Posts Tagged ‘AOI technology’

The Application of AOI in Reflow Inspection

Monday, December 24th, 2018

Today, we continue to talk about AOI technology applied in the PCB manufacturing. The component mounting inspection is followed by the reflow inspection, if you would like to know more details, please click The Application of AOI in Component Mounting Inspection to know.

AOI can be divided into two types: preventing problem phase and finding problem phase. The inspections after solder paste printing and SMT belongs to preventing problem phase and the inspections followed by reflow soldering are finding problem phase.

In the back end inspection of reflow soldering, AOI technology is able to detect some problems as below:

√ whether the components are missed, deviated or skewed.

√ The defects of polarity.

√ Whether solder joints are correct.

√ Whether the solder paste is enough.

√ Whether there is short circuit in soldering etc..

The back end inspection of reflow soldering is the most prevailing choice for AOI now. Because all of the assembly errors can be found at this process, so that the quality of printed circuit boards are able to step forward to a higher level.

Best Technology is the premier expert in manufacture of PCB and PCBA. Our unique AOI testing technology and high quality products give you a competitive supply of printed circuit board and rigid-flex circuit board. To learn more, contact us at 0755-29091601 or check our website: https://www.bestpcbs.com/

The Application of AOI in Component Mounting Inspection

Monday, December 17th, 2018

In the previous articles, we have talked about PCB inspection and solder paste printing inspection. To find more information of the details, please check: The Application of AOI in PCB Inspection and The Application of AOI in Solder Paste Printing Inspection.

The component mounting requires high precision of equipment and the common defects including forgetting to mount the component, mounting the component in a wrong way, polarity reversal etc.. AOI technology not only can find the defects above, but also can check the connection dense spacing and the solder paste on the pads of BGA component.

 

Since the component mounting is followed by the reflow soldering, the testing after component mounting is usually called front end inspection of reflow soldering. However, it is meaningless from the perspective of quality guarantee. Because the defects can not be found in the reflow oven. The solder tin is able to correct by itself after melting in the reflow oven, so the the mounting displacement and solder printing status can not be detected on the substrate after soldering. In fact, the front end inspection of reflow soldering is incredible significant for quality guarantee as that the component mounting of all parts can be inspected before reflow soldering.

The alarm will be sent out if the defects are found by AOI technology. After that, the visual inspection will be carried out by the operator. If miss some components at this stage, it can be corrected by tweezers. After the visual inspection operator repaired the same problem for many times, he will ask the person who charge the production equipment to reconfirm whether the setting of the machine is reasonable. The feedback information is very helpful to enhance the production quality and it can improve it in a very short time.

Best Technology is the premier expert in manufacture of PCB and PCBA. Our unique AOI testing technology and high quality products give you a competitive supply of printed circuit board and rigid-flex circuit board. To learn more, contact us at 0755-29091601 or check our website: https://www.bestpcbs.com/