{"id":29644,"date":"2026-07-06T17:05:12","date_gmt":"2026-07-06T09:05:12","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=29644"},"modified":"2026-07-06T17:06:45","modified_gmt":"2026-07-06T09:06:45","slug":"de104","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/","title":{"rendered":"Isola DE104 PCB Material Guide: Properties, Datasheet and FR-4 Comparison"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_84 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Is_Isola_DE104_PCB_Material\" >What Is Isola DE104 PCB Material?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Are_the_Material_Properties_of_Isola_DE104_Laminate_and_Prepreg\" >What Are the Material Properties of Isola DE104 Laminate and Prepreg?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Is_the_Tg_Temperature_of_Isola_DE104\" >What Is the Tg Temperature of Isola DE104?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Are_the_Dk_Df_and_Thermal_Conductivity_of_DE104\" >What Are the Dk, Df and Thermal Conductivity of DE104?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#Isola_DE104_Datasheet_Overview\" >Isola DE104 Datasheet Overview<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Applications_Commonly_Use_DE104_PCB_Material\" >What Applications Commonly Use DE104 PCB Material?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#DE104_vs_Standard_FR-4_What_Is_the_Difference\" >DE104 vs Standard FR-4: What Is the Difference?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#DE104_vs_FR406_Which_Material_Should_You_Choose\" >DE104 vs FR406: Which Material Should You Choose?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#How_Does_DE104_Compare_with_Other_Low_Tg_FR-4_Materials\" >How Does DE104 Compare with Other Low Tg FR-4 Materials?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Should_You_Check_Before_Choosing_DE104_PCB_Material\" >What Should You Check Before Choosing DE104 PCB Material?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#What_Affects_Isola_DE104_PCB_Cost\" >What Affects Isola DE104 PCB Cost?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/#FAQs_About_Isola_DE104_PCB_Material\" >FAQs About Isola DE104 PCB Material<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div>\n<p>Isola <strong><a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/\" title=\"\">DE104<\/a><\/strong> is a low-Tg modified FR-4 laminate and prepreg system for PCB projects that need stable manufacturing, clear material data and controlled cost. It is mainly used in standard multilayer PCB designs where high-Tg or low-loss materials are not required.<\/p>\n\n\n\n<p>The key point is simple: <strong>this material is suitable for moderate thermal stress, general signal requirements and cost-sensitive PCB production<\/strong>. Before approval, engineers should check Tg, Dk, Df, copper weight, reflow profile, stackup structure and final reliability targets.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-1.png\"><img loading=\"lazy\" decoding=\"async\" width=\"613\" height=\"611\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-1.png\" alt=\"DE104, https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/\" class=\"wp-image-29659\" style=\"aspect-ratio:3\/2;object-fit:contain;width:800px\" srcset=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-1.png 613w, https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-1-300x300.png 300w, https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-1-150x150.png 150w\" sizes=\"auto, (max-width: 613px) 100vw, 613px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_Isola_DE104_PCB_Material\"><\/span>What Is Isola DE104 PCB Material?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Isola <a href=\"https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/\" title=\"\">DE104 <\/a>PCB material is a low-Tg FR-4 laminate and prepreg system used for rigid and multilayer PCB fabrication.<\/strong> It uses E-glass reinforcement and an epoxy resin system designed for standard FR-4 processing.<\/p>\n\n\n\n<p>This material is selected when a PCB project needs named material traceability, predictable production and lower cost than many high-Tg FR-4 alternatives. It can be used as copper-clad laminate core or prepreg bonding layer in multilayer stackups.