{"id":34821,"date":"2026-09-01T12:06:36","date_gmt":"2026-09-01T04:06:36","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=34821"},"modified":"2026-09-01T12:06:39","modified_gmt":"2026-09-01T04:06:39","slug":"ipc-2222","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/","title":{"rendered":"IPC-2222 Standard Explained: Rigid PCB Types, Materials, Holes, Spacing and Design Requirements"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_85 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Is_IPC-2222_and_When_Is_It_Used\" >What Is IPC-2222 and When Is It Used?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Types_of_Rigid_PCBs_Does_IPC-2222_Cover\" >What Types of Rigid PCBs Does IPC-2222 Cover?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Does_IPC-2222_Relate_to_IPC-2221_and_Other_PCB_Standards\" >How Does IPC-2222 Relate to IPC-2221 and Other PCB Standards?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Are_the_Main_Design_Requirements_in_IPC-2222\" >What Are the Main Design Requirements in IPC-2222?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Does_IPC-2222_Guide_PCB_Material_and_Laminate_Selection\" >How Does IPC-2222 Guide PCB Material and Laminate Selection?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Does_IPC-2222_Require_for_PCB_Thickness_Profiles_and_Mechanical_Features\" >What Does IPC-2222 Require for PCB Thickness, Profiles and Mechanical Features?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Does_IPC-2222_Address_Panelization_Routing_and_V-Scoring\" >How Does IPC-2222 Address Panelization, Routing and V-Scoring?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Does_IPC-2222_Require_for_PTHs_NPTHs_and_Vias\" >What Does IPC-2222 Require for PTHs, NPTHs and Vias?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Does_IPC-2222_Address_Lands_Annular_Rings_and_Plane_Clearance\" >How Does IPC-2222 Address Lands, Annular Rings and Plane Clearance?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Does_IPC-2222_Say_About_Conductor_Features_and_PCB_Edge_Spacing\" >What Does IPC-2222 Say About Conductor Features and PCB Edge Spacing?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Changed_from_IPC-2222A_to_IPC-2222B\" >What Changed from IPC-2222A to IPC-2222B?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Should_IPC-2222_Be_Applied_During_PCB_Design_and_DFM_Review\" >How Should IPC-2222 Be Applied During PCB Design and DFM Review?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Files_and_Documentation_Are_Needed_for_an_IPC-2222-Based_PCB_Design\" >What Files and Documentation Are Needed for an IPC-2222-Based PCB Design?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#What_Are_the_Most_Common_IPC-2222_Design_Mistakes\" >What Are the Most Common IPC-2222 Design Mistakes?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#How_Can_EBest_Circuit_Support_Rigid_PCB_Design_and_Manufacturing\" >How Can EBest Circuit Support Rigid PCB Design and Manufacturing?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/09\/ipc-2222\/#FAQs_About_IPC-2222\" >FAQs About IPC-2222<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div>\n<p><strong>IPC-2222 is the sectional design standard for rigid organic printed boards.<\/strong> Used with IPC-2221, it brings the discussion down to the physical details of a rigid board: materials, construction, thickness, mechanical features, holes, lands and conductor geometry. IPC currently lists IPC-2222B, issued in October 2020, as the latest revision.<\/p>\n<p>The document is useful because it turns a broad PCB design requirement into information that can be placed on a stackup, drawing or fabrication dataset. It does not replace every electrical, thermal, manufacturing or acceptance standard. Instead, it shows which rigid-board details need to be settled and where those details connect with other IPC documents and the finished board.<\/p>\n<figure><img decoding=\"async\" style=\"display:block;width:100%;max-width:100%;height:auto;margin-left:auto;margin-right:auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/ipc-2222-hero-v4.jpg\" width=\"600\" height=\"400\" alt=\"IPC-2222 rigid PCB design title above a centered green rigid PCB\" fetchpriority=\"high\"><\/figure>\n\n<h2 id=\"what-is-ipc-2222\"><span class=\"ez-toc-section\" id=\"What_Is_IPC-2222_and_When_Is_It_Used\"><\/span>What Is IPC-2222 and When Is It Used?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Use IPC-2222 when the interconnecting structure is a rigid organic printed board.<\/strong> It is read alongside IPC-2221 when the board type, material system, construction, holes, lands, profile and rigid-board circuit features have to be defined.<\/p>\n<p>IPC-2221 supplies the generic design foundation; IPC-2222 adds the details that belong specifically to rigid boards. A fabrication drawing can cite IPC-2222 and still be incomplete if it omits the applicable generic, performance or procurement requirements.