# Polyimide PCB Manufacturer in China, Over 18 Years

_Published: 2025-07-21_

Table of Contents

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- What Is Polyimide PCB?
- How Thick Is a Polyimide PCB?
- Polyimide PCB Material Data Sheet & Properties
- What Is the Thermal Conductivity of Polyimide Flex PCB?
- What Are the Pros and Cons of Polyimide Circuit Board?
- What Are Applications of Flexible Polyimide PCB?
- How Are Polyimide PCBs Manufactured?
- Polyimide PCB Manufacturer in China – EBest Circuit (Best Technology)

Why choose**[polyimide PCB](https://www.bestpcbs.com/blog/2025/07/polyimide-pcb-manufacturer-in-china-over-18-years/)**?‌ This guide details their critical properties, thickness, thermal conductivity, pros and cons, manufacturing processes and applications.

**Are you still troubled by these problems?**

- Complex circuit design leads to low yield?
- Traditional materials degrade in humid environment?
- Does micro-aperture processing affect circuit accuracy?

**EBest Circuit (Best Technology) 丨Polyimide PCB Manufacturer in China Over 18 years:**

- High-precision graphic transfer technology: using laser direct imaging (LDI) process, line width/line spacing up to 25μm, yield increased by 30%.
- Ultra-low water absorption material: 0.2% water absorption formula, insulation resistance retention rate in humid environment> 95%.
- Precision micro-hole processing: CO2 laser + UV laser combined drilling, aperture accuracy ±15μm, hole wall roughness 250°C).
- Adhesive Coating: Epoxy/acrylic adhesive applied to PI film for copper bonding.

**2. Copper Cladding**

- Lamination: Adhesive-coated PI film laminated with electrolytic copper foil (1/3–2 oz) at 180–200°C.
- Temporary Carrier: Aluminum/steel carrier attached for ultra-thin FPCs to prevent warping.

**3. Circuit Patterning**

- Dry Film Application: Photosensitive dry film laminated onto copper.
- Exposure & Development: UV light exposes circuit pattern; unexposed areas washed away.
- Etching: Ferric chloride/alkaline etching removes unprotected copper (line width/spacing ≥25µm).

**4. Coverlay Application**

- PI Coverlay: Second PI film with adhesive laminated over circuits for protection.
- Laser Ablation: CO₂ laser drills precision holes (via/pad openings).

**5. Plating & Surface Finish**

- ENIG Plating: Electroless nickel/immersion gold applied to pads for solderability.
- Stiffener Bonding: FR4/PI stiffeners attached to connector zones via thermal bonding.

**6. Testing & Inspection**

- AOI: Automated optical inspection for defects (open/short circuits).
- Electrical Testing: Flying probe/bed-of-nails tests verify continuity/impedance.

**7. Cutting & Forming**

- Laser Cutting: Precision shaping of FPC outlines.
- Bending Test: Flexibility validation (1,000+ bend cycles at 180°).

**8. Final Cleaning & Drying**

- Ultrasonic Cleaning: Removes residual particles from etching/plating.
- Baking: FPCs dried in 80–100°C oven to eliminate moisture.

**9. Packaging**

- Anti-Static Protection: FPCs placed in anti-static bags with desiccant packs.
- Cushioning: Foam inserts or vacuum-formed trays used to prevent movement.
- Labeling: Barcode/QR code labels include product ID, batch number, and RoHS compliance.

**10. Quality Final Check**

- Visual Inspection: Confirm no scratches, folds, or contamination.
- Electrical Recheck: Sample testing for critical parameters (e.g., impedance).

[https://www.bestpcbs.com/blog/wp-content/uploads/2025/07/4-2.jpg](https://www.bestpcbs.com/blog/wp-content/uploads/2025/07/4-2.jpg)

## Polyimide PCB Manufacturer in China – EBest Circuit (Best Technology)

Reasons why choose us as **[polyimide PCB manufacturer](https://www.bestpcbs.com/blog/2025/07/polyimide-pcb-manufacturer-in-china-over-18-years/)**:

- 24-hour rapid prototyping: shorten the R&D cycle by 50% and accelerate product launch.
- 1 Piece MOQ: zero inventory risk, trial production cost reduced by 90%.
- Competitive & Transparent Pricing – No hidden costs, offering the best value without compromising quality.
- Turnkey Solutions – Full-service PCB manufacturing from design to delivery, accelerating your product’s time-to-market.
- ISO 14001/ISO 13485 certification: medical/automotive customers are exempt from secondary testing, and compliance costs are reduced by 30%
- 0.075mm ultra-thin substrate processing: folding screen FPC thickness is reduced by 40%, and the bending life reaches 200,000 times.
- Mature blind and buried via technology: circuit density increased by 40%, adapting to the needs of 5G modules/medical implants.
- Free DFM (Design for Manufacturability) Analysis: Optimizes PCB layouts to reduce material waste, lower production costs, and avoid late-stage design revisions.

Please feel free to contact EBest Circuit (Best Technology) if you have any inquiry for polyimide PCB: **[sales@bestpcbs.com](mailto:sales@bestpcbs.com)**. Looking forward to hearing from you soon!