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Copper Clad Laminate Manufacturing Process
星期四, 20 3 月, 2025

Copper clad laminate (CCL) is crucial in printed circuit boards (PCBs), providing structural integrity and conductivity. Whether you are a PCB designer, engineer, or manufacturer, understanding CCLs will help you choose the right materials for your applications. In this guide, we explore CCL types, uses, and pricing, along with an in-depth look at its manufacturing process.

Best Technology offers comprehensive PCB manufacturing solutions, seamlessly integrating design, prototyping, assembly, component sourcing, and 360° technical support across the entire project lifecycle. Leveraging advanced lamination systems and high-precision CNC drilling machines from Hitachi and Timax, we ensure exceptional accuracy in multilayer PCB fabrication. Backed by a seasoned R&D team and engineers with over 10 years of industry experience, we guarantee a prompt response within 12 hours. Punctual delivery is our commitment, ensuring your projects stay on track. Feel free to reach out to us at sales@bestpcbs.com for any copper-clad laminate PCB needs.

Copper Clad Laminate Manufacturing Process

What is Copper Clad Laminate?

Copper clad laminate (CCL) is a composite material made of a non-conductive substrate (such as fiberglass, resin-impregnated paper), filler, and other chemicals, with a thin copper foil layer bonded to one or both sides. It serves as the foundation for PCB fabrication, ensuring electrical pathways are properly formed while offering mechanical support. CCLs are widely used in consumer electronics, automotive applications, and industrial equipment.

Copper Clad Laminate

What is Flexible Copper Clad Laminate?

Flexible copper clad laminate (FCCL) is a variation of CCL that uses a flexible substrate instead of rigid fiberglass. The most common substrate materials include polyimide or polyester, and FCCL is produced by laminating copper foil onto polyimide film (PI), making FCCLs suitable for bendable and lightweight applications. These laminates are commonly found in wearables, foldable devices, and medical electronics, where flexibility is a key requirement.

Copper Clad Laminate

What is Copper Clad in PCB?

In PCB manufacturing, copper clad laminate acts as the base material that undergoes etching, drilling, and layering processes to create functional circuits. The copper layer allows for efficient electrical conductivity, while the substrate provides insulation and mechanical support. PCBs can have single-sided, double-sided, or multi-layer configurations, depending on design complexity.

What are the Different Types of Copper Clad Laminate?

There are several types of CCLs, each designed for specific performance requirements:

  • FR-4 – The most widely used CCL, composed of woven glass fabric and epoxy resin, offering excellent electrical insulation and thermal resistance.
  • CEM-1 – A cost-effective option with a paper-based core and fiberglass reinforcement, ideal for single-sided PCBs.
  • CEM-3 – Similar to FR-4 but with a finer glass weave, providing better flexibility and processing ease.
Copper Clad Laminate
  • Flexible Copper Clad Laminate (FCCL) – Uses polyimide or polyester as a base, enabling use in applications requiring bending or flexing.
  • Metal Core CCL – Features an aluminum or copper core for better heat dissipation, commonly used in LED lighting and power electronics.
  • High-Frequency CCL – Designed for RF and microwave applications, using PTFE or ceramic-based substrates for improved signal integrity.

What is the Difference Between Copper and Copper Clad?

Copper is a pure metal known for its excellent electrical and thermal conductivity. Copper clad laminate, however, is a composite material where a thin copper layer is bonded to an insulating substrate. While pure copper is used in electrical wiring and heat exchangers, copper clad laminates serve as the base for PCBs, allowing for structured circuit pathways while maintaining mechanical stability.

What is the HS Code for Copper Clad Laminates?

The Harmonized System (HS) code ‌7410.11‌ is widely used for ‌copper clad laminates‌ in international trade. This classification applies to materials consisting of copper foil (printed or unprinted) bonded to an insulating substrate such as fiberglass, epoxy resin, paper, or other dielectric layers.‌

  • 7410.11‌: Covers copper foil laminated with insulating materials, regardless of surface patterning. These laminates serve as core materials for manufacturing printed circuit boards (PCBs), enabling electrical conductivity and structural support.

