{"id":15733,"date":"2025-11-21T11:38:01","date_gmt":"2025-11-21T03:38:01","guid":{"rendered":"https:\/\/www.bestpcbs.com\/blog\/?p=15733"},"modified":"2025-11-21T14:16:52","modified_gmt":"2025-11-21T06:16:52","slug":"pcb-8-layer-stackup-what-makes-it-better-than-6-layer","status":"publish","type":"post","link":"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/","title":{"rendered":"PCB 8 Layer Stackup: What Makes It Better Than 6-Layer?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_82_2 ez-toc-wrap-left counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BWhat_is_the_Typical_PCB_8_Layer_Stackup%E2%80%8B%E2%80%8B\" >\u200bWhat is the Typical PCB 8 Layer Stackup?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BWhat_are_the_Differences_8_Layer_PCB_vs_6_Layer_PCB%E2%80%8B%E2%80%8B\" >\u200bWhat are the Differences: 8 Layer PCB vs 6 Layer PCB?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#How_Thick_is_an_8_Layer_PCB%E2%80%8B%E2%80%8B\" >How Thick is an 8 Layer PCB?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BHow_to_Calculate_the_8_Layer_PCB_Stackup_Impedance%E2%80%8B%E2%80%8B\" >\u200bHow to Calculate the 8 Layer PCB Stackup Impedance?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BHow_Many_Layers_can_a_PCB_Have%E2%80%8B\" >\u200bHow Many Layers can a PCB Have?\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BWhat_is_the_4_Layer_PCB_Rule%E2%80%8B%E2%80%8B\" >\u200bWhat is the 4 Layer PCB Rule?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8B8_Layer_PCB_Stackup_Design_Guidelines\" >\u200b8 Layer PCB Stackup Design Guidelines<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BHow_is_the_8_Layer_HDI_Stackup%E2%80%8B%E2%80%8B\" >\u200bHow is the 8 Layer HDI Stackup?\u200b\u200b<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/#%E2%80%8BWhat_are_the_Applications_of_8_Layer_Stackup_PCB%E2%80%8B%E2%80%8B\" >\u200bWhat are the Applications of 8 Layer Stackup PCB?\u200b\u200b<\/a><\/li><\/ul><\/nav><\/div>\n<div class=\"yzp-no-index\"><\/div>\n<p><a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/\">PCB 8 layer stackup<\/a>\u200b is a specific arrangement of copper and insulating layers that provides an optimal balance of performance, density, and signal integrity for complex electronic designs. This article will provide a comprehensive guide to the standard 8 layer PCB stackup, compare it critically with 6-layer alternatives, and explore its key design considerations.<\/p>\n\n\n<div class=\"pcbask\">\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">Are you struggling to decide if your high-speed or high-density design truly needs an 8-layer board, or if a 6-layer stackup would suffice?<\/mark><\/strong> <\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Performance Anxiety:\u200b<\/strong>\u200b Worrying that a 6-layer board might not provide sufficient isolation for sensitive signals, leading to crosstalk and electromagnetic interference (EMI).<\/li>\n\n\n\n<li>\u200b<strong>Routing Congestion:\u200b<\/strong>\u200b Facing the frustrating reality of not being able to route all the traces on a 6-layer board, especially with complex components like BGAs.<\/li>\n\n\n\n<li>\u200b<strong>Impedance Mismatch:\u200b<\/strong>\u200b Struggling to achieve consistent and controlled impedance for high-speed signals, which is more challenging with fewer layers.<\/li>\n\n\n\n<li>\u200b<strong>Power Integrity Issues:\u200b<\/strong>\u200b Experiencing noise on the power plane, which can cause erratic circuit behavior and is harder to manage in a 6-layer stackup.<\/li>\n\n\n\n<li>\u200b<strong>Cost vs. Performance Dilemma:\u200b<\/strong>\u200b Being caught between the lower cost of a 6-layer board and the superior performance and reliability of an 8-layer PCB, unsure of the right long-term investment.<\/li>\n<\/ul>\n\n\n<\/div>\n<div class=\"pcbserviec\">\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">The good news is that these challenges have clear solutions when you understand the advantages of a well-designed \u200b8 layer pcb stackup\u200b and partner with an experienced manufacturer.<\/mark><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Enhanced Signal Integrity:\u200b<\/strong>\u200b An 8-layer stackup allows for dedicated signal layers adjacent to solid ground planes, effectively minimizing crosstalk and EMI, which directly addresses performance anxiety.<\/li>\n\n\n\n<li>\u200b<strong>Superior Routing Capability:\u200b<\/strong>\u200b The two additional layers provide much-needed real estate for routing complex designs, effortlessly solving routing congestion.<\/li>\n\n\n\n<li>\u200b<strong>Precise Impedance Control:\u200b<\/strong>\u200b With more layers, achieving a consistent dielectric environment for impedance-controlled traces (like for the \u200b<strong>8 layer PCB stackup impedance<\/strong>) becomes more straightforward and reliable.