<\/p>\n\n\n\n<p>In practical PCB manufacturing, this FR-4 system is not designed for extreme thermal stress or ultra-low signal loss. It is a dependable option for commercial, industrial and general electronic products.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Are_the_Material_Properties_of_Isola_DE104_Laminate_and_Prepreg\"><\/span>What Are the Material Properties of Isola DE104 Laminate and Prepreg?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Isola DE104 laminate and prepreg are low-Tg modified FR-4 materials for standard rigid and multilayer PCB fabrication.<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Material type:<\/strong> Low-Tg modified FR-4 laminate and prepreg.<\/li>\n\n\n\n<li><strong>Glass system:<\/strong> E-glass fabric with epoxy resin.<\/li>\n\n\n\n<li><strong>Tg:<\/strong> <strong>135\u00b0C<\/strong>, suitable for moderate thermal stress.<\/li>\n\n\n\n<li><strong>Td:<\/strong> <strong>315\u00b0C<\/strong>, showing resin decomposition resistance.<\/li>\n\n\n\n<li><strong>T260:<\/strong> <strong>More than 12 minutes<\/strong>, useful for soldering heat evaluation.<\/li>\n\n\n\n<li><strong>Dk:<\/strong> <strong>4.37 at 1 GHz<\/strong>, suitable for standard impedance PCB designs.<\/li>\n\n\n\n<li><strong>Df:<\/strong> <strong>0.022 at 1 GHz<\/strong>, not a low-loss RF material.<\/li>\n\n\n\n<li><strong>Thermal conductivity:<\/strong> <strong>0.36 W\/m\u00b7K<\/strong>, suitable for general PCB insulation.<\/li>\n\n\n\n<li><strong>Moisture absorption:<\/strong> <strong>0.3%<\/strong>, so storage and baking control still matter.<\/li>\n\n\n\n<li><strong>Flammability:<\/strong> <strong>UL 94 V-0<\/strong>.<\/li>\n\n\n\n<li><strong>Compliance:<\/strong> Supports <strong>IPC-4101 \/21, RoHS and UL E41625<\/strong> checks.<\/li>\n\n\n\n<li><strong>Laminate use:<\/strong> Used as PCB core material.<\/li>\n\n\n\n<li><strong>Prepreg use:<\/strong> Used for bonding layers in multilayer PCB stackups.<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-material-properties.png\"><img loading=\"lazy\" decoding=\"async\" width=\"621\" height=\"630\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-material-properties.png\" alt=\"DE104 material properties, https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/\" class=\"wp-image-29665\" style=\"aspect-ratio:3\/2;object-fit:contain;width:800px\" srcset=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-material-properties.png 621w, https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-material-properties-296x300.png 296w\" sizes=\"auto, (max-width: 621px) 100vw, 621px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_the_Tg_Temperature_of_Isola_DE104\"><\/span>What Is the Tg Temperature of Isola DE104?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>The Tg temperature of Isola DE104 is 135\u00b0C by DSC.<\/strong> Tg means glass transition temperature, where the resin starts changing from a rigid glassy state to a softer state under heat.<\/p>\n\n\n\n<p>This value matters because PCB materials expand faster above Tg. During lead-free reflow, rework or high-temperature operation, Z-axis expansion can increase stress on plated through holes, vias and innerlayer connections.<\/p>\n\n\n\n<p>A Tg of 135\u00b0C can work for many standard PCB projects. However, thick PCB, heavy copper PCB, double-sided assembly and repeated reflow may need a higher-Tg laminate for better reliability margin.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Are_the_Dk_Df_and_Thermal_Conductivity_of_DE104\"><\/span>What Are the Dk, Df and Thermal Conductivity of DE104?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>DE104 has Dk 4.37, Df 0.022 at 1 GHz and thermal conductivity of 0.36 W\/m\u00b7K.<\/strong> These values affect impedance, signal loss and heat transfer.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Frequency<\/th><th>Dk<\/th><th>Df<\/th><\/tr><\/thead><tbody><tr><td>100 MHz<\/td><td>4.46<\/td><td>0.020<\/td><\/tr><tr><td>500 MHz<\/td><td>4.40<\/td><td>0.021<\/td><\/tr><tr><td>1 GHz<\/td><td>4.37<\/td><td>0.022<\/td><\/tr><tr><td>2 GHz<\/td><td>4.35<\/td><td>0.023<\/td><\/tr><tr><td>5 GHz<\/td><td>4.32<\/td><td>0.024<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Dk affects impedance and signal speed.