<\/p>\n<p>Put the approved revision on the fabrication drawing or controlled standards list. The <a href=\"https:\/\/www.ipc.org\/ipc-document-revision-table\">IPC document revision table<\/a> lists IPC-2222B from October 2020 and IPC-2222A from December 2010. Once a revision is contractually selected, it remains the baseline until the project formally changes it.<\/p>\n\n<h2 id=\"rigid-board-types\"><span class=\"ez-toc-section\" id=\"What_Types_of_Rigid_PCBs_Does_IPC-2222_Cover\"><\/span>What Types of Rigid PCBs Does IPC-2222 Cover?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>IPC-2222 covers six construction types.<\/strong> They are distinguished by conductive-layer structure, blind or buried vias and the presence of a metal core. The type describes how the board is built; it says nothing by itself about performance class.<\/p>\n<div class=\"table-wrap\" style=\"display:block;width:100%;max-width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;\"><table><thead><tr><th>PCB Type<\/th><th>Board Structure<\/th><th>Design Focus<\/th><\/tr><\/thead><tbody>\n<tr><td>Type 1<\/td><td>Single-sided printed board<\/td><td>One conductive layer; hole and component attachment choices still need a defined material and mechanical design.<\/td><\/tr>\n<tr><td>Type 2<\/td><td>Double-sided printed board<\/td><td>Two conductive layers with the applicable through-hole and interconnection design.<\/td><\/tr>\n<tr><td>Type 3<\/td><td>Multilayer board without blind or buried vias<\/td><td>Stackup, plated-through holes, registration and internal plane relationships become central.<\/td><\/tr>\n<tr><td>Type 4<\/td><td>Multilayer board with blind and\/or buried vias<\/td><td>Via depth, sequential construction and the applicable interconnection controls must be defined.<\/td><\/tr>\n<tr><td>Type 5<\/td><td>Multilayer metal-core board without blind or buried vias<\/td><td>The metal core changes the material, electrical isolation, thermal and fabrication decisions.<\/td><\/tr>\n<tr><td>Type 6<\/td><td>Multilayer metal-core board with blind and\/or buried vias<\/td><td>Metal-core construction and non-through interconnections must be reviewed together.<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p><strong>Type 3 and Class 3 are different designations.<\/strong> Type 3 describes a multilayer construction without blind or buried vias. Class 3 refers to performance expectations under the applicable performance and acceptance documents. When both matter, state both.<\/p>\n\n<h2 id=\"standards-hierarchy\"><span class=\"ez-toc-section\" id=\"How_Does_IPC-2222_Relate_to_IPC-2221_and_Other_PCB_Standards\"><\/span>How Does IPC-2222 Relate to IPC-2221 and Other PCB Standards?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>The standards are easiest to separate by the job each one performs.<\/strong> IPC-2221 provides the generic design basis, IPC-2222 adds rigid-board requirements, IPC-6012 addresses qualification and performance, and IPC-A-600 illustrates bare-board acceptability.<\/p>\n<div class=\"table-wrap\" style=\"display:block;width:100%;max-width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;\"><table><thead><tr><th>Standard<\/th><th>Primary Role<\/th><th>When It Applies<\/th><\/tr><\/thead><tbody>\n<tr><td>IPC-2221<\/td><td>Generic printed board design requirements<\/td><td>Provides the common design framework used with the relevant sectional standard.<\/td><\/tr>\n<tr><td>IPC-2222<\/td><td>Sectional design standard for rigid organic printed boards<\/td><td>Adds rigid-board-specific construction, material, mechanical, hole, land and circuit-feature requirements.<\/td><\/tr>\n<tr><td>IPC-2223<\/td><td>Sectional design standard for flexible printed boards<\/td><td>Applies to flexible and rigid-flexible board applications instead of treating them as ordinary rigid boards.<\/td><\/tr>\n<tr><td>IPC-2226<\/td><td>Sectional design standard for HDI printed boards<\/td><td>Adds HDI-specific design requirements and considerations where high-density interconnect technology is used.<\/td><\/tr>\n<tr><td>IPC-6012<\/td><td>Rigid PCB qualification and performance specification<\/td><td>Defines the applicable delivered-board performance and qualification requirements.<\/td><\/tr>\n<tr><td>IPC-A-600<\/td><td>Bare printed board acceptability illustrations<\/td><td>Supports visual interpretation of acceptance criteria together with the governing procurement documents.<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p>The <a href=\"https:\/\/www.ipc.org\/ipc-design-standards\">IPC design standards list<\/a> assigns IPC-2222, IPC-2223 and IPC-2226 to different board technologies. The publisher\u2019s <a href=\"https:\/\/www.ipc.org\/news-release\/ipc-releases-ipc-6012f-qualification-and-performance-specification-rigid-printed\">IPC-6012 description<\/a> places that document in qualification and performance. They work together, but evidence against one document cannot stand in for evidence against another.