<\/li>\n\n\n\n<li>\u200b<strong>Stable Power Delivery:\u200b<\/strong>\u200b Dedicated power planes in an 8-layer stackup offer low-inductance power distribution, ensuring clean power to all components and eliminating power integrity issues.<\/li>\n\n\n\n<li>\u200b<strong>Optimal Value Proposition:\u200b<\/strong>\u200b While the initial cost is higher, the enhanced performance, reliability, and reduced need for re-spins often make the \u200b<strong>8 layer stackup pcb<\/strong>\u200b the more cost-effective solution for advanced applications, resolving the cost vs. performance dilemma.<\/li>\n<\/ul>\n\n\n<\/div>\n\n\n<p>At BEST Technology, we specialize in manufacturing high-quality, high-performance <a href=\"https:\/\/www.bestpcbs.com\/\">PCBs<\/a>. As an original<a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/05\/microwave-pcb-price-microwave-pcb-manufacturer-no-moq\/\"> 8 layer PCB<\/a> factory with 19 years of extensive experience in <a href=\"https:\/\/www.bestpcbs.com\/products\/multi-layer-pcb.htm\">multilayer boards<\/a>, we understand the intricacies of PCB 8 layer stackup design. We work with you to determine the optimal stackup, whether it&#8217;s a \u200bstandard 8 layer PCB stackup\u200b or a more advanced \u200b8 layer HDI stackup, ensuring your design is built to the highest standards. A warm welcome to contact us at <strong>sales@bestpcbs.com<\/strong> to discuss your PCB 8 layer stackup project requirements.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_1.jpg\"><img decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_1.jpg\" alt=\"PCB 8 Layer Stackup\" class=\"wp-image-15758\"\/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BWhat_is_the_Typical_PCB_8_Layer_Stackup%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>What is the Typical PCB 8 Layer Stackup?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>A typical \u200b<a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/\" title=\"\">PCB 8 layer stackup<\/a>\u200b is engineered to maximize performance by carefully alternating signal, plane, and dielectric layers. The arrangement is not random; it is designed to shield high-speed signals and provide stable power.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>1. Standard Arrangement:\u200b<\/strong>\u200b A common and effective \u200b<strong>typical 8-layer pcb stackup<\/strong>\u200b follows this sequence from top to bottom: Top Signal -&gt; Ground Plane -&gt; Inner Signal 1 -&gt; Power Plane -&gt; Ground Plane -&gt; Inner Signal 2 -&gt; Power Plane -&gt; Bottom Signal. This &#8220;signal-plane-signal&#8221; pattern is a cornerstone of good \u200b<strong>8 layer pcb stackup design guidelines<\/strong>.<\/li>\n\n\n\n<li>\u200b<strong>2. Shielding and Isolation:\u200b<\/strong>\u200b This configuration provides shielding for the inner signal layers (Inner 1 and Inner 2) by placing them between ground planes. This is crucial for reducing noise and crosstalk.<\/li>\n\n\n\n<li>\u200b<strong>3. Impedance Control:\u200b<\/strong>\u200b The symmetric structure makes it easier to control the characteristic impedance of traces, which is vital for signal integrity.<\/li>\n<\/ul>\n\n\n\n<p>In summary, the \u200btypical <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/\">pcb 8 layer stackup<\/a>\u200b is a balanced structure that prioritizes signal integrity, EMI control, and power stability, making it a versatile choice for many demanding applications.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BWhat_are_the_Differences_8_Layer_PCB_vs_6_Layer_PCB%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>What are the Differences: 8 Layer PCB vs 6 Layer PCB?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>The core difference in the &#8220;\u200b8 layer PCB vs 6\u200b&#8221; debate lies in the available resources for routing, shielding, and power distribution. The two extra layers in an 8-layer board provide a significant functional advantage.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>1. Layer Configuration:\u200b<\/strong>\u200b A standard 6-layer stackup might be: Signal &#8211; Ground &#8211; Signal &#8211; Signal &#8211; Power &#8211; Signal. This often forces high-speed signals to be routed on layers adjacent to other signal layers, increasing the risk of crosstalk. In contrast, the \u200bPCB 8 layer stackup\u200b provides dedicated internal routing layers between ground planes.<\/li>\n\n\n\n<li>\u200b<strong>2. Performance:\u200b<\/strong>\u200b The 8-layer board offers superior performance for high-speed designs due to better isolation and the ability to have dedicated power and ground planes. This leads to fewer signal integrity issues.