<\/strong> This material can support standard controlled impedance PCB designs when the stackup is calculated with real dielectric thickness, copper thickness and glass style.<\/p>\n\n\n\n<p><strong>Df affects dielectric loss.<\/strong> A Df of <strong>0.022 at 1 GHz<\/strong> is acceptable for industrial control boards, consumer electronics and moderate-speed digital circuits. It is not suitable for RF, microwave or strict high-speed loss control.<\/p>\n\n\n\n<p><strong>Thermal conductivity affects heat transfer through the dielectric layer.<\/strong> At <strong>0.36 W\/m\u00b7K<\/strong>, this material is not a heat-spreading substrate. For power PCB, heat should be handled through copper area, thermal vias, stackup design and layout.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Isola_DE104_Datasheet_Overview\"><\/span>Isola DE104 Datasheet Overview<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>The Isola DE104 datasheet shows that this material is a low-Tg FR-4 option with clear thermal, electrical and compliance data.<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Item<\/th><th>Data<\/th><\/tr><\/thead><tbody><tr><td>Material class<\/td><td>Low Tg FR-4 laminate and prepreg<\/td><\/tr><tr><td>Tg<\/td><td>135\u00b0C<\/td><\/tr><tr><td>Td<\/td><td>315\u00b0C<\/td><\/tr><tr><td>T260<\/td><td>&gt;12 min<\/td><\/tr><tr><td>Dk at 1 GHz<\/td><td>4.37<\/td><\/tr><tr><td>Df at 1 GHz<\/td><td>0.022<\/td><\/tr><tr><td>Thermal conductivity<\/td><td>0.36 W\/m\u00b7K<\/td><\/tr><tr><td>Moisture absorption<\/td><td>0.3%<\/td><\/tr><tr><td>Flammability<\/td><td>UL 94 V-0<\/td><\/tr><tr><td>IPC recognition<\/td><td>IPC-4101 \/21<\/td><\/tr><tr><td>UL file<\/td><td>E41625<\/td><\/tr><tr><td>RoHS<\/td><td>Compliant<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>Tg and Td show thermal margin.<\/strong> This helps judge whether the PCB can handle assembly heat, rework and operating temperature.<\/p>\n\n\n\n<p><strong>Dk and Df affect impedance and signal loss.<\/strong> They should be checked before controlled impedance PCB production.<\/p>\n\n\n\n<p><strong>Thermal conductivity is only moderate.<\/strong> This material can support general PCB applications, but it should not be selected as a thermal management material.<\/p>\n\n\n\n<p><strong>Compliance data helps reduce sourcing risk.<\/strong> Buyers should confirm material name, laminate type, prepreg construction and testing requirements before production.<\/p>\n\n\n\n<div class=\"wp-block-file\"><a id=\"wp-block-file--media-4e443caf-dbc8-4d44-afab-ce39477740ee\" href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/Isola-De104-Datasheet-EBest-Circuit.pdf\">Isola De104 Datasheet-EBest Circuit<\/a><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/Isola-De104-Datasheet-EBest-Circuit.pdf\" class=\"wp-block-file__button wp-element-button\" download aria-describedby=\"wp-block-file--media-4e443caf-dbc8-4d44-afab-ce39477740ee\">Download<\/a><\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Applications_Commonly_Use_DE104_PCB_Material\"><\/span>What Applications Commonly Use DE104 PCB Material?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>DE104 PCB material is used in products that need standard FR-4 processing, moderate reliability and controlled PCB cost.<\/strong><\/p>\n\n\n\n<p>Common applications include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Industrial control PCB:<\/strong> Control modules, relay boards, automation controllers and signal interface boards.<\/li>\n\n\n\n<li><strong>Consumer electronics PCB:<\/strong> Cost-sensitive electronics with normal operating temperature.<\/li>\n\n\n\n<li><strong>Home appliance control boards:<\/strong> Washing machines, air conditioners, kitchen appliances and household control systems.<\/li>\n\n\n\n<li><strong>Power supply control PCB:<\/strong> Feedback boards, control circuits and low-to-medium power management sections.<\/li>\n\n\n\n<li><strong>LED control modules:<\/strong> LED driver control boards, dimming modules and lighting control circuits.<\/li>\n\n\n\n<li><strong>Instrumentation PCB:<\/strong> Measurement devices, monitoring equipment and general electronic instruments.<\/li>\n\n\n\n<li><strong>Communication support boards:<\/strong> Non-RF control sections, interface boards and moderate-speed signal boards.