<\/p>\n<figure><img decoding=\"async\" style=\"display:block;width:100%;max-width:100%;height:auto;margin-left:auto;margin-right:auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/ipc-2222-design-review-v2.jpg\" width=\"600\" height=\"400\" alt=\"Rigid PCB, stackup and fabrication drawing representing the IPC-2222 design-document hierarchy\" loading=\"lazy\"><\/figure>\n\n<h2 id=\"requirements-map\"><span class=\"ez-toc-section\" id=\"What_Are_the_Main_Design_Requirements_in_IPC-2222\"><\/span>What Are the Main Design Requirements in IPC-2222?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>IPC-2222 defines the rigid-board details that sit beneath a generic PCB design.<\/strong> It touches electrical and thermal subjects, but it is not the sole source for current capacity, signal integrity, thermal analysis or every spacing rule. Those decisions may also draw on IPC-2221, product requirements and other applicable standards.<\/p>\n<div class=\"table-wrap\" style=\"display:block;width:100%;max-width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;\"><table><thead><tr><th>Design Area<\/th><th>IPC-2222 Scope<\/th><\/tr><\/thead><tbody>\n<tr><td>Materials<\/td><td>Laminate, dielectric, conductive and embedded-component materials, including property and substitution controls<\/td><\/tr>\n<tr><td>Board construction<\/td><td>Board type, dielectric arrangement, copper construction and overall thickness<\/td><\/tr>\n<tr><td>Mechanical features<\/td><td>Finished profile, cutouts, notches, slots, routing, scoring, datums and tolerances<\/td><\/tr>\n<tr><td>Assembly interface<\/td><td>Board and array features that affect component attachment, handling and separation<\/td><\/tr>\n<tr><td>Holes and interconnections<\/td><td>PTHs, unsupported holes, vias, fit, tolerance, plating and aspect ratio<\/td><\/tr>\n<tr><td>Lands and planes<\/td><td>Land geometry, annular copper, nonfunctional lands and plane interaction<\/td><\/tr>\n<tr><td>Circuit features<\/td><td>Edge spacing, balanced conductors, offset lands and large conductive areas<\/td><\/tr>\n<tr><td>Documentation<\/td><td>Controlled information needed to communicate the approved rigid-board design<\/td><\/tr>\n<\/tbody><\/table><\/div>\n\n<h2 id=\"materials\"><span class=\"ez-toc-section\" id=\"How_Does_IPC-2222_Guide_PCB_Material_and_Laminate_Selection\"><\/span>How Does IPC-2222 Guide PCB Material and Laminate Selection?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>\u201cFR-4\u201d is not a complete material specification.<\/strong> An IPC-2222 review needs enough information to connect the laminate system, dielectric construction, copper and permitted substitutions with the board\u2019s electrical, thermal and mechanical demands.<\/p>\n<ul>\n<li><strong>Laminate system:<\/strong> name the approved material grade or define the properties and test methods that an equivalent material must satisfy. A glass transition temperature value alone does not define the full material behavior.<\/li>\n<li><strong>Core and prepreg:<\/strong> show the layer sequence and target dielectric thicknesses. The design and fabrication teams should agree which dielectric separates each copper layer and reference plane.<\/li>\n<li><strong>Copper construction:<\/strong> distinguish starting foil from finished copper where plating changes the result. Copper thickness affects etching, spacing, current paths, thermal behavior and impedance geometry.<\/li>\n<li><strong>Material properties:<\/strong> review the electrical, thermal, moisture and mechanical properties that affect the application instead of selecting a laminate from one headline value.<\/li>\n<li><strong>Substitution control:<\/strong> state which changes require engineering approval. A substitute that changes dielectric, thermal-expansion or pressed-thickness behavior can invalidate an otherwise completed review.<\/li>\n<\/ul>\n<p>This is a material-definition exercise, not a full stackup tutorial. The review succeeds when the proposed construction can be checked without guessing which laminate, dielectric or copper assumptions were used.<\/p>\n\n<h2 id=\"thickness-mechanical\"><span class=\"ez-toc-section\" id=\"What_Does_IPC-2222_Require_for_PCB_Thickness_Profiles_and_Mechanical_Features\"><\/span>What Does IPC-2222 Require for PCB Thickness, Profiles and Mechanical Features?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Mechanical fit depends on the finished board, not the nominal CAD model.<\/strong> Finished thickness, the delivered profile and functional datums must still fit the connector, enclosure, guide rail or mounting system at their tolerance limits.