Critical Considerations:

  • Regional Variations‌: Some jurisdictions classify PCB-ready laminates (pre-etched or pre-engineered for circuitry) under ‌8547.20‌ (“printed circuits”).
  • Example: China may categorize advanced laminates under ‌8547.20‌ if they are explicitly designed for PCB production.
  • Material-Specific Codes‌: Laminates with plastic-based substrates (e.g., phenolic resin) might fall under ‌3921.90‌ (“plastic laminates”).

Verification‌: Pls consult local customs or a licensed broker for binding rulings in necessary situation, as interpretations vary. For instance:

  • U.S. HTS: May use ‌7410.11.0000‌ for basic laminates.
  • EU TARIC: Could require additional subcodes based on thickness or resin type.
Copper Clad Laminate Manufacturing Process

What is the Price of Copper Clad?

The price of copper clad laminate varies based on factors like copper thickness, substrate type, and manufacturing complexity. Here are the key factors that impact pricing:

  • Copper Thickness – Thicker copper layers increase cost due to the higher material requirement.
  • Substrate Material – FR-4 is pricier than paper-based laminates like CEM-1.
  • Processing Complexity – Advanced CCLs with high-frequency capabilities cost more to manufacture.
  • Market Demand – Prices fluctuate based on raw material availability and global market trends.
  • Order Volume – Bulk purchases typically come with lower unit costs.

Standard FR-4 CCLs typically range from $5 to $15 per square meter, while high-performance laminates designed for RF applications can cost significantly more.

What is the Manufacturing Process of Copper Clad Laminate?

What is copper clad laminate manufacturing process? Manufacturing copper clad laminate involves precise processes to ensure consistent quality and performance. Here take the double-sided copper clad laminate as a case. The production of double-sided copper clad laminates generally follows these steps:

1. Film Printing – Prepare and print the design film.

2. Board Cutting – Cut the board to size, keeping a 20mm process edge.

3. Drilling – Set the board thickness to 2.0mm or 1.6mm, ensuring the drill tip is 1-1.5mm above the PCB surface. Use Create-DCM software to generate U00 format drill files for CNC machines.

4. Polishing – Remove surface oxidation, oil stains, and burrs from drilling.

5. Hole Inspection – Ensure hole clarity for proper chemical penetration. Inspect the drilled and polished board under light to check if the holes are clear and unobstructed.

6. Pre-soaking – Remove oil, oxidation, and copper powder while adjusting the charge for better carbon particle adsorption.

7. Water Rinsing – Thoroughly rinse with clean water to remove chemical residues.

8. Drying – Eliminate residual moisture inside the holes using a drying oven or electric blower.

9. Activation – Coat the inner hole walls with nano-carbon particles to enhance conductivity.

10. Through-Hole Processing – Remove excess activation liquid to ensure all holes remain open using a vacuum cleaner.

11. Curing – Secure carbon particles to the hole walls and dry them with airflow.

12. Repeat Steps 9-11 for better adhesion.

13. Micro-etching – Remove excess carbon particles and wipe off black residues from the copper surface.

14. Water Rinsing – Clean the board thoroughly.

15. Copper Plating – Immerse in a copper plating bath for 20-30 minutes at a current of approximately 3-4A/d㎡ (adjust as needed). This process ensures electrical conductivity by plating copper on the hole walls.

16. Water Rinsing – Clean the surface after plating.

17. Drying – Dry the board and remove any residual moisture in the holes.

18. Lamination – Apply the dry film using a lamination machine.

19. Exposure – Expose the film to light for approximately 3 minutes.  Align the film (negative film at this stage) with the board first. Ensure correct alignment of the negative film for double-sided circuits.

20. Developing – Remove unexposed film in a developing solution at 45-50°C while observing changes on the board.

21. Water Rinsing – Rinse thoroughly to remove residues.

22. Etching – Etch at 45-50°C to remove unwanted copper.

23. Water Rinsing – Wash off any remaining etchant to prevent further corrosion.

24. Stripping – Use a strong alkaline solution to remove the dry film.

25. Water Rinsing – Rinse thoroughly.

26. Drying – Dry the board completely.

27. Tin Plating – Perform micro-etching, rinsing, and tin plating to protect exposed copper areas from oxidation and improve solderability.