<\/li>\n\n\n\n<li><strong>Office electronics:<\/strong> Printers, scanners, access devices and commercial electronic equipment.<\/li>\n\n\n\n<li><strong>General multilayer PCB:<\/strong> Standard multilayer boards that need named FR-4 material control.<\/li>\n\n\n\n<li><strong>Mixed-signal PCB:<\/strong> Moderate-speed analog and digital circuits with reviewed impedance.<\/li>\n<\/ul>\n\n\n\n<p>For RF circuits, high-speed backplanes, aerospace electronics or safety-critical automotive systems, higher-grade laminate should be reviewed first.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"DE104_vs_Standard_FR-4_What_Is_the_Difference\"><\/span>DE104 vs Standard FR-4: What Is the Difference?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>DE104 is a named Isola FR-4 material. Standard FR-4 is a broad material category with different suppliers, grades and performance levels.<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Item<\/th><th>DE104<\/th><th>Standard FR-4<\/th><\/tr><\/thead><tbody><tr><td>Material identity<\/td><td>Named Isola material<\/td><td>Generic category<\/td><\/tr><tr><td>Tg<\/td><td>135\u00b0C<\/td><td>Supplier dependent<\/td><\/tr><tr><td>Td<\/td><td>315\u00b0C<\/td><td>Varies by grade<\/td><\/tr><tr><td>Dk at 1 GHz<\/td><td>4.37<\/td><td>Varies by grade<\/td><\/tr><tr><td>Df at 1 GHz<\/td><td>0.022<\/td><td>Varies by grade<\/td><\/tr><tr><td>Thermal conductivity<\/td><td>0.36 W\/m\u00b7K<\/td><td>Supplier dependent<\/td><\/tr><tr><td>IPC recognition<\/td><td>IPC-4101 \/21<\/td><td>Depends on grade<\/td><\/tr><tr><td>UL recognition<\/td><td>UL E41625<\/td><td>Depends on supplier<\/td><\/tr><tr><td>Traceability<\/td><td>Stronger<\/td><td>Often weaker<\/td><\/tr><tr><td>Cost<\/td><td>Moderate<\/td><td>Usually lower<\/td><\/tr><tr><td>Best use<\/td><td>Controlled standard PCB<\/td><td>Basic low-cost PCB<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p><strong>DE104 gives better traceability than unknown FR-4.<\/strong> It is useful when the project requires material approval, datasheet review, impedance calculation or batch consistency.<\/p>\n\n\n\n<p>Generic FR-4 can work for simple low-cost PCB projects. However, if reliability, material control or customer documentation matters, a named laminate is safer.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-vs-FR4-2.png\"><img loading=\"lazy\" decoding=\"async\" width=\"752\" height=\"626\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-vs-FR4-2.png\" alt=\"DE104 vs FR4, https:\/\/www.bestpcbs.com\/blog\/2026\/07\/de104\/\" class=\"wp-image-29663\" style=\"aspect-ratio:3\/2;object-fit:contain;width:800px\" srcset=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-vs-FR4-2.png 752w, https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2026\/07\/DE104-vs-FR4-2-300x250.png 300w\" sizes=\"auto, (max-width: 752px) 100vw, 752px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"DE104_vs_FR406_Which_Material_Should_You_Choose\"><\/span>DE104 vs FR406: Which Material Should You Choose?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Choose DE104 for cost-sensitive standard PCB builds. Choose FR406 when higher Tg, stronger thermal margin and better reliability are required.<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Item<\/th><th>DE104<\/th><th>FR406<\/th><\/tr><\/thead><tbody><tr><td>Material class<\/td><td>Low Tg FR-4<\/td><td>High Tg FR-4<\/td><\/tr><tr><td>Tg<\/td><td>135\u00b0C<\/td><td>170\u00b0C<\/td><\/tr><tr><td>Td<\/td><td>315\u00b0C<\/td><td>300\u00b0C<\/td><\/tr><tr><td>Dk<\/td><td>4.37<\/td><td>3.93<\/td><\/tr><tr><td>Df<\/td><td>0.022<\/td><td>0.0167<\/td><\/tr><tr><td>IPC recognition<\/td><td>IPC-4101 \/21<\/td><td>IPC-4101 \/21 \/24 \/26<\/td><\/tr><tr><td>Thermal margin<\/td><td>Moderate<\/td><td>Higher<\/td><\/tr><tr><td>Signal loss<\/td><td>Higher<\/td><td>Lower<\/td><\/tr><tr><td>Typical cost<\/td><td>Lower<\/td><td>Higher<\/td><\/tr><tr><td>Best fit<\/td><td>Standard PCB<\/td><td>Higher-reliability PCB<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Choose DE104 when:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Cost control matters.<\/strong><\/li>\n\n\n\n<li><strong>Operating temperature is moderate.