<\/li>\n\n\n\n<li>\u200b<strong>3. Cost and Complexity:\u200b<\/strong>\u200b The \u200b6 layer PCB stackup\u200b is less expensive and simpler to manufacture. It is an excellent choice for many applications but can become a bottleneck for very high-speed or dense designs.<\/li>\n<\/ul>\n\n\n\n<p>Ultimately, the choice hinges on the design&#8217;s complexity. For applications where signal integrity is paramount, the \u200b8 layer PCB motherboard\u200b or similar complex board is the clear winner.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_2.jpg\"><img decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_2.jpg\" alt=\"PCB 8 Layer Stackup\" class=\"wp-image-15759\"\/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Thick_is_an_8_Layer_PCB%E2%80%8B%E2%80%8B\"><\/span><strong>How Thick is an 8 Layer PCB?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>The \u200bstandard thickness of a PCB stackup\u200b is often, but not always, around 1.6mm (0.063 inches). However, the final \u200b8 layer PCB thickness\u200b is a result of the materials used and the number of layers.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>1. Standard and Custom Thickness:\u200b<\/strong>\u200b While 1.6mm is common, the thickness can vary. The \u200bstandard 8 layer PCB stackup\u200b thickness can be designed to be 0.8mm, 1.0mm, 1.6mm, or even thicker based on the application&#8217;s mechanical and electrical requirements.<\/li>\n\n\n\n<li>\u200b<strong>2. Factors Influencing Thickness:\u200b<\/strong>\u200b The \u200b8 layer PCB stackup thickness\u200b is determined by the thickness of the core and prepreg (insulating) materials, as well as the copper weight. For impedance control, the dielectric thickness between a signal layer and its reference plane is critical.<\/li>\n\n\n\n<li>\u200b<strong>3. Importance of Specification:\u200b<\/strong>\u200b When discussing your \u200b<a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/\">PCB 8 layer stackup\u200b<\/a> with a manufacturer, it is essential to specify your desired finished thickness and impedance requirements to ensure the stackup is designed correctly.<\/li>\n<\/ul>\n\n\n\n<p>Therefore, the thickness of an 8-layer PCB is not a fixed value but a key parameter that is carefully engineered during the stackup design phase.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BHow_to_Calculate_the_8_Layer_PCB_Stackup_Impedance%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>How to Calculate the 8 Layer PCB Stackup Impedance?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Calculating the \u200b8 layer PCB stackup impedance\u200b is a critical step for high-speed design, ensuring signals are transmitted without reflection or distortion.<\/p>\n\n\n\n<p><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>1. Key Parameters:\u200b<\/strong>\u200b <\/mark>The characteristic impedance of a trace depends on its width (W), the dielectric height (H) to the reference plane, and the dielectric constant (Er) of the insulating material. The copper thickness (T) also has a minor effect.<\/p>\n\n\n\n<p><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\"><strong>2. <\/strong>\u200b<strong>Use of Formulas and Tools:\u200b<\/strong>\u200b <\/mark>While formulas exist, e.g., for microstrip: <\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup.png\"><img decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup.png\" alt=\"PCB 8 Layer Stackup\" class=\"wp-image-15744\"\/><\/a><\/figure>\n\n\n\n<p>Most engineers use impedance calculation tools provided by manufacturers or integrated into PCB design software like \u200b8 layer PCB stackup altium. These tools automatically calculate the required trace width for a target impedance (e.g., 50\u03a9 or 100\u03a9 differential) based on the defined stackup.<\/p>\n\n\n\n<p><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>3. Manufacturer Collaboration:\u200b<\/strong>\u200b<\/mark> It is best practice to finalize your stackup with your PCB manufacturer. They can provide the most accurate Er values and ensure the fabricated board will meet your impedance targets.<\/p>\n\n\n\n<p>Proper impedance calculation is non-negotiable for reliable high-speed performance and is a fundamental part of the \u200b8 layer PCB stackup design guidelines.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BHow_Many_Layers_can_a_PCB_Have%E2%80%8B\"><\/span>\u200b<strong>How Many Layers can a PCB Have?<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>PCBs can have a vast number of layers, from 1 to over 50 in extreme cases like advanced servers. The more pertinent question is: do PCB layers matter? The answer is an emphatic<strong> yes<\/strong>.