{"id":36333,"date":"2026-09-17T17:36:24","date_gmt":"2026-09-17T09:36:24","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=36333"},"modified":"2026-09-17T17:36:57","modified_gmt":"2026-09-17T09:36:57","slug":"tqfp-package","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/","title":{"rendered":"TQFP Package: Dimensions, Pin Counts, LQFP\/QFN Comparison &#038; PCB Guide"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#Key_Takeaways\" >Key Takeaways<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#What_Is_a_TQFP_Package\" >What Is a TQFP Package?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#How_Is_a_TQFP_Package_Constructed\" >How Is a TQFP Package Constructed?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#What_Dimensions_Define_a_TQFP_Package\" >What Dimensions Define a TQFP Package?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#TQFP32_44_48_64_100_and_144_What_Are_the_Common_Dimensions\" >TQFP32, 44, 48, 64, 100 and 144: What Are the Common Dimensions?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#Does_the_Same_TQFP_Pin_Count_Always_Mean_the_Same_Footprint\" >Does the Same TQFP Pin Count Always Mean the Same Footprint?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#TQFP_vs_QFP_What_Is_the_Difference\" >TQFP vs QFP: What Is the Difference?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#TQFP_vs_LQFP_What_Is_the_Difference\" >TQFP vs LQFP: What Is the Difference?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#TQFP_vs_QFN_Which_Is_Easier_for_PCB_Assembly\" >TQFP vs QFN: Which Is Easier for PCB Assembly?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#How_Should_a_TQFP_PCB_Footprint_Be_Designed\" >How Should a TQFP PCB Footprint Be Designed?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#What_SMT_Assembly_Problems_Are_Common_with_TQFP_Packages\" >What SMT Assembly Problems Are Common with TQFP Packages?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#When_Is_TQFP_a_Good_Package_Choice\" >When Is TQFP a Good Package Choice?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/#FAQ_About_TQFP_Packages\" >FAQ About TQFP Packages<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div><p>The <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/\">TQFP package<\/a> remains widely used for microcontrollers, mixed-signal ICs, communication devices, motor-control ICs, and other components that need moderate to high I\/O counts without moving to BGA packaging. Their exposed gull-wing leads also make them attractive when visual solder inspection, prototyping, and rework matter.<\/p>\n<p>The main challenge is that \u201cTQFP64\u201d or \u201cTQFP100\u201d does not uniquely define a package. Two ICs can have the same TQFP pin count but different body sizes, lead pitches, or overall dimensions. For PCB designers, the correct workflow is therefore <strong>part number \u2192 package drawing \u2192 land pattern<\/strong>, not pin count \u2192 generic footprint.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-package.jpg\" alt=\"TQFP package overview showing thin body gull-wing leads visible solder joints and common pin counts\" data-first-enter-image=\"true\" \/><\/figure>\n<div class=\"key-takeaways\">\n<h2><span class=\"ez-toc-section\" id=\"Key_Takeaways\"><\/span>Key Takeaways<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<ul>\n<li><strong>TQFP stands for Thin Quad Flat Package<\/strong>, a surface-mount IC package with gull-wing leads extending from all four sides.<\/li>\n<li>TQFP is a <strong>package family, not one fixed footprint<\/strong>. Pin count alone does not determine body size, lead pitch, or PCB land pattern.<\/li>\n<li>Common examples include TQFP32, TQFP44, TQFP48, TQFP64, TQFP100, and TQFP144, but dimensions can vary between semiconductor manufacturers.<\/li>\n<li>For example, NXP lists both <strong>10 \u00d7 10 mm and 7 \u00d7 7 mm TQFP64 packages<\/strong>, showing why \u201cTQFP64\u201d is not enough information for footprint selection.<\/li>\n<li>TQFP and LQFP are closely related QFP variants, but package names alone do not guarantee footprint compatibility.<\/li>\n<li>Compared with QFN, TQFP uses visible gull-wing leads, which makes solder-joint inspection and rework easier but requires more PCB area.