28. Edge Cutting – Trim off excess material from the fabricated board based on the circuit outline and smooth the board edges using a manual grinding tool.

This process ensures high-quality double-sided copper clad laminate for various PCB applications.

Copper Clad Laminate Manufacturing Process

Copper Clad Laminate Manufacturers

Several manufacturers produce high-quality copper clad laminates for different industries. Some of the leading names include:

  • Doosan Corporation Electro-Materials – A global leader in FR-4 and high-performance CCL production.
  • Shengyi Technology – Specializes in advanced CCLs for high-frequency and RF applications.
  • Rogers Corporation – Renowned for high-frequency laminates used in 5G and aerospace applications.
  • DuPont‌ – Known for high-reliability materials like polyimide-based CCLs for flexible circuits and high-temperature applications.

Best Technology Primarily dedicated to PCB manufacturing, we also source and supply copper clad laminates, providing customers with reliable materials tailored to their specific requirements.

In conclusion, copper clad laminate plays a vital role in PCB manufacturing, influencing performance, cost, and durability. Understanding its manufacturing process, types, and pricing helps engineers and buyers make better decisions. Whether you need rigid FR-4 laminates or flexible options for advanced applications, choosing the right material ensures optimal performance and reliability.

For those sourcing copper clad laminates, partnering with a reputable manufacturer guarantees high-quality materials and consistent supply. We provide one-stop PCB manufacture service, including PCB assembly and component purchasing and all-around technical support before and after-sales. Just feel free to reach out to us at sales@bestpcbs.com for any printed circuit board needs.

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What is Copper Clad Laminate (CCL)?
星期五, 13 9 月, 2024

What is Copper Clad Laminate?

Copper clad laminate short for CCL, it is a foundational material in the electronics industry. It consists of a thin copper foil bonded to one or both sides of a non-conductive substrate like fiberglass or resin. This combination creates a durable and conductive material that serves as the base for creating printed circuit boards (PCBs). The copper layer facilitates the transmission of electrical signals, while the insulating substrate supports the board’s structural integrity.

CCL comes in various thicknesses and types, depending on the application. It’s a critical part of most electronic devices, from smartphones to industrial machines. Its main role is to support the etching of circuit patterns, where unnecessary copper is removed, leaving conductive paths that enable electrical connections. Below is a structure of a double sided copper clad laminate:

What is Copper Clad Laminate (CCL)?

What is Copper Clad Board Used For?

Copper clad boards are widely used in PCB manufacturing. Their role is to provide a surface for electrical components to connect through conductive copper traces. CCLs are widely used in applications including, but not limited to:

  • Electronic products: Copper clad board is the basic material of electronic products, used to manufacture various electronic equipment circuit board, such as TV, radio, computer, computer and so on.
  • Communication equipment: Mobile phones, tablet computers, routers and other communication equipment a large number of copper clad laminate.
  • Computers and peripherals: Computer motherboards, graphics cards, hard disks, etc., need a large number of copper-clad boards.
  • Automotive electronics: Electronic equipment in modern automobiles, such as ABS, air conditioning, navigation, etc., need to use copper clad board.
  • Military: Electronic components in military equipment also need to use a large number of copper-clad boards.

In addition, copper clad boards are also used in industrial control, medical instruments, national defense, aerospace and other fields. With the development of technology and the increase of application demand, the use of copper clad plate in electronic products is more and more extensive, which plays an important role in promoting the renewal of social production and living tools. For example, the development of the Internet of Things and artificial intelligence, as well as the application of 5G communication technology, have greatly increased the demand for copper clad sheets. ‌

What is the Market Report for Copper Clad Laminate?

The market for copper clad laminate has grown steadily due to the increasing demand for consumer electronics, automotive advancements, and telecommunication developments. The global CCL market is expected to expand significantly over the next few years, driven by technological advancements in 5G, renewable energy systems, and electric vehicles.