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>1. Function of Layers:\u200b<\/strong>\u200b The number of \u200bPCB board layers\u200b directly determines the board&#8217;s functionality. More layers allow for more complex circuitry, better separation of analog and digital sections, improved power integrity, and superior signal integrity through proper referencing and shielding.<\/li>\n\n\n\n<li>\u200b<strong>2. Choosing the Right Number:\u200b<\/strong>\u200b A simple electronic device might only need a \u200bPCB stackup 4 layer, while a smartphone motherboard might require 10 or 12 layers. The decision for a \u200bPCB 8 layer stackup\u200b is based on the need for a robust design that can handle multiple high-speed signals and multiple power supplies efficiently.<\/li>\n<\/ul>\n\n\n\n<p>The number of layers is a fundamental architectural decision that impacts the cost, performance, and reliability of the final product.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BWhat_is_the_4_Layer_PCB_Rule%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>What is the 4 Layer PCB Rule?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>\u200bThe &#8220;4 layer PCB rule&#8221; is a fundamental guideline in PCB design that dictates the optimal arrangement of layers to maximize performance while minimizing cost. It serves as a crucial stepping stone towards understanding more complex stackups like the 8-layer board. While not a rigid law, following this rule is considered a best practice for most 4-layer designs.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>1. The Core Principle: Dedicated Plane Layers<\/strong><\/mark>\u200b<br>The most important aspect of the rule is the allocation of the two internal layers. <br>Instead of using them for additional signal routing, they are dedicated exclusively as solid, uninterrupted planes\u2014one for ground (GND) and one for power (PWR). <br>The outer layers (Top and Bottom) are then used for component placement and signal routing.<\/li>\n\n\n\n<li><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>2. Standard Layer Stackup<\/strong><\/mark>\u200b<br>A typical and effective \u200b4 layer board stackup\u200b follows this sequence:\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Layer 1 (Top):\u200b<\/strong>\u200b Components and Signal Routing<\/li>\n\n\n\n<li>\u200b<strong>Layer 2 (Internal):\u200b<\/strong>\u200b Ground Plane (GND)<\/li>\n\n\n\n<li>\u200b<strong>Layer 3 (Internal):\u200b<\/strong>\u200b Power Plane (PWR)<\/li>\n\n\n\n<li>\u200b<strong>Layer 4 (Bottom):\u200b<\/strong>\u200b Components and Signal Routing<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>3. Key Benefits of This Rule<\/strong><\/mark>\u200b\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Improved Signal Integrity:\u200b<\/strong>\u200b By routing signals on the outer layers adjacent to the solid internal planes, each signal trace has a clear and continuous reference plane. <br>This controlled environment is essential for managing characteristic impedance and significantly reducing electromagnetic interference (EMI) and crosstalk.<\/li>\n\n\n\n<li>\u200b<strong>Enhanced Power Integrity:\u200b<\/strong>\u200b The dedicated power plane provides a low-inductance path for distributing power to all components, resulting in a cleaner and more stable voltage supply, which reduces noise.<\/li>\n\n\n\n<li>\u200b<strong>Superior EMI Performance:\u200b<\/strong>\u200b The two internal planes act as shields, containing the electromagnetic fields generated by high-speed signals on the outer layers, making the board less susceptible to emitting and receiving interference.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b<strong>4. Comparison to 2-Layer Boards<\/strong><\/mark>\u200b<br>This rule highlights the major leap in performance from a 2-layer to a \u200bPCB stackup 4 layer. <br>A 2-layer board lacks dedicated planes, forcing signals and power to share routing space, which often leads to noise and reliability issues.<\/li>\n<\/ul>\n\n\n\n<p>In summary, the \u200b4 layer PCB rule\u200b is a foundational concept that prioritizes a clean and stable electrical environment. It establishes the core principles of using dedicated power and ground planes, which are then scaled up and refined in more advanced stackups like the \u200b8 layer PCB stackup.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8B8_Layer_PCB_Stackup_Design_Guidelines\"><\/span>\u200b<strong>8 Layer PCB Stackup Design Guidelines<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>\u200bAdhering to proven \u200b<a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/05\/8-layer-pcb-8-layer-pcb-manufacturer-no-moq\/\" title=\"\">8 layer PCB <\/a>stackup design guidelines\u200b is fundamental to achieving optimal signal integrity, power integrity, and EMC performance. While the previous section outlined four key principles, a deeper understanding requires grounding these rules in the fundamental goals of all stackup design.