<\/li>\n<li>PCB footprints should always be built from the <strong>exact manufacturer package drawing<\/strong>, including pitch, body size, overall lead span, lead width, lead length, and package orientation.<\/li>\n<\/ul>\n<\/div>\n<h2><span class=\"ez-toc-section\" id=\"What_Is_a_TQFP_Package\"><\/span>What Is a TQFP Package?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>TQFP stands for <strong>Thin Quad Flat Package<\/strong>, it is a surface-mount package with leads extending from all four sides of a thin molded body. It belongs to the broader QFP, or Quad Flat Package, family. The leads are formed into a gull-wing shape so they can sit on PCB pads and be soldered by <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/04\/smt-pcb-manufacturer\/\">standard SMT reflow processes<\/a>.<\/p>\n<p>Typical TQFP characteristics include:<\/p>\n<ul>\n<li>Leads on four sides<\/li>\n<li>Gull-wing lead shape<\/li>\n<li>Surface-mount assembly<\/li>\n<li>Relatively low package profile<\/li>\n<li>Fine lead pitch<\/li>\n<li>Visible solder joints<\/li>\n<li>Pin counts from a few dozen to well above 100<\/li>\n<\/ul>\n<p>A TQFP package is commonly used when the IC needs more I\/O than SOIC or similar two-sided packages can provide but the design does not require BGA-level interconnect density.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Is_a_TQFP_Package_Constructed\"><\/span>How Is a TQFP Package Constructed?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A TQFP package normally contains a silicon die mounted inside a molded plastic body and electrically connected to an external lead frame.<\/p>\n<p>Its basic construction includes:<\/p>\n<ul>\n<li>Silicon die<\/li>\n<li>Die attach material<\/li>\n<li>Bond wires or equivalent internal interconnection<\/li>\n<li>Copper-alloy lead frame<\/li>\n<li>Mold compound<\/li>\n<li>Gull-wing leads<\/li>\n<li>Pin 1 orientation mark<\/li>\n<\/ul>\n<p>The lead frame carries signals from the silicon die to the external terminals. After molding, the leads extend outward from all four sides and bend downward toward the PCB.<\/p>\n<p>The package body itself is smaller than the total installed footprint because the leads extend beyond the molded body. This distinction matters during placement and land-pattern design.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-package-construction.jpg\" alt=\"Exploded TQFP package construction showing mold compound silicon die bond wires lead frame gull-wing leads and pin 1\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"What_Dimensions_Define_a_TQFP_Package\"><\/span>What Dimensions Define a TQFP Package?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>TQFP package dimensions include several mechanical values, not just the molded body width.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Parameter<\/th>\n<th>What It Describes<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>D \u00d7 E<\/td>\n<td>Molded body length and width<\/td>\n<\/tr>\n<tr>\n<td>HD \u00d7 HE or overall D \u00d7 E<\/td>\n<td>Total span including leads<\/td>\n<\/tr>\n<tr>\n<td>A<\/td>\n<td>Overall package height<\/td>\n<\/tr>\n<tr>\n<td>A1<\/td>\n<td>Standoff above the PCB seating plane<\/td>\n<\/tr>\n<tr>\n<td>e<\/td>\n<td>Lead pitch<\/td>\n<\/tr>\n<tr>\n<td>b<\/td>\n<td>Lead width<\/td>\n<\/tr>\n<tr>\n<td>L<\/td>\n<td>Gull-wing lead length<\/td>\n<\/tr>\n<tr>\n<td>N<\/td>\n<td>Total lead count<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><strong>Body size and overall lead span are not the same dimension.<\/strong> A PCB footprint designed only from the stated body size can miss the additional space occupied by the gull-wing leads.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-package-dimensions.jpg\" alt=\"TQFP package dimension drawing showing body size overall lead span pitch height lead width and lead length\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"TQFP32_44_48_64_100_and_144_What_Are_the_Common_Dimensions\"><\/span>TQFP32, 44, 48, 64, 100 and 144: What Are the Common Dimensions?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>TQFP packages appear in many pin counts, but the following values should be treated as <strong>representative package examples rather than universal dimensions<\/strong>.