# Rogers RO3003 Laminate Datasheet Detailed Explaination _Published: 2025-12-08_ Table of Contents Toggle - Rogers RO3003™ Electrical Properties - RO3003™ Material Thermal Properties - RO3003™ Mechanical Properties - RO3003™ Chemical & Environmental Properties - RO3003™ Thickness Availability - RO3003™ Available Panel Sizes - RO3003™ Impedance Control Data - RO3003™ Reliability Properties - RO3003™ Comparison Against Other Rogers Materials - RO3003™ Material Stack-Up Examples RO3003 is widely used across [RF and microwave PCB](https://www.bestpcbs.com/products/RF-board.htm) because it offers stable electrical behavior, low loss, and smooth processing on modern PCB lines. Engineers often choose this laminate when they need predictable impedance, steady phase response, and strong thermal performance at high frequencies. Below is a comprehensive, **fabrication-level [RO3003 datasheet](https://www.bestpcbs.com/blog/2025/12/rogers-ro3003-laminate-datasheet-detailed-explaination/)**, covering electrical, mechanical, thermal, chemical, processing, and reliability properties. ![Rogers RO3003 Laminate Datasheet Detailed Explaination](https://www.bestpcbs.com/blog/wp-content/uploads/2025/12/rogers-ro3003-laminate.png) **Rogers RO3003 Laminate Datasheet** ## Rogers RO3003™ Electrical Properties **Parameter** **Condition** **Typical Value** **Notes** Dielectric Constant (Dk) 10 GHz (IPC-TM-650 2.5.5.5) 3.00 ± 0.04 Very stable across temperature and frequency Dielectric Constant (Dk) 2.5 GHz 3.01 Suitable for wideband RF Dissipation Factor (Df) 10 GHz 0.0010 Extremely low loss Dissipation Factor (Df) 2.5 GHz 0.0009 Excellent for mmWave Volume Resistivity 23°C / 50% RH 1.7 × 10¹⁰ MΩ·cm High electrical insulation Surface Resistivity 23°C / 50% RH 5.7 × 10⁹ MΩ Stable in damp conditions Electric Strength 0.5 mm thickness 35 kV/mm Strong dielectric barrier Impedance Stability -40°C to +85°C ±1.3% Very stable for antenna structures Dk Temperature Coefficient (TCDk) -40 to +85°C -3 ppm/°C Very low drift RO3003 is chosen often for **77 GHz radar**, **24 GHz radar**, and **mmWave antennas** because of these stable dielectric properties. ## RO3003™ Material Thermal Properties **Parameter** **Typical Value** **Notes** Thermal Conductivity 0.5 W/m·K Higher than FR4 Usable Temperature Range -55°C to +150°C Suitable for automotive radar Dimensional Stability (X/Y) 0.2–0.3% Strong laminate stability Coefficient of Thermal Expansion (CTE) – X 17 ppm/°C Matches copper closely CTE – Y 17 ppm/°C Helps reduce expansion stress CTE – Z 24 ppm/°C Critical for microvias Thermal Decomposition Temp (Td) > 400°C Much higher than FR4 Thermal Stress 288°C / 10 sec No delamination Specific Heat 1.0 J/g-K Supports stable power handling The matched X/Y CTE and moderate Z-axis CTE improve reliability in **[multi-layer RF boards](https://www.bestpcbs.com/products/RF-board.htm)**, **QFN modules**, and **BGA transitions**. ## RO3003™ Mechanical Properties **Parameter** **Condition** **Typical Value** Tensile Modulus (MD) 23°C 18,000 MPa Tensile Modulus (CD) 23°C 17,500 MPa Flexural Strength 23°C 340 MPa Peel Strength 1 oz Cu, after thermal aging 8.0 lb/in Density — 2.1 g/cm³ Hardness (Shore D) — 74 Moisture Absorption 48h @ 50°C water 0.02% Low moisture absorption is one of the main reasons designers choose [Ro3003 laminate](https://www.bestpcbs.com/blog/2025/12/rogers-ro3003-laminate-datasheet-detailed-explaination/) for outdoor and long-range radio systems. ## RO3003™ Chemical & Environmental Properties **Property** **Typical Value** Flammability UL 94 V-0 Fungus Resistance Pass Copper Corrosion Test Pass Water Absorption 0.02% RoHS Compliant Lead-Free Assembly Fully supported The laminate performs well in harsh environments such as **marine radar, industrial sensors, and automotive radar systems.