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">Before delving into specifics, all stackup design aims to satisfy two primary rules:<\/mark><\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>\u200b<strong>A Reference Plane for Every Signal Layer:\u200b<\/strong>\u200b Every high-speed signal routing layer must be adjacent to a solid reference plane (power or ground). This provides a controlled impedance path and a clear, low-inductance return path for signals.<\/li>\n\n\n\n<li>\u200b<strong>Tight Power-Ground Coupling:\u200b<\/strong>\u200b Closely spaced power and ground planes are crucial. The minimal spacing between them creates a natural, high-frequency decoupling capacitor that enhances power integrity and reduces EMI.<\/li>\n<\/ol>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200bUnderstanding the limitations of simpler boards highlights the necessity of a well-designed 8-layer stackup.<\/mark><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Single\/Double-Sided Boards:\u200b<\/strong>\u200b These lack dedicated planes, leading to large signal loop areas which are major sources of EMI and susceptibility. The primary mitigation is to route critical signals (like clocks) with an adjacent ground trace to minimize the loop area.<\/li>\n\n\n\n<li>\u200b<strong>Four-Layer Boards:\u200b<\/strong>\u200b While a significant improvement, the standard 1.6mm board thickness creates a large separation between layers, weakening power-ground coupling and making impedance control challenging. The best <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/04\/4-layer-pcb-manufacturer-4-layer-pcb-manufacturer-india\/\">4-layer<\/a> stackup for EMI (GND-SIG\/PWR-SIG\/PWR-GND) uses outer layers as ground planes for shielding.<\/li>\n\n\n\n<li>\u200b<strong>Six-Layer Boards:\u200b<\/strong>\u200b These offer a better balance. A common good stackup is SIG-GND-SIG-PWR-GND-SIG. It provides a reference plane for each signal layer and pairs the power and ground layers. However, achieving tight power-ground coupling within a standard board thickness remains difficult.<\/li>\n<\/ul>\n\n\n\n<p>\u200b<strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">An 8-layer board provides the canvas to implement near-ideal stackup design. Here are critical guidelines, moving beyond the basics.<\/mark><\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>\u200b<strong>Prioritize Shielding and Symmetry to Prevent Warping<\/strong>\u200b<br>The simplest 8-layer stackup (e.g., SIG-SIG-GND-SIG-SIG-PWR-SIG-SIG) is inherently poor. It has multiple consecutive signal layers without reference planes, leading to poor SI and EMI. A superior approach uses symmetry and multiple ground planes. A \u200b<strong>highly recommended 8 layer stackup<\/strong>\u200b is:\n<ul class=\"wp-block-list\">\n<li>Top Signal (Microstrip)<\/li>\n\n\n\n<li>Ground Plane<\/li>\n\n\n\n<li>Internal Signal 1 (Stripline)<\/li>\n\n\n\n<li>Power Plane<\/li>\n\n\n\n<li>Ground Plane<\/li>\n\n\n\n<li>Internal Signal 2 (Stripline)<\/li>\n\n\n\n<li>Power Plane<\/li>\n\n\n\n<li>Bottom Signal (Microstrip)<br>This arrangement is symmetrical, preventing warping. The internal signal layers are shielded between planes, and the ground planes act as excellent EMI shields.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>\u200b<strong>Maximize Interplane Capacitance for Power Integrity<\/strong>\u200b<br>Following the core rule of tight coupling, place the power and ground planes that require the best noise immunity (e.g., the core voltage for an<a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/10\/fpga-board-design-for-faster-prototyping-and-reliable-production\/\"> FPGA<\/a>) as adjacent layers (e.g., L4\/L5 or L6\/L7 in the stackup above). The thin dielectric between them creates a large, low-inductance distributed capacitor that effectively suppresses high-frequency noise on the power rail.<\/li>\n\n\n\n<li>\u200b<strong>Select the Optimal Stackup for Your EMC and SI Goals<\/strong>\u200b<br>The provided material describes three common 8-layer configurations. The best choice depends on your priority:\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Good SI, Poor EMI (Example 1):\u200b<\/strong>\u200b Features many signal layers but lacks sufficient shielding, making it susceptible to radiating.<\/li>\n\n\n\n<li>\u200b<strong>Good SI, Better EMI (Example 2):\u200b<\/strong>\u200b This is a strong, common choice. It uses outer ground planes for shielding and has a tightly coupled power-ground plane pair in the center. It offers an excellent balance for most applications.