<\/strong><\/li>\n\n\n\n<li><strong>Layer count is not too high.<\/strong><\/li>\n\n\n\n<li><strong>Signal speed is not demanding.<\/strong><\/li>\n\n\n\n<li><strong>Standard FR-4 processing is enough.<\/strong><\/li>\n<\/ul>\n\n\n\n<p>Choose FR406 when:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Lead-free assembly stress is high.<\/strong><\/li>\n\n\n\n<li><strong>Layer count is higher.<\/strong><\/li>\n\n\n\n<li><strong>Via reliability is critical.<\/strong><\/li>\n\n\n\n<li><strong>Lower signal loss is required.<\/strong><\/li>\n\n\n\n<li><strong>Long-term reliability is more important than material cost.<\/strong><\/li>\n<\/ul>\n\n\n\n<p><strong>Selection rule:<\/strong> use DE104 when standard performance is enough; use FR406 when thermal and reliability margin matter more.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Does_DE104_Compare_with_Other_Low_Tg_FR-4_Materials\"><\/span>How Does DE104 Compare with Other Low Tg FR-4 Materials?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>DE104 offers better material control than many unknown low-Tg FR-4 options.<\/strong><\/p>\n\n\n\n<p>Compared with unknown low-Tg FR-4, its advantages include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Clear Tg, Dk, Df and thermal values.<\/strong><\/li>\n\n\n\n<li><strong>Recognized laminate and prepreg system.<\/strong><\/li>\n\n\n\n<li><strong>Better material traceability.<\/strong><\/li>\n\n\n\n<li><strong>Predictable multilayer PCB processing.<\/strong><\/li>\n\n\n\n<li><strong>Suitable cost for volume production.<\/strong><\/li>\n<\/ul>\n\n\n\n<p>However, it is still a low-Tg FR-4 material. For high-temperature use, repeated reflow, severe thermal cycling or low-loss signal requirements, a higher-grade material should be selected.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Should_You_Check_Before_Choosing_DE104_PCB_Material\"><\/span>What Should You Check Before Choosing DE104 PCB Material?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Before choosing DE104 PCB material, check whether the board\u2019s real working conditions match the material limits.<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Operating temperature:<\/strong> Check ambient temperature, component heat and enclosure heat. If the PCB often works near high temperature, <strong>Tg 135\u00b0C<\/strong> may not provide enough margin.<\/li>\n\n\n\n<li><strong>Reflow profile:<\/strong> Check peak temperature, time above liquidus and rework count. Thick PCB, heavy copper and double-sided assembly increase thermal stress.<\/li>\n\n\n\n<li><strong>Layer count:<\/strong> More layers increase Z-axis expansion risk. High-layer-count PCB may need a higher-Tg laminate.<\/li>\n\n\n\n<li><strong>Stackup balance:<\/strong> Review copper distribution and dielectric thickness. Poor balance can cause warpage and registration issues.<\/li>\n\n\n\n<li><strong>Copper weight:<\/strong> Heavy copper affects resin flow, drilling quality and lamination filling. Dense copper areas need enough prepreg resin.<\/li>\n\n\n\n<li><strong>Controlled impedance:<\/strong> Use actual pressed thickness, copper thickness and glass style. Do not rely only on one Dk value.<\/li>\n\n\n\n<li><strong>Via reliability:<\/strong> Check hole size, aspect ratio and plating thickness. Microsection testing is useful for high-reliability PCB.<\/li>\n\n\n\n<li><strong>Compliance:<\/strong> Confirm <strong>UL, RoHS, IPC class and customer material approval<\/strong> before production.<\/li>\n\n\n\n<li><strong>Prepreg handling:<\/strong> Check shelf life, storage condition and moisture control. Poor handling can affect lamination quality.<\/li>\n\n\n\n<li><strong>Testing plan:<\/strong> Confirm electrical test, AOI, impedance coupon, microsection and thermal stress test if required.<\/li>\n\n\n\n<li><strong>Material availability:<\/strong> Check stock before locking the stackup. If the exact construction is unavailable, approve an alternative before production.<\/li>\n\n\n\n<li><strong>Factory capability:<\/strong> Choose a PCB factory that can review material risk, stackup feasibility and process control before quoting.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Affects_Isola_DE104_PCB_Cost\"><\/span>What Affects Isola DE104 PCB Cost?