# IT170GRA2 Material Selection Guide for High Speed PCB

_Published: 2025-10-24_

Table of Contents

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- What Is IT170GRA2?
- IT170GRA2 Material Datasheet
- Why Choose IT170GRA2 Material for High Speed PCB?
- What Frequency Range Is IT-170GRA2 Suitable for?
- IT170GRA2 Material Selection Guide for High Speed PCB
- How Much Does IT-170GRA2 Material Cost?
- Alternative Materials of the Same Grade to IT-170GRA2

How to choose **[IT170GRA2 material](https://www.bestpcbs.com/blog/2025/10/it170gra2-material-selection-guide-for-high-speed-pcb/)**? Let’s discover definition, datasheet, benefits, applicable frequency range, cost and alternative solution for IT-170GRA2.

**Are you troubled with these questions?**

- How to prevent signal attenuation from material loss in high-frequency transmission?
- How to manage heat in multi-layer PCBs while maintaining high-density routing efficiency?
- How to shorten prototyping cycles for rapid design validation and market entry?

**As a high speed PCB manufacturer, EBest Circuit (Best Technology) can provide you service and solution:**

- IT170GRA2 material delivers ultra-low loss with dissipation factor ≤0.002 at 10GHz, ensuring cleaner signal integrity and 30% higher first-pass design success.
- Thermal conductivity ≥3.0W/m·K combined with optimized heat dissipation paths reduces board temperature rise by 15% in high-density designs, eliminating thermal stress risks.
- 48-hour rapid prototyping and direct material database access cut design iteration time in half, doubling speed-to-market for competitive edge.

**Welcome to contact us if you have any request for high speed PCB: sales@bestpcbs.com.**

## What Is IT170GRA2?

**[IT170GRA2](https://www.bestpcbs.com/blog/2025/10/it170gra2-material-selection-guide-for-high-speed-pcb/) **is a high-performance copper-clad laminate (CCL) manufactured by ITEQ, specifically designed for high-speed and high-frequency printed circuit board (PCB) applications. The model name encodes its core features: “IT” stands for the brand ITEQ, “170” indicates a glass transition temperature (Tg) exceeding 170°C (verified at 175°C via DSC testing), “GR” denotes glass fiber reinforced substrate, “A” signifies a halogen-free environmental formulation (RoHS compliant), and “2” represents the second-generation optimized version.

Compared to its predecessor (e.g., IT-170GRA1), it achieves reduced dielectric loss (Df≈0.012) and enhanced anti-CAF (anti-ionic migration) performance. Defined as an epoxy resin/glass fiber cloth-based high Tg halogen-free CCL, it combines low signal loss, high thermal resistance (Tg=175°C), and high reliability, making it ideal for high-speed scenarios including 5G communication systems, server backplanes, and automotive electronic control units.

[https://www.bestpcbs.com/blog/wp-content/uploads/2025/10/M-5.jpg](https://www.bestpcbs.com/blog/wp-content/uploads/2025/10/M-5.jpg)

## IT170GRA2 Material Datasheet

**Parameter Category**
**Specification Value**
**Test Standard**

Glass Transition Temp (Tg)
175°C
DSC Method (IPC-TM-650 2.4.25)

Dielectric Constant (Dk)
3.85±0.05 @10GHz
IPC-TM-650 2.5.5.13 (Stripline Method)

Dielectric Loss (Df)
0.012 @10GHz
Same as Dk (Stripline Method)

CTE (Coefficient of Thermal Expansion)
X/Y Axis: 12 ppm/℃;Z Axis: 45 ppm/℃ (50–260°C)
TMA Method (IPC-TM-650 2.4.24)

Anti-CAF Performance
Passed 85°C/85%RH, 50V, 1000h
IPC-650 2.6.25

Flame Retardancy
UL 94 V-0
UL Standard

Copper Foil Peel Strength
≥0.7 N/mm (Normal Condition)
IPC-TM-650 2.4.8

Thickness Range
0.04–3.2 mm
None (Basic Dimension Specification)

Copper Thickness Range
1/3oz–4oz
None (Supporting Process Parameters)

## Why Choose IT170GRA2 Material for High Speed PCB?

**Reasons Why Choose[IT-170GRA2 Material](https://www.bestpcbs.com/blog/2025/10/it170gra2-material-selection-guide-for-high-speed-pcb/) for High Speed PCB**:

- High-Frequency Signal Low-Loss Transmission: Df value 0.009–0.012 (@10GHz) reduces signal loss by approximately 40% compared to FR-4, ensuring signal integrity for 25Gbps+ high-speed links (e.g., PCIe 5.0) and minimizing data transmission errors.
- Stable Performance in High-Temperature Environments: Tg=175°C supports lead-free soldering processes, Z-axis CTE of 45ppm/℃ minimizes interlayer separation, and passing 85°C/85%RH 1000h CAF test extends service life in high-temperature scenarios like 5G base stations and automotive electronics.
- Environmentally Compliant and Safe: Halogen-free formulation meets RoHS/IEC 61249-2-21 standards, UL 94 V-0 flame retardancy enhances terminal product safety, complying with global environmental regulations.
- High Process Compatibility and Cost Efficiency: Supports advanced processes like laser drilling and HDI stacking, copper foil peel strength ≥0.7N/mm prevents detachment during processing. Cost is 30%+ lower than ultra-low loss materials (e.g., Megtron 6), achieving 80% of FR-4 performance at 10–25GHz scenarios, balancing performance and cost.
- Precise Impedance Control: Dk value 3.85±0.05 (@10GHz) maintains stable frequency variation, supports ±3% tolerance impedance design, avoids signal reflection issues, suitable for precision requirements like 100G optical modules in data centers.
- Multi-Scenario Verified Reliability: 10GHz insertion loss ≤-0.8dB/inch in 5G base station RF front-end boards, 77GHz automotive radar withstands thermal cycling (-40°C~150°C) without delamination, 56G PAM4 eye diagram jitter 25GHz (e.g., 77GHz automotive radar) due to excessive loss causing signal failure.
- Long-term high-temperature environments >150°C (e.g., engine ECU) requiring polyimide substrates.
- Ultra-thick ratio structures with board thickness ≥3.2mm and hole diameter 16:1) risking drilling cracks.
- Strong acid environments with pH