<\/p>\n<ul>\n<li><strong>Finished thickness:<\/strong> state a nominal value and the applicable overall tolerance. Compare the complete delivered range with card-edge connectors, guides, press-fit tooling and enclosure slots.<\/li>\n<li><strong>Board profile:<\/strong> provide closed, unambiguous outline geometry and identify the dimensions that control the finished edge.<\/li>\n<li><strong>Cutouts, slots and notches:<\/strong> define finished size, position, corner radius and plated status where relevant. Check the geometry against mating hardware and router capability.<\/li>\n<li><strong>Mechanical datums:<\/strong> locate mounting holes, connectors and critical features from shared datums. Temporary panel rails should not control the dimensions of the delivered board.<\/li>\n<li><strong>Tolerance purpose:<\/strong> tighten only the dimensions that protect an actual interface. Unnecessary tolerance reduction can lower yield without improving product function.<\/li>\n<\/ul>\n\n<h2 id=\"panelization-routing\"><span class=\"ez-toc-section\" id=\"How_Does_IPC-2222_Address_Panelization_Routing_and_V-Scoring\"><\/span>How Does IPC-2222 Address Panelization, Routing and V-Scoring?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Routing, scoring and breakaway features define both the finished edge and the stress applied during depanelization.<\/strong> That is why they belong in the rigid-board design review. The IPC-2222B public contents specifically name scoring parameters, V-groove conductor clearance, low-stress breakaway tabs, mouse bites, routed slots and a break line.<\/p>\n<ul>\n<li><strong>Panel borders:<\/strong> define rails, tooling features and the relationship between the array and the delivered boards.<\/li>\n<li><strong>Routing:<\/strong> show routed outlines, internal channels and slots with the finished dimensions and process tolerances that matter to the board.<\/li>\n<li><strong>V-scoring:<\/strong> agree the score geometry, residual web and conductor clearance with the fabricator. The score path and separation method should not be inferred from a line on an assembly drawing.<\/li>\n<li><strong>Breakaway tabs and mouse bites:<\/strong> place them where separation will not load fragile components or leave an unacceptable edge.<\/li>\n<li><strong>Copper and component clearance:<\/strong> evaluate the worst-case remaining distance after routing or scoring variation, not only the nominal CAD distance.<\/li>\n<\/ul>\n<p>The <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/02\/what-are-the-pcb-assembly-requirements-pcb-panelization-guidelines\/\">PCB panelization guidelines<\/a> cover assembly-side choices in more detail. If a tab, rail, score or routed channel changes, review it again; the change can affect handling, separation stress and the delivered edge.<\/p>\n\n<h2 id=\"holes-vias\"><span class=\"ez-toc-section\" id=\"What_Does_IPC-2222_Require_for_PTHs_NPTHs_and_Vias\"><\/span>What Does IPC-2222 Require for PTHs, NPTHs and Vias?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Start with what the hole does, then define its finished condition.<\/strong> Drill-tool size, finished-hole size, plating, tolerance, aspect ratio and component fit belong to one tolerance chain. Copying those values separately from another board can produce a combination that no longer fits or plates as intended.<\/p>\n<ul>\n<li><strong>Plated-through hole:<\/strong> define the finished hole and compare its minimum size with the maximum component-lead envelope. Confirm that the remaining clearance supports insertion and the intended soldering process.<\/li>\n<li><strong>Via:<\/strong> select the drill and finished geometry with the plated depth, board thickness, land size, registration and the fabricator\u2019s process capability.<\/li>\n<li><strong>Unsupported or non-plated hole:<\/strong> identify the hole as non-plated, state its finished size and tolerance, and review nearby copper and hardware contact.<\/li>\n<li><strong>Press-fit hole:<\/strong> use the connector manufacturer\u2019s finished-hole, plating, insertion and qualification requirements. An ordinary soldered-hole fit cannot define a press-fit interface.<\/li>\n<li><strong>Aspect ratio:<\/strong> evaluate plated depth relative to drill diameter with the proposed stackup and process. It is a manufacturing review input, not one universal target for every supplier.<\/li>\n<\/ul>\n<p>Consider an illustrative round lead specified as 0.60 \u00b1 0.02 mm and a finished plated hole of 0.78 \u00b1 0.05 mm. These are example design inputs, not IPC-2222 minimum limits.<\/p>\n<div class=\"table-wrap\" style=\"display:block;width:100%;max-width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;\"><table><thead><tr><th>Parameter<\/th><th>Minimum-Clearance Case<\/th><th>Maximum-Clearance Case<\/th><th>Review Check<\/th><\/tr><\/thead><tbody>\n<tr><td>Lead diameter<\/td><td>0.62 mm maximum<\/td><td>0.58 mm minimum<\/td><td>Include lead shape, plating, straightness and positional variation.