{"id":35090,"date":"2026-09-03T18:12:53","date_gmt":"2026-09-03T10:12:53","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=35090"},"modified":"2026-09-03T18:13:39","modified_gmt":"2026-09-03T10:13:39","slug":"what-is-solder-paste-inspection-in-pcb-assembly","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/","title":{"rendered":"What Is Solder Paste Inspection in PCB Assembly?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#Where_Does_SPI_Fit_in_the_PCB_Assembly_Line\" >Where Does SPI Fit in the PCB Assembly Line?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#Solder_Paste_Inspection_Process\" >Solder Paste Inspection Process<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#Solder_Paste_Inspection_Parameters\" >Solder Paste Inspection Parameters<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#How_Does_3D_SPI_Measure_the_Paste\" >How Does 3D SPI Measure the Paste?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#Solder_Paste_Inspection_Tolerance\" >Solder Paste Inspection Tolerance<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#Solder_Paste_Inspection_Defects\" >Solder Paste Inspection Defects<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#What_Should_Happen_After_an_SPI_Failure\" >What Should Happen After an SPI Failure?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#How_Is_SPI_Different_from_AOI\" >How Is SPI Different from AOI?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#How_Can_SPI_Data_Improve_Printing_Control\" >How Can SPI Data Improve Printing Control?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#What_Should_an_SPI_Report_Contain\" >What Should an SPI Report Contain?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/#How_Can_EBest_Circuit_Support_Your_PCB_Assembly_Inspection_Plan\" >How Can EBest Circuit Support Your PCB Assembly Inspection Plan?<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div><p><a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/\">What is solder paste inspection<\/a>? Solder paste inspection, or SPI, checks the deposits printed onto PCB pads before components are placed. A 3D SPI system measures deposit height and shape to calculate area, volume, and position. These measurements help identify printing problems while the board can still be corrected before placement and reflow.<\/p>\n<p>The useful question is not simply whether the machine displays \u201cpass.\u201d It is whether the inspection program measures the right deposits, uses a suitable reference, and applies limits that have been validated for the assembly. A passing print is one process checkpoint\u2014not proof that every finished solder joint will be reliable.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 20px auto;\"><img decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/spi-pcb-assembly-hero.jpg\" alt=\"What Is Solder Paste Inspection? Optical inspection of paste deposits before component placement\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Where_Does_SPI_Fit_in_the_PCB_Assembly_Line\"><\/span>Where Does SPI Fit in the PCB Assembly Line?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>SPI normally sits after stencil printing and before pick-and-place. At this point, the inspection target is the printed paste\u2014not a mounted component or a solidified solder joint.<\/p>\n<ol>\n<li><strong>Print:<\/strong> a squeegee transfers paste through stencil apertures onto the pads.<\/li>\n<li><strong>Inspect:<\/strong> SPI checks the deposits against the programmed print requirements.<\/li>\n<li><strong>Place:<\/strong> components are positioned on accepted prints.<\/li>\n<li><strong>Reflow:<\/strong> the assembly follows a qualified thermal profile.<\/li>\n<li><strong>Inspect and test:<\/strong> later checks evaluate placement, accessible joints, hidden features where applicable, and electrical performance.<\/li>\n<\/ol>\n<p>Finding a printing error early can avoid placing components onto a defective print. It does not remove the need to control placement accuracy, paste condition, reflow, or downstream testing.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 20px auto;\"><img decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/spi-smt-process-position.jpg\" alt=\"SMT process order: print, SPI, placement, reflow and AOI\" \/><\/figure>\n<h2><span class=\"ez-toc-section\" id=\"Solder_Paste_Inspection_Process\"><\/span>Solder Paste Inspection Process<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>The solder paste inspection process begins with a board-specific program. Accurate machine measurements cannot compensate for an incorrect pad map, reference volume, or revision.<\/p>\n<ul>\n<li><strong>Load the correct data:<\/strong> match PCB revision, paste-layer data, stencil revision, and component requirements.<\/li>\n<li><strong>Register the board:<\/strong> use the configured fiducials and board orientation to locate inspection regions.<\/li>\n<li><strong>Establish the surface reference:<\/strong> identify the local board or pad baseline used for height measurements.<\/li>\n<li><strong>Measure and classify:<\/strong> compare each deposit with the appropriate target and limits.