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Package Example<\/th>\n<th>Representative Body Size<\/th>\n<th>Representative Pitch<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>TQFP32<\/td>\n<td>7 \u00d7 7 mm<\/td>\n<td>0.80 mm<\/td>\n<\/tr>\n<tr>\n<td>TQFP44<\/td>\n<td>10 \u00d7 10 mm<\/td>\n<td>0.80 mm<\/td>\n<\/tr>\n<tr>\n<td>TQFP48<\/td>\n<td>7 \u00d7 7 mm<\/td>\n<td>0.50 mm<\/td>\n<\/tr>\n<tr>\n<td>TQFP64<\/td>\n<td>7 \u00d7 7 or 10 \u00d7 10 mm examples<\/td>\n<td>0.40 or 0.50 mm examples<\/td>\n<\/tr>\n<tr>\n<td>TQFP100<\/td>\n<td>14 \u00d7 14 mm<\/td>\n<td>0.50 mm<\/td>\n<\/tr>\n<tr>\n<td>TQFP144<\/td>\n<td>16 \u00d7 16 mm example<\/td>\n<td>0.40 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The package name should therefore never replace the exact IC mechanical drawing.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp32-44-48-64-100-144-package-examples.jpg\" alt=\"Representative TQFP32 TQFP44 TQFP48 TQFP64 TQFP100 and TQFP144 package examples\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Does_the_Same_TQFP_Pin_Count_Always_Mean_the_Same_Footprint\"><\/span>Does the Same TQFP Pin Count Always Mean the Same Footprint?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>No. <strong>The same TQFP pin count does not guarantee the same body size, lead pitch, lead span, or PCB footprint.<\/strong><\/p>\n<p>TQFP64 is a clear example. Different vendors offer 64-pin packages in multiple body sizes and pitches, so a CAD library entry named only \u201cTQFP64\u201d is not sufficiently specific for production.<\/p>\n<p>Before reusing a footprint, compare:<\/p>\n<ul>\n<li>Body dimensions<\/li>\n<li>Overall lead span<\/li>\n<li>Lead pitch<\/li>\n<li>Lead width<\/li>\n<li>Lead length<\/li>\n<li>Package height<\/li>\n<li>Pin 1 orientation<\/li>\n<\/ul>\n<p>A footprint can look plausible on screen and still be completely incompatible with the physical component.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp64-same-pin-count-different-footprint.jpg\" alt=\"TQFP64 comparison showing same 64 pin count with 7 by 7 mm and 10 by 10 mm packages and different pitch\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"TQFP_vs_QFP_What_Is_the_Difference\"><\/span>TQFP vs QFP: What Is the Difference?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>QFP is the broader <strong>Quad Flat Package family<\/strong>, while TQFP is a thinner-profile member of that family.<\/p>\n<p>Both use:<\/p>\n<ul>\n<li>Leads on four sides<\/li>\n<li>Gull-wing terminals<\/li>\n<li>Surface-mount assembly<\/li>\n<li>Similar general soldering methods<\/li>\n<\/ul>\n<p>The difference is mainly in the mechanical outline and package profile. TQFP should therefore not be treated as a package technology completely separate from QFP; it is better understood as a thinner mechanical implementation within the same four-sided leaded package concept.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"TQFP_vs_LQFP_What_Is_the_Difference\"><\/span>TQFP vs LQFP: What Is the Difference?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>In a TQFP vs LQFP package comparison, both are closely related low-profile QFP variants. Their naming conventions can overlap enough that engineers should compare actual mechanical drawings instead of relying on the acronym.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Feature<\/th>\n<th>TQFP<\/th>\n<th>LQFP<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Full name<\/td>\n<td>Thin Quad Flat Package<\/td>\n<td>Low-Profile Quad Flat Package<\/td>\n<\/tr>\n<tr>\n<td>Leads<\/td>\n<td>Gull-wing<\/td>\n<td>Gull-wing<\/td>\n<\/tr>\n<tr>\n<td>Mounting<\/td>\n<td>SMT<\/td>\n<td>SMT<\/td>\n<\/tr>\n<tr>\n<td>Typical profile<\/td>\n<td>Thin<\/td>\n<td>Low profile<\/td>\n<\/tr>\n<tr>\n<td>Common pitch range<\/td>\n<td>0.4\u20130.8 mm<\/td>\n<td>0.4\u20130.8 mm<\/td>\n<\/tr>\n<tr>\n<td>Footprint compatibility<\/td>\n<td>Only if full outline matches<\/td>\n<td>Same rule<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><strong>Never assume that TQFP and LQFP are footprint-compatible just because the pin count is the same.