<\/td><\/tr>\n<tr><td>Finished hole<\/td><td>0.73 mm minimum<\/td><td>0.83 mm maximum<\/td><td>Confirm the drawing specifies finished size rather than drill-tool size.<\/td><\/tr>\n<tr><td>Diametral clearance<\/td><td><strong>0.11 mm<\/strong><\/td><td><strong>0.25 mm<\/strong><\/td><td>Check insertion and soldering across the complete assembly tolerance chain.<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p>The minimum diametral clearance is 0.73 \u2212 0.62 = <strong>0.11 mm<\/strong>; the maximum is 0.83 \u2212 0.58 = <strong>0.25 mm<\/strong>. A square lead needs its maximum corner-to-corner envelope checked against the minimum hole. Multi-pin insertion also depends on lead position, hole position and straightness.<\/p>\n<figure><img decoding=\"async\" style=\"display:block;width:100%;max-width:100%;height:auto;margin-left:auto;margin-right:auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/ipc-2222-hole-fit-v2.jpg\" width=\"600\" height=\"400\" alt=\"Plated through-hole cutaway showing the IPC-2222 relationship between a component lead, finished hole and copper barrel\" loading=\"lazy\"><\/figure>\n\n<h2 id=\"lands-planes\"><span class=\"ez-toc-section\" id=\"How_Does_IPC-2222_Address_Lands_Annular_Rings_and_Plane_Clearance\"><\/span>How Does IPC-2222 Address Lands, Annular Rings and Plane Clearance?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Hole size, land size, remaining annular copper and plane clearance have to be reviewed together.<\/strong> Increasing the land may protect the annular ring, yet reduce isolation to an unrelated plane. Treating either check alone hides that tradeoff.<\/p>\n<ol>\n<li><strong>Start with hole function and finished size.<\/strong> The land must suit the plated or non-plated feature and the connection it is expected to make.<\/li>\n<li><strong>Add fabrication allowance and registration.<\/strong> Drill position, layer registration, etching and finished-hole variation determine the copper that remains at the narrowest point.<\/li>\n<li><strong>Evaluate the annular ring.<\/strong> The centered CAD difference between pad and hole diameters is only the nominal starting point.<\/li>\n<li><strong>Recheck plane clearance.<\/strong> A larger land can improve remaining copper while reducing isolation to an unconnected plane.<\/li>\n<li><strong>Choose the plane connection.<\/strong> Thermal relief or a solid connection should follow electrical duty, heat flow, copper thickness and soldering needs.<\/li>\n<li><strong>Decide how to treat nonfunctional lands.<\/strong> Removal can affect registration support and clearance; retention can constrain routing and plane geometry.<\/li>\n<\/ol>\n<p>The <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/pcb-annular-ring\/\">PCB annular ring guide<\/a> develops this geometry further. Whenever a land changes, repeat the annular-ring, plane-clearance and conductor-spacing checks before closing the design.<\/p>\n\n<h2 id=\"conductor-edge-spacing\"><span class=\"ez-toc-section\" id=\"What_Does_IPC-2222_Say_About_Conductor_Features_and_PCB_Edge_Spacing\"><\/span>What Does IPC-2222 Say About Conductor Features and PCB Edge Spacing?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Conductor geometry must survive both copper processing and edge formation.<\/strong> IPC-2222B specifically names printed board edge spacing, balanced conductors, offset lands and large conductive areas among its circuit-feature topics.<\/p>\n<ul>\n<li><strong>Printed board edge spacing:<\/strong> measure from the finished routed or scored edge and include process tolerance. A nominal CAD clearance does not describe the minimum delivered distance.<\/li>\n<li><strong>Balanced conductors:<\/strong> review copper distribution through the stack and across the panel. Strong asymmetry can contribute to distortion and should be discussed before release.<\/li>\n<li><strong>Offset lands:<\/strong> use offset geometry only when the connection and fabrication allowances remain clear; do not treat it as a generic repair for congested routing.<\/li>\n<li><strong>Large conductive areas:<\/strong> evaluate their electrical and thermal role together with copper balance, etching and assembly heat flow.<\/li>\n<li><strong>Edge-process interaction:<\/strong> repeat the spacing check after changing routing, V-scoring, tabs, mouse bites or the board datum that defines the final profile.<\/li>\n<\/ul>\n\n<h2 id=\"ipc-2222b-changes\"><span class=\"ez-toc-section\" id=\"What_Changed_from_IPC-2222A_to_IPC-2222B\"><\/span>What Changed from IPC-2222A to IPC-2222B?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>IPC-2222B supersedes IPC-2222A and reorganizes several material, mechanical, interconnection and circuit-feature topics.