# PCB Manufacturing Capability

_Published: 2026-03-26_

Table of Contents

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- General Capability Overview
- Minimum Board Thickness by Layer Count
- Copper / Conductor Capability
- Trace / Hole / Pad Capability
- Tolerance Capability
- Electrical and Surface Finish Capability

We are continued to improve our [MCPCB](https://www.bestpcbs.com/products/metal-core-pcb.htm), [FR4 PCB](https://www.bestpcbs.com/products/FR4-pcb.htm) & [Ceramic PCB](https://www.bestpcbs.com/products/ceramic-pcb.htm) manufacturing level to get satisfactory result from customers and ourselves. Currently our monthly productivity is 260,000 square feet (28,900 square meter), more than 100 different boards will be completed. We also provide fast service, and urgent boards can be shipped out within 24 hours! For more information, please [click here for lead time…](https://www.bestpcbs.com/about/lead-time.htm)

Best Technology provides a wide range of **[PCB manufacturing capabilities](https://www.bestpcbs.com/blog/pcb-manufacturing-capability/)** covering FR4 PCB, MCPCB, and Ceramic PCB solutions. From standard multilayer boards to high thermal conductivity and high-reliability applications, our engineering and production team supports both prototype and volume requirements with stable quality and flexible lead time.

## General Capability Overview

**Capability Item**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**Max Layer Count**
32 Layers
10 Layers
Thick Film: 10 Layers; DCB: 2 Layers

**Max Board Thickness**
2L: 6.0 mm; 4L and above: 8.0 mm
4.0 mm
Thick Film: 1.5 mm; DCB: 1L: 1.3 mm, 2L: 1.6 mm

**Max Board Size**
610 × 610 mm; 100 × 1,300 mm
610 × 1,625 mm
Thick Film: 200 × 200 mm; DCB: 138 × 178 mm

**Max Aspect Ratio**
8:1
12:1
8:1

**Warp & Twist**
≤ 0.75%
≤ 3%
N/A

**Flammability**
UL 94V-0
N/A
N/A

**Thermal Stress**
3 × 10 sec @ 280°C
N/A
N/A

## Minimum Board Thickness by Layer Count

**Layer Structure**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**2 Layers**
0.13 mm / 0.17 mm
0.3 mm / 0.6 mm
Thick Film: 0.25 mm / 0.28 mm; DCB: 0.30 mm / 0.40 mm

**4 Layers**
0.4 mm
1.0 mm
0.34 mm

**6 Layers**
0.6 mm
1.2 mm
0.46 mm

**8 Layers**
0.8 mm
1.6 mm
0.81 mm

**10 Layers**
1.2 mm
2.0 mm
1.50 mm

## Copper / Conductor Capability

**Capability Item**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**Max Conductor Thickness**
20 oz
10 oz
Thick Film: 13 μm; DCB: 8.6 oz

**Min Conductor Thickness**
1/2 oz
N/A
Thick Film: 10 μm; DCB: 3.9 oz

**Thermal Conductivity**
0.30–0.45 W/m·K
Standard: 0.8–1.5 W/m·K; High: 2.0–3.0 W/m·K
Al2O3: ≥24 W/m·K; AlN: ≥170 W/m·K

**Dielectric Strength**
>1.3 kV/mm
>1.5 kV; >3.0 kV for wider spacing
>15 kV/mm

## Trace / Hole / Pad Capability

**Capability Item**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**Min Trace / Space**
Standard: 4/4 mil; HDI: 2/2 mil
6/6 mil
Thick Film: 6/8 mil; DCB: 12/12 mil

**Min Hole Diameter**
Standard: 0.20 mm; HDI: 0.10 mm
0.30 mm
0.10 mm

**Min Punch Hole Diameter**
2.5 mm
3.0 mm
N/A

**Min Hole Spacing**
0.30 mm
0.40 mm
NPTH: 0.30 mm; PTH: 0.50 mm

**Min Solder Pad Diameter**
HDI: 0.25 mm; Standard: 0.35 mm
0.35 mm
0.25 mm

**Min Annular Ring**
0.075 mm
0.15 mm
0.20 mm

**Min Solder Mask Bridge**
HDI: 0.15 mm; Standard: 0.20 mm
0.20 mm
0.30 mm

**Min BGA Pad Margin**
0.125 mm
0.30 mm
N/A

## Tolerance Capability

**Capability Item**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**PTH Wall Thickness**
HDI: 12 μm; Standard: 15 μm
N/A
Thick Film: 10 μm; DCB: Not Available

**PTH Hole Tolerance**
±0.075 mm
±0.10 mm
N/A

**NPTH Hole Tolerance**
±0.05 mm
±0.05 mm
±0.05 mm

**Hole Position Tolerance**
±0.05 mm
±0.075 mm
±0.10 mm

**Outline Tolerance (CNC)**
±0.15 mm
±0.15 mm
Laser: +0.20 / -0.05 mm

**Outline Tolerance (Punching)**
±0.10 mm
±0.15 mm
+0.25 / -0.20 mm

## Electrical and Surface Finish Capability

**Capability Item**
**FR4 PCB**
**MCPCB**
**Ceramic PCB**

**Impedance Control**
>50 ohm: ±10%; ≤50 ohm: ±5 ohm
N/A
N/A

**Surface Finish**
ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold Plating, ENEPIG, ENIPIG, HAL, Lead-Free HASL, OSP, Immersion Silver, Immersion Tin
N/A
Thick Film: AgPd, AuPd, Mn/Ni; DCB: Ni Plating, ENIG

**Notes:**

- Units: mm unless otherwise specified
- Special requirements: available upon engineering review
- Capability values: subject to product design, material type, and manufacturing process
- Custom stack-up and tighter tolerance: available on request

If you would like some special [material](https://www.bestpcbs.com/equipments/material.htm), tighter tolerance or other requirements, you can [Contact](https://www.bestpcbs.com/contact/index.htm) our stuff directly, we are going to answer any questions of [MCPCB](https://www.bestpcbs.com/products/metal-core-pcb.htm), [FR4 PCB](https://www.bestpcbs.com/products/FR4-pcb.htm) & [Ceramic PCB](https://www.bestpcbs.com/products/ceramic-pcb.htm) at any time.