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Isola DE104 PCB cost is affected by material stock, PCB structure, process difficulty and inspection requirements.<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Material availability:<\/strong> Exact laminate and prepreg stock can affect both price and lead time.<\/li>\n\n\n\n<li><strong>Layer count:<\/strong> More layers increase lamination, alignment, AOI and production risk.<\/li>\n\n\n\n<li><strong>PCB thickness:<\/strong> Thick boards need more drilling control and lamination planning.<\/li>\n\n\n\n<li><strong>Copper weight:<\/strong> Heavy copper increases etching difficulty, resin filling demand and drilling wear.<\/li>\n\n\n\n<li><strong>Board size:<\/strong> Large panels affect material utilization, warpage control and packaging cost.<\/li>\n\n\n\n<li><strong>Trace and spacing:<\/strong> Fine lines reduce yield and require tighter inspection.<\/li>\n\n\n\n<li><strong>Hole size and aspect ratio:<\/strong> Small holes and high aspect ratio increase drilling and plating difficulty.<\/li>\n\n\n\n<li><strong>Controlled impedance:<\/strong> Impedance PCB needs stackup calculation, coupon design and measurement.<\/li>\n\n\n\n<li><strong>Surface finish:<\/strong> HASL, ENIG, immersion silver and other finishes have different costs.<\/li>\n\n\n\n<li><strong>Inspection level:<\/strong> Microsection, impedance test, thermal stress test and full electrical test add cost.<\/li>\n\n\n\n<li><strong>Order quantity:<\/strong> Prototype unit cost is higher because setup and engineering cost are spread over fewer boards.<\/li>\n\n\n\n<li><strong>Shipping method:<\/strong> Export packaging, vacuum sealing and shipping speed affect final landed cost.<\/li>\n<\/ul>\n\n\n\n<p>For accurate pricing, send Gerber files, drill files, stackup, copper weight, surface finish, impedance requirements, IPC class and quantity together.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"FAQs_About_Isola_DE104_PCB_Material\"><\/span>FAQs About Isola DE104 PCB Material<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p><strong>Q1: Can this material be replaced by another FR-4 laminate?<\/strong><br>A1: Yes, but the replacement must be approved first. It should match <strong>Tg, Dk, Df, thickness, copper weight and IPC recognition<\/strong>. For impedance PCB, even a small Dk change can affect final trace width and impedance.<\/p>\n\n\n\n<p><strong>Q2: How can buyers prevent wrong material use?<\/strong><br>A2: Ask for the approved material name, laminate type, prepreg construction and stackup before production. For batch orders, request <strong>material traceability, impedance records and microsection reports<\/strong>.<\/p>\n\n\n\n<p><strong>Q3: Does the PCB need baking before assembly?<\/strong><br>A3: It depends on storage time, packaging and moisture exposure. If boards were stored in humid conditions, baking can reduce moisture-related defects such as blistering or delamination.<\/p>\n\n\n\n<p><strong>Q4: What inspection records are useful for batch orders?<\/strong><br>A4: Useful records include <strong>electrical test, AOI, microsection, impedance coupon data and final inspection report<\/strong>. These help confirm that the PCB matches the approved stackup.<\/p>\n\n\n\n<p><strong>Q5: Can it be used for fine-pitch BGA PCB?<\/strong><br>A5: Yes, but the stackup must be reviewed. Key checks include <strong>warpage control, via reliability, solder mask registration and reflow stress<\/strong>. Complex HDI or dense BGA boards may need higher material margin.<\/p>\n\n\n\n<p><strong>Q6: Is it suitable for outdoor electronics?<\/strong><br>A6: It can be used in some outdoor products if the enclosure, coating and humidity protection are suitable. For harsh outdoor use, review <strong>moisture resistance, coating, surface finish and thermal cycling<\/strong>.<\/p>\n\n\n\n<p><strong>Q7: What causes delamination risk?<\/strong><br>A7: Common causes include moisture absorption, excessive reflow heat, poor lamination, wrong rework process and weak material handling. The risk is higher in thick PCB, heavy copper PCB and multilayer PCB.<\/p>\n\n\n\n<p><strong>Q8: Why does copper balance matter?