


{"id":36011,"date":"2026-09-15T11:54:28","date_gmt":"2026-09-15T03:54:28","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=36011"},"modified":"2026-09-15T11:55:22","modified_gmt":"2026-09-15T03:55:22","slug":"ipc-1601a","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/","title":{"rendered":"IPC 1601A: PCB Handling, Storage and Baking Guide"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#What_Does_IPC-1601A_Cover\" >What Does IPC-1601A Cover?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#IPC_1601_and_1602_What_Is_the_Difference\" >IPC 1601 and 1602: What Is the Difference?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#PCB_Storage_Requirements\" >PCB Storage Requirements<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#What_Belongs_in_PCB_Dry_Packaging\" >What Belongs in PCB Dry Packaging?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#How_Should_You_Handle_Bare_PCBs\" >How Should You Handle Bare PCBs?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#What_Should_You_Check_When_Opening_a_PCB_Package\" >What Should You Check When Opening a PCB Package?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#When_Do_PCBs_Need_Baking_Before_Assembly\" >When Do PCBs Need Baking Before Assembly?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#What_Baking_Temperature_Should_You_Use\" >What Baking Temperature Should You Use?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#Does_Baking_Restore_PCB_Shelf_Life\" >Does Baking Restore PCB Shelf Life?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#Where_Can_You_Get_the_IPC_1601A_PDF\" >Where Can You Get the IPC 1601A PDF?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#FAQ_About_IPC-1601A\" >FAQ About IPC-1601A<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/#How_Can_EBest_Circuit_Support_Your_PCB_Project\" >How Can EBest Circuit Support Your PCB Project?<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div><p><a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-1601a\/\">IPC 1601A<\/a> is the June 2016 guide for handling, packaging and storing printed circuit boards before and during assembly. It addresses moisture uptake, contamination, mechanical damage and loss of solderability. It is not the current edition: IPC-1602 replaced it in 2020, and the official revision table lists IPC-1602A, November 2024, as of September 2026.<\/p>\n<p>If your drawing still specifies IPC-1601A, confirm that edition with your customer rather than silently changing it. For production, the useful questions are concrete: what packaging protects this board, how should an opened lot be stored, and does it need a validated drying cycle before soldering?<\/p>\n<div style=\"width: 100%; max-width: 600px; margin: 24px auto;\"><img loading=\"lazy\" decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/project238-ipc-1601a-hero.jpg\" alt=\"IPC 1601A PCB handling and storage illustration with bare boards, dry packaging and humidity indicator card\" width=\"1536\" height=\"1024\" data-first-enter-image=\"true\" \/><\/div>\n<h2><span class=\"ez-toc-section\" id=\"What_Does_IPC-1601A_Cover\"><\/span>What Does IPC-1601A Cover?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>IPC-1601A covers the handling of printed boards from fabrication through shipment, receiving, storage and soldering. Its focus is preserving the board&#8217;s condition, not defining every fabrication acceptance limit or every assembled solder-joint criterion.<\/p>\n<p>The IPC 1601A 2016 edition organizes the subject into fabrication and handling, packaging and shipment, then receiving and assembly. A board that passes electrical testing can still become difficult to solder after poor storage; these are different quality checks.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Document<\/strong><\/td>\n<td><strong>Main purpose<\/strong><\/td>\n<\/tr>\n<tr>\n<td>IPC-1601A<\/td>\n<td>Historical printed-board handling and storage guidance<\/td>\n<\/tr>\n<tr>\n<td>IPC-1602<\/td>\n<td>Printed-board handling and storage requirements and recommendations<\/td>\n<\/tr>\n<tr>\n<td>J-STD-003<\/td>\n<td>Solderability testing of printed boards<\/td>\n<\/tr>\n<tr>\n<td>J-STD-001<\/td>\n<td>Requirements for soldered electrical and electronic assemblies<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<h2><span class=\"ez-toc-section\" id=\"IPC_1601_and_1602_What_Is_the_Difference\"><\/span>IPC 1601 and 1602: What Is the Difference?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>IPC-1601 is a guideline series; IPC-1602 replaced it with a standard containing both requirements and recommendations. In IPC-1602, \u201cshall\u201d identifies a requirement, while \u201cshould\u201d identifies guidance.