** ## RO3003™ Thickness Availability **Standard Thickness** **Inches** **Mil** **Notes** 0.127 mm 0.0050″ 5 mil Very common for antennas 0.203 mm 0.0080″ 8 mil Good for compact RF paths 0.254 mm 0.0100″ 10 mil LNA/PA front-end boards 0.508 mm 0.0200″ 20 mil Many GPS modules 0.762 mm 0.0300″ 30 mil Lower insertion loss 1.524 mm 0.0600″ 60 mil Large antennas or radar Copper foil options include: **Copper Type** **Standard Weight** **Notes** ED Copper ½ oz, 1 oz Best for general RF Reverse-Treat Copper (RTF) ½ oz, 1 oz Better for low-loss designs Rolled Copper Limited Used for bending applications ## RO3003™ Available Panel Sizes **Panel Size** **Notes** 12″ × 18″ Most common 18″ × 24″ Higher utilization 24″ × 36″ For mass production Custom Cuts By manufacturer Panel selection strongly affects **[Rogers 3003 price](https://www.bestpcbs.com/blog/2025/12/rogers-ro3003-laminate-datasheet-detailed-explaination/)** because utilization changes final cost. ## RO3003™ Impedance Control Data **Line Type** **Result on 10 mil RO3003** **Notes** 50 Ω Microstrip ~23 mil width Typical, depends on copper 75 Ω Microstrip ~12 mil width Used in satellite links 100 Ω Differential Pair 8–10 mil / 8–10 mil spacing Depends on copper thickness 90 Ω Diff Pair 10–12 mil Common in RF front ends For mmWave (60–86 GHz), designers often use: **Feature** **Typical Value** Via Stub Target < 6 mil CPWG Gap 6–8 mil Bends Avoid sharp angles ## RO3003™ Reliability Properties **Test** **Result** Thermal Cycling Excellent stability IST Test Low via fatigue PTH Reliability Stable with standard processes Solder Float No blistering High-Temp Exposure No resin cracking Multi-Reflow Test Stable after 3× lead-free reflow RO3003 is widely used in 77 GHz automotive radar because it withstands large temperature swings without drift. ## RO3003™ Comparison Against Other Rogers Materials **Parameter** **RO3003** **RO4003C** **RO4350B** Dk 3.00 3.38 3.48 Df 0.0010 0.0027 0.0037 Moisture Absorption 0.02% 0.04% 0.06% Thermal Conductivity 0.5 W/m·K 0.3 W/m·K 0.6 W/m·K Dimensional Stability High Medium High Fabrication Difficulty Low Very low Low Cost Highest Lowest Medium Best For Radar, mmWave General RF Telecom, WiFi, RF modules ## RO3003™ Material Stack-Up Examples - 1- Layer RF Antenna Stack-Up **Layer** **Material** Top Copper 18 μm RTF Dielectric RO3003 10 mil Ground Copper 18 μm RTF - 2-Layer Balanced RF Module **Layer** **Material** Signal Layer ½ oz copper RO3003 Core 20 mil Ground Layer 1 oz copper - Hybrid RF + Digital Stack-Up **Layer** **Material** Top Copper RF traces RO3003 10 mil Adhesive Layer — FR4 Prepreg Standard FR4 Core Digital circuits Bottom Copper Ground / digital signals If your next RF project involves RO3003 or other high-frequency laminates, our engineering team is ready to assist with simulations, stack-up proposals, prototype runs, and volume builds. You are welcome to contact [EBest Circuit (Best Technology)](https://www.bestpcbs.com/contact/index.htm) for professional guidance and fast support as you move from concept to production. Our teams support [RF designers](https://www.bestpcbs.com/products/RF-board.htm) from the early stack-up stage through final production with careful engineering review, material guidance, and precise process control. Every PCB moves through certified systems, including **ISO9001**, **ISO13485**, **IATF16949**, and **AS9100D**, which gives customers confidence in long-term reliability.