Key players in this market are working to develop lighter, thinner, and more efficient CCLs to keep pace with the growing need for high-performance electronics. Manufacturers exploring new materials and production methods to reduce costs while enhancing performance. The future looks promising, with a forecast of rapid growth driven by the electronics industry’s evolution.

Is Copper Clad Better Than Copper?

Copper clad laminate is a more practical option for PCBs than solid copper because it provides the required conductive properties at a lower cost. While copper is an excellent conductor, using copper as metal core PCBs would be expensive and impractical. CCL offers the same conductivity benefits but adds a lightweight, non-conductive layer that provides structural support.

What is Copper Clad Laminate (CCL)?

Electrical Conductivity and Cost Efficiency

While pure copper has excellent electrical conductivity, copper clad laminates (CCLs) provide a balance between cost and performance. In a copper clad board, only a thin copper layer is used, which significantly reduces the amount of copper needed compared to using solid copper. For applications like PCBs, where large surfaces need copper conductivity but do not require the full thickness of copper, copper clad is more efficient and economical.

Thermal Management

Copper clad materials often have better thermal management properties due to the substrate’s ability to dissipate heat while maintaining the copper layer’s high conductivity. Pure copper, while an excellent heat conductor, may not offer the same level of thermal dissipation when used alone in complex electronic assemblies. For instance, in multi-layer PCBs, copper clad boards help balance the need for heat management and conductivity by using the copper layer efficiently while the base material manages thermal stress.

Structural Support and Durability

Copper clad laminates provide added structural support compared to pure copper sheets. The non-conductive substrate, often made of fiberglass, resin, or other materials, adds durability and rigidity to the thin copper layer. By contrast, is soft and flexible, making it unsuitable for structural applications without some form of backing material.

Corrosion Resistance

Copper, though highly conductive, is prone to oxidation and corrosion over time, which can affect its performance in certain environments. Copper clad laminates, however, are often treated with protective coatings or layered with other materials to enhance their resistance to corrosion.

Weight Considerations

Another important factor is weight. Copper is a dense metal, and using thick copper layers can significantly increase the weight of a product. In contrast, copper clad laminates achieve high conductivity with only a fraction of the copper’s weight.

How Thick is Copper Clad Board?

The thickness of a copper clad board depends on its intended application. Standard copper thicknesses for CCL are measured in ounces per square foot, typically ranging from 0.5 oz to 2 oz per square foot. This translates to about 17 to 70 microns. For high-power applications, thicker copper, such as 3 oz or more, may be used.

What is Copper Clad Laminate (CCL)?

On the other hand, the thickness of the laminate itself can also vary, depending on whether it’s a single-layer, double-layer, or multilayer board. The insulating substrate can range from 0.2 mm to several millimeters, depending on the application. The total thickness of the copper clad board is a combination of the copper foil and the insulating material.

How Much Does Copper Cladding Weigh?

The weight of copper cladding is typically expressed in ounces per square foot. A common weight is 1 oz of copper, which means that a square foot of copper clad board has a 1-ounce copper layer. This is approximately 35 microns thick. Heavier copper cladding, such as 2 oz or 3 oz, is also used for applications that require higher current-carrying capacity or greater durability.

It’s important to balance the weight with the application needs. Higher copper weight provides better conductivity and durability but adds cost and weight to the final product. Therefore, the choice of copper weight in CCL depends largely on the required performance and cost considerations.

Copper Clad Laminate Price

The price of copper clad laminate varies based on several factors such as copper thickness, substrate material, board size, and production volume. Standard-grade CCL is more affordable, while high-end options with specialty substrates like Teflon or ceramic tend to be more expensive.

On average, copper clad laminate costs range from $5 to $15 per square meter for common types. However, high-performance laminates designed for demanding environments, such as those used in aerospace or military applications, can be significantly more expensive.

Global market trends, material shortages, and the demand for electronics heavily influence pricing. Recently, fluctuations in copper prices and supply chain disruptions have impacted the cost of CCL. Still, bulk orders or long-term contracts with suppliers can help reduce costs for large manufacturers.

How to Cut Copper Clad Laminate?