<\/p>\n<ul>\n<li><strong>August 2010:<\/strong> original IPC-1601.<\/li>\n<li><strong>June 2016:<\/strong> IPC-1601A revision.<\/li>\n<li><strong>April 2020:<\/strong> IPC-1602 explicitly superseded IPC-1601A.<\/li>\n<li><strong>November 2024:<\/strong> IPC-1602A, the revision currently listed by the publisher.<\/li>\n<\/ul>\n<p>For a new purchase specification, identify the document and revision explicitly. For an existing approved product, resolve any revision change through the customer&#8217;s document-control process. A newer publication is not permission to alter an agreed acceptance basis.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"PCB_Storage_Requirements\"><\/span>PCB Storage Requirements<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Keep boards in their specified protective packaging, monitor the storage environment, and follow the supplier&#8217;s limits for the exact laminate and surface finish. Room storage and low-humidity dry storage are not interchangeable conditions.<\/p>\n<p>Published manufacturer examples show why a single number can be misleading:<\/p>\n<div class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Published example<\/strong><\/td>\n<td><strong>Condition<\/strong><\/td>\n<td><strong>Application<\/strong><\/td>\n<\/tr>\n<tr>\n<td>KSG storage guidance<\/td>\n<td>20\u00b0C \u00b1 5\u00b0C; maximum 60% RH<\/td>\n<td>Boards kept in closed transport packaging under its stated conditions<\/td>\n<\/tr>\n<tr>\n<td>W\u00fcrth Elektronik flex guidance<\/td>\n<td>5% RH at room temperature<\/td>\n<td>Dry-cabinet storage of its flex and rigid-flex products<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>These are supplier-specific examples, not universal IPC-1601A limits or EBest Circuit guarantees. Specify the permitted temperature and relative humidity, packaging state, storage duration and action after an excursion. Record actual conditions where the stock is held, not just the building&#8217;s air-conditioning setpoint.<\/p>\n<p>Keep lots identifiable and use the earliest approved expiry date first. Do not mix opened boards with an unopened lot and retain only the newer package label.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"What_Belongs_in_PCB_Dry_Packaging\"><\/span>What Belongs in PCB Dry Packaging?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Dry packaging combines a moisture barrier bag, desiccant and a humidity indicator card sealed around the boards. Each part has a different function.<\/p>\n<ul>\n<li><strong>Moisture barrier bag (MBB):<\/strong> restricts water-vapor entry; its barrier performance and seal matter more than a shiny appearance.<\/li>\n<li><strong>Desiccant:<\/strong> absorbs moisture within its rated capacity. Select the quantity for the package and storage requirement.<\/li>\n<li><strong>Humidity indicator card (HIC):<\/strong> indicates package humidity; read it using that card&#8217;s instructions.<\/li>\n<\/ul>\n<div style=\"width: 100%; max-width: 600px; margin: 24px auto;\"><img loading=\"lazy\" decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/project238-pcb-dry-packaging.jpg\" alt=\"Moisture barrier bag, desiccant and humidity indicator card arranged around a bare PCB\" width=\"1536\" height=\"1024\" \/><\/div>\n<p>Vacuum sealing alone does not establish a dry-pack system. For example, an ordinary polyethylene bag can appear tightly sealed yet lack the specified moisture barrier. Likewise, adding a fresh desiccant sachet does not demonstrate that an already damp laminate is ready for soldering.<\/p>\n<p>Mechanical protection remains separate. Thin or routed panels may need rigid backing or separators so transport pressure cannot bend unsupported sections or rub solderable surfaces. ZVEI&#8217;s implementation recommendations specifically identify thin boards below 1.40 mm, flexible boards and complex contours for protective-backing consideration, subject to customer\u2013supplier agreement.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Should_You_Handle_Bare_PCBs\"><\/span>How Should You Handle Bare PCBs?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Hold bare PCBs by their edges with clean, suitable gloves, and keep fingers away from pads, plated holes and contact surfaces.<\/p>\n<ul>\n<li>Use clean trays or separate rack slots instead of sliding boards across one another.<\/li>\n<li>Replace dirty gloves; a contaminated glove can transfer residue just as a bare hand can.<\/li>\n<li>Support thin panels during transfer rather than lifting them by a narrow breakaway tab.