<\/li>\n<li><strong>Review exceptions:<\/strong> separate actual print defects from alignment, reference, or recipe errors.<\/li>\n<li><strong>Record the disposition:<\/strong> release, hold, or clean and reprint under the approved process.<\/li>\n<\/ul>\n<p>Programming should distinguish solder paste openings from copper and solder mask features. Our explanation of <a href=\"https:\/\/www.bestpcbs.com\/blog\/2022\/12\/differences-between-solder-mask-and-solder-paste-in-pcb\/\">solder mask and solder paste layers<\/a> covers why these data sets are not interchangeable.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Solder_Paste_Inspection_Parameters\"><\/span>Solder Paste Inspection Parameters<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>The main solder paste inspection parameters are height, area, volume, and offset. Reading them together is more useful than treating any one number as a complete verdict.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Parameter<\/strong><\/td>\n<td><strong>Measurement<\/strong><\/td>\n<td><strong>Typical units<\/strong><\/td>\n<\/tr>\n<tr>\n<td>Height<\/td>\n<td>Deposit elevation above the selected reference surface<\/td>\n<td>\u00b5m<\/td>\n<\/tr>\n<tr>\n<td>Area<\/td>\n<td>Detected deposit footprint in the board plane<\/td>\n<td>mm\u00b2 or percentage<\/td>\n<\/tr>\n<tr>\n<td>Volume<\/td>\n<td>Paste volume calculated from measured shape<\/td>\n<td>mm\u00b3 or percentage<\/td>\n<\/tr>\n<tr>\n<td>Offset<\/td>\n<td>Deposit displacement from the programmed target<\/td>\n<td>\u00b5m in X and Y<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>A wide, shallow deposit may have an acceptable-looking footprint but insufficient volume. Conversely, a tall deposit does not necessarily contain the intended total volume if its footprint is small. Offset can also matter even when volume is close to target: the paste must be positioned where the termination and pad need it.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 20px auto;\"><img decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/spi-deposit-measurements.jpg\" alt=\"Solder paste deposit height, footprint area and three-dimensional volume\" data-first-enter-image=\"true\" \/><\/figure>\n<p><strong>Example\u2014not an acceptance limit:<\/strong> assume a rectangular stencil aperture is 0.30 mm \u00d7 0.50 mm in a 0.10 mm thick stencil. Its theoretical aperture volume is 0.015 mm\u00b3. A measured deposit of 0.012 mm\u00b3 represents 80% transfer efficiency relative to that aperture volume. Whether it is acceptable depends on the validated assembly requirements; 80% is not automatically a pass or fail.<\/p>\n<p>Before interpreting a percentage report, ask what \u201c100%\u201d means. It may refer to theoretical aperture volume or a configured nominal target. Results from different programs are not directly comparable until their reference definitions are aligned.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Does_3D_SPI_Measure_the_Paste\"><\/span>How Does 3D SPI Measure the Paste?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>3D SPI reconstructs the deposit surface using optical measurement. Depending on the equipment, this can involve projected light patterns or laser-based profiling. The measured surface is compared with a reference plane to calculate deposit geometry.<\/p>\n<p>A 2D image can reveal a footprint or visible bridge, but it does not independently provide a full height map. That difference matters when two deposits look similar from above yet contain different amounts of paste.<\/p>\n<p>Board warpage, surface reflectivity, shadows, and the choice of reference regions can influence the measurement. Multiple illumination directions and local height-reference methods are examples of equipment features used to address these issues. Their availability and performance are machine-specific; \u201c3D\u201d alone does not establish measurement capability.<\/p>\n<p>For a demanding package, check repeatability on the actual board and deposit geometry. A brochure resolution number is not the same as demonstrated measurement accuracy in production.<\/p>\n<p>A practical measurement study separates repeated scans of the same print from scans after the board is unloaded and reloaded. The first tests short-term measurement consistency; the second also exposes registration and handling effects. If those variations are large relative to the proposed tolerance, the process team should resolve the measurement problem before using the results for fine printer adjustments.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Solder_Paste_Inspection_Tolerance\"><\/span>Solder Paste Inspection Tolerance<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Solder paste inspection tolerance should be set around the needs of each deposit group and validated against assembly results. One percentage window should not be assumed suitable for every pad on a mixed-technology board.<\/p>\n<p>Start with the stencil design, paste characteristics, package geometry, and printing process. Then use trial builds and downstream findings to establish limits that separate acceptable variation from prints likely to cause trouble.