<\/li>\n\n\n\n<li>\u200b<strong>Best SI and EMI (Example 3):\u200b<\/strong>\u200b This is the premium configuration, utilizing four ground planes. It provides the highest level of shielding and the cleanest possible return paths for all signals, making it ideal for extremely noise-sensitive or high-radiation applications.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>\u200b<strong>Collaborate with Your Manufacturer Early for Impedance Control<\/strong>\u200b<br>This guideline cannot be overstated. Once you have a target stackup, you must work with your PCB manufacturer <em>before<\/em> finalizing the design. Provide them with your target impedances (e.g., 50\u03a9 single-ended, 100\u03a9 differential). They will feedback the precise dielectric thicknesses and trace widths required to hit your targets based on their specific materials and process capabilities. This is a non-negotiable step in the \u200b<strong>8 layer pcb stackup design guidelines<\/strong>.<\/li>\n<\/ol>\n\n\n\n<p>In summary, designing an 8-layer stackup is an exercise in careful layer ordering to manage return paths, provide shielding, and ensure stable power. By moving from the basic rules to these advanced guidelines\u2014prioritizing shielded stripline layers, tight power-ground coupling, and selecting a stackup based on EMC needs\u2014you can fully leverage the capabilities of an 8-layer board to create a robust, high-performance product.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BHow_is_the_8_Layer_HDI_Stackup%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>How is the 8 Layer HDI Stackup?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>\u200bAn \u200b8 layer HDI stackup\u200b represents a significant advancement over a standard \u200b8 layer PCB stackup\u200b by incorporating High-Density Interconnect (HDI) technologies. It is designed for the most space-constrained and performance-driven applications where miniaturization and complex routing are paramount.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b1. Core HDI Technologies<\/mark><\/strong>\u200b<br>HDI stackups are defined by their use of advanced manufacturing processes:\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Microvias:\u200b<\/strong>\u200b These are laser-drilled vias with a much smaller diameter (typically less than 150\u00b5m) than mechanically drilled through-hole vias. They allow for connections between adjacent layers (e.g., from Layer 1 to Layer 2) with a minimal footprint.<\/li>\n\n\n\n<li>\u200b<strong>Finer Traces and Spaces:\u200b<\/strong>\u200b HDI processes enable the etching of much narrower trace widths and clearances, allowing more circuitry to be packed into a smaller area.<\/li>\n\n\n\n<li>\u200b<strong>Advanced Build-Up Structures:\u200b<\/strong>\u200b HDI boards are often built using a sequential lamination process, creating complex sub-composites that can include stacked microvias, staggered vias, and buried vias.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">\u200b2. Design Advantages over Standard 8-Layer Stackups<\/mark><\/strong>\u200b<br>The integration of HDI technology into an \u200b8 layer stackup PCB\u200b offers several critical benefits:\n<ul class=\"wp-block-list\">\n<li>\u200b<strong>Extreme Miniaturization:\u200b<\/strong>\u200b By using microvias and finer lines, components can be placed closer together, and the overall board size can be drastically reduced. This is essential for devices like modern smartphones, wearables, and IoT sensors.<\/li>\n\n\n\n<li>\u200b<strong>Enhanced Signal Performance:\u200b<\/strong>\u200b Shorter pathways and reduced via stubs from microvias lead to better electrical performance at high frequencies, minimizing signal loss and reflection.<\/li>\n\n\n\n<li>\u200b<strong>Greater Routing Density:\u200b<\/strong>\u200b HDI allows for escape routing from high-pin-count components like fine-pitch BGAs, which would be impossible to route on a standard \u200b8 layer PCB motherboard\u200b of the same size.<\/li>\n\n\n\n<li>\u200b<strong>Improved Reliability:\u200b<\/strong>\u200b The materials and processes used in HDI manufacturing often result in a more robust and reliable board.<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\"><strong>\u200b3. Typical Applications<\/strong><\/mark>\u200b<br>An \u200b8 layer HDI stackup\u200b is not for every project due to its higher cost. It is typically reserved for cutting-edge applications, including:\n<ul class=\"wp-block-list\">\n<li>Smartphones and Tablets<\/li>\n\n\n\n<li>Advanced Medical Implants and Diagnostic Equipment<\/li>\n\n\n\n<li>High-Performance Computing and Networking Hardware<\/li>\n\n\n\n<li>Aerospace and Defense Avionics<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p>In conclusion, the \u200b8 layer HDI stackup\u200b is the pinnacle of dense, high-performance <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/06\/hdi-printed-circuit-board-hdi-pcb-design-prompt-delivery\/\">PCB design<\/a>. While a standard \u200btypical 8-layer PCB stackup\u200b is powerful, the <a href=\"https:\/\/youtu.be\/67gIgiQIs5A?si=UzEZyhcWdRQvWjvA\">HDI<\/a> variant pushes the boundaries of what&#8217;s possible, enabling the creation of smaller, faster, and more complex electronic devices.