<\/strong><br>A8: Poor copper balance can cause warpage, uneven thickness and registration problems. The factory should review <strong>copper distribution, prepreg flow and stackup symmetry<\/strong> before production.<\/p>\n\n\n\n<p><strong>Q9: Can it support high-volume PCB production?<\/strong><br>A9: Yes, if the material construction and process are fixed. For repeat orders, keep the <strong>same stackup, approved material list and inspection standard<\/strong> to maintain batch consistency.<\/p>\n\n\n\n<p><strong>Q10: What should be checked for impedance PCB?<\/strong><br>A10: Check pressed dielectric thickness, copper thickness, glass style, resin content and impedance tolerance. A test coupon is recommended because final impedance depends on the finished PCB stackup.<\/p>\n\n\n\n<p><strong>Q11: Can it be used in automotive electronics?<\/strong><br>A11: It may be used for non-critical automotive PCB applications. For high-temperature or safety-critical automotive electronics, check <strong>thermal cycling, long-term reliability and customer approval standards<\/strong> first.<\/p>\n\n\n\n<p><strong>Q12: What is the best way to request a quote?<\/strong><br>A12: Send Gerber files, drill files, stackup, copper weight, PCB thickness, surface finish, quantity, IPC class and testing requirements. For assembly, also send <strong>BOM and Pick and Place file<\/strong>.<\/p>\n\n\n\n<p><strong>Conclusion<\/strong><\/p>\n\n\n\n<p><strong>DE104 is a cost-effective Isola FR-4 material for standard PCB projects that need clear datasheet values, stable production and named material traceability.<\/strong> It is suitable for multilayer PCB, industrial control boards, appliance control boards, consumer electronics and moderate-speed mixed-signal PCB.<\/p>\n\n\n\n<p>Choose this material when the project has moderate thermal stress, normal signal requirements and standard FR-4 process needs. If the PCB has high layer count, repeated lead-free reflow, strict signal integrity or severe thermal cycling, review FR406 or another higher-grade laminate before production.<\/p>\n\n\n\n<p>A good PCB supplier should not only quote a price. The factory should review stackup, copper weight, prepreg construction, impedance, inspection plan and material availability before fabrication. This helps reduce redesign risk, delivery delay and batch quality problems.<\/p>\n\n\n\n<p><strong><a href=\"https:\/\/www.bestpcbs.com\/\" title=\"\">EBest Circuit <\/a><\/strong>is a China source PCB factory supporting custom multilayer PCB fabrication, controlled impedance PCB, PCB assembly and global delivery. Send your Gerber files, stackup and quantity to <strong><a href=\"mailto:sales@bestpcbs.com\">sales@bestpcbs.com<\/a><\/strong>. Our team will review your project and provide a fast PCB quotation.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Isola DE104 is a low-Tg modified FR-4 laminate and prepreg system for PCB projects that need stable manufacturing, clear material data and controlled cost. It is mainly used in standard multilayer PCB designs where high-Tg or low-loss materials are not required. The key point is simple: this material is suitable for moderate thermal stress, general [&hellip;]<\/p>\n","protected":false},"author":33247,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[175,174,5309],"tags":[6585,6587,6589,6586,6588],"class_list":["post-29644","post","type-post","status-publish","format-standard","hentry","category-best-pcb","category-bestpcb","category-pcb-material","tag-de104-material","tag-de104-pcb-material-properties","tag-de104-vs-fr4","tag-isola-de104-datasheet","tag-isola-de104-tg-temperature"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/29644","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/users\/33247"}],"replies":[{"embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/comments?post=29644"}],"version-history":[{"count":12,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/29644\/revisions"}],"predecessor-version":[{"id":29671,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/29644\/revisions\/29671"}],"wp:attachment":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/media?parent=29644"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/categories?post=29644"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/tags?post=29644"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}