<\/li>\n<li>Keep packing debris, hand lotion and loose fibers away from exposed boards.<\/li>\n<li>Apply the specified ESD controls where sensitive devices or product requirements make them necessary.<\/li>\n<\/ul>\n<div style=\"width: 100%; max-width: 600px; margin: 24px auto;\"><img loading=\"lazy\" decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/project238-pcb-edge-handling.jpg\" alt=\"Gloved hands holding a bare PCB at its edges beside a slotted storage rack\" width=\"1536\" height=\"1024\" \/><\/div>\n<h2><span class=\"ez-toc-section\" id=\"What_Should_You_Check_When_Opening_a_PCB_Package\"><\/span>What Should You Check When Opening a PCB Package?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Check the seal, identification, storage history and HIC at opening, then record the exposure start time for the lot.<\/p>\n<ol>\n<li><strong>Before opening:<\/strong> inspect for punctures, separated seals, wet cartons or missing labels.<\/li>\n<li><strong>Match the lot:<\/strong> confirm part number, revision, finish and quantity against the production order.<\/li>\n<li><strong>Read the card promptly:<\/strong> use the card&#8217;s own reference and the agreed acceptance procedure.<\/li>\n<li><strong>Release or hold:<\/strong> send acceptable boards to the planned process; segregate suspect packages for engineering review.<\/li>\n<li><strong>Protect the remainder:<\/strong> restore the approved packaging or dry-storage condition and retain its exposure record.<\/li>\n<\/ol>\n<p>A card reading is not a direct measurement of water inside the laminate. If the exposure history is unknown, do not infer a safe soldering condition solely from a dry-looking card or an undamaged board surface.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"When_Do_PCBs_Need_Baking_Before_Assembly\"><\/span>When Do PCBs Need Baking Before Assembly?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>PCBs need a drying step when their product instructions require it or when a qualified assessment finds moisture incompatible with the planned soldering process. Baking every incoming lot by default can unnecessarily age its finish.<\/p>\n<p>Review a lot before release if its bag is damaged, its exposure limit has been exceeded, or its storage history is missing. Polyimide flex constructions may also carry explicit pre-solder drying instructions even when shipped in protective packaging.<\/p>\n<p>Use the actual board thickness, resin system, copper coverage, finish and exposure history to select the response. Drying a 0.8 mm board and drying a 3.2 mm board with extensive copper planes are not automatically equivalent processes; those dimensions are examples of different constructions, not thresholds in this guideline.<\/p>\n<p>The preheat stage of <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/reflow-process-soldering\/\">reflow soldering<\/a> is not a substitute for a qualified drying cycle. Its short thermal exposure serves the soldering process and does not establish that moisture has diffused out of the board.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"What_Baking_Temperature_Should_You_Use\"><\/span>What Baking Temperature Should You Use?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Use the board supplier&#8217;s approved, product-specific drying profile\u2014not a universal \u201c120\u00b0C for every PCB\u201d rule.<\/p>\n<p>For context, W\u00fcrth Elektronik&#8217;s January 2022 flex specification describes 120\u00b0C drying, with 4\u201324 hours potentially needed, and explicitly requires product-specific verification. Those figures illustrate the range within one supplier&#8217;s flex guidance; they are not a recipe for every FR-4, OSP or assembled board.<\/p>\n<div style=\"width: 100%; max-width: 600px; margin: 24px auto;\"><img loading=\"lazy\" decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/project238-pcb-drying-review.jpg\" alt=\"PCB drying review showing an oven, copper and resin cross section, and protected storage after drying\" width=\"1536\" height=\"1024\" \/><\/div>\n<ul>\n<li><strong>Material and geometry:<\/strong> resin, thickness and copper coverage affect the drying path.<\/li>\n<li><strong>Surface finish:<\/strong> confirm permitted heat exposure for OSP, immersion tin and other finish systems before selecting a cycle.<\/li>\n<li><strong>Equipment loading:<\/strong> allow the validated airflow and support boards against deformation.<\/li>\n<li><strong>After drying:<\/strong> control the wait before assembly so the boards do not simply reabsorb moisture.