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%80%8BWhat_are_the_Applications_of_8_Layer_Stackup_PCB%E2%80%8B%E2%80%8B\"><\/span>\u200b<strong>What are the Applications of 8 Layer Stackup PCB?\u200b<\/strong>\u200b<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>An 8-layer PCB stackup is widely used in advanced electronic systems where designers need strong signal integrity, stable power delivery, and compact circuit density. These boards support <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/09\/how-to-make-top-quality-high-speed-board-pcb\/\" title=\"\">high-speed<\/a> interfaces, complex processors, and mixed-signal architectures that cannot be achieved with simpler stackups.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">Typical applications include:<\/mark><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>8-layer PCB motherboards for industrial and embedded computing<\/li>\n\n\n\n<li>High-speed network devices such as routers, switches, and 5G baseband units<\/li>\n\n\n\n<li>Telecommunications infrastructure with dense RF and digital circuits<\/li>\n\n\n\n<li>Automotive electronics including ADAS domain controllers<\/li>\n\n\n\n<li>Medical imaging and diagnostic systems<\/li>\n\n\n\n<li>Industrial automation and rugged control equipment<\/li>\n<\/ul>\n\n\n\n<p>To show how a real design translates into actual applications, the following example highlights a high-performance 8-layer HDI PCB with engineering features tailored to demanding markets. And the following specific applications are supported by a PCB built to these professional specifications:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Via Type:<\/strong> Resin-filled buried and blind vias<\/li>\n\n\n\n<li><strong>Layer Count:<\/strong> 8-Layer<\/li>\n\n\n\n<li><strong>Material:<\/strong> High-Tg FR-4<\/li>\n\n\n\n<li><strong>Tg Rating:<\/strong> 180\u00b0C<\/li>\n\n\n\n<li><strong>Copper Weight:<\/strong> 1oz outer \/ 1oz inner<\/li>\n\n\n\n<li><strong>Surface Finish:<\/strong> ENIG (1\u03bc\u2033)<\/li>\n\n\n\n<li><strong>Solder Mask:<\/strong> Green<\/li>\n\n\n\n<li><strong>Silkscreen:<\/strong> White<\/li>\n\n\n\n<li><strong>Final Thickness:<\/strong> 1.6mm<\/li>\n\n\n\n<li><strong>Technology:<\/strong> 3-step HDI<\/li>\n<\/ul>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">1. Core Networking &amp; Communication Systems<\/mark><\/strong><\/p>\n\n\n\n<p><strong>Application:<\/strong> Processing and switching board for 100G\/200G\/400G network equipment.<\/p>\n\n\n\n<p><strong>Why an 8-layer PCB fits:<\/strong><br>The <strong>3-step HDI structure<\/strong> handles fine-pitch BGA components used in high-bandwidth ASICs and FPGAs. Meanwhile, <strong>TG180 FR-4<\/strong> improves thermal stability during long-term, high-load operation. This combination supports multi-lane SerDes signals and tight impedance control for high-speed communication links.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">2. Aerospace and Defense Electronics<\/mark><\/strong><\/p>\n\n\n\n<p><strong>Application:<\/strong> Signal processing module for airborne radar or mission-critical avionics.<\/p>\n\n\n\n<p><strong>Why an 8-layer PCB fits:<\/strong><br>Aircraft electronics experience extreme temperature swings and continuous vibration. <strong>1.6mm finished thickness<\/strong> and <strong>TG180 laminate<\/strong> provide strong mechanical strength and thermal endurance. The <strong>1\u03bc\u2033 ENIG<\/strong> finish offers reliable surface quality for gold-wire bonding and high-frequency interconnects common in RF signal chains.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">3. Advanced Medical Imaging Equipment<\/mark><\/strong><\/p>\n\n\n\n<p><strong>Application:<\/strong> Core electronic module in portable ultrasound or digital imaging diagnostics.<\/p>\n\n\n\n<p><strong>Why an 8-layer PCB fits:<\/strong><br>Medical devices demand both miniaturization and signal clarity. <strong>HDI + resin-filled vias<\/strong> help integrate dense components into a compact format while maintaining stable impedance for sensitive analog\/digital imaging circuits. The <strong>ENIG<\/strong> surface ensures excellent contact reliability for fine-pitch connectors and probe interfaces.