CCL requires careful handling to ensure precise cuts without damaging the copper layer or the substrate. The cutting method will vary depending on the thickness and material, but overall, clean and accurate techniques are key.

What is Copper Clad Laminate (CCL)?

1. Choose the Right Tools

    The tools you use depend on the thickness of the copper clad laminate. Thin CCL can be cut with a utility knife, while thicker boards require specialized tools like a PCB shear or laser cutter.

    2. Prepare the Work Area

    Before cutting, ensure that your workspace is clean and stable. Use a flat surface to keep the laminate steady during cutting. For larger boards, use clamps to secure them in place. Always wear protective gear like goggles and a mask, especially when working with power tools to avoid dust and debris.

    3. Measure and Mark the Cutting Line

    Accurate measurements are crucial for a clean cut. Use a ruler or measuring tape to mark the cutting line and draw it clearly with a permanent marker. Double-check your measurements to avoid mistakes before cutting.

    4. Score the Copper Clad Laminate

    For thin laminates, use a utility knife to score along the marked line. Score the copper side first, then flip it over and score the substrate. Once both sides are scored, gently bend the laminate along the line until it snaps cleanly.

    5. Cut Thick Copper Clad Laminate

    For thicker CCL, use a guillotine PCB shear or a Dremel tool. A PCB shear provides a clean, straight cut, while a Dremel is useful for cutting complex shapes. For high precision, a laser cutter is the best choice, especially for intricate designs.

    6. Deburr and Smooth the Edges

    After cutting, the edges may be rough. Use a file to smooth out any jagged areas, then finish with fine-grit sandpaper.

    Safety is important when cutting CCL. Fiberglass and other substrate materials can produce harmful dust. Always wear a dust mask and safety goggles, and work in a well-ventilated area to minimize exposure to particles. In addition to this, avoid over-scoring the laminate, which can damage the substrate or cause copper peeling. Make sure to apply consistent pressure while cutting to prevent uneven edges. Always prioritize safety by using proper protective gear to avoid injuries.

    Copper Clad Laminate Suppliers

    Numerous suppliers provide copper clad laminate globally. The selection of a supplier depends on factors like the type of laminate, application requirements, and volume needed. Some well-known suppliers include:

    • Kingboard Laminates
    • Panasonic
    • Isola Group
    • Nan Ya Plastics
    • Shengyi Technology
    • Rogers Corporation
    • Ventec International Group
    • Doosan Corporation
    • Iteq Corporation
    • Mitsubishi Gas Chemical

    With over a decade of effort and experience, Best Technology has been actively contributing to the growth of this business. Certified with ISO9001, ISO13485, IATF16949, UL, and RoHS, the company is fully capable of delivering high-quality, eco-friendly PCBs and various types of copper clad laminates at competitive prices.

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    What is a Copper Clad Laminate (CCL) in PCB?
    星期二, 18 6 月, 2024

    Copper Clad Laminate as a base material of FR4 PCB, serving as a key part in the building of printed circuit board. Understanding what Copper Clad Laminate is, its benefits, types, and manufacturing process is essential for anyone who involved in the electronics industry. This article aims to provide a comprehensive overview of copper clad laminate material, and hope everyone in the PCB industry be interested in it.

    copper clad laminate

    What is copper clad laminate?

    Copper Clad Laminate, short for CCL, is an electronic glass fiber cloth or other reinforcing material dipped in resin, one or both sides covered with copper foil and made of a plate-like material, referred to as copper clad plate. It also called “Core” when used in the multi-layer PCB designs. Through the different process like etch, drill or copper plating, we can generate different patterns, layouts onto the surface of the CCL, and then form a circuit board that we saw in the electronics.

    CCLs provide the necessary support and electrical insulation in an electronic device, while also facilitating the pathways for electrical currents through the copper foil. So, in another word, the performance, long-term reliability and stability of the PCB depend on the CCL to a large extent.

    copper clad laminate

    What are the types of copper clad laminates?

    Generally speaking, copper clad laminate can be divided into two main types according to its mechanical properties, they are – rigid copper clad laminate and flexible copper clad laminate. Here we listing the detailed types of CCL.