<\/strong><\/p>\n<h2><span class=\"ez-toc-section\" id=\"TQFP_vs_QFN_Which_Is_Easier_for_PCB_Assembly\"><\/span>TQFP vs QFN: Which Is Easier for PCB Assembly?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>In a TQFP vs QFN package comparison, TQFP is generally easier to inspect and rework because its gull-wing leads and solder joints are visible around the package perimeter.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Assembly Factor<\/th>\n<th>TQFP<\/th>\n<th>QFN<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>External leads<\/td>\n<td>Gull-wing<\/td>\n<td>Leadless bottom pads<\/td>\n<\/tr>\n<tr>\n<td>Solder-joint visibility<\/td>\n<td>High<\/td>\n<td>Limited<\/td>\n<\/tr>\n<tr>\n<td>AOI access<\/td>\n<td>Good<\/td>\n<td>Bottom joints less visible<\/td>\n<\/tr>\n<tr>\n<td>X-ray requirement<\/td>\n<td>Usually not essential<\/td>\n<td>Often useful<\/td>\n<\/tr>\n<tr>\n<td>Manual rework<\/td>\n<td>Easier<\/td>\n<td>More difficult<\/td>\n<\/tr>\n<tr>\n<td>PCB area<\/td>\n<td>Larger<\/td>\n<td>Smaller<\/td>\n<\/tr>\n<tr>\n<td>Fine-pitch defect risk<\/td>\n<td>Bridging \/ opens<\/td>\n<td>Insufficient wetting \/ voids<\/td>\n<\/tr>\n<tr>\n<td>Thermal pad<\/td>\n<td>Package dependent<\/td>\n<td>Common on many QFNs<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>QFN can save significant PCB area and often offers a shorter electrical and thermal path, while TQFP remains attractive when inspection access and rework matter.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-vs-lqfp-vs-qfn.jpg\" alt=\"TQFP versus LQFP versus QFN package comparison\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"How_Should_a_TQFP_PCB_Footprint_Be_Designed\"><\/span>How Should a TQFP PCB Footprint Be Designed?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A TQFP PCB footprint should be created from the <strong>exact semiconductor manufacturer&#8217;s land-pattern or package drawing<\/strong>, not from a generic pin-count template.<\/p>\n<p>Check these dimensions first:<\/p>\n<ul>\n<li>Lead pitch<\/li>\n<li>Lead width<\/li>\n<li>Lead length<\/li>\n<li>Molded body size<\/li>\n<li>Overall lead span<\/li>\n<li>Pin 1 orientation<\/li>\n<li>Seating-plane information<\/li>\n<li>Package tolerances<\/li>\n<\/ul>\n<p>The PCB land pattern must also provide suitable solder fillets around the gull-wing leads. Toe, heel, and side fillets depend on the package geometry and the chosen land-pattern standard.<\/p>\n<p>Also include clear pin 1 marking, solder-mask clearance, silkscreen that does not overlap pads, component courtyard, pick-and-place origin, and adequate neighboring-component clearance.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-pcb-footprint-design.jpg\" alt=\"TQFP PCB footprint design showing pad length pitch solder mask clearance courtyard and pin 1\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"What_SMT_Assembly_Problems_Are_Common_with_TQFP_Packages\"><\/span>What SMT Assembly Problems Are Common with TQFP Packages?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>The most common TQFP assembly defects involve fine-pitch leads, solder-paste volume, placement accuracy, and lead coplanarity.<\/p>\n<p>Typical issues include:<\/p>\n<ul>\n<li>Solder bridging<\/li>\n<li>Insufficient solder<\/li>\n<li>Open joints<\/li>\n<li>Bent leads<\/li>\n<li>Lifted leads<\/li>\n<li>Lead coplanarity problems<\/li>\n<li>Component misalignment<\/li>\n<li>Wrong orientation<\/li>\n<li>Contamination around fine-pitch pads<\/li>\n<\/ul>\n<p><strong>Solder bridging<\/strong> is especially common when pad geometry, stencil aperture, paste volume, or placement is poorly controlled. Fine-pitch packages leave little margin between adjacent solder deposits.<\/p>\n<p>A robust SMT process may use solder paste inspection, accurate placement, controlled reflow, AOI, microscope inspection, and X-ray when hidden structures also require it.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 24px auto 28px;\"><img decoding=\"async\" style=\"display: block; width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain; margin: 0 auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/p250-tqfp-smt-assembly-defects.jpg\" alt=\"Common TQFP SMT assembly defects including solder bridge open joint bent lead and misalignment\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"When_Is_TQFP_a_Good_Package_Choice\"><\/span>When Is TQFP a Good Package Choice?