<\/p>\n<ul>\n<li>Group deposits with comparable aperture geometry and assembly requirements.<\/li>\n<li>Confirm that height and volume references remain stable across the board.<\/li>\n<li>Assess measurement variation before tightening a tolerance.<\/li>\n<li>Correlate marginal prints with placement, reflow, and final inspection results.<\/li>\n<li>Control program revisions when the stencil, paste, board finish, or package changes.<\/li>\n<\/ul>\n<p>Repeated false calls are a reason to investigate the measurement and recipe, not automatically widen every limit. Equally, a low rejection count is not evidence of a capable process if the limits are too broad to identify meaningful variation.<\/p>\n<p>Windowed apertures for a large thermal pad need particular care in the recipe. Several separate deposits may belong to one component land. Decide whether acceptance is evaluated by individual window, a combined region, or both, and document that choice. Comparing the combined volume with a target intended for one window would produce a misleading result even if the optical measurement itself were correct.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Solder_Paste_Inspection_Defects\"><\/span>Solder Paste Inspection Defects<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Solder paste inspection defects include missing deposits, insufficient or excessive paste, misplaced deposits, and paste connecting regions that should remain separate. These are printing conditions, not final solder-joint diagnoses.<\/p>\n<figure style=\"width: 100%; max-width: 600px; margin: 20px auto;\"><img decoding=\"async\" style=\"width: 100%; max-width: 600px; max-height: 400px; height: auto; object-fit: contain;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/spi-printing-defects.jpg\" alt=\"Conceptual missing paste, low-volume paste and paste bridge before component placement\" \/><\/figure>\n<ul>\n<li><strong>Missing or low-volume paste:<\/strong> investigate blocked apertures, release behavior, paste condition, and print settings.<\/li>\n<li><strong>Excess paste:<\/strong> check aperture design, stencil contact, support, and the printing setup.<\/li>\n<li><strong>Deposit offset:<\/strong> review alignment, fiducial recognition, board movement, and registration.<\/li>\n<li><strong>Paste bridging or smearing:<\/strong> examine stencil underside contamination, separation behavior, support, and material handling.<\/li>\n<\/ul>\n<p>The pattern helps narrow the investigation. A problem confined to one aperture differs from a whole-board shift or a gradual trend across many prints. SPI identifies what changed; confirming the cause still requires examining the printing process.<\/p>\n<p>Do not label a print as a \u201ccold solder joint.\u201d That term describes a soldering outcome, whereas SPI takes place before solder has reflowed. The later thermal and metallurgical conditions have not yet occurred.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"What_Should_Happen_After_an_SPI_Failure\"><\/span>What Should Happen After an SPI Failure?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Hold the affected board before component placement and verify the call. Review the image or height map, the failed value, the target, and the program revision before making a disposition.<\/p>\n<p>If the print is genuinely unacceptable, follow the approved cleaning and reprinting procedure for the board and paste system. Do not assume that adding paste by hand produces the same controlled deposit as a qualified printing process.<\/p>\n<p>Then address recurrence: check the stencil, board support, print alignment, underside cleaning, paste handling, and relevant printer settings. After a correction, inspect a new print and verify that the original problem is resolved without introducing a different one.<\/p>\n<p>For repeated failures around small apertures, review the <a href=\"https:\/\/www.bestpcbs.com\/products\/smt-stencil.htm\">SMT stencil<\/a> as well as the machine settings. An inspection threshold cannot repair an aperture design that does not release paste consistently.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Is_SPI_Different_from_AOI\"><\/span>How Is SPI Different from AOI?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>SPI evaluates the print before placement; AOI evaluates visible features at its configured inspection stage. They answer different questions and should not be treated as substitutes.<\/p>\n<div class=\"wp-block-table\">\n<table>\n<tbody>\n<tr>\n<td><strong>Inspection<\/strong><\/td>\n<td><strong>Typical stage<\/strong><\/td>\n<td><strong>Main target<\/strong><\/td>\n<\/tr>\n<tr>\n<td>SPI<\/td>\n<td>After paste printing<\/td>\n<td>Deposit geometry and position<\/td>\n<\/tr>\n<tr>\n<td>Pre-reflow AOI<\/td>\n<td>After placement, where used<\/td>\n<td>Visible component presence and placement<\/td>\n<\/tr>\n<tr>\n<td>Post-reflow AOI<\/td>\n<td>After soldering<\/td>\n<td>Visible component and joint features<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Hidden solder connections may require other inspection methods, and electrical defects require appropriate testing. Neither an SPI pass nor an AOI pass proves every functional requirement. For the later optical stage, see our guide to <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/aoi-in-pcb-manufacturing-quality-guide\/\">AOI in PCB manufacturing<\/a>.