication aligned with the via.<\/p>\n<p>Voids that recur at the same coordinates, follow via locations, or concentrate near different copper mass point toward a fixed board feature. Compare the X-ray with the land pattern and fabrication data, then verify via fill, cap, planarity, and pad dimensions on the delivered PCB. <strong>The actual construction, not the drawing alone, shows whether solder wicking or thermal imbalance is present.<\/strong> Check both design intent and delivered-board evidence before changing the assembly process.<\/p>\n<\/section>\n<section>\n<h2 id=\"how-can-you-find-the-root-cause-of-bga-voids\"><span class=\"ez-toc-section\" id=\"How_Can_You_Find_the_Root_Cause_of_BGA_Voids\"><\/span>How Can You Find the Root Cause of BGA Voids?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>The fastest route to a likely BGA void cause is to match the X-ray pattern with the process or design evidence that could produce it.<\/strong> The image supplies a direction; SPI, thermal data, material history, and PCB information confirm or reject it.<\/p>\n<figure class=\"article-image\">\n      <img src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/10\/bga-void-root-cause-patterns-f5a62e3e6e.jpg\" alt=\"BGA void, four X-ray distribution patterns used to compare likely cause areas\" width=\"600\" height=\"400\" loading=\"lazy\" class=\"aligncenter size-full\" decoding=\"async\" style=\"display:block;width:100%;max-width:600px;height:auto;margin:0 auto;\"><br \/>\n    <\/figure>\n<figure class=\"wp-block-table diagnostic-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>X-Ray Pattern<\/strong><\/td>\n<td><strong>Likely Cause Area<\/strong><\/td>\n<td><strong>Check First<\/strong><\/td>\n<\/tr>\n<tr>\n<td data-label=\"X-Ray Pattern\">Many small voids<\/td>\n<td data-label=\"Likely Cause Area\">Paste or reflow behavior<\/td>\n<td data-label=\"Check First\">Paste condition, SPI stability, and the measured thermal profile<\/td>\n<\/tr>\n<tr>\n<td data-label=\"X-Ray Pattern\">One large isolated void<\/td>\n<td data-label=\"Likely Cause Area\">Local printing or wetting<\/td>\n<td data-label=\"Check First\">SPI at that pad, pad surface condition, and contamination evidence<\/td>\n<\/tr>\n<tr>\n<td data-label=\"X-Ray Pattern\">Voids aligned with vias<\/td>\n<td data-label=\"Likely Cause Area\">Via-in-pad construction<\/td>\n<td data-label=\"Check First\">Via fill, cap, planarity, and evidence of solder wicking<\/td>\n<\/tr>\n<tr>\n<td data-label=\"X-Ray Pattern\">One row or corner affected<\/td>\n<td data-label=\"Likely Cause Area\">Thermal imbalance or warpage<\/td>\n<td data-label=\"Check First\">Temperature distribution across the BGA and board flatness<\/td>\n<\/tr>\n<tr>\n<td data-label=\"X-Ray Pattern\">Same coordinates on many boards<\/td>\n<td data-label=\"Likely Cause Area\">Fixed design or process factor<\/td>\n<td data-label=\"Check First\">Pad, via, copper, tooling, and repeatable process patterns<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n<p><strong>A pattern is a starting hypothesis, not a final diagnosis.<\/strong> Start with the broadest repeatable feature, because an array-wide change is usually more informative than the most visually dramatic joint. Then work through five practical moves:<\/p>\n<ol>\n<li><strong>Check whether it repeats.<\/strong> Compare several boards and the same ball coordinates.<\/li>\n<li><strong>Match the pattern to evidence.<\/strong> Review SPI, the measured profile, material history, and PCB features.<\/li>\n<li><strong>Choose the strongest explanation.<\/strong> Predict which joints should change if that explanation is correct.<\/li>\n<li><strong>Change one leading variable.<\/strong> Keep the other major conditions stable so the trial is readable.<\/li>\n<li><strong>Recheck the same locations.<\/strong> Improvement supports the cause; no change means the next explanation should be tested.<\/li>\n<\/ol>\n<\/section>\n<section>\n<h2 id=\"how-can-you-reduce-and-prevent-bga-voids\"><span class=\"ez-toc-section\" id=\"How_Can_You_Reduce_and_Prevent_BGA_Voids\"><\/span>How Can You Reduce and Prevent BGA Voids?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Prevent recurring BGA voids by holding proven material, printing, thermal, moisture, and PCB conditions stable and confirming that the improvement repeats.<\/strong><\/p>\n<ul>\n<li><strong>Stabilize paste and printing.<\/strong> Keep paste within its handling limits, maintain the stencil, and use SPI to confirm consistent volume and alignment.<\/li>\n<li><strong>Profile the actual assembly.<\/strong> Use thermocouple data from the real board and BGA rather than copying an oven recipe from another product.<\/li>\n<li><strong>Control moisture and contamination.<\/strong> Follow the documented storage, floor-life, handling, cleaning, and any required baking limits.<\/li>\n<li><strong>Verify pad and via construction.<\/strong> Confirm that delivered boards match the corrected via fill, cap, planarity, and land geometry.<\/li>\n<li><strong>Use a repeat-build check.