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>TQFP is a practical choice when the design needs a moderate or high pin count while keeping solder joints visible and accessible.<\/p>\n<p>It works particularly well for:<\/p>\n<ul>\n<li>Microcontrollers<\/li>\n<li>Industrial control ICs<\/li>\n<li>Motor-control devices<\/li>\n<li>Mixed-signal ICs<\/li>\n<li>Communication controllers<\/li>\n<li>Prototype and low-to-medium-volume assemblies<\/li>\n<li>Products where rework access matters<\/li>\n<\/ul>\n<p>TQFP may be less attractive when the design requires extremely high I\/O density, minimum PCB area, very short high-speed interconnects, exceptional thermal dissipation, or package sizes smaller than exposed-lead QFP can provide.<\/p>\n<p>For many industrial, automotive-control, instrumentation, and embedded applications, the additional board area is acceptable because the visible leads simplify inspection and troubleshooting.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"FAQ_About_TQFP_Packages\"><\/span>FAQ About TQFP Packages<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>1. What does TQFP stand for?<\/strong><br \/>\nTQFP stands for <strong>Thin Quad Flat Package<\/strong>. It is a surface-mount IC package with gull-wing leads on all four sides.<\/p>\n<p><strong>2. Is TQFP a surface-mount package?<\/strong><br \/>\nYes. TQFP is designed for surface-mount PCB assembly and is commonly soldered using SMT reflow.<\/p>\n<p><strong>3. What is the typical TQFP64 package size?<\/strong><br \/>\nA common TQFP64 example is <strong>10 \u00d7 10 mm with 0.5 mm pitch<\/strong>, but 7 \u00d7 7 mm TQFP64 packages also exist. Always check the exact IC datasheet.<\/p>\n<p><strong>4. What is the typical TQFP100 package size?<\/strong><br \/>\nA common TQFP100 example is <strong>14 \u00d7 14 mm with 0.5 mm lead pitch<\/strong>. Always verify the actual manufacturer drawing.<\/p>\n<p><strong>5. Is TQFP the same as LQFP?<\/strong><br \/>\nNo. They are closely related QFP variants, but the package profile and mechanical outline can differ. Some specific TQFP and LQFP parts may share a footprint only when all relevant dimensions match.<\/p>\n<p><strong>6. Can every TQFP with the same number of pins use the same PCB footprint?<\/strong><br \/>\nNo. Pin count alone does not define body size, pitch, lead span, or land pattern. A TQFP64, for example, can exist in multiple mechanical outlines.<\/p>\n<p>If you are moving a TQFP-based design into fabrication or assembly, EBest Circuit can review the component package drawing, footprint, pad geometry, stencil requirements, orientation, BOM, and <a href=\"https:\/\/www.bestpcbs.com\/products\/pcba.htm\">PCBA manufacturability<\/a> before production. Send your <strong>Gerber files, BOM, placement files, and component datasheets<\/strong> to <strong>sales@bestpcbs.com<\/strong> for <a href=\"https:\/\/www.bestpcbs.com\/manufacturing\/pcb-manufacturing.htm\">DFM review<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Learn TQFP package dimensions, pin counts, footprint rules, LQFP\/QFN differences, soldering defects, and PCB assembly checks for reliable designs.<\/p>\n","protected":false},"author":623,"featured_media":36325,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[175,5341,5789,17],"tags":[8488,8489,8491,8492,8490],"class_list":["post-36333","post","type-post","status-publish","format-standard","hentry","category-best-pcb","category-electrical-components","category-pcb-design","category-smt-technology","tag-tqfp-package","tag-tqfp-package-dimensions","tag-tqfp-vs-lqfp-package","tag-tqfp-vs-qfn-package","tag-tqfp64-package"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Learn TQFP package dimensions, pin counts, footprint rules, LQFP\/QFN differences, soldering defects, and PCB assembly checks for reliable designs.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"Love PCB\"\/>\n\t<link rel=\"canonical\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/tqfp-package\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"PCB &amp; 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