<\/strong> The public previews for <a href=\"https:\/\/www.ipc.org\/TOC\/IPC-2222A.pdf\">IPC-2222A<\/a> and <a href=\"https:\/\/www.electronics.org\/TOC\/IPC-2222B-toc.pdf\">IPC-2222B<\/a> reveal headings and table titles, not every requirement or numerical change. The comparison below is therefore a review guide rather than a clause-by-clause redline.<\/p>\n<div class=\"table-wrap\" style=\"display:block;width:100%;max-width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;\"><table><thead><tr><th>Design Area<\/th><th>IPC-2222A<\/th><th>IPC-2222B<\/th><th>B-Revision Review<\/th><\/tr><\/thead><tbody>\n<tr><td>Material properties<\/td><td>Table 4-1 focuses on clad-laminate UL maximum operating temperatures.<\/td><td>Section 4.3.1 is \u201cUL Parameters,\u201d and Table 4-1 covers typical thermal properties of selected dielectrics.<\/td><td>Review the complete material property set and its test methods rather than carrying forward one temperature value.<\/td><\/tr>\n<tr><td>Embedded component materials<\/td><td>No standalone embedded-component-materials section appears in the A preview contents.<\/td><td>Section 4.5 is \u201cElectronic (Embedded) Component Materials.\u201d<\/td><td>Identify the additional construction controls when components or materials are embedded.<\/td><\/tr>\n<tr><td>Assembly array<\/td><td>Section 5.3.1 is \u201cAssembly, Palletization and Test.\u201d<\/td><td>Section 5.3.1 is \u201cAssembly Array (or Pallet).\u201d<\/td><td>Review the controlled array, rails, tooling features and separation method.<\/td><\/tr>\n<tr><td>Overall thickness<\/td><td>Table 5-3 is \u201cPrinted Board Thickness Tolerance Levels.\u201d<\/td><td>Table 5-3 is \u201cPrinted Board Overall Thickness Tolerance Levels.\u201d<\/td><td>Confirm the delivered overall range required by connectors and mechanical interfaces.<\/td><\/tr>\n<tr><td>Interconnection lands<\/td><td>The A preview proceeds to pad-to-plane clearance without a separate fabrication-allowance table.<\/td><td>Table 9-1 is \u201cMinimum Standard Fabrication Allowance for Interconnection Lands.\u201d<\/td><td>Recheck land geometry with process allowance before approving annular-ring or plane-clearance changes.<\/td><\/tr>\n<tr><td>Plated-hole data<\/td><td>The preview lists PTH aspect-ratio and minimum diameter-tolerance tables.<\/td><td>The preview lists plated-hole aspect ratio, LMC\/MMC hole-size limits and a recommended minimum drill-size table.<\/td><td>Revalidate drill, finished-hole limits, plating, aspect ratio and component fit as one chain.<\/td><\/tr>\n<tr><td>Breakaway and edge features<\/td><td>The preview lists low-stress breakaway tabs and routed slots.<\/td><td>The figure titles explicitly include mouse bites, routed slots and a break line; the contents also name printed board edge spacing.<\/td><td>Recheck tabs, scoring, routing and minimum delivered copper-to-edge distance.<\/td><\/tr>\n<\/tbody><\/table><\/div>\n<p>Use the authorized editions before applying clause values or making a compliance claim. When a project moves from A to B, record the revision decision and update every affected design and procurement document.<\/p>\n\n<h2 id=\"design-dfm-review\"><span class=\"ez-toc-section\" id=\"How_Should_IPC-2222_Be_Applied_During_PCB_Design_and_DFM_Review\"><\/span>How Should IPC-2222 Be Applied During PCB Design and DFM Review?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>A practical review moves from board identity to controlled production data.<\/strong> DFM then tests the proposed design against a manufacturing process. It cannot choose the applicable standards, product requirements or approved exceptions on behalf of the project.<\/p>\n<ol>\n<li><strong>Determine the board type.<\/strong> Identify the layer structure, blind or buried vias and any metal-core construction.<\/li>\n<li><strong>Confirm the applicable IPC documents.<\/strong> Record the IPC-2221 and IPC-2222 revisions, performance basis and any customer-specific requirements.<\/li>\n<li><strong>Define materials and construction.<\/strong> Approve the laminate system, dielectric sequence, copper build, finished thickness and impedance information.<\/li>\n<li><strong>Review mechanical dimensions.<\/strong> Check the delivered profile, datums, cutouts, slots and component or enclosure interfaces at tolerance extremes.<\/li>\n<li><strong>Check holes and lands.<\/strong> Separate PTH, via, press-fit and NPTH requirements; then review finished size, fit, aspect ratio, registration and annular copper.<\/li>\n<li><strong>Check plane and edge clearance.<\/strong> Evaluate the complete tolerated hole-and-land feature and the minimum copper distance after the edge process.<\/li>\n<li><strong>Review panel features.<\/strong> Confirm routing, scoring, tabs, mouse bites, rails, handling and separation effects.<\/li>\n<li><strong>Release controlled production data.<\/strong> Reopen the final outputs and verify that the fabrication data, drill files, stackup and drawing describe the same revision.