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">4. Next-Generation Automotive Electronics<\/mark><\/strong><\/p>\n\n\n\n<p><strong>Application:<\/strong> Central computing board for ADAS or autonomous driving systems.<\/p>\n\n\n\n<p><strong>Why an 8-layer PCB fits:<\/strong><br>ADAS controllers must process multiple high-resolution camera, radar, and LiDAR inputs. An <strong>8-layer stackup<\/strong> provides robust isolation between high-speed differential pairs and noisy power circuits. The <strong>1oz copper<\/strong> thickness supports steady power delivery to high-current SoCs and processing units, ensuring stable performance even at elevated vehicle temperatures.<\/p>\n\n\n\n<p><strong><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-cyan-blue-color\">5. Industrial IoT and Edge Computing Devices<\/mark><\/strong><\/p>\n\n\n\n<p><strong>Application:<\/strong> Industrial edge gateway, PLC controller, or machine-vision interface.<\/p>\n\n\n\n<p><strong>Why an 8-layer PCB fits:<\/strong><br>Factories require devices that remain stable under dust, humidity, vibration, and electrical noise. The <strong>ENIG finish<\/strong> prevents oxidation, and the <strong>green solder mask + white silkscreen<\/strong> combination improves maintenance visibility. The rigid 8-layer architecture enhances long-term reliability for 24\/7 operation in challenging industrial environments.<\/p>\n\n\n\n<p>In closing, this example makes it clear that an <strong>8-layer PCB stackup<\/strong> is far more than a simple increase in layer count. With the right combination of materials, HDI structures, and controlled-impedance routing, it becomes a powerful platform for mission-critical, high-speed, and high-density electronic systems across multiple industries.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_3.jpg\"><img decoding=\"async\" src=\"https:\/\/www.bestpcbs.com\/blog\/wp-content\/uploads\/2025\/11\/pcb_8_layer_stackup_3.jpg\" alt=\"PCB 8 Layer Stackup\" class=\"wp-image-15760\"\/><\/a><\/figure>\n\n\n\n<p>In conclusion\u200b, <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/11\/pcb-8-layer-stackup-what-makes-it-better-than-6-layer\/\" title=\"\">PCB 8 layer stackup<\/a>\u200b is a sophisticated multilayer board configuration that offers a significant performance upgrade over 6-layer alternatives for demanding electronic applications. This article has explored the structure, advantages, and design considerations that make the 8-layer stackup a preferred choice for high-speed and high-density designs.<\/p>\n\n\n\n<p>For engineers seeking reliable, high-performance PCB 8 layer stackup\u200b fabrication, partnering with an experienced <a href=\"https:\/\/www.bestpcbs.com\/blog\/2025\/05\/8-layer-pcb-8-layer-pcb-manufacturer-no-moq\/\" title=\"\">8 layer PCB manufacturer <\/a>is crucial. At BEST Technology, we have the expertise to guide you through the entire process, from selecting the \u200bbest 8 layer stackup\u200b for your needs to ensuring impeccable manufacturing quality. Pls feel free to contact us at <strong>sales@bestpcbs.com<\/strong> to get started on your next 8 layer stackup PCB project.<\/p>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>PCB 8 layer stackup\u200b is a specific arrangement of copper and insulating layers that provides an optimal balance of performance, density, and signal integrity for complex electronic designs. This article will provide a comprehensive guide to the standard 8 layer PCB stackup, compare it critically with 6-layer alternatives, and explore its key design considerations. Are [&hellip;]<\/p>\n","protected":false},"author":33085,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uf_show_specific_survey":0,"_uf_disable_surveys":false,"footnotes":""},"categories":[175,174],"tags":[2536,1742,2535],"class_list":["post-15733","post","type-post","status-publish","format-standard","hentry","category-best-pcb","category-bestpcb","tag-8-layer-pcb-stackup-2","tag-8-layer-pcb-stackup","tag-pcb-8-layer-stackup"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/15733","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/users\/33085"}],"replies":[{"embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/comments?post=15733"}],"version-history":[{"count":5,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/15733\/revisions"}],"predecessor-version":[{"id":15767,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/posts\/15733\/revisions\/15767"}],"wp:attachment":[{"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/media?parent=15733"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/categories?post=15733"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.bestpcbs.com\/blog\/wp-json\/wp\/v2\/tags?post=15733"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}