<\/strong> Inspect the same coordinates with the same X-ray setup on the next build and confirm that the improvement holds across the agreed sample.<\/li>\n<\/ul>\n<p><strong>One improved image is not enough.<\/strong> Treat the correction as proven only when the process evidence and X-ray result repeat. Higher-risk products may also need electrical, mechanical, or qualification testing because X-ray alone cannot predict field life.<\/p>\n<\/section>\n<section>\n<h2 id=\"faqs-about-bga-voids\"><span class=\"ez-toc-section\" id=\"FAQs_About_BGA_Voids\"><\/span>FAQs About BGA Voids<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Q1: Can a BGA pass functional testing and still have a hidden solder-joint problem?<\/strong><\/p>\n<p><strong>A1: Yes.<\/strong> Functional testing confirms operation under the applied conditions, not the internal shape of every joint. A marginal connection may behave differently during bending, vibration, or thermal cycling, so test results and X-ray evidence answer different questions.<\/p>\n<p><strong>Q2: Should a BGA be reworked solely because voids appear on an X-ray?<\/strong><\/p>\n<p><strong>A2: No.<\/strong> Rework adds thermal and handling risk. First confirm the defect type, applicable acceptance requirement, void location, and repeatability. An ambiguous image may need another view before the package is removed.<\/p>\n<p><strong>Q3: What information should a useful BGA X-ray report include?<\/strong><\/p>\n<p><strong>A3: The report should make the decision reproducible.<\/strong> Include the assembly identity, BGA part number, lot, array orientation, ball coordinates, overview and detail images, measurement method, governing requirement, and disposition. Preserve the original images for later comparisons.<\/p>\n<p><strong>Q4: Can 2D X-ray reliably distinguish a void from head-in-pillow?<\/strong><\/p>\n<p><strong>A4: Not in every case.<\/strong> A 2D image is a projection, so overlapping materials can hide an interface separation. Another X-ray view or physical analysis may be needed when the image and electrical symptom do not agree.<\/p>\n<p><strong>Q5: What should be checked after BGA rework?<\/strong><\/p>\n<p><strong>A5: Review the complete reworked array.<\/strong> Check alignment, ball shape and collapse, bridges, opens, voiding, and regional differences. Compare with the earlier image when available, then complete the appropriate electrical or functional test.<\/p>\n<p><strong>Q6: When is destructive analysis justified for a suspected BGA void problem?<\/strong><\/p>\n<p><strong>A6: It is justified when nondestructive evidence cannot resolve an important failure question.<\/strong> Cross-sectioning or dye-and-pry can confirm interface cracking, pad separation, intermetallic condition, or true void geometry when a sample can be sacrificed. Preserve the X-ray, electrical results, and build history first.<\/p>\n<\/section>\n<section>\n<h2 id=\"conclusion\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusion<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>A BGA void should lead to an evidence-based decision, not automatic rework.<\/strong> Confirm the defect type, compare its size, location, distribution, and repeatability, measure it with a consistent X-ray method, and apply the requirement that governs the build. If the pattern repeats, change one likely cause at a time and treat the correction as proven only when the next build shows repeatable improvement.<\/p>\n<p><strong>Unsure whether a BGA void calls for rework or a process adjustment?<\/strong> Email <a href=\"mailto:sales@bestpcbs.com\">sales@bestpcbs.com<\/a> with the X-ray image and BGA part number. If available, include the Gerber or ODB++ files and the applicable acceptance requirement. EBest Circuit can review the pattern and help you determine what to verify before rework or the next build.<\/p>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>Learn what causes BGA voids, which patterns present greater reliability risk, how X-ray measurement and acceptance work, and how to prevent repeat voiding.<\/p>\n","protected":false},"author":33247,"featured_media":36948,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[7717],"tags":[8695,8694,8692,8693],"class_list":["post-36951","post","type-post","status-publish","format-standard","hentry","category-pcb-knowledge","tag-bga-pad-and-via-design","tag-bga-reflow-process","tag-bga-void-analysis","tag-bga-x-ray-inspection"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Learn what causes BGA voids, which patterns present greater reliability risk, how X-ray measurement and acceptance work, and how to prevent repeat voiding.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"Jessica, Jessica\"\/>\n\t<link rel=\"canonical\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/10\/bga-void\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"PCB &amp; MCPCB - EBest PCB - More Technical Details &amp; News on PCB, MCPCB &amp; Ceramic PCB from EBest PCB\" \/>\n\t\t<meta property=\"og:type\" content=\"article\" \/>\n\t\t<meta property=\"og:title\" content=\"What Is a BGA Void? 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