<\/li>\n<\/ol>\n\n<h2 id=\"files-documentation\"><span class=\"ez-toc-section\" id=\"What_Files_and_Documentation_Are_Needed_for_an_IPC-2222-Based_PCB_Design\"><\/span>What Files and Documentation Are Needed for an IPC-2222-Based PCB Design?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>The released files must describe one approved board construction without contradiction.<\/strong> IPC-2222 does not prescribe a universal upload package, so the exact records depend on the product, contract and manufacturing route.<\/p>\n<ul>\n<li><strong>Gerber, <a href=\"https:\/\/www.bestpcbs.com\/blog\/2024\/12\/what-file-type-is-used-for-pcb\/\">ODB++ files<\/a> or another agreed fabrication format:<\/strong> copper, mask, legend, profile and other released layers.<\/li>\n<li><strong>NC drill and rout data:<\/strong> plated and non-plated holes, slots, routed channels and any controlled-depth features.<\/li>\n<li><strong>Fabrication drawing:<\/strong> board revision, dimensions, datums, tolerances, surface finish, scoring or routing and applicable standards with revisions.<\/li>\n<li><strong>Stackup:<\/strong> material, dielectric construction, copper build, finished thickness and impedance information.<\/li>\n<li><strong>Hole table:<\/strong> hole functions, finished sizes, tolerances, plated status and special press-fit or component requirements.<\/li>\n<li><strong>Special requirements:<\/strong> approved substitutions, coupons, reports, inspection, test and any agreed exceptions.<\/li>\n<\/ul>\n<p>After accepting a DFM change, update every file it touches. An approval email is not enough if the released drill table, stackup or drawing still carries the old value.<\/p>\n<figure><img decoding=\"async\" style=\"display:block;width:100%;max-width:100%;height:auto;margin-left:auto;margin-right:auto;\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/09\/ipc-2222-release-package-v2.jpg\" width=\"600\" height=\"400\" alt=\"Rigid PCB with controlled stackup, drill data, fabrication drawing and CAM layers for an IPC-2222-based design\" loading=\"lazy\"><\/figure>\n\n<h2 id=\"common-mistakes\"><span class=\"ez-toc-section\" id=\"What_Are_the_Most_Common_IPC-2222_Design_Mistakes\"><\/span>What Are the Most Common IPC-2222 Design Mistakes?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Most IPC-2222 mistakes begin with a wrong assumption about scope or with a nominal value taken out of its tolerance chain.<\/strong> Both can pass a superficial checklist while leaving the board definition incomplete.<\/p>\n<ul>\n<li><strong>Treating IPC-2222 as a standalone standard:<\/strong> use it with IPC-2221 and the applicable performance, procurement and acceptance documents.<\/li>\n<li><strong>Confusing PCB type with performance class:<\/strong> Type 3 describes a multilayer construction; it does not automatically mean Class 3.<\/li>\n<li><strong>Specifying only nominal board thickness:<\/strong> include the finished tolerance and test the complete range against mechanical interfaces.<\/li>\n<li><strong>Confusing drill size with finished-hole size:<\/strong> plating and process compensation separate the tool diameter from the delivered opening.<\/li>\n<li><strong>Increasing land size without rechecking plane clearance:<\/strong> more annular copper can reduce isolation to unconnected copper.<\/li>\n<li><strong>Ignoring the edge process:<\/strong> routing and scoring tolerances determine the minimum delivered copper-to-edge distance and separation stress.<\/li>\n<li><strong>Using an outdated revision reference:<\/strong> identify the contractual revision and formally review any move from IPC-2222A to IPC-2222B.<\/li>\n<li><strong>Treating DFM approval as automatic IPC compliance:<\/strong> DFM confirms selected manufacturing conditions; it does not choose every applicable standard or product requirement for the designer.<\/li>\n<\/ul>\n\n<h2 id=\"ebest-support\"><span class=\"ez-toc-section\" id=\"How_Can_EBest_Circuit_Support_Rigid_PCB_Design_and_Manufacturing\"><\/span>How Can EBest Circuit Support Rigid PCB Design and Manufacturing?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>EBest Circuit can check whether the proposed rigid-board construction is buildable and whether the released files agree.<\/strong> The free DFM review supports prototype and production preparation, while standards selection, product qualification and compliance responsibility remain with the customer and project owners.<\/p>\n<ul>\n<li><strong>Materials and stackup:<\/strong> review the proposed laminate system, copper build, finished thickness, impedance targets and substitution boundaries.<\/li>\n<li><strong>Holes and lands:<\/strong> compare finished-hole intent, aspect ratio, annular copper, plane clearance and special connector requirements with the proposed process.