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Can_SPI_Data_Improve_Printing_Control\"><\/span>How Can SPI Data Improve Printing Control?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Trend data can reveal drift that an isolated pass\/fail result hides. Track comparable deposit groups by board, print sequence, stencil revision, and relevant process events rather than averaging unrelated pads into one reassuring number.<\/p>\n<p>For example, a consistent directional offset may justify checking alignment, while falling volume in a particular aperture group may prompt a stencil-release investigation. Compare the trend with cleaning cycles and setup changes before assigning a cause.<\/p>\n<p>Some printer and SPI combinations support integrated feedback. Such a connection needs compatible equipment, validated correction rules, and limits on what the system may adjust. It should not be assumed present on every SMT line, and it should not turn an unresolved measurement problem into an automatic printer correction.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"What_Should_an_SPI_Report_Contain\"><\/span>What Should an SPI Report Contain?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>A useful report lets an engineer trace a result to the board, deposit, program, and disposition. A green dashboard without that context is difficult to investigate later.<\/p>\n<ul>\n<li>Board or panel identifier, inspection time, and product revision.<\/li>\n<li>SPI program revision and the applicable pad or deposit group.<\/li>\n<li>Measured values, units, nominal references, and acceptance limits.<\/li>\n<li>Images or height maps for reviewed exceptions.<\/li>\n<li>Release, hold, reprint, or other approved disposition.<\/li>\n<li>Relevant process changes and links to downstream inspection or test records.<\/li>\n<\/ul>\n<p>Specify the required records before production if they are part of your quality agreement. Retention, serialization, and reporting formats should be agreed for the project rather than assumed from the presence of an SPI machine. Our overview of <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/pcb-testing\/\">PCB testing<\/a> explains how inspection fits into a broader verification plan.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_Can_EBest_Circuit_Support_Your_PCB_Assembly_Inspection_Plan\"><\/span>How Can EBest Circuit Support Your PCB Assembly Inspection Plan?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>At EBest Circuit, we provide PCB fabrication and PCBA assembly support, including solder paste inspection within our SMT capabilities. We can review your board data, component requirements, and inspection expectations together so the manufacturing and verification plan matches the assembly.<\/p>\n<p>If your starting question is <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/\">what is solder paste inspection<\/a>, the next step is to identify which print characteristics matter for your components and which records your project needs.<\/p>\n<p>Send your <strong>Gerber files, BOM, placement data, quantity, and inspection or traceability requirements<\/strong> to <a href=\"mailto:sales@bestpcbs.com\">sales@bestpcbs.com<\/a>. We will review the assembly scope with you, including any package-specific checks that need to be agreed before production.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Learn what solder paste inspection measures, how SPI tolerances are set, and how print defects are corrected before component placement in PCB assembly.<\/p>\n","protected":false},"author":623,"featured_media":35086,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[175,5789,16],"tags":[8154,8151,8152,8153,8150],"class_list":["post-35090","post","type-post","status-publish","format-standard","hentry","category-best-pcb","category-pcb-design","category-pcb-technology","tag-solder-paste-inspection-defects-tag","tag-solder-paste-inspection-parameters-tag","tag-solder-paste-inspection-process-tag","tag-solder-paste-inspection-tolerance-tag","tag-what-is-solder-paste-inspection-tag"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Learn what solder paste inspection measures, how SPI tolerances are set, and how print defects are corrected before component placement in PCB assembly.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"Love PCB\"\/>\n\t<link rel=\"canonical\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/what-is-solder-paste-inspection-in-pcb-assembly\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"PCB &amp; MCPCB - EBest PCB - More Technical Details &amp; News on PCB, MCPCB &amp; Ceramic PCB from EBest PCB\" \/>\n\t\t<meta property=\"og:type\" content=\"article\" \/>\n\t\t<meta property=\"og:title\" content=\"What Is Solder Paste Inspection? 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