<\/li>\n<\/ul>\n<p>Keep the drying record with the lot: profile identifier, oven run, start and finish times, and subsequent storage condition. Do not apply a bare-board oven profile to populated PCBAs without checking component and assembly limits.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Does_Baking_Restore_PCB_Shelf_Life\"><\/span>Does Baking Restore PCB Shelf Life?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>No. Baking removes moisture under suitable conditions; it does not renew an aged surface finish, reverse corrosion or erase the board&#8217;s storage history.<\/p>\n<p>Shelf life depends on finish, packaging and exposure conditions. A remaining storage allowance should come from the approved supplier specification, not an automatic six- or twelve-month extension after an oven cycle.<\/p>\n<p>When the concern is whether solder can wet an old pad or plated hole, review <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/j-std-003\/\">J-STD-003 PCB solderability testing<\/a>. Moisture condition and solderability may both need evaluation, but one result cannot stand in for the other.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Where_Can_You_Get_the_IPC_1601A_PDF\"><\/span>Where Can You Get the IPC 1601A PDF?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Obtain a licensed IPC 1601A PDF through the publisher or an authorized standards distributor, and verify that the listing is for the June 2016 revision.<\/p>\n<p>The publisher&#8217;s publicly accessible table-of-contents PDF is only a preview. It does not contain the complete baking-profile table, packaging provisions or acceptance instructions. For a new project, also check whether IPC-1602A is the specified document before buying a historical edition.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"FAQ_About_IPC-1601A\"><\/span>FAQ About IPC-1601A<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<h3>Is IPC-1601A a PCB certification?<\/h3>\n<p>No. It is a handling and storage guideline, not a stand-alone factory certification. Ask a supplier which documented controls satisfy your specified revision and purchase requirements.<\/p>\n<h3>Can an antistatic bag replace a moisture barrier bag?<\/h3>\n<p>Not solely because it is antistatic. Electrostatic protection and resistance to water-vapor transmission are different properties. A bag intended to provide both must meet both specified functions.<\/p>\n<h3>Does ENIG prevent the laminate from absorbing moisture?<\/h3>\n<p>No. ENIG protects solderable copper surfaces; it does not turn the complete PCB into a moisture-impermeable object. Laminate condition still needs to suit the assembly process.<\/p>\n<h3>Should every bare PCB use the same component MSL floor-life table?<\/h3>\n<p>No. Do not assign a component moisture-sensitivity level to every bare board by assumption. Follow the printed-board requirements and supplier instructions; a supplier may specify an analogous handling rule for a particular product.<\/p>\n<h3>What should a PCB storage label record?<\/h3>\n<p>Record the part and revision, lot identity, packaging date and applicable storage instruction. For opened material, retain the opening time and any subsequent drying or repacking record needed by your process.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Can_EBest_Circuit_Support_Your_PCB_Project\"><\/span>How Can EBest Circuit Support Your PCB Project?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>At EBest Circuit, we provide PCB fabrication and PCBA services, from prototypes to production. We can review your board construction, surface finish and assembly requirements together, including the handling and packaging instructions your project needs.<\/p>\n<p>Send your Gerber files, fabrication drawing, quantity and specified IPC revision to <a href=\"mailto:sales@bestpcbs.com\">sales@bestpcbs.com<\/a>. Include any storage, dry-pack, labeling or pre-assembly drying requirements so we can confirm the project scope before production.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Understand IPC 1601A, its replacement by IPC-1602, and practical PCB storage, dry packaging and baking decisions before assembly.<\/p>\n","protected":false},"author":623,"featured_media":36007,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[175,5953,5233],"tags":[8406,8403,8405,8404,8407],"class_list":["post-36011","post","type-post","status-publish","format-standard","hentry","category-best-pcb","category-ipc-standard","category-quality","tag-ipc-1601-and-1602","tag-ipc-1601a","tag-ipc-1601a-2016","tag-ipc-1601a-pdf","tag-pcb-storage-requirements"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com 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