<\/li>\n<li><strong>Board edge and panelization:<\/strong> review routing, cutouts, V-scoring, tabs, rails and copper or component clearances.<\/li>\n<li><strong>CAM and document consistency:<\/strong> compare Gerber or ODB++, NC drill, stackup and fabrication drawing for revision, outline, hole and construction conflicts.<\/li>\n<li><strong>Prototype to production:<\/strong> keep approved DFM changes in the controlled files used for the prototype, follow-up builds and inspection plan.<\/li>\n<\/ul>\n<p>Send your <strong>Gerber or ODB++ files, drill files, stackup and fabrication drawing<\/strong> to <a href=\"mailto:sales@bestpcbs.com\">sales@bestpcbs.com<\/a> for rigid PCB DFM review and quotation.<\/p>\n\n<h2 id=\"faq\"><span class=\"ez-toc-section\" id=\"FAQs_About_IPC-2222\"><\/span>FAQs About IPC-2222<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Q1: Is IPC-2222B the latest revision of IPC-2222?<\/strong><\/p>\n<p><strong>A1:<\/strong> Yes, according to the IPC revision table checked on September 1, 2026. It lists IPC-2222B with an October 2020 date. Check the table again at project start and follow the revision named by the contract.<\/p>\n<p><strong>Q2: Where can I get the official IPC-2222 standard or IPC-2222B PDF?<\/strong><\/p>\n<p><strong>A2:<\/strong> IPC provides a four-page preview that confirms the document identity, scope and contents. The preview is not the full standard, so use an authorized edition before applying clause values. <a href=\"https:\/\/www.electronics.org\/TOC\/IPC-2222B-toc.pdf\">Download the official IPC-2222B PDF preview (4 pages)<\/a>.<\/p>\n<p><strong>Q3: Can IPC-2222 be used without IPC-2221?<\/strong><\/p>\n<p><strong>A3:<\/strong> No. IPC-2222 adds rigid-board-specific design requirements to the generic framework in IPC-2221.<\/p>\n<p><strong>Q4: Does a Type 3 board mean a Class 3 board?<\/strong><\/p>\n<p><strong>A4:<\/strong> No. Type describes board construction; class describes performance expectations under the applicable documents.<\/p>\n<p><strong>Q5: Does IPC-2222 cover metal-core rigid PCBs?<\/strong><\/p>\n<p><strong>A5:<\/strong> Yes. Types 5 and 6 are multilayer metal-core constructions. The project still has to define the material system, isolation, thermal conditions and supplier agreements.<\/p>\n<p><strong>Q6: Does IPC-2222 contain every electrical and thermal PCB design rule?<\/strong><\/p>\n<p><strong>A6:<\/strong> No. IPC-2222 includes rigid-board electrical and thermal topics, but current capacity, signal integrity and detailed thermal analysis may also depend on IPC-2221, other standards and the product specification.<\/p>\n<p><strong>Q7: Are press-fit holes designed like ordinary soldered PTHs?<\/strong><\/p>\n<p><strong>A7:<\/strong> No. Use the connector manufacturer\u2019s finished-hole, plating, insertion and qualification requirements.<\/p>\n<p><strong>Q8: Does a fabricator\u2019s DFM approval prove IPC compliance?<\/strong><\/p>\n<p><strong>A8:<\/strong> No. DFM can confirm that selected features suit a manufacturing process. Compliance also depends on the chosen standards and revisions, the product requirements and any documented exceptions.<\/p>\n<p><strong>Q9: Should flex, rigid-flex or HDI boards use only IPC-2222?<\/strong><\/p>\n<p><strong>A9:<\/strong> No. IPC identifies IPC-2223 for flexible and rigid-flexible applications and IPC-2226 for HDI printed boards. Use the standards that match the actual technologies in the design.<\/p>\n<p><strong>Q10: Which files should be sent first for an IPC-2222-based review?<\/strong><\/p>\n<p><strong>A10:<\/strong> Send the current Gerber or ODB++, NC drill data, stackup and fabrication drawing first. Include any component or mechanical requirement that controls hole fit, finished thickness or the board edge.<\/p>\n\n","protected":false},"excerpt":{"rendered":"<p>IPC-2222 is the sectional design standard for rigid organic printed boards. Used with IPC-2221, it brings the discussion down to the physical details of a rigid board: materials, construction, thickness, mechanical features, holes, lands and conductor geometry. IPC currently lists IPC-2222B, issued in October 2020, as the latest revision. The document is useful because it [&hellip;]<\/p>\n","protected":false},"author":33247,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[5953,5789],"tags":[8040,8042,1744,8029],"class_list":["post-34821","post","type-post","status-publish","format-standard","hentry","category-ipc-standard","category-pcb-design","tag-ipc-2222","tag-pcb-design-standards","tag-pcb-dfm","tag-rigid-pcb-design"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Learn how IPC-2222 covers rigid PCB types, materials, thickness, routing, holes, lands and edge spacing, and how it works with IPC-2221.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<meta name=\"author\" content=\"Jessica, Jessica\"\/>\n\t<link 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