    • Rigid copper-clad laminate

    a. According to different insulation materials and structures: organic resin clad copper laminate, metal clad copper laminate, ceramic clad copper laminate.

    b. According to the thickness of the plate: conventional copper-covered laminate and thin copper-covered laminate. The thickness less than 0.5mm (doesn’t include the copper foil) is called thin CCL.

    c. According to the reinforcement material used: electronic glass fiber cloth base copper foil board, paper base copper foil board and composite base copper foil board.

    d. According to the insulating resin used, such as epoxy resin copper-coated foil board, polyester resin copper-coated foil board and cyanate resin copper-coated foil board.

    e. Special rigid copper clad plate, according to the flame-retardant grade and some special properties.

    • Flexible copper clad laminate

    a. polyester types (flame retardant and non-flame retardant)

    b. polyimide type (flame retardant, non-flame retardant)

    c. Extra thin electronic glass fiber cloth copper foil laminate

    What’s the main composition of copper clad laminate?

    A normal copper clad laminate mainly consists of copper foil and some auxiliary materials. These materials make the CCL conductive and be used as the core material of the circuit board. Here we would like to explain these compositions in details:

    • Copper foil

    Copper foil is one of the main raw materials for manufacturing copper clad laminate, and it is a very pure metal material with excellent electrical conductivity. The thickness and purity requirements of the copper clad foil are very high, usually between 18-70μm, and the purity is more than 99.8%. In the manufacturing process of CCL, copper foil is used as a conductive layer to transfer current from one electronic component to another. It also has good plasticity and ductility, and can be bent, stretched and formed as needed without adversely affecting electrical conductivity. In addition, the corrosion resistance of the copper foil is also very good, which can resist the erosion of chemical substances, ensuring that the CCL can work properly in a variety of environments.

    copper clad laminate
    • Auxiliary materials like resin and adhesive

    In addition to copper foil and copper clad foil, the production of CCL also involves some other auxiliary materials, such as adhesives and reinforcing materials. Among them, the adhesive is mainly used to fix the copper foil and copper clad foil on the substrate. The selection of adhesives should take into account their adhesion and high temperature resistance to ensure that the copper foil and copper clad foil can be firmly bonded to the substrate. Reinforcement materials are mainly used to improve the mechanical strength and bending resistance of CCL. Common reinforcement materials include glass fiber cloth and polyimide film.

    CCL Manufacturing Process

    The manufacture of CCL is a meticulous process; therefore, it includes many accurate steps:

    • Prepare substrate – the commonly used substrate is fiberglass cloth impregnated with epoxy resin, which is non-conductive material and has good insolation and mechanical properties, then cured to get the correct mechanical and thermal characteristics.
    • Surface treatment – this is a surface cleaning and grinding process to achieve a clean and roughness surface of the substrate, resulting a good adhesion between the copper foil and substrate.
    • Copper Foil Lamination – lamination of copper foil onto the prepared substrate is done by temperature and pressure quickly and smoothly to obtain a stable bond. This is a lamination process of single layer CCL, if you want a multi-layer CCL, coating adhesive on each layer and then laminate in the press machine, then making them in a whole product.
    • Cutting and Trimming – the need for the dimensions drives the sheets to be cut and trimmed into a desired size.
    • Quality Checking: A thorough quality check follows to confirm that the CCL matches industry requirements on thickness, adhesion, and electrical properties.
    copper clad laminate

    Where is the Copper Clad Laminate uses?

    CCL has a widely applications thus constituting a critical element for numerous electronic devices and systems, the typically are including:

    • Consumer electronics like cell phones, laptops, and tablets
    • Automotives including infotainment and engine control units
    • Industrial equipment like common test equipment
    • Telecommunications such as networking equipment and communication devices
    • Medical device, for example: imaging system, diagnostics

    If you are looking for a company that can advance and improve your electronic circuit, then Best Technology is the right choice for you. Best Technology is a one-stop solution providers in China with extensive years of experience in high quality PCB and PCBA manufacturing. We have certificated by ISO9001, ISO13485